JPH0518676B2 - - Google Patents

Info

Publication number
JPH0518676B2
JPH0518676B2 JP2045614A JP4561490A JPH0518676B2 JP H0518676 B2 JPH0518676 B2 JP H0518676B2 JP 2045614 A JP2045614 A JP 2045614A JP 4561490 A JP4561490 A JP 4561490A JP H0518676 B2 JPH0518676 B2 JP H0518676B2
Authority
JP
Japan
Prior art keywords
solder
flux
sheet
end surface
gas exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2045614A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03254393A (ja
Inventor
Satoyuki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2045614A priority Critical patent/JPH03254393A/ja
Publication of JPH03254393A publication Critical patent/JPH03254393A/ja
Publication of JPH0518676B2 publication Critical patent/JPH0518676B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2045614A 1990-02-28 1990-02-28 溝付きシート状はんだおよびその製造方法 Granted JPH03254393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2045614A JPH03254393A (ja) 1990-02-28 1990-02-28 溝付きシート状はんだおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2045614A JPH03254393A (ja) 1990-02-28 1990-02-28 溝付きシート状はんだおよびその製造方法

Publications (2)

Publication Number Publication Date
JPH03254393A JPH03254393A (ja) 1991-11-13
JPH0518676B2 true JPH0518676B2 (cs) 1993-03-12

Family

ID=12724255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2045614A Granted JPH03254393A (ja) 1990-02-28 1990-02-28 溝付きシート状はんだおよびその製造方法

Country Status (1)

Country Link
JP (1) JPH03254393A (cs)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004344958A (ja) * 2003-05-23 2004-12-09 Sentan Zairyo:Kk 炭素アルミニウム複合材料または炭化珪素アルミニウム複合材料に金属を接合したハイブリッド材料および該ハイブリッド材料を用いた熱交換器用部品
US8678271B2 (en) * 2007-06-26 2014-03-25 Globalfoundries Inc. Method for preventing void formation in a solder joint
JP5214483B2 (ja) * 2009-02-06 2013-06-19 リコーマイクロエレクトロニクス株式会社 電子部品加工方法、及び電子部品実装方法
JP5688837B2 (ja) * 2010-10-21 2015-03-25 三菱アルミニウム株式会社 電気絶縁部材とろう付されるアルミニウム部材および電気絶縁部材
JP6944907B2 (ja) * 2018-07-27 2021-10-06 株式会社 日立パワーデバイス 半導体装置の製造方法および半導体装置ならびに半田シートおよびその製造方法
JP2023137310A (ja) * 2022-03-18 2023-09-29 日本電気株式会社 接合材、仮固定方法及び製造方法

Also Published As

Publication number Publication date
JPH03254393A (ja) 1991-11-13

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