JPH0518862Y2 - - Google Patents
Info
- Publication number
- JPH0518862Y2 JPH0518862Y2 JP1987162180U JP16218087U JPH0518862Y2 JP H0518862 Y2 JPH0518862 Y2 JP H0518862Y2 JP 1987162180 U JP1987162180 U JP 1987162180U JP 16218087 U JP16218087 U JP 16218087U JP H0518862 Y2 JPH0518862 Y2 JP H0518862Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- heat dissipation
- heat
- circuit board
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、回路基板を電気的結線すると共に
回路基板の放熱を司る放熱コネクタに関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a heat dissipation connector that electrically connects a circuit board and also controls heat dissipation of the circuit board.
従来、回路基板の放熱に係る技術としては、例
えば、実公昭55−33664号公報に開示されたよう
な技術がある。
Conventionally, as a technology related to heat dissipation of a circuit board, there is a technology such as that disclosed in Japanese Utility Model Publication No. 33664/1983, for example.
すなわち、当該従来の技術は、可撓性のある絶
縁フイルムの両端からLSIとの接続に用いる複数
のコネクタ端子を出したコネクタ端子部を熱伝導
性のすぐれた軽量の金属板の先端に略コ字状に巻
き付け接着し、該金属板に設けた溝穴上に位置す
るLSIの端子パターン部とコネクタ端子部の端子
とを接続することにより、LSIの両面から外部接
続用端子を取り出した高密度端子の熱放散のすぐ
れた電子回路パツケージに関するものであつた。 In other words, in this conventional technology, the connector terminal section, which has a plurality of connector terminals used for connection with the LSI from both ends of a flexible insulating film, is roughly connected to the tip of a lightweight metal plate with excellent thermal conductivity. By wrapping the metal plate in a shape and gluing it, and connecting the terminal pattern part of the LSI located on the slot provided in the metal plate and the terminal of the connector terminal part, high density terminals for external connection are taken out from both sides of the LSI. The invention concerned an electronic circuit package with excellent terminal heat dissipation.
しかしながら、前述の従来の技術では、次に挙
げる問題点を有していた。
However, the above-mentioned conventional technology has the following problems.
ａ 絶縁フイルムを用いたコネクタ端子部を略コ
字状に巻き付けた特殊な回路基板を設計する必
要があつた。a. It was necessary to design a special circuit board in which the connector terminal part using an insulating film was wrapped in a substantially U-shape.
ｂ 回路基板へ電子素子を載設して半田付けする
場合、前記絶縁フイルムや接着剤の耐熱性を考
慮し、半田付け後の後工程で接着する必要があ
つた。(b) When electronic elements are mounted on a circuit board and soldered, it is necessary to take into account the heat resistance of the insulating film and adhesive and perform adhesion in a post-soldering process.
ｃ 発熱素子等の発熱部の両面から外部接続用端
子を取り出す場合においては放熱効果を望むこ
とは出来なかつた。c. When external connection terminals are taken out from both sides of a heat generating part such as a heat generating element, it is not possible to expect a heat dissipation effect.
この考案は、前述した従来の技術が有する問題
点を解決するものであり、発熱素子を載設する回
路基板に接続されるコネクタと、該コネクタに貫
通配備すると共に回路基板に圧接した放熱部材と
を具備した放熱コネクタを提供し、従来の問題点
が解消されるものである。
This invention solves the problems of the conventional technology described above, and consists of a connector connected to a circuit board on which a heat generating element is mounted, a heat dissipation member that is disposed through the connector and is pressed into contact with the circuit board. The present invention provides a heat dissipation connector equipped with a heat dissipation connector, which solves the conventional problems.
発熱素子からの熱は回路基板を介して放熱部材
へ伝達され、該放熱部材から外部に熱を放出し、
回路基板の温度上昇が抑制される。
The heat from the heating element is transmitted to the heat radiating member via the circuit board, and the heat is radiated to the outside from the heat radiating member,
Temperature rise of the circuit board is suppressed.
第１図は、この考案の好適な実施例を示す断面
図である。
FIG. 1 is a sectional view showing a preferred embodiment of this invention.
第１図に於いて、１は基板、２は絶縁層、３は
導電パターン、４はチツプ素子、５は発熱素子、
６はボンデイングワイヤ、７はコネクタ、８は端
子、９はハーネス、１０は放熱部材である。 In FIG. 1, 1 is a substrate, 2 is an insulating layer, 3 is a conductive pattern, 4 is a chip element, 5 is a heating element,
6 is a bonding wire, 7 is a connector, 8 is a terminal, 9 is a harness, and 10 is a heat radiation member.
前記基板１は、例えば、アルミニウムからなる
金属基板で構成され、絶縁層２は例えば、アルミ
ニウムの酸化膜AI2O3を形成する。 The substrate 1 is made of, for example, a metal substrate made of aluminum, and the insulating layer 2 is formed of, for example, an aluminum oxide film AI 2 O 3 .
導電パターン３は、例えば、ニツケル箔を回路
パターン状に成形し絶縁層２の表面に貼着したも
のである。 The conductive pattern 3 is, for example, a nickel foil formed into a circuit pattern and adhered to the surface of the insulating layer 2.
発熱素子５は、パワーチツプトランジスタや
LSI等の半導体で構成される。 The heating element 5 is a power chip transistor or
Consists of semiconductors such as LSI.
コネクタ７はプラスチツク成形品であり、一方
の側に端子８の挿入口７ａ及び放熱部材１０の挿
入口７ｂを有し、他方の側に基板１の差込み口７
ｃを有する。 The connector 7 is a plastic molded product, and has an insertion opening 7a for the terminal 8 and an insertion opening 7b for the heat dissipation member 10 on one side, and an insertion opening 7 for the board 1 on the other side.
It has c.
端子全体８はステンレスや黄銅板等をプレス加
工したもの若しくは更に金メツキ等の表面処理を
施したものであり、該端子の先端部８ａは側面が
Ｕ字状に形成され、基端部８ｂはハーネス９が加
締めつけられている。 The entire terminal 8 is made of pressed stainless steel or brass plate, or is further surface-treated with gold plating, etc. The tip end 8a of the terminal has a U-shaped side surface, and the base end 8b has a U-shaped side surface. Harness 9 is tightened.
放熱部材１０は、AIや銅板等をプレス加工し
たものであり、該放熱部材１０は前記コネクタ７
の成形時に一体成形するか、又は圧入することに
よつてコネクタ７に一体的に設けられる。そし
て、後者の手段、すなわち圧入によつて一体化す
る場合の実施例としては放熱部材１０の側面等に
鋸歯状の端面を形成し該放熱部材１０がコネクタ
７から抜けることを防止するとよい。 The heat dissipation member 10 is made by pressing AI, a copper plate, etc., and the heat dissipation member 10 is connected to the connector 7.
The connector 7 is provided integrally with the connector 7 by being integrally molded or press-fitted during molding. In the case of the latter method, that is, integration by press-fitting, it is preferable to form sawtooth end faces on the side surfaces of the heat dissipating member 10 to prevent the heat dissipating member 10 from coming off from the connector 7.
尚、該放熱部材１０の先端部１０ａは基板１の
下面に延在して固着し、該基板１を支持してい
る。 Note that the distal end portion 10a of the heat dissipating member 10 extends and is fixed to the lower surface of the substrate 1 to support the substrate 1.
又、該放熱部材１０の基端部１０ｂは下方に折
曲されており、コネクタ７を基板１に装着する場
合は基端部１０ｂを押込むことにより該基板１を
差込み口７ｃに嵌入する。 The base end 10b of the heat dissipating member 10 is bent downward, and when the connector 7 is attached to the board 1, the base end 10b is pushed in to fit the board 1 into the insertion port 7c.
また基端部１０ｂにより放熱面積を広げ放熱効
果を向上させ得る。又、該放熱部材１０の基端部
１０ｂに穿設された穴１０ｃを用いて装置のケー
ス（図示せず）に螺着し、固定する。そして基板
１を差込み口７ｃに圧入する。 Moreover, the heat radiation area can be expanded by the base end portion 10b, and the heat radiation effect can be improved. Further, the heat dissipating member 10 is screwed into a case (not shown) of the device using a hole 10c drilled in the base end 10b to be fixed. Then, the board 1 is press-fitted into the insertion port 7c.
この考案は、コネクタに回路基板へ圧接される
放熱部材を一体的に設けたことに特徴を有し、そ
のため次に列挙した多くの効果を奏する。
This invention is characterized in that the connector is integrally provided with a heat dissipating member that is press-contacted to the circuit board, and therefore has many of the effects listed below.
ａ 回路基板は既存のものを使うことができ、特
殊な回路基板を配設する必要はない。a. An existing circuit board can be used, and there is no need to install a special circuit board.
ｂ 放熱面積を広くすることができ、放熱効果を
向上させ得る。b The heat radiation area can be increased, and the heat radiation effect can be improved.
ｃ 実施例によつて示されるごとく、放熱部材に
よつて基板を支持することができる。c. As shown in the embodiments, the substrate can be supported by the heat dissipation member.
ｄ 放熱部材が支持部材として機能し、基板に対
するコネクタの着脱を容易になし得るものであ
る。d) The heat dissipation member functions as a support member and allows the connector to be easily attached to and detached from the board.
ｅ 放熱部材を装置のケースに固定し、放熱効果
が更に向上でき、又、コネクタが装置に固定で
きるという波及効果を有する。e) The heat dissipation member can be fixed to the case of the device, further improving the heat dissipation effect, and the connector can be fixed to the device, which has the ripple effect.
第１図は、この考案の好適な実施例を示す断面
図である。
１……基板、５……発熱素子、７……コネク
タ、８……端子、１０……放熱部材。
FIG. 1 is a sectional view showing a preferred embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Board, 5... Heat generating element, 7... Connector, 8... Terminal, 10... Heat dissipation member.
Claims (1)
ネクタと、該コネクタに貫通配備すると共に該
回路基板に圧接した放熱部材とを具備したこと
を特徴とする放熱コネクタ。 (2) 放熱部材の基端部をＬ字状に垂下させたこと
を特徴とする実用新案登録請求の範囲第１項記
載の放熱コネクタ。[Claims for Utility Model Registration] (1) The invention is characterized by comprising a connector connected to a circuit board on which a heating element is mounted, and a heat dissipation member disposed through the connector and pressed into contact with the circuit board. Heat dissipation connector. (2) The heat dissipation connector according to claim 1, wherein the base end of the heat dissipation member is suspended in an L-shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162180U JPH0518862Y2 (en) | 1987-10-24 | 1987-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162180U JPH0518862Y2 (en) | 1987-10-24 | 1987-10-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0166768U JPH0166768U (en) | 1989-04-28 |
| JPH0518862Y2 true JPH0518862Y2 (en) | 1993-05-19 |
Family
ID=31445773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162180U Expired - Lifetime JPH0518862Y2 (en) | 1987-10-24 | 1987-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0518862Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004253364A (en) * | 2003-01-27 | 2004-09-09 | Matsushita Electric Ind Co Ltd | Lighting system |
| JP6134557B2 (en) * | 2013-03-29 | 2017-05-24 | Ｊｘ金属株式会社 | Copper strip or copper alloy strip and heat dissipating part provided with the strip |
-
1987
- 1987-10-24 JP JP1987162180U patent/JPH0518862Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0166768U (en) | 1989-04-28 |
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