JPH05198230A - Manufacture of electrode material - Google Patents

Manufacture of electrode material

Info

Publication number
JPH05198230A
JPH05198230A JP4008269A JP826992A JPH05198230A JP H05198230 A JPH05198230 A JP H05198230A JP 4008269 A JP4008269 A JP 4008269A JP 826992 A JP826992 A JP 826992A JP H05198230 A JPH05198230 A JP H05198230A
Authority
JP
Japan
Prior art keywords
copper
powder
chromium
alloy
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4008269A
Other languages
Japanese (ja)
Inventor
Nobuyuki Yoshioka
信行 吉岡
Taiji Noda
泰司 野田
Toshimasa Fukai
利真 深井
Nobunao Suzuki
伸尚 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp, Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Corp
Priority to JP4008269A priority Critical patent/JPH05198230A/en
Priority to EP19920118218 priority patent/EP0538896A3/en
Priority to US07/965,203 priority patent/US5352404A/en
Priority to TW081108517A priority patent/TW240184B/zh
Priority to KR1019920019655A priority patent/KR950008375B1/en
Publication of JPH05198230A publication Critical patent/JPH05198230A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Manufacture Of Switches (AREA)
  • High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)

Abstract

PURPOSE:To provide a method for easily manufacturing an electrode material, with excellent reproducibility, whose contact-resistance value is low and whose weld-resisting performance is excellent without difficulty by adding a low fusion- point metal to a copper-chromium alloy. CONSTITUTION:An electrode material is manufactured by compounding the micro-powder of copper and chromium obtained through an atomizing method with the micro-powder of an alloy of copper and metal having its fusion point lower than that of this copper and that is obtained through the atomizing method, and then heating the inter-compounded micro-powder to be sintered in a non-oxidizing atmosphere.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、銅−クロム系の合金に
銅よりも低融点の金属を添加したアトマイズ法による金
属微粉末を原料とする電極材料の製造方法に関し、特に
真空インタラプタの電極に用いて好適である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an electrode material using a fine metal powder as a raw material by an atomizing method in which a metal having a melting point lower than that of copper is added to a copper-chromium alloy, and more particularly to a vacuum interrupter electrode. It is suitable for use in.

【0002】[0002]

【従来の技術】真空インタラプタの電極材料として要求
される重要な性能の一つに電流しゃ断性能の高いことが
挙げられる。
2. Description of the Related Art One of the important performances required as a material for a vacuum interrupter electrode is high current interruption performance.

【0003】銅(Cu)−クロム(Cr)合金は、この電流しゃ
断性能が非常に優れた電極材料として知られており、従
来では電解法等により製造された銅の粉体と、粉砕法等
により製造されたクロムの粉体とを混合したものを圧縮
加圧成形し、これを高温で焼結する粉末冶金法による製
造方法が一般的である。
A copper (Cu) -chromium (Cr) alloy is known as an electrode material having an excellent current cut-off performance. Conventionally, a copper powder produced by an electrolytic method or the like and a pulverizing method or the like are used. A general method is a powder metallurgical method in which a mixture of the chrome powder produced by (1) and (2) is compression-pressed and sintered at high temperature.

【0004】この銅−クロム合金は、銅のマトリックス
中にクロムが分散したものであるが、電極材料としての
電気的特性に着目した場合、微細なクロムが銅マトリッ
クス中に均一に分散している方が好ましい。
This copper-chromium alloy is one in which chromium is dispersed in a copper matrix, and when attention is paid to the electrical characteristics as an electrode material, fine chromium is uniformly dispersed in the copper matrix. Is preferred.

【0005】ところが、粉末冶金法により製造される従
来の銅−クロム合金の場合、粉砕法により機械的に粉砕
して得られるクロム粉末の粒度分布の幅が非常に大き
く、しかもその平均粒径が40μm程度にも達するた
め、銅の粉体とクロムの粉体とを混合する際にこれらの
比重差や粉体の粒度、或いは粒度分布の相違により、均
一に混合され難い欠点を有する。この結果、焼結後にお
ける銅マトリックス中のクロムが微細且つ均一に分散せ
ず、その電気的特性が期待できるほど良好ではなかっ
た。
However, in the case of the conventional copper-chromium alloy produced by the powder metallurgy method, the width of the grain size distribution of the chromium powder obtained by mechanically pulverizing by the pulverizing method is very large, and the average grain size thereof is large. Since it reaches about 40 μm, when the copper powder and the chromium powder are mixed, there is a drawback that it is difficult to mix them uniformly due to the difference in specific gravity, the particle size of the powder, or the difference in particle size distribution. As a result, the chromium in the copper matrix after sintering was not finely and uniformly dispersed, and its electrical characteristics were not so good as expected.

【0006】そこで、クロム粉末を更に機械的に粉砕し
てその粒径を小さくすることが考えられるが、この場合
には粉砕の過程及び保管時にクロム粉体の表面が酸化が
進行し、酸素含有量の増加に伴って焼結性が低下してし
まう問題も生ずる。又、粉砕法により得られるクロム粉
末をふるいで分級し、微細径のクロム粉末のみを使用す
ることも考えられるが、この方法では歩留りが極めて悪
くなってしまい、製造コストが嵩む原因となる。
Therefore, it is conceivable to further mechanically pulverize the chromium powder to reduce its particle size. In this case, the surface of the chromium powder is oxidized during the pulverization process and storage, and oxygen content is increased. There is also a problem that the sinterability decreases as the amount increases. It is also conceivable to classify the chrome powder obtained by the pulverizing method by sieving and use only the chrome powder having a fine diameter. However, this method causes extremely low yield and causes an increase in manufacturing cost.

【0007】このようなことから、本発明者らは微細化
が困難で表面酸化の問題を抱えたクロムの機械的粉砕法
を採用せず、アトマイズ法により銅−クロム合金の微粉
末を製造し、これを焼結して電極材料を製造する方法を
提案し、銅マトリックス中に微細な粒径のクロムが均一
に分散した銅−クロムを得ることによって、従来の焼結
冶金法等による銅−クロム合金と比べ、しゃ断電流値が
大きく改善された電極材料を提供できるようになった。
For these reasons, the present inventors have manufactured a fine powder of a copper-chromium alloy by the atomization method without adopting the mechanical pulverization method of chromium, which is difficult to miniaturize and has the problem of surface oxidation. Proposing a method for producing an electrode material by sintering this, and obtaining copper-chrome in which chromium having a fine particle size is uniformly dispersed in a copper matrix, copper- It has become possible to provide an electrode material having a greatly improved breaking current value as compared with a chromium alloy.

【0008】[0008]

【発明が解決しようとする課題】アトマイズ法による原
料を用い、焼結法にて製造することにより、電流しゃ断
性能を優れたものにすることができる銅−クロム合金で
あっても、他の電極材料と比較すると接触抵抗値や耐溶
着性能の点では未だ充分とは言えない。
[Problems to be Solved by the Invention] Even if a copper-chromium alloy which can be excellent in current interruption performance is manufactured by a sintering method using a raw material by an atomizing method, another electrode is used. Compared with the materials, it cannot be said that they are sufficient in terms of contact resistance and welding resistance.

【0009】そこで、このアトマイズ法により製造され
た銅−クロム合金の微粉末に接触抵抗値を低下させて耐
溶着性能を向上させ得るビスマス(Bi)等の低融点金属の
粉末を混合し、これらを加熱して焼結させることによ
り、しゃ断電流値が大きくて接触抵抗値が低く、しかも
耐溶着力等の優れた電極材料を得ることを試みた。
Therefore, a fine powder of a copper-chromium alloy produced by this atomization method is mixed with a powder of a low melting point metal such as bismuth (Bi) which can reduce the contact resistance value and improve the welding resistance performance. It was attempted to obtain an electrode material having a large breaking current value, a low contact resistance value, and an excellent welding resistance, etc., by heating and sintering.

【0010】ところが、この方法では焼結の際の加熱工
程中に低融点金属の蒸発飛散が激しく、アトマイズ法に
よる銅−クロム合金の微粉末と低融点金属の粉末とを混
合する際、この低融点金属の飛散を見越してこれらの割
合を設定する必要がある。しかも、銅−クロム合金の微
粉末に対する低融点金属の混合割合が数パーセント以下
となるため、これらを均一にばらつきなく混合すること
は非常に難しく、製造工程が煩雑となってしまう。更
に、これによって得られる電極材料中に占める低融点金
属の割合に再現性が乏しく、品質を一定に保持すること
が困難であることが判明した。
In this method, however, the low melting point metal evaporates and scatters significantly during the heating step during sintering, and when the fine powder of the copper-chromium alloy and the low melting point metal powder are mixed by the atomizing method, this low melting point metal is mixed. It is necessary to set these ratios in consideration of the scattering of the melting point metal. Moreover, since the mixing ratio of the low melting point metal to the fine powder of the copper-chromium alloy is several percent or less, it is extremely difficult to mix these uniformly and without variation, and the manufacturing process becomes complicated. Further, it was found that the proportion of the low melting point metal in the electrode material obtained thereby was poor in reproducibility and it was difficult to keep the quality constant.

【0011】[0011]

【発明の目的】本発明は、銅−クロム合金に低融点金属
を添加することにより、接触抵抗値が低くしかも耐溶着
性能が良好な電極材料を容易且つ再現性良く製造し得る
方法を提供することを目的とする。
An object of the present invention is to provide a method capable of easily and reproducibly producing an electrode material having a low contact resistance value and a good welding resistance by adding a low melting point metal to a copper-chromium alloy. The purpose is to

【0012】[0012]

【課題を解決するための手段】本発明者らは、銅とクロ
ムとをアトマイズ法により合金微粉末化し、これを非酸
化性雰囲気にて加熱して焼結させることにより、電極材
料の製造が可能であることに着目し、銅と銅よりも低融
点の金属とをアトマイズ法により合金微粉末化し、アト
マイズ法によるこれら銅−低融点金属の微粉末と銅−ク
ロム合金の微粉末とを混合し、これらを非酸化性雰囲気
にて加熱して焼結させることにより、電極材料の製造が
可能であるか否かを調べた。
Means for Solving the Problems The inventors of the present invention can produce an electrode material by atomizing copper and chromium into an alloy fine powder by an atomizing method and heating the alloy in a non-oxidizing atmosphere for sintering. Focusing on the fact that it is possible, alloy fine powder of copper and a metal having a lower melting point than copper by an atomizing method, and mixing the fine powder of these copper-low melting point metal and the fine powder of copper-chromium alloy by the atomizing method Then, it was examined whether or not the electrode material could be manufactured by heating and sintering these in a non-oxidizing atmosphere.

【0013】そこで、銅のインゴットが投入された耐火
るつぼをアルゴン(Ar)ガスや窒素(N 2)ガス或いは真空等
の非酸化性雰囲気にて1200℃に加熱し、これによっ
て耐火るつぼ内の銅を溶解させ、次いで極く小さなブリ
ック状のクロムをこの耐火るつぼ内に投入し、これらを
非酸化性雰囲気にて1700℃まで加熱して銅とクロム
との混合溶湯を得た後、これをアルゴンガスにより5〜
8MPaの圧力で噴霧し、粒径が150μm以下でクロム
の平均粒径が3.5μmとなった銅−クロム合金のアト
マイズ粉末を得た。
Therefore, a refractory containing a copper ingot is used.
Arrange the crucible with argon (Ar) gas or nitrogen (N 2) Gas or vacuum
Heated to 1200 ° C in a non-oxidizing atmosphere of
Melt the copper in the refractory crucible and then
Put chrome-shaped chrome into this refractory crucible and
Copper and chromium by heating to 1700 ° C in a non-oxidizing atmosphere
After obtaining a mixed molten metal with
Sprayed at a pressure of 8MPa and chromium with a particle size of 150μm or less
Of copper-chromium alloy with an average particle size of 3.5 μm
Mize powder was obtained.

【0014】一方、耐火るつぼ内で1200℃に加熱溶
解した銅に対して30重量%の割合のビスマス(Bi)を
投入し、銅とビスマスとの混合溶湯を得た後、これをア
ルゴンガスにより5〜8MPaの圧力で噴霧し、粒径が1
00μm以下となった銅−ビスマス合金のアトマイズ粉
末を得た。そして、このアトマイズ粉末を化学分析した
ところ、ビスマスの含有量は25重量%であった。
On the other hand, 30% by weight of bismuth (Bi) was added to copper which was heated and melted at 1200 ° C. in a refractory crucible to obtain a mixed molten metal of copper and bismuth, which was then treated with argon gas. Sprayed at a pressure of 5-8MPa and the particle size is 1
Atomized powder of copper-bismuth alloy having a particle size of 00 μm or less was obtained. When the atomized powder was chemically analyzed, the bismuth content was 25% by weight.

【0015】なお、銅とクロム及び銅とビスマスとをそ
れぞれ溶融する際には、溶湯の酸素含有量を低減するた
めに酸素含有量の低い銅及びクロム及びビスマスを選定
する一方、上述した非酸化性雰囲気にて溶融するか或い
は脱酸処理を施し、酸素含有量を1000ppm以下に抑
えた。この場合、原料等に混入している不可避の不純
物、例えば鉄(Fe)やニッケル(Ni)等の存在は許容した。
When melting copper and chromium and copper and bismuth, respectively, copper, chromium and bismuth having a low oxygen content are selected in order to reduce the oxygen content of the molten metal, while the above-mentioned non-oxidation is carried out. The oxygen content was suppressed to 1000 ppm or less by melting in a neutral atmosphere or by performing deoxidation treatment. In this case, the presence of inevitable impurities, such as iron (Fe) and nickel (Ni), mixed in the raw materials was allowed.

【0016】しかる後、上述した銅−クロム合金のアト
マイズ粉末と銅−ビスマス合金のアトマイズ粉末とをビ
スマスの割合が0.5重量%となるように混合し、この
混合粉末を直径が50mmの金型に充填し、3.5トン/c
m2の圧力にて円盤状に加圧成形した後、これを5×10
-5Torrの真空炉中において1080℃で30分間加熱
し、焼結させた。そして、この焼結体に含まれるビスマ
スの含有量を10の試料についてそれぞれ測定した結果
を本発明方法として表1に示す。又、この焼結体の組織
を電子顕微鏡にて観察した結果、5μm以下のクロム粒
子が銅マトリックス中に均一に分散していることを確認
できた。
Thereafter, the above-mentioned atomized powder of copper-chromium alloy and atomized powder of copper-bismuth alloy are mixed so that the proportion of bismuth is 0.5% by weight, and this mixed powder is mixed with gold having a diameter of 50 mm. Fill the mold, 3.5 tons / c
After press-molding into a disk shape with a pressure of m 2 , this is 5 × 10
Sintered by heating at 1080 ° C. for 30 minutes in a −5 Torr vacuum furnace. Table 1 shows the results of measuring the bismuth content contained in this sintered body for each of the 10 samples as the method of the present invention. As a result of observing the structure of this sintered body with an electron microscope, it was confirmed that chromium particles of 5 μm or less were uniformly dispersed in the copper matrix.

【0017】比較として、上述したアトマイズ法と同様
な方法により得られる銅−クロム合金微粉末と、この銅
−クロム合金微粉末に対して0.5重量%の割合のビス
マスの粉末とを混合し、これを直径が50mmの金型に充
填し、3.5トン/cm2の加圧力にて円盤状に加圧成形し
た後、これを5×10-5Torrの真空中にて30分間10
80℃に加熱焼結させた場合(以下、この製造方法を粉
末添加法と呼称する)におけるこの焼結体に含まれるビ
スマスの含有量を10の試料についてそれぞれ測定した
結果を表1に併せて示す。
For comparison, copper-chromium alloy fine powder obtained by the same method as the atomizing method described above and 0.5% by weight of bismuth powder with respect to this copper-chromium alloy fine powder are mixed. Then, this was filled in a mold having a diameter of 50 mm, pressure-molded into a disk shape with a pressing force of 3.5 tons / cm 2 , and then this was molded in a vacuum of 5 × 10 −5 Torr for 10 minutes for 30 minutes.
Table 1 also shows the results of measuring the bismuth content of each of the 10 samples when heated and sintered at 80 ° C. (hereinafter, this manufacturing method is referred to as a powder addition method). Show.

【0018】更に、銅の粉末とクロムの粉末とこれらに
対して0.5重量%の割合のビスマスの粉末とを混合
し、これによって得られる銅とクロムとビスマスとの混
合粉末を直径が50mmの金型に充填し、3.5トン/cm2
の加圧力にて円盤状に加圧成形した後、これを5×10
-5Torrの真空中にて30分間1080℃に加熱焼結させ
た場合(以下、この製造方法を従来方法と呼称する)に
おけるこの焼結体に含まれるビスマスの含有量を10の
試料についてそれぞれ測定した結果も表1に併せて示
す。
Further, a copper powder, a chromium powder and a bismuth powder in a proportion of 0.5% by weight relative to these are mixed, and the mixed powder of copper, chromium and bismuth obtained by this is mixed to have a diameter of 50 mm. Filled into the mold of 3.5 tons / cm 2
After press-molding into a disk shape with a pressing force of 5 × 10
The content of bismuth contained in this sintered body when heated and sintered at 1080 ° C. for 30 minutes in a vacuum of −5 Torr for each of 10 samples The measured results are also shown in Table 1.

【0019】[0019]

【表1】 [Table 1]

【0020】以上の結果から明らかなように、本発明方
法は粉末添加法及び従来方法よりもビスマスが飛散し難
く、しかもビスマスの割合のばらつきが少ないことが判
明した。
As is clear from the above results, it was found that the method of the present invention is less likely to cause bismuth to scatter than the powder addition method and the conventional method, and the bismuth ratio is less uneven.

【0021】本発明による電極材料の製造方法は、上述
した考察及び試験に基づいてなされたものであり、アト
マイズ法により得られた銅及びクロムの合金微粉末と、
アトマイズ法により得られた銅及びこの銅よりも低融点
の金属の合金微粉末とを混合し、これらを非酸化性雰囲
気にて加熱して焼結させるようにしたことを特徴とする
ものである。
The method for producing the electrode material according to the present invention is based on the above-mentioned consideration and test, and includes copper and chromium alloy fine powder obtained by the atomizing method,
It is characterized in that copper obtained by the atomizing method and alloy fine powder of a metal having a melting point lower than that of copper are mixed, and these are heated and sintered in a non-oxidizing atmosphere. ..

【0022】ここで、銅よりも低融点で電極材料の接触
抵抗値を下げて耐溶着性能を向上させ得る金属(以下、
これを低融点金属と呼称する)としては、ビスマス(B
i),アンチモン(Sb),テルル(Te),セレン(Se),鉛(Pb)のう
ちの1種類以上を採用することが可能である。
Here, a metal having a melting point lower than that of copper and capable of lowering the contact resistance value of the electrode material to improve the welding resistance performance (hereinafter, referred to as
This is called a low melting point metal), bismuth (B
It is possible to adopt one or more of i), antimony (Sb), tellurium (Te), selenium (Se), and lead (Pb).

【0023】なお、銅及びクロムに対してこれら低融点
金属の割合が0.02%未満の場合は、低融点金属を添
加したことによる接触抵抗値の低下や耐溶着性能の向上
を期待することがほとんどできない。逆に、3.0重量
%を越えた量の低融点金属を添加すると、電流しゃ断性
能が急激に悪化することとなる。従って、銅及びクロム
に対するこれら低融点金属の割合は、0.02〜3.0重
量%の範囲に収めることが望ましい。
When the ratio of these low melting point metals to copper and chromium is less than 0.02%, it is expected that the addition of the low melting point metal will lower the contact resistance value and improve the welding resistance performance. Can hardly do. On the contrary, if the low melting point metal is added in an amount of more than 3.0% by weight, the current cut-off performance is abruptly deteriorated. Therefore, it is desirable that the ratio of these low melting point metals to copper and chromium is in the range of 0.02 to 3.0% by weight.

【0024】又、アトマイズ法により銅と低融点金属と
の合金微粉末を製造する際、銅に対するこの低融点金属
の割合が10%未満の場合には、これら銅と低融点金属
との合金微粉末の混合割合を銅とクロムとの合金微粉末
に対して多く設定しなければならず、全体的に銅の割合
が増加して遮断性能の低下を招来する虞が生ずる。逆
に、50重量%を越えた量の低融点金属を添加した場合
には、この銅と低融点金属との合金微粉末を製造する際
に、低融点金属の飛散量が著しく増大し、更に低融点金
属が析出して銅の結晶粒間に存在する低融点金属の含有
量に濃度差が生じ、均一な合金微粉末を得ることができ
ない。従って、銅と低融点金属との合金微粉末を製造す
る際の銅に対する低融点金属の割合は、10%〜50%
の範囲に収めることが望ましい。
Further, when the fine alloy powder of copper and low melting point metal is produced by the atomization method, if the ratio of the low melting point metal to copper is less than 10%, the alloy fineness of the copper and low melting point metal is reduced. The mixing ratio of the powder has to be set to a large amount with respect to the fine alloy powder of copper and chromium, and there is a possibility that the ratio of copper is increased as a whole and the barrier performance is deteriorated. On the contrary, when the low melting point metal in an amount exceeding 50% by weight is added, the amount of the low melting point metal scattered remarkably increases during the production of the alloy fine powder of the copper and the low melting point metal. A low melting point metal precipitates and a concentration difference occurs in the content of the low melting point metal existing between the crystal grains of copper, and a uniform alloy fine powder cannot be obtained. Therefore, the ratio of the low melting point metal to copper at the time of producing an alloy fine powder of copper and the low melting point metal is 10% to 50%.
It is desirable to stay within the range.

【0025】[0025]

【作用】アトマイズ法によって得られる銅−クロム合金
微粉末は、銅マトリックス中に微小な粒径のクロムが均
一に分散している。又、アトマイズ法によって得られる
銅−低融点金属合金微粉末は、銅マトリックス中に微小
な粒径の低融点金属が均一に分散している。これらを均
一に混合して加熱することにより、これら金属結晶粒子
が粗大化することなく緻密に焼結して一体化される。
In the fine copper-chromium alloy powder obtained by the atomizing method, chromium having a fine particle size is uniformly dispersed in the copper matrix. Further, in the copper-low melting point metal alloy fine powder obtained by the atomization method, the low melting point metal having a fine particle size is uniformly dispersed in the copper matrix. By uniformly mixing and heating these, the metal crystal particles are densely sintered and integrated without coarsening.

【0026】[0026]

【実施例】真空インタラプタは、その概略構造の一例を
表す図1に示すようなものであり、相互に一直線状をな
す一対のリード棒11,12の対向端面には、それぞれ
電極13,14が図示しないろう材を介して一体的に接
合されている。これら電極13,14を囲む筒状のシー
ルド15の外周中央部は、このシールド15を囲む一対
の絶縁筒16,17の間に挟まれた状態で保持されてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A vacuum interrupter is as shown in FIG. 1 showing an example of a schematic structure thereof, and electrodes 13 and 14 are provided on opposite end faces of a pair of lead rods 11 and 12 which are in a straight line with each other. They are integrally joined via a brazing material (not shown). A central portion of the outer circumference of a cylindrical shield 15 that surrounds the electrodes 13 and 14 is held in a state of being sandwiched between a pair of insulating cylinders 16 and 17 that surrounds the shield 15.

【0027】そして、一方の前記リード棒11は、一方
の絶縁筒16の一端に接合された金属端板18を気密に
貫通した状態で、この金属端板18に一体的に固定され
ている。又、図示しない駆動装置に連結される他方のリ
ード棒12は、他方の絶縁筒17の他端に気密に接合さ
れた他方の金属端板19にベローズ20を介して連結さ
れ、駆動装置の作動に伴って電極13,14の対向方向
に往復動可能に可動側の電極14が固定側の電極13に
対して開閉動作するようになっている。
One of the lead rods 11 is integrally fixed to the metal end plate 18 in a state where the metal end plate 18 joined to one end of the one insulating cylinder 16 is hermetically penetrated. Further, the other lead rod 12 connected to the drive device (not shown) is connected to the other metal end plate 19 airtightly joined to the other end of the other insulating cylinder 17 via the bellows 20 to operate the drive device. Accordingly, the movable-side electrode 14 opens and closes with respect to the fixed-side electrode 13 so that the electrodes 13 and 14 can reciprocate in opposite directions.

【0028】本実施例における前記電極13,14は、
アトマイズ法による原料を焼結してなる銅−クロム−鉛
合金で構成される。
The electrodes 13 and 14 in this embodiment are
It is composed of a copper-chromium-lead alloy obtained by sintering a raw material by an atomizing method.

【0029】本発明によるこの電極13,14の製造方
法の一例を以下に記すと、前述した方法と全く同様な方
法で銅−クロム合金のアトマイズ粉末を得る一方、耐火
るつぼ内で1200℃に加熱溶解した銅に対して27重
量%の割合の鉛(Pb)を投入し、銅と鉛との混合溶湯を
得た後、これをアルゴンガスにより5〜8MPaの圧力で
噴霧し、粒径が100μm以下となった銅−鉛合金のア
トマイズ粉末を得た。そして、このアトマイズ粉末を化
学分析したところ、鉛の含有量は25重量%であった。
An example of the method for producing the electrodes 13 and 14 according to the present invention will be described below. Atomized powder of copper-chromium alloy is obtained by the same method as described above, while heating to 1200 ° C. in a refractory crucible. 27% by weight of lead (Pb) was added to the molten copper to obtain a molten mixture of copper and lead, which was then sprayed with argon gas at a pressure of 5 to 8 MPa so that the particle size was 100 μm. The atomized powder of the following copper-lead alloy was obtained. Then, when the atomized powder was chemically analyzed, the lead content was 25% by weight.

【0030】次に、上述した銅−クロム合金のアトマイ
ズ粉末と銅−鉛合金のアトマイズ粉末とを鉛の割合が
0.5重量%となるように混合し、この混合粉末を直径
が50mmの金型に充填し、3.5トン/cm2の圧力にて円
盤状に加圧成形した後、これを5×10-5Torrの真空炉
中において1080℃で30分間加熱し、焼結させた。
そして、この焼結体に含まれる鉛の含有量を10の試料
についてそれぞれ測定した結果を本発明方法として表2
に示す。
Next, the above-mentioned atomized powder of copper-chromium alloy and atomized powder of copper-lead alloy were mixed so that the proportion of lead was 0.5% by weight, and this mixed powder was mixed with gold having a diameter of 50 mm. After filling in a mold and pressure-molding into a disk shape at a pressure of 3.5 ton / cm 2 , this was heated in a vacuum furnace of 5 × 10 −5 Torr at 1080 ° C. for 30 minutes and sintered. ..
The results of measuring the content of lead contained in this sintered body for each of the 10 samples are shown in Table 2 as the method of the present invention.
Shown in.

【0031】比較として、アトマイズ法により得られる
銅−クロム合金微粉末と、この銅−クロム合金微粉末に
対して0.5重量%の割合の鉛の粉末とを混合し、前述
した粉末添加法により銅−クロム−鉛合金の焼結体を
得、この焼結体に含まれる鉛の含有量を10の試料につ
いてそれぞれ測定した結果を表2に併せて示す。
For comparison, a fine powder of copper-chromium alloy obtained by the atomizing method and a powder of lead of 0.5% by weight based on the fine powder of copper-chromium alloy are mixed, and the above-mentioned powder addition method is used. A copper-chromium-lead alloy sintered body was obtained in accordance with the above, and the content of lead contained in this sintered body was measured for each of 10 samples.

【0032】更に、銅の粉末とクロムの粉末とこれらに
対して0.5重量%の割合の鉛の粉末とを混合し、これ
によって得られる銅とクロムと鉛の混合粉末を前述した
従来法により銅−クロム−鉛合金の焼結体を得、この焼
結体に含まれる鉛の含有量を10の試料についてそれぞ
れ測定した結果も表2に併せて示す。
Further, a copper powder, a chromium powder, and a lead powder in an amount of 0.5% by weight relative to these are mixed, and the copper, chromium, and lead mixed powder obtained by this is mixed with the above-mentioned conventional method. A copper-chromium-lead alloy sintered body was obtained in accordance with the above, and the results of measuring the lead content in this sintered body for each of the 10 samples are also shown in Table 2.

【0033】[0033]

【表2】 [Table 2]

【0034】以上の結果から明らかなように、低融点金
属として鉛を採用した本実施例においては、粉末添加法
及び従来方法よりも鉛の飛散量が非常に少なく、しかも
鉛の割合にばらつきの少ないことが判明した。
As is clear from the above results, in the present example in which lead is used as the low melting point metal, the amount of lead scattered is much smaller than that in the powder addition method and the conventional method, and the lead ratio varies. It turned out to be few.

【0035】又、上述した各試料を直径が40mmのスパ
イラル状電極として機械加工し、図1に示す真空インタ
ラプタに組み込んで耐電圧特性及び耐溶着力について更
に試験した結果、本発明方法は粉末添加法及び従来方法
よりも接触抵抗値を少なくしかもそのばらつきを少なく
できることが判明した。
Each of the above-mentioned samples was machined into a spiral electrode having a diameter of 40 mm and incorporated into the vacuum interrupter shown in FIG. 1, and further tested for withstand voltage characteristics and welding resistance. It was also found that the contact resistance value was smaller than that of the conventional method and the variation thereof could be reduced.

【0036】上述した実施例では低融点金属として鉛を
採用したが、この低融点金属としてテルルを用いた本発
明によるこの電極13,14の製造方法の他の一例を以
下に記すと、前述した方法と全く同様な方法で銅−クロ
ム合金のアトマイズ粉末を得る一方、耐火るつぼ内で1
200℃に加熱溶解した銅に対して27重量%の割合の
テルル(Te)を投入し、銅とテルルとの混合溶湯を得た
後、これをアルゴンガスにより5〜8MPaの圧力で噴霧
し、粒径が100μm以下となった銅−テルル合金のア
トマイズ粉末を得た。そして、このアトマイズ粉末を化
学分析したところ、テルルの含有量は25重量%であっ
た。
Although lead is used as the low melting point metal in the above-described embodiments, another example of the method for manufacturing the electrodes 13 and 14 according to the present invention using tellurium as the low melting point metal will be described below. Atomized powder of copper-chromium alloy is obtained in the same manner as the above method, while
Tellurium (Te) at a ratio of 27% by weight was added to the copper melted by heating at 200 ° C. to obtain a molten mixture of copper and tellurium, which was then sprayed with argon gas at a pressure of 5 to 8 MPa, Atomized powder of copper-tellurium alloy having a particle size of 100 μm or less was obtained. When the atomized powder was chemically analyzed, the tellurium content was 25% by weight.

【0037】次に、上述した銅−クロム合金のアトマイ
ズ粉末と銅−テルル合金のアトマイズ粉末とをテルルの
割合が0.5重量%となるように混合し、この混合粉末
を直径が50mmの金型に充填し、3.5トン/cm2の圧力
にて円盤状に加圧成形した後、これを5×10-5Torrの
真空炉中において1080℃で30分間加熱し、焼結さ
せた。そして、この焼結体に含まれるテルルの含有量を
10の試料についてそれぞれ測定した結果を本発明方法
として表3に示す。
Next, the above-described atomized powder of copper-chromium alloy and atomized powder of copper-tellurium alloy were mixed so that the ratio of tellurium was 0.5% by weight, and the mixed powder was mixed with gold having a diameter of 50 mm. After filling in a mold and pressure-molding into a disk shape at a pressure of 3.5 ton / cm 2 , this was heated in a vacuum furnace of 5 × 10 −5 Torr at 1080 ° C. for 30 minutes and sintered. .. Then, Table 3 shows the results of measuring the tellurium content contained in this sintered body for each of the 10 samples as the method of the present invention.

【0038】比較として、アトマイズ法により得られる
銅−クロム合金微粉末と、この銅−クロム合金微粉末に
対して0.5重量%の割合のテルルの粉末とを混合し、
前述した粉末添加法により銅−クロム−テルル合金の焼
結体を得、この焼結体に含まれるテルルの含有量を10
の試料についてそれぞれ測定した結果を表3に併せて示
す。
For comparison, copper-chromium alloy fine powder obtained by the atomizing method and 0.5% by weight of tellurium powder with respect to the copper-chromium alloy fine powder are mixed,
A copper-chromium-tellurium alloy sintered body was obtained by the above-mentioned powder addition method, and the content of tellurium contained in this sintered body was 10%.
Table 3 also shows the measurement results of the respective samples.

【0039】更に、銅の粉末とクロムの粉末とこれらに
対して0.5重量%の割合のテルルの粉末とを混合し、
これによって得られる銅とクロムとテルルの混合粉末を
前述した従来法により銅−クロム−テルル合金の焼結体
を得、この焼結体に含まれるテルルの含有量を10の試
料についてそれぞれ測定した結果も表3に併せて示す。
Further, copper powder, chromium powder and tellurium powder in a proportion of 0.5% by weight with respect to these are mixed,
The mixed powder of copper, chromium and tellurium thus obtained was obtained by the above-mentioned conventional method to obtain a sintered body of a copper-chromium-tellurium alloy, and the content of tellurium contained in this sintered body was measured for each of 10 samples. The results are also shown in Table 3.

【0040】[0040]

【表3】 [Table 3]

【0041】以上の結果から明らかなように、低融点金
属としてテルルを採用した場合においても、本発明方法
は粉末添加法及び従来方法よりテルルの飛散量が非常に
少なく、しかもテルルの割合にばらつきの少ないことが
判明した。
As is clear from the above results, even when tellurium is used as the low melting point metal, the method of the present invention has a much smaller amount of tellurium scattered than the powder addition method and the conventional method, and the tellurium ratio varies. Turned out to be less.

【0042】又、上述した各試料を直径が40mmのスパ
イラル状電極として機械加工し、図1に示す真空インタ
ラプタに組み込んで耐電圧特性及び耐溶着力について更
に試験した結果、本発明方法は粉末添加法及び従来方法
よりも接触抵抗値を少なくしかもそのばらつきを少なく
できることが判明した。
Each of the above-mentioned samples was machined into a spiral electrode having a diameter of 40 mm and incorporated into the vacuum interrupter shown in FIG. 1 to further test the withstand voltage characteristics and the welding resistance. It was also found that the contact resistance value was smaller than that of the conventional method and the variation thereof could be reduced.

【0043】上述した二つの実施例では、低融点金属と
して鉛及びテルルをそれぞれ単独で採用したが、この他
にアンチモンやセレンを単独で採用したり、これらを2
種類以上混合しても上述した場合と同様な性能の電極材
料を得ることができる。
In the above-mentioned two embodiments, lead and tellurium are individually used as the low melting point metal, but in addition to this, antimony or selenium is independently used, or both of them are used.
Even if more than one kind is mixed, an electrode material having the same performance as the above case can be obtained.

【0044】[0044]

【発明の効果】本発明の電極材料の製造方法によると、
アトマイズ法により得られた銅とクロムとの合金微粉末
と、アトマイズ法により得られた銅と低融点金属との合
金微粉末とを混合し、これらを非酸化性雰囲気にて加熱
して焼結させるようにしたので、従来の方法よりも低融
点金属の飛散量が抑制される結果、この低融点金属の割
合を比較的高精度に制御することが可能となり、粉末添
加法や従来方法による製造方法と比べて、しゃ断電流値
を高くできると共に接触抵抗値が低く、しかも耐溶着力
の優れた電極材料を提供することができる。
According to the method for producing an electrode material of the present invention,
Fine alloy powder of copper and chromium obtained by the atomizing method, and fine alloy powder of copper and low melting point metal obtained by the atomizing method are mixed, and these are heated in a non-oxidizing atmosphere and sintered. As a result, the scattering amount of the low melting point metal is suppressed as compared with the conventional method, and as a result, it becomes possible to control the ratio of the low melting point metal with relatively high accuracy, and the powder addition method or the conventional method is used. As compared with the method, it is possible to provide an electrode material which can have a higher breaking current value, a lower contact resistance value and an excellent welding resistance.

【図面の簡単な説明】[Brief description of drawings]

【図1】真空インタラプタの一例を表す断面図である。FIG. 1 is a cross-sectional view showing an example of a vacuum interrupter.

【符号の説明】[Explanation of symbols]

11,12:リード棒 13,14:電極 11,12: Lead bar 13,14: Electrode

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 伸尚 東京都品川区大崎二丁目1番17号 株式会 社明電舍内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuhisa Suzuki 2-1-1 Osaki, Shinagawa-ku, Tokyo Meiden Shosha Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 アトマイズ法により得られた銅及びクロ
ムの合金微粉末と、アトマイズ法により得られた銅及び
この銅よりも低融点の金属の合金微粉末とを混合し、こ
れらを非酸化性雰囲気にて加熱して焼結させるようにし
たことを特徴とする電極材料の製造方法。
1. A fine alloy powder of copper and chromium obtained by the atomizing method and a fine alloy powder of copper and a metal having a melting point lower than that of copper obtained by the atomizing method are mixed to obtain non-oxidizing properties. A method for producing an electrode material, comprising heating and sintering in an atmosphere.
【請求項2】 低融点の金属がビスマス,アンチモン,テ
ルル,セレン,鉛のうちの1種類以上であることを特徴と
する請求項1に記載した電極材料の製造方法。
2. The method for producing an electrode material according to claim 1, wherein the low melting point metal is one or more of bismuth, antimony, tellurium, selenium, and lead.
JP4008269A 1991-10-25 1992-01-21 Manufacture of electrode material Withdrawn JPH05198230A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP4008269A JPH05198230A (en) 1992-01-21 1992-01-21 Manufacture of electrode material
EP19920118218 EP0538896A3 (en) 1991-10-25 1992-10-23 Process for forming contact material
US07/965,203 US5352404A (en) 1991-10-25 1992-10-23 Process for forming contact material including the step of preparing chromium with an oxygen content substantially reduced to less than 0.1 wt. %
TW081108517A TW240184B (en) 1991-10-25 1992-10-24
KR1019920019655A KR950008375B1 (en) 1991-10-25 1992-10-24 Process for forming contact material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4008269A JPH05198230A (en) 1992-01-21 1992-01-21 Manufacture of electrode material

Publications (1)

Publication Number Publication Date
JPH05198230A true JPH05198230A (en) 1993-08-06

Family

ID=11688448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4008269A Withdrawn JPH05198230A (en) 1991-10-25 1992-01-21 Manufacture of electrode material

Country Status (1)

Country Link
JP (1) JPH05198230A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231510A (en) * 2001-02-01 2002-08-16 Anzai Setsu Current-control resistor element
JP2006140073A (en) * 2004-11-15 2006-06-01 Hitachi Ltd Electrode and electrical contact and its manufacturing method
WO2017212731A1 (en) 2016-06-08 2017-12-14 株式会社明電舎 Method for manufacturing electrode material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231510A (en) * 2001-02-01 2002-08-16 Anzai Setsu Current-control resistor element
JP2006140073A (en) * 2004-11-15 2006-06-01 Hitachi Ltd Electrode and electrical contact and its manufacturing method
WO2017212731A1 (en) 2016-06-08 2017-12-14 株式会社明電舎 Method for manufacturing electrode material
US10766069B2 (en) 2016-06-08 2020-09-08 Meidensha Corporation Method for manufacturing electrode material

Similar Documents

Publication Publication Date Title
US4743718A (en) Electrical contacts for vacuum interrupter devices
EP0083200B1 (en) Electrode composition for vacuum switch
US5236523A (en) Silver- or silver-copper alloy-metal oxide composite material
JP3067318B2 (en) Manufacturing method of electrode material
EP0521274B1 (en) Process for manufacturing a contact material for vacuum circuit breakers
JP3663038B2 (en) Vacuum valve
US5352404A (en) Process for forming contact material including the step of preparing chromium with an oxygen content substantially reduced to less than 0.1 wt. %
JPH05198230A (en) Manufacture of electrode material
US5882448A (en) Contact material for vacuum valve and method of manufacturing the same
JP3106610B2 (en) Manufacturing method of electrode material
JPH05117720A (en) Production of electrode material
JP3106609B2 (en) Manufacturing method of electrode material
JPH05217473A (en) Manufacture of electrode material
JP3067317B2 (en) Manufacturing method of electrode material
JPS637345A (en) Electrical contact material and its production
JPH0435545B2 (en)
JP3168635B2 (en) Manufacturing method of electrode material
JPS6141091B2 (en)
JPH05101751A (en) Manufacture of electrode material
KR0171607B1 (en) Electrode for vacuum circuit breaker and vacuum circuit breaker
Gotkhindikar Nitin et al. Development of Copper-Chromium Electrical Contact Materials by Powder Forging
WO2023238285A1 (en) Powder, metal component, electrical contact, and method for producing powder
JPH08143989A (en) Production of electrical contact material
JPH07111857B2 (en) Contact material for vacuum valve and manufacturing method thereof
JPH08171830A (en) Manufacturing method of contact material for vacuum valve

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990408