JPH05198710A - Cooling device for integrated circuit - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a cooling device for an integrated circuit capable of efficiently cooling the integrated circuit via an LSI case. [Structure] A vertical heat transfer plate 6 equidistantly provided on a heat dissipation surface of an LSI case 2 on which an integrated circuit 1 is mounted, and a vertical heat transfer plate 6 supported by the vertical heat transfer plate 6 substantially parallel to the heat dissipation surface of the LSI case 2. A plurality of parallel heat dissipation plates 7 mounted at predetermined intervals
Are provided, and the LSI is provided at the center of the plurality of parallel heat dissipation plates 7.
A large opening 9 is formed as the distance from the case 2 increases, and a nozzle 8 for injecting a refrigerant in a direction along the vertical heat transfer plate 6 is provided to the entire parallel heat dissipation plate 7 including the opening 9 so that a plurality of parallel heat dissipation devices are provided. Equipped to face the board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling structure.

[0002]

2. Description of the Related Art Conventionally, as a cooling structure of this type, an example shown in FIG. 5 (S. Oktay, H. C. Kammerer "AConduc
tion-Cooled Module for High Performance LSI
Devise "IBM J. RES. DEVELOP Vo
L26 No1 Jan 1982), the piston 54 is pressed against the integrated circuit 51 by the spring 55 to remove heat, and the heat is transferred to the cooling plate 58 through the space filled with the helium gas 60, the hat 56, the intervening layer 57, and the cooling plate 58. There is a method of radiating heat to 59. Although the above-mentioned example uses the liquid refrigerant, there is also one in which large fins are attached for forced air cooling. Further, as shown in FIG. 6, the heat generated in the integrated circuit 61 is transmitted to the heat transfer substrate 63 and the deformable heat transfer body 64, and the liquid refrigerant is ejected from the nozzle 66 to cool the heat transfer plate 65. There is also a method.

[0003]

Among the conventional cooling structures described above, in the example of FIG. 5, in order to follow the variations in height and inclination that occur when the integrated circuit is mounted on the wiring board, the piston and the integrated circuit are connected. Although the contact surface with and is a spherical surface and a gap is provided between the hat and the piston, this has a disadvantage that the effective heat transfer area is reduced and the cooling capacity is reduced.

Further, in the example of FIG. 6, the jet flow is collided with the heat transfer plate for cooling. To improve the cooling capacity, the flow velocity of the jet flow is increased or the nozzle diameter is increased to increase the flow rate. Although it is necessary to increase the flow rate, the force applied to the integrated circuit increases, which adversely affects the reliability of the connection between the integrated circuit and the wiring board.

When the nozzle diameter is increased, the refrigerant flows radially after colliding with the heat radiating plate, so that the jet flow outside the nozzle is obstructed by the flow of the jet flow in the central portion after the collision, resulting in poor cooling capacity. , It is difficult to improve the ability as a whole.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a cooling device for an integrated circuit, which is capable of improving the disadvantages of the conventional example and, in particular, efficiently cooling the integrated circuit through an LSI case.

[0007]

According to the present invention, a vertical heat transfer plate is provided equidistantly on a heat dissipation surface of an LSI case on which an integrated circuit is mounted, and a heat dissipation surface of the LSI case supported by the vertical heat transfer plate. A plurality of parallel heat dissipation plates mounted substantially parallel to each other at a predetermined interval, and a large opening is formed in the central portion of the plurality of parallel heat dissipation plates as the distance from the LSI case increases. The nozzles for injecting the refrigerant in the direction along the vertical heat transfer plate with respect to the entire parallel heat dissipation plate are provided so as to face the plurality of parallel heat dissipation plates. This aims to achieve the above-mentioned object.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In the embodiment shown in FIGS. 1 and 2, the integrated circuit 1 is mounted in the LSI case 2. The LSI case 2 is connected to the wiring board 4 by solder bumps 3. The LSI case 2 is a wiring board 4
The opposite surface is the heat dissipation surface. A heat radiation fin 5 is fixed to the heat radiation surface of the LSI case 2 so as to be horizontal to the heat radiation surface by brazing or adhesion with a good heat conductive adhesive to transmit heat. Of course, means such as screwing may be used.

A nozzle 8 corresponding to the LSI case 2 is provided on the heat radiation fin 5, and the nozzle 8 is provided at a position where the refrigerant is ejected and collides with the heat radiation fin 5. FIG. 2 is a view taken along the line AA of FIG. 1, and is a view of the heat radiation fin 5 as seen from the nozzle 8 side.

The radiating fin 5 is composed of a vertical heat transfer plate 6 and a plurality of horizontal heat radiating plates 7. In addition, the horizontal heat sink 7
Are fixed by a vertical heat transfer plate 6 so as to be horizontal to the heat dissipation surface of the LSI case 2. An opening 9 is provided in the center of the horizontal heat dissipation plate except for a portion to be mounted on the LSI case 2, and the opening 9 becomes larger as the distance from the LSI case 2 becomes closer to the nozzle 8.

In this embodiment, there are four horizontal heat dissipation plates and the openings 9 are round holes, but the number of horizontal heat dissipation plates 7 and the shape of the openings 9 may be changed.

The heat generated in the integrated circuit 1 is LS
It is transmitted to the heat radiation fins 5 through the I-case 2, and is transmitted to each horizontal heat radiation plate 7 by the vertical heat transfer plate 6. The refrigerant is ejected from the nozzle 8 to form a jet, and the refrigerant collides with the uppermost horizontal radiator plate 7, but the central portion of the jet flows through the opening 9 of the horizontal radiator plate 7 to the next horizontal radiator plate, The colliding refrigerant flows on the horizontal heat dissipation plate 7.

At this time, the refrigerant collides with the horizontal radiator plate 7,
Heat is radiated from the horizontal heat radiating plate 7 to the refrigerant. After that, the refrigerant is
It flows on the horizontal heat radiating plate 7 in the outer peripheral direction, and the heat is radiated from the horizontal heat radiating plate 7 and the vertical heat transfer plate 6 to the refrigerant. The second and third horizontal radiator plates 7 are also repeated to radiate heat to the refrigerant, and finally L
Colliding with a horizontal heat sink attached on the SI case 2,
Runs outwards.

In this way, the heat generated in the integrated circuit 1 is radiated to the refrigerant through the radiating fins 5, but the flow path after the jet collides is secured between the horizontal heat radiating plates, so that the nozzle diameter Even when the flow rate is increased by increasing the thickness, the flow after the jet impingement does not hinder the cooling performance. Further, since the horizontal radiator plate and the vertical radiator plate can be cooled after the collision and while flowing through the horizontal radiator plates, the cooling capacity can be improved. Since it is possible to increase the flow rate by increasing the diameter in this way, it is not necessary to increase the flow velocity, and the force applied to the LSI case 2 can be suppressed.

Further, as shown in FIGS. 3 and 4, a second embodiment is shown. In the second embodiment shown in FIGS. 3 to 4, the gaps between the horizontal heat radiating plates 7 are made equal, and the areas seen from the nozzles of each horizontal heat radiating plate are set to be equal. The other structure is the same as that of the embodiment shown in FIGS. In this case, the amount of the refrigerant that collides with each horizontal heat radiating plate 7 becomes equal, and the flow velocity of the refrigerant flowing between the horizontal heat radiating plates 7 and flowing out to the outer periphery is equalized. Therefore, the refrigerant flowing out from the horizontal heat radiating plate does not interfere with and obstruct the flow.

Further, since the amount of heat radiated from each horizontal heat radiating plate 7 can be equalized, there is an advantage that fin efficiency can be increased and cooling capacity can be increased.

[0017]

As described above, according to the present invention,
By securing the flow path after the jet collision, the cooling effect can be effectively increased by the flow rate and the collision area of the jet, and the cooling capacity is further increased because the flow after the collision is also used for cooling. In addition, since it is not necessary to increase the flow rate, it is possible to provide an unprecedented excellent integrated circuit cooling device that can reduce the force applied to the LSI case and increase durability.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of the embodiment shown in FIG.

FIG. 3 is a vertical sectional view showing a second embodiment of the present invention.

FIG. 4 is a cross-sectional view taken along the line BB of the embodiment shown in FIG.

5 to 6 are cross-sectional views showing a conventional example.

[Explanation of symbols]

 1 Integrated Circuit 2 LSI Case 3 Solder Bump 4 Wiring Board 5 Radiating Fin 6 Vertical Heat Transfer Plate 7 Horizontal Radiating Plate 8 Nozzle 9 Opening 10 Refrigerant

Claims (3)

[Claims] 1. A vertical heat transfer plate equidistantly provided on a heat dissipation surface of an LSI case on which an integrated circuit is mounted, and a predetermined interval substantially parallel to the heat dissipation surface of the LSI case supported by the vertical heat transfer plate. A plurality of parallel heat sinks mounted apart from each other are provided, and a large opening is formed in the central portion of the plurality of parallel heat sinks as the distance from the LSI case increases. On the other hand, a cooling device for an integrated circuit, characterized in that a nozzle for injecting a refrigerant in a direction along the vertical heat transfer plate is provided so as to face the plurality of parallel heat dissipation plates. 2. The areas of the parallel heat dissipation plates to which the plurality of parallel heat dissipation plates are directly sprayed with respect to the refrigerant ejected from the nozzles toward the plurality of parallel heat dissipation plates are set to be the same. The cooling device for an integrated circuit according to claim 1. 3. The cooling device for an integrated circuit according to claim 1, wherein the intervals between the plurality of parallel heat dissipation plates are set to be the same.