JPH05200769A - Method and apparatus for resin encapsulation molding of electronic parts - Google Patents

Abstract

(57) [Summary] [Purpose] The resin tablets 3 supplied into each pot 4 are heated and expanded to allow air and water contained therein to flow into the cull portion 8 and forcibly suck this outside. It is discharged to prevent the residual air and the like from being mixed in the molten resin material and forming voids inside and outside the resin-sealed molded body 20. [Structure] When the upper and lower molds are clamped, the bottom surface portion and the peripheral surface portion of the resin tablet 3 supplied into the lower mold pot 4 are heated,
By heating and expanding to the cull portion 8 side above the pot,
The inside and outside of the thermal expansion portion of the resin tablet can be ventilated so that the air and water trapped inside the resin tablet can easily flow out to the outside, and further the air passage communicated with the cull portion 8 is connected. Through the cull part 8 through 11
By setting the inside of the cull portion to a vacuum state, the air, the generated gas, and the water flowing out into the cull portion 8 and the residual air and the moisture in the space between the upper and lower mold surfaces communicating with the cull portion 8 are discharged to the outside. Forced discharge.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, ICs and LSs.
The present invention relates to an improved method and apparatus for sealing and molding electronic components such as I, diodes, and capacitors with resin, and in particular, voids (air bubbles) are formed inside and outside a resin-sealed molded body (mold package) of electronic components. Regarding things that prevent

[0002]

2. Description of the Related Art Conventionally, resin encapsulation molding of electronic parts has been carried out by a transfer molding method. This method uses, for example, a resin molding die (see FIGS. 1 and 2). Usually, it is performed as follows.

That is, the upper mold (1) and the lower mold (2) are previously heated to the resin molding temperature by the heating means (22). Next, the lead frame (18) equipped with the electronic component (19) is fitted and set at a predetermined position of the recess (21) provided on the mold surface of the lower mold (2), and the resin tablet (3) is potted. (4) Supply inside (see Fig. 1). Next, the lower mold (2) is moved up and the upper and lower molds (1 and 2) are clamped. At this time, the electronic component (19) and the lead frame (18) around the electronic component (19) are fitted and set in the upper and lower cavities (9) opposite to the mold surfaces of the upper and lower molds (1, 2). become. Also, the resin tablet (3) in the pot (4)
Since the resin is heated and sequentially melted, when the resin tablet (3) is pressurized by the plunger (5), the molten resin material is generated between the pot (4) and both cavities (9). The resin is transferred into the cavities (9) through the provided resin passages (8, 10) and injected / filled. When the molten resin material is injected / filled into both the cavities (9) by communicating the inside and outside of the cavity (9) through a groove-shaped air vent, the resin injection / filling action is performed. It is provided so that the residual air inside the cavity (9) is naturally pushed out to the outside through the air vent.
Therefore, the electronic component (13) and its surrounding lead frame (1
8) will be sealed in a resin molding (20) molded according to the shape of both cavities (9), and after the resin is cured, the lower mold (2) is moved down to move up and down. Both molds (1 and 2) are opened, and at the same time as this, the resin-sealed molded body (20) in both cavities (9), lead frame (18) and resin passages (8 and 10)
The cured resin (17) therein may be released by the release mechanism (16) (see FIG. 2).

[0004]

By the way, the upper and lower molds (1
・ When the mold is clamped in 2) (see Fig. 1), the upper and lower molds are composed of the pot (4), both cavities (9), and the resin passages (8, 10) that connect the pot and both cavities. The residual air and moisture existing in the space between the surfaces are, as described above,
It is designed to be naturally discharged from the air vent. However, the air vent is
(9) Along with the fact that the molten resin material injected into the inside is formed in a shallow groove shape for the purpose of preventing it from flowing out, a means for naturally discharging residual air and water using the air vent. However, there is a technical problem that the discharge action is uncertain. Furthermore, if this discharge effect is uncertain,
Air and moisture will remain in both cavities (9), and thus these residual air and moisture will mix into the molten resin material injected into both cavities, or the molten resin There is a serious problem that voids (air bubbles) are formed inside and outside a resin-sealed molded body of an electronic component which is wound up in a material and is impaired in moisture resistance and durability of a product.

According to the present invention, when the upper and lower molds are clamped, residual air and moisture existing in the space between the upper and lower mold surfaces and the air contained in the resin tablet (gas generated from the resin tablet・ Efficiently and reliably discharge moisture to the outside, and the air and moisture are mixed in the molten resin material,
Alternatively, a resin of an electronic component capable of forming a product having high quality and high reliability in which voids are not formed inside and outside the resin-sealed molded product by preventing the resin from being caught in the molten resin material. It is an object of the present invention to provide a sealing molding method and an apparatus thereof.

[0006]

A resin encapsulation molding method for an electronic component according to the present invention for solving the above-mentioned problems corresponds to a lower mold having a plurality of pots and positions of the respective pots. A step of arranging an upper mold having a cull portion at each position facing each other and forming an air passage for connecting and connecting the respective cull portions at the time of mold clamping of the upper and lower molds, and a resin tablet in each pot. A resin tablet supplying step, an electronic part supplying setting step of supplying and setting an electronic part at a predetermined position of a cavity portion opposite to the upper and lower mold surfaces, a resin tablet supplying step, and the electronic part After the supply setting step, the upper and lower mold surfaces are pressed against each other, and the resin tablets in each pot supplied in the resin tablet supplying step are thermally expanded to obtain the resin. Ta The heat and expansion step of the resin tablet for letting out the air and water contained in the lettuce into the cull part, and the air remaining through the cull part and the space between the upper and lower mold surfaces communicating with it through the air passage, and A vacuum process of forcibly discharging moisture to the outside, a heating and melting process of a resin tablet in which the resin tablets in each pot are heated to a predetermined temperature to be melted, and the molten resin material is pressure-transferred. By injecting into the upper and lower mold cavities, a resin encapsulation step of electronic parts for encapsulating and molding the electronic parts in the cavities supplied and set in the electronic part supply and set step with the injected resin material. It is characterized by having.

Further, the resin encapsulation molding method for an electronic component according to the present invention comprises a step of heating and expanding the resin tablets in each of the pots, air and water flowing out from the resin tablets, and each cull part. It is characterized in that the vacuum step of forcibly discharging the air / water remaining in the space between the upper and lower mold surfaces communicating with each other to the outside is performed substantially at the same time.

Further, the resin encapsulation molding method for an electronic component according to the present invention comprises a heating and expanding step and a heating and melting step for the resin tablets in each of the pots, and air, moisture and each flowing out from the resin tablets. It is characterized in that the cull portion and the vacuum step of forcibly discharging the air and moisture remaining in the space portion between the upper and lower mold surfaces communicating with the cull portion to each other are performed substantially at the same time.

Further, the resin encapsulation molding method for an electronic component according to the present invention comprises a heating and expanding step and a heating and melting step for the resin tablets in each of the above-mentioned pots, and air, moisture and each flowing out from the resin tablets. After performing the vacuum process to forcibly discharge the air and moisture remaining in the space between the cull part and the upper and lower mold surfaces communicating with it to the outside,
It is characterized by performing a resin sealing step of an electronic component in which the resin material in each pot is pressurized and transferred and injected into the upper and lower mold cavities.

Further, in the resin-sealing molding method for electronic parts according to the present invention, during the above-mentioned mold clamping step of the upper and lower molds, the residual remains in the space between the cull parts and the upper and lower mold surfaces communicating with the cull parts. It is characterized by performing a vacuum process for forcibly discharging air and moisture to the outside.

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention for solving the above-mentioned problems, a lower die having a plurality of pots and a cull portion at a position corresponding to the position of each pot. A resin encapsulation molding apparatus for an electronic component, comprising a resin molding die in which an upper die in which each of the upper die and the upper die in which the upper die and the lower die are clamped are respectively disposed between the upper and lower die surfaces are clamped. An air passage for connecting the cull portions to each other is provided, and a space portion between the upper and lower mold surfaces including the pot portion, the cull portion, the cavity portion, and the resin passage portion for communicating the cull portion and the cavity portion. A seal member for blocking the inside of the space from the outside air is provided at a position around the outside, and an air passage for connecting the cull portions to each other and a vacuum path communicating with a vacuum source are connected to each other. Resin molding equipment for electronic parts characterized by .

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention, an air valve is provided between the air passage communicated with each of the cull portions and the vacuum passage communicated with the vacuum source. It is characterized in that it is configured.

[0013]

According to the present invention, when the upper and lower molds are clamped,
The resin tablets in each pot can be heated and expanded to allow the air and water contained in the resin tablets to flow out into the cull portion, and further, the outflowing air and water can be passed through the air passages that are connected to the cull portion. It can be efficiently and forcibly discharged to the outside. The term "outflow air and water" is a concept that includes not only the air and water contained in the resin tablet but also outflow gas such as gas generated during preheating of the resin tablet. ..

In addition, when the upper and lower molds are clamped, the bottom surface and the peripheral surface of the resin tablet supplied into the lower mold pot are heated, so that the upper part of the pot is in an open state. Then, it is heated and expanded from the upper surface side to the inside of the pot, that is, the cull side. Further, the thermal expansion portion of the resin tablet is in a state in which the inside and the outside can be ventilated, so that the air and moisture trapped inside the resin tablet are easily discharged to the outside. Therefore, the inside of the cull portion is set to a vacuum state through an air passage that is connected to the cull portion, so that the air and water flowing out from the resin tablet that has flown into the cull portion, and the upper and lower portions communicating with the cull portion. Air and moisture remaining in the space between the mold surfaces can be efficiently and forcibly discharged to the outside.

[0015]

[Embodiment] The figure schematically shows a resin encapsulation molding apparatus for electronic parts adopting a multi-plunger type configuration.
1 shows the mold clamping state of the upper mold 1 and the lower mold 2, FIG. 2 shows the mold open state of the upper and lower molds (1 and 2), and FIG. 3 shows the mold surface of the lower mold 2.
FIG. 4 shows the mold surface of the upper mold 1, and FIG. 5 shows the vertical section taken along the line AA of FIG.

A plurality of pots 4 for supplying the resin tablets 3 are arranged on the lower die 2 side, and a plunger 5 for pressurizing the resin tablets 3 is provided in each pot. It is always fitted. Therefore, the actual pot portion for supplying the resin tablet 3 is the upper space portion constituted by the upper end portion of the pot 4 and the upper end portion 5a of the plunger fitted therein (see FIG. 1). The plunger 5 is provided so as to move up and down by a suitable drive mechanism (not shown) such as hydraulic pressure, pneumatic pressure, or an electric motor.

Further, a sliding portion 5b for tightly fitting the lower portion of the pot 4 is provided in the middle portion of the plunger 5, and further, the upper end portion 5a of the plunger and the sliding portion 5b are provided. A small diameter portion 5c is provided between them. Further, the inside of the pot 4 within the range in which the small diameter portion 5c of the plunger moves up and down and the vacuum source 6 such as a vacuum pump are connected to each other via a vacuum path 7 such as an intake hole or an intake pipe. Therefore, when the vacuum source 6 is operated, the air and moisture in the pot 4 can be forcibly sucked and removed to the outside through the vacuum path 7.

A cull portion 8 for molten resin distribution is provided on the mold surface of the upper mold 1 corresponding to the position of each pot 4, and a cavity for resin molding is provided on both upper and lower mold surfaces. 9 are opposed to each other, and the cavity 9 and the cull portion 8 are further provided.
Are communicated with each other via a gate 10 having a required length. Therefore, as will be described later, when the plunger 5 pressurizes the resin tablet 3 which is heated in each pot 4, the resin tablet 3 is heated and melted, and the molten resin material is melted by the cull portion 8. It is provided so as to be pressurized and injected into both upper and lower cavities 9 through a molten resin transfer passage portion (see FIG. 1) composed of a gate 10 and a gate 10.

Further, the space between the cull portions 8 described above is as shown in FIGS.
As shown in FIG. 3, they are connected to each other by an appropriate groove-shaped air passage 11 formed on the mold surface of the upper mold 1. Also,
An air passage 11a (see FIG. 4) communicated with the cull portion 8 at one end and / or both ends and a vacuum source 12 such as a vacuum pump are communicatively connected via a vacuum passage 13 such as an intake hole or an intake pipe. ing. Further, in the air passage 11a or the vacuum passage 13, an appropriate air valve 14 for opening and closing the passage or passage is provided. Therefore, the air valve 14
When the vacuum source 12 is opened and the vacuum source 12 is operated, the air and moisture in each cull portion 8 can be forcibly sucked and removed to the outside through the vacuum path 13 and the air passage 11.

When the upper and lower molds (1, 2) are clamped, as shown in FIG. 1, the pot 4 parts, the cull part 8, the upper and lower cavities 9 part, and the cull part 8 and A space portion between the upper and lower mold surfaces, which is composed of a resin passage portion (passage portion for transferring molten resin) which communicates with the cavity 9 portion, is formed. Since the space between the upper and lower mold surfaces is at least a range to be set to a vacuum state at the time of resin sealing molding, for example, at the mold surface position of the lower mold 2 which is the outer periphery of the space. Providing an appropriate seal member S for blocking the inside of the space from the outside air, and interposing the seal member S between the upper and lower mold surfaces when the upper and lower molds (1, 2) are clamped. As a result, the effect of blocking the outside air in the space can be enhanced.

When clamping the upper and lower molds (1, 2),
The seal member S of the lower mold 2 mold surface may be brought into pressure contact with the upper mold 1 mold surface. For example, as shown in FIG. 4, the seal member S is fitted to the mold surface of the upper mold 1. The groove 15 may be formed. Further, as shown in the figure, the seal member S similar to the above-mentioned seal member may be interposed and arranged also in other parts such as the joint surface or the sliding surface where airtightness is required.

Reference numeral 16 in the figure is an ejector pin provided at each position of each cull portion 8 and both upper and lower cavities 9 of the upper and lower molds (1, 2), and when the mold is clamped as shown in FIG. Retreat to approximately the same position as the cull portion 8 and the bottom surface of the cavity 9, and when the mold is opened as shown in FIG. 2, the resin passage (the cull portion 8 and the gate) is advanced toward both mold surfaces. Ten)
A resin-sealed molded body 20 obtained by resin-sealing the cured resin 17 in the portion and the electronic component 19 on the lead frame 18 molded in the cavity 9 can be released. Further, the reference numeral 21 is a recess for the lead frame fitting set provided on the mold surface of the lower mold 2, and the reference numeral 22 is both upper and lower molds.
The heating means arranged in (1.2) are shown respectively.

A method of resin-molding the electronic component 19 mounted on the lead frame 18 using the above-mentioned resin-molding apparatus will be described below.

First, the upper and lower molds (1.2) are opened (second
(Refer to the drawing), the semiconductor lead frame 18 with the electronic component 19 is fitted and set in the recess 21 of the lower mold 2 surface,
The resin tablet 3 which is preheated or not preheated is supplied into the lower mold pot 4.

Next, the upper and lower molds (1 and 2) are clamped (see FIG. 1), the air valve 14 is opened to operate the vacuum source 12 (see FIG. 4), and the vacuum path 13 and Air passage 11
Since the air and water in each cull portion 8 are forcibly sucked and removed to the outside through the cull portion 8, all the space portions in the cull portion 8, each air passage 11 and the vacuum path 13 can be set to a vacuum state. At this time, the resin tablets 3 in the lower mold pot 4 are heated by the heating means 22 of the upper and lower molds (1, 2).

When the upper and lower molds (1 and 2) are clamped, the resin tablet supplied into the lower mold pot 4 is heated at its bottom and peripheral surfaces, so that the upper part of the pot 4 is opened. In addition to the above state, as shown in FIG. 5, it is heated and expanded from the upper surface side to the upper part in the pot 4, that is, to the cull part 8 side. In addition, the thermally expanded portion of the resin tablet 3 is in a state in which the inside and the outside can be ventilated, and the air and water trapped inside the resin tablet are easily discharged to the outside. At this time, not only the air and water contained in the resin tablet but also the outflow gas such as gas generated at the time of preheating of the resin tablet is included in the outflow air and the water flowing out of the resin tablet. Is also included. Therefore, when the cull portion 8, the air passage 11 and the vacuum passage 13 are set to a vacuum state in the above-mentioned state, not only the residual air and water in the cull portion 8 existing at the time of mold clamping of the upper and lower molds, , Outflow air (including outflow gas such as gas) from the resin tablet that has flowed into the pot 4 and the cull portion 8 and moisture, and the remaining in the space portion between the upper and lower mold surfaces communicating with the cull portion 8. It is possible to efficiently and forcibly discharge the accumulated air and the moisture to the outside at the same time.

Since the resin tablet 3 supplied into the lower mold pot 4 has a relatively small shape, it can be heated by the required time (for example, about 10 seconds).
Subsequent to the heat expansion action of the resin tablet described above, its almost complete heat melting action can be performed. Therefore, when the resin tablet 3 in the pot 4 is pressurized by the plunger 5, the molten resin material is transferred and injected into both upper and lower cavities 9 through the resin passage (cull portion 8 and gate 10) portion. Therefore, the electronic components 19 on the lead frames set in the upper and lower cavities 9 are sealed and molded by the injected and filled resin material.

Next, after the required curing time, the upper and lower molds
The molds (1 and 2) are opened again, and the upper and lower ejector pins 16 are advanced so that the upper and lower cavities 9 and the resin passages (8
The resin sealing molded body 20 and the cured resin 17 in the section 10) may be released simultaneously.

As mentioned above, in this embodiment,
When clamping the upper and lower molds (1 and 2), not only the residual air and water existing in the space between the upper and lower mold surfaces, but also the outflow air (including outflow gas such as gas) from the resin tablet and It is possible to efficiently and surely discharge water to the outside,
Therefore, it is possible to prevent the air and water from being mixed in the molten resin material or to be caught in the molten resin material, so that voids are not formed inside and outside the resin sealing molded body 20. Thus, it is possible to obtain a resin-sealed molded product of an electronic component having high reliability and high reliability.

As described above, the cull portions 8 are arranged at the positions corresponding to the positions of the pots 4, respectively, and the air passages 11 are communicated with the respective cull portions 8 to connect the cull portions to the respective cull portions. Since the air and moisture remaining in the space between the upper and lower mold surfaces communicating with this are forcedly discharged to the outside, the upper and lower molds (1 and 2) are completely removed as shown in FIG. Even in the mold-clamped state, residual air and moisture in the cull portions and the space between the upper and lower mold surfaces communicating with the cull portions can be efficiently and forcibly discharged to the outside. So, for example, both upper and lower types (1
・ Compared with the intermediate mold clamping in 2) and the vacuum process that is continuously performed during the subsequent complete mold clamping, at least,
Since the vacuum step during the intermediate mold clamping can be omitted, there is an advantage that the overall resin molding time can be shortened.

The present invention is not limited to the above-mentioned embodiments, but can be arbitrarily and appropriately modified / selected as necessary within the scope of the gist of the present invention. Is.

For example, the air passage 11 described above exemplifies a case where the cull portions 8 are connected to each other by a suitable groove formed in the die surface of the upper die 1 (see FIGS. 3 to 4). ), The air passage may have a structure in which the respective cull portions are mutually connected and communicated by an appropriate concave groove formed in the mold surface of the lower die 2. Which mold surface of the mold is to be arranged can be arbitrarily and appropriately changed / selected and adopted as necessary.

Further, each air passage 11 and the vacuum passage on the upper mold surface
A vacuum process for forcibly discharging the air and moisture in each cull portion 8 and the air and moisture remaining in the space between the upper and lower mold surfaces communicating with the respective cull portion 8 to the outside through At the same time, the vacuum source 6 may be operated to perform a vacuum step of forcibly sucking and removing air and moisture in the pot 4 to the outside through the vacuum path 7.

[0034]

According to the present invention, when the upper and lower molds are clamped, the resin tablets in each pot can be heated and expanded so that the air and water contained in the resin tablets can flow into the cull portion. Furthermore, since the outflowing air (including the gas generated from the resin tablet) and moisture can be efficiently and forcibly discharged to the outside through the air passage connected to the cull portion, the resin sealing molding can be performed. EFFECT OF THE INVENTION It is possible to provide a resin encapsulation molding method and device for an electronic component, which can efficiently and surely prevent the formation of voids or defects caused by the air and moisture inside or on the surface of the body. It is a thing.

Further, according to the present invention, since the resin encapsulation molding of the electronic component can be performed under the vacuum condition, the electronic component and the lead frame having the electronic component mounted thereon and the sealing resin can be completely adhered. Can be planned. That is, since air or the like does not exist between the electronic component and the lead frame on which the electronic component is mounted and the encapsulating resin, the adhesion between the two is significantly improved. It is possible to efficiently prevent the harmful effects such as peeling between the two during immersion and the occurrence of cracks, and therefore, it is possible to mold this kind of product having high quality and high reliability. Is played.

[Brief description of drawings]

FIG. 1 is a partially cutaway vertical cross-sectional view of a main part of a mold in a resin-sealing molding apparatus for electronic parts adopting a multi-plunger type configuration, showing a complete mold clamping state.

FIG. 2 is a partially cutaway vertical sectional view of a main part of a mold corresponding to FIG. 1, showing a mold open state thereof.

FIG. 3 is a partially cutaway plan view showing a lower mold surface of a mold corresponding to FIG.

FIG. 4 is a partially cutaway bottom view showing an upper die surface of a die corresponding to FIG.

5 is a partially cutaway vertical sectional view taken along the line AA of FIG.

[Explanation of symbols]

 1 Upper mold 2 Lower mold 3 Resin tablet 4 Pot 5 Plunger 5a Upper end 5b Sliding part 5c Small diameter part 6 Vacuum source 7 Vacuum path 8 Cull part 9 Cavity 10 Gate 11 Air passage 11a Air passage 12 Vacuum source 13 Vacuum passage 14 Air valve 15 Groove 16 Ejector pin 17 Hardened resin 18 Lead frame 19 Electronic component 20 Molded resin molding 21 Recess 22 Heater S Seal member

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location // B29L 31:34 4F

Claims (7)

[Claims] 1. A lower mold having a plurality of pots and an upper mold having a cull portion at a position corresponding to the position of each pot are arranged to face each other, and at the time of clamping the upper and lower molds. A step of forming an air passage for connecting and connecting the cull parts to each other; a step of supplying a resin tablet into each of the pots; and an electronic part at a predetermined position of a cavity part opposed to the upper and lower mold surfaces. And a step of supplying and setting an electronic component, a step of supplying the resin tablet, and a step of supplying and setting the electronic component, and then clamping the upper and lower molds to press both upper and lower mold surfaces, Thermal expansion of the resin tablets in the pots supplied in the resin tablet supplying step to expand the resin tablets by heating and expand the air and water contained in the resin tablets into the cull portion. A vacuum step of forcibly discharging air and water remaining in the space between the cull portion and the upper and lower mold surfaces communicating with each cull portion to the outside through the air passage, and the resin tablet in each pot. A heating and melting step of heating a resin tablet to be melted by heating to a predetermined temperature, and a molten resin material is pressure-transferred and injected into the upper and lower mold cavities. A resin encapsulation step of encapsulating and molding the electronic component in the cavity that has been supplied and set with the injected resin material, and a resin encapsulation molding method for an electronic component. 2. A step of heating and expanding the resin tablets in each pot, and air flowing out from the resin tablets.
The vacuum step of forcibly discharging moisture and air / moisture remaining in the space between the cull portion and the upper and lower mold surfaces communicating with the cull portion to the outside are performed substantially at the same time. 1. The method for resin encapsulation molding of an electronic component according to 1. 3. A heating and expanding step and a heating and melting step for the resin tablet in each pot, and air and water flowing out from the resin tablet and each cull portion and a space portion between both upper and lower mold surfaces communicating with the cull portion. The resin encapsulation molding method for an electronic component according to claim 1, wherein the vacuum step of forcibly discharging the remaining air and moisture to the outside is performed substantially at the same time. 4. A heat expansion step and a heat melting step for the resin tablet in each pot, and air and water flowing out from the resin tablet, and each cull portion and a space portion between both upper and lower mold surfaces communicating with this. After performing the vacuum process to forcibly discharge the remaining air and moisture to the outside, perform the resin sealing process for the electronic parts to pressurize the resin material in each pot and transfer it into the upper and lower mold cavities The resin encapsulation molding method for an electronic component according to claim 1, wherein. 5. A vacuum process for forcibly discharging air and moisture remaining in the space between the cull parts and the upper and lower mold surfaces communicating with the mold parts during the mold clamping process of the upper and lower molds. The resin encapsulation molding method for an electronic component according to claim 1. 6. An electronic component comprising a resin molding die in which a lower die having a plurality of pots and an upper die having a cull portion at a position corresponding to the position of each pot are arranged to face each other. A resin encapsulation molding apparatus, wherein an air passage for connecting and connecting the cull parts is provided between the upper and lower mold surfaces when the upper and lower molds are clamped, and the pot part, the cull part, and the cavity are provided. A seal member for blocking the inside of the space from the outside air at a position around the outer side of the space between the upper and lower mold surfaces, which is composed of a resin passage part that connects the cavity part and the cull part to each other, Furthermore, the resin encapsulation molding apparatus for an electronic component, characterized in that an air passage for communicatively connecting the respective cull portions and a vacuum passage for communicating with a vacuum source are communicatively connected. 7. The electronic component according to claim 6, wherein an air valve is arranged between an air passage communicating with each cull portion and a vacuum passage communicating with a vacuum source. Resin molding equipment.