JPH0521990A - Electronic component assembly and supply device for electronic component assembly - Google Patents
Electronic component assembly and supply device for electronic component assemblyInfo
- Publication number
- JPH0521990A JPH0521990A JP3176636A JP17663691A JPH0521990A JP H0521990 A JPH0521990 A JP H0521990A JP 3176636 A JP3176636 A JP 3176636A JP 17663691 A JP17663691 A JP 17663691A JP H0521990 A JPH0521990 A JP H0521990A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component assembly
- tape
- assembly
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
- Package Frames And Binding Bands (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【目的】 電子部品実装機における部品供給に適用され
る電子部品集合体および電子部品集合体合体の供給装置
において、部品供給部に対する部品供給の自動化が容易
にできることを目的とする。
【構成】 テープ状の保持体2にその長手方向に複数の
電子部品3を配置して保持している電子部品集合テープ
5を芯や支持体無しで渦巻き状に巻回した構成、または
巻回した電子部品集合テープ5の内側または内側および
外側に隣接している部分が適当ピッチで互いに分離可能
に接合され、かつ電子部品集合テープ5の先端部が内側
部分と接合されずに所定の長さをほぼ真っ直ぐに延出さ
せた構成により、電子部品3を取り出した後、テープ状
の保持体2を切断破棄して、リール等の部品を残さない
ようにでき、収納部に電子部品集合体1を自動供給でき
る。
(57) [Abstract] [Object] An object of the present invention is to facilitate automation of component supply to a component supply unit in a supply device for an electronic component assembly and an electronic component assembly combination applied to component supply in an electronic component mounting machine. To do. [Structure] A structure in which an electronic component assembly tape 5 holding a plurality of electronic components 3 arranged in a longitudinal direction on a tape-shaped holder 2 is spirally wound without a core or a support, or is wound. The parts adjacent to the inside or the inside and the outside of the electronic component collecting tape 5 are separably joined to each other at an appropriate pitch, and the tip end of the electronic component collecting tape 5 is not joined to the inner portion and has a predetermined length Since the electronic component 3 is taken out, the tape-shaped holder 2 can be cut and discarded so that no components such as reels are left, and the electronic component assembly 1 is stored in the storage portion. Can be automatically supplied.
Description
【0001】[0001]
【産業上の利用分野】本発明は電子部品実装機における
部品供給に適用される電子部品集合体および電子部品集
合体の供給装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component assembly and an electronic component assembly supply device applied to component supply in an electronic component mounter.
【0002】[0002]
【従来の技術】電子部品回路基板に実装する電子部品実
装機における部品供給方法には、電子部品をトレイ内に
整列・収容して供給するスティック方式および電子部品
をカセット容器内に多数収容して供給するバルクカセッ
ト方式等があるが、テープ状の保持体にその長手方向に
多数の電子部品を配置して保持している電子部品集合テ
ープをリールに巻回して電子部品集合体を構成し、この
電子部品集合体を部品供給装置としてのパーツカセット
に装着したパーツカセット方式が、電子部品集合体の取
扱いが容易でかつ部品供給動作の信頼性が高く、さらに
部品実装動作の高速化が可能であるので、最も広く利用
されている。2. Description of the Related Art Electronic component mounting methods for mounting electronic components on a circuit board include a stick method in which electronic components are aligned and accommodated in a tray and a large number of electronic components are accommodated in a cassette container. There is a bulk cassette system etc. to supply, but an electronic component assembly tape is formed by winding a reel of an electronic component assembly tape that holds a number of electronic components arranged in a longitudinal direction on a tape-shaped holder, The parts cassette method, in which this electronic parts assembly is mounted in a parts cassette as a parts supply device, makes it easy to handle the electronic parts assembly, has high reliability in the parts supply operation, and can speed up the parts mounting operation. It is, therefore, the most widely used.
【0003】パーツカセット方式では、電子部品集合テ
ープをリールに巻回した電子部品集合体をパーツカセッ
トに装着し、このパーツカセットを電子部品実装機の部
品供給部に並列して搭載し、部品実装時には部品供給部
を移動させて所定の種類の電子部品を保持したパーツカ
セットを順次部品取出位置に位置決めし、この部品取出
位置で実装ヘッドにて部品を取り出し、部品実装位置に
移送して位置決めされている基板上に部品を実装してい
る。また、この実装動作に連動してパーツカセットは電
子部品集合テープを1ピッチ送り、次の電子部品をパー
ツカセットにおける部品取出位置に送り出すように構成
されている。In the parts cassette system, an electronic parts assembly obtained by winding an electronic parts assembly tape around a reel is mounted on a parts cassette, and the parts cassette is mounted in parallel with a parts supply section of an electronic parts mounting machine to mount the parts. Occasionally, the component supply unit is moved to sequentially position the parts cassette holding a predetermined type of electronic component at the component extraction position, the mounting head takes out the component at this component extraction position, and the component cassette is transferred to the component mounting position for positioning. Parts are mounted on the board. Further, in conjunction with this mounting operation, the parts cassette is configured to feed the electronic component assembly tape one pitch and to feed the next electronic component to the component pick-up position in the parts cassette.
【0004】[0004]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、部品実装機の部品供給部に対するパーツ
カセットの搭載・交換作業が容易で、かつその作業は煩
雑で自動化が困難であり、またこのパーツカセットに対
して部品集合体のリールを着脱する作業も煩雑で手間が
かかり、自動化も困難であり、全体として部品供給に要
する工数が多くかかり、自動化が困難であるという問題
点を有していた。However, in the above-mentioned conventional configuration, it is easy to mount and replace the parts cassette in the parts supply section of the mounter, and the operations are complicated and difficult to automate. The work of attaching and detaching the reels of the component assembly to and from the parts cassette is complicated and time-consuming, and automation is difficult, and the number of man-hours required to supply the components is large, and automation is difficult. It was
【0005】本発明は上記従来の問題点を解決するもの
で、電子部品実装機の部品供給部に対する部品供給の自
動化が容易にできる電子部品集合体と電子部品集合体の
供給装置を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and provides an electronic component assembly and an electronic component assembly supply device capable of easily automating the component supply to the component supply unit of an electronic component mounter. With the goal.
【0006】[0006]
【課題を解決するための手段】この目的を達成するため
に本発明の電子部品集合体は、テープ状の保持体にその
長手方向に複数の電子部品を配置して保持している電子
部品集合テープを芯や支持体無しで渦巻き状に巻回した
構成、または、巻回した電子部品集合テープの内側また
は内側および外側に隣接している部分が適当ピッチで互
いに分離可能に接合され、かつ、電子部品集合テープの
先端部が、内側部分と接合されずに所定の長さをほぼ真
っ直ぐに延出させた構成を有している。In order to achieve this object, an electronic component assembly of the present invention is an electronic component assembly in which a plurality of electronic components are arranged and held in a tape-shaped holder in the longitudinal direction thereof. A structure in which the tape is wound in a spiral shape without a core or a support, or inside or inside and outside of the wound electronic component assembly tape are joined so as to be separable from each other at an appropriate pitch, and The front end portion of the electronic component assembly tape has a structure in which it is extended straight in a predetermined length without being joined to the inner portion.
【0007】また、本発明の電子部品集合体の供給装置
は、一方向に移動可能な供給台に配設した複数の部品供
給ユニットと、供給台の移動方向に並列して配設された
収納している電子部品集合体を収納部に向けて投入する
複数の部品補給手段を備えた構成、さらに前述の電子部
品集合体を収納可能な収納部と、電子部品集合テープを
収納部から部品取り出し位置に案内する案内経路を備
え、収納部内には電子部品集合体の外周に接触させて回
転する回転手段と、電子部品集合テープを挟持して案内
経路に送り出す送出手段とを備えた構成としたものであ
る。The electronic component assembly supply apparatus of the present invention includes a plurality of component supply units arranged on a supply table movable in one direction and a storage arranged in parallel in the moving direction of the supply table. A configuration including a plurality of component replenishing means for charging the electronic component assembly into the storage portion, a storage portion capable of storing the electronic component assembly described above, and a component removal tape from the storage portion. A configuration is provided in which a guide path for guiding to a position is provided, and rotation means for contacting the outer periphery of the electronic component assembly to rotate in the storage portion, and delivery means for sandwiching the electronic component assembly tape and delivering it to the guide path. It is a thing.
【0008】[0008]
【作用】この構成によって、納置している電子部品を取
り出した後、テープ状の保持体を切断廃棄して使用後に
リール等の部品を残さないこととなる。また収納部に電
子部品集合体を投入するだけの簡単な作業で部品取り出
し位置に電子部品を供給することができて容易に自動化
できることとなる。With this configuration, after the stored electronic components are taken out, the tape-shaped holding body is cut and discarded, and no components such as reels remain after use. In addition, the electronic components can be supplied to the component take-out position by a simple operation of inserting the electronic component assembly into the storage portion, which can be easily automated.
【0009】さらに、部品補給手段から電子部品集合体
を収納部に自動供給できることとなる。Further, the electronic component assembly can be automatically supplied from the component supply means to the storage section.
【0010】[0010]
【実施例】(実施例1)以下本発明の一実施例につい
て、図面を参照しながら説明する。(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.
【0011】図1に示すように、電子部品集合体1は、
テープ状の保持体2の長手方向に多数形成された収納穴
4内に電子部品3を納置した電子部品集合テープ5を芯
や支持体無しで渦巻き状に巻回した構成である。巻回さ
れている電子部品集合テープ5の内側または内側および
外側とに隣接している部品の側面同士が適当ピッチ間隔
で接着剤6にて互いに分離可能に接合されている。接合
の方法としては、接着剤6に限らず、融着や粘着等の方
法でもよく、接合位置にも側面に限らず、幅方向の中央
部もしくは全幅にわたってもよい。さらに、容易に分離
可能であれば適当なピッチ間隔でなく全長にわたって接
合してもよい。As shown in FIG. 1, the electronic component assembly 1 includes
The electronic component assembly tape 5 having the electronic components 3 stored in a plurality of storage holes 4 formed in the longitudinal direction of the tape-shaped holder 2 is wound in a spiral shape without a core or a support. The side surfaces of the components adjacent to the inside or the inside and the outside of the wound electronic component assembly tape 5 are joined to each other with an adhesive 6 at an appropriate pitch. The joining method is not limited to the adhesive 6, but may be a method such as fusion or adhesion, and the joining position is not limited to the side surface, and may be the central portion or the entire width in the width direction. Further, if they can be easily separated, they may be joined to each other over the entire length instead of an appropriate pitch interval.
【0012】また、巻回されている電子部品集合テープ
5の先端部7は、内側の部分とは接合されずに接線方向
に所定の長さだけほぼ真っ直ぐに延出されている。な
お、電子部品集合テープ5には、収納穴4から電子部品
3が抜け出さないようにカバーテープ8が貼付けられて
おり、また外縁部に送り穴9が設けられている(図5参
照)。収容穴4に電子部品3を納置する手段として粘着
性シリコン等の粘着性樹脂を用いるとカバーテープ8を
不用とすることも可能である。Further, the front end portion 7 of the wound electronic component assembly tape 5 is not joined to the inner portion but extends substantially straight in a tangential direction by a predetermined length. A cover tape 8 is attached to the electronic component assembly tape 5 so that the electronic component 3 does not come out of the storage hole 4, and a feed hole 9 is provided at the outer edge portion (see FIG. 5). If an adhesive resin such as adhesive silicon is used as a means for storing the electronic component 3 in the accommodation hole 4, the cover tape 8 can be dispensed with.
【0013】以上のように本実施例によれば、電子部品
集合テープ5を巻回した状態で内側または内側および外
側に隣接している部分が適当なピッチ間隔で接着剤6に
て分離可能に接合されているので、芯や支持体がなくて
も、搬送中や各作業工程中に不測に巻回状態が崩れてし
まうような事はない。As described above, according to the present embodiment, the inner part or the part adjacent to the inner part and the outer part in the wound state of the electronic component assembly tape 5 can be separated by the adhesive 6 at an appropriate pitch interval. Since they are joined, the winding state does not accidentally collapse during transport or during each work process even without a core or support.
【0014】また、電子部品実装機により、収納穴4の
電子部品3を取り出した後にテープ状の保持体2を切断
廃棄すると、使用後に、リール等の部品が残ることが無
いので、煩雑な作業無しで部品供給できることになる。Also, if the tape-shaped holder 2 is cut and discarded after the electronic component 3 is taken out from the storage hole 4 by the electronic component mounter, parts such as reels do not remain after use, which is a troublesome work. It will be possible to supply parts without it.
【0015】また先端部を適当長ほぼまっすぐ延出して
おくと、電子部品集合テープ5を最初に引き出す際の自
動化が容易となる。Further, if the tip portion is extended substantially straight to an appropriate length, it is easy to automate the electronic component collecting tape 5 when it is first pulled out.
【0016】(実施例2)以下本発明の第2の実施例に
ついて図面を参照しながら説明する。(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.
【0017】図2および図3に示すように、第1の実施
例の構成の電子部品集合体1を電子部品の種類ごとに各
部品補給手段20の収納部21内に予め収納しておき、
部品補給手段20にて収納部21内の電子部品集合体1
を電子部品実装機の部品供給部10の移動可能な供給台
12上に配設された所定の部品供給ユニット13の収納
部14内にシュート23を経て投入する。収納部21内
には、収納されている電子部品集合体1を受ける帯状体
22が配設され、この帯状体22の一端は、シュート2
3の基端部の底面近傍に固定され、他端は巻き上げ手段
24に巻き付けられており、巻き上げ手段24にて帯状
体22を巻き上げることにより収納部21内の電子部品
集合体1を押し上げ、上部に収納されている電子部品集
合体1から順番にシュート23を経て収納部14内に搬
入できるように構成されている。As shown in FIGS. 2 and 3, the electronic component assembly 1 having the configuration of the first embodiment is stored in advance in the storage portion 21 of each component replenishing means 20 for each type of electronic component.
The electronic component assembly 1 in the storage portion 21 by the component replenishing means 20.
Is charged into the storage portion 14 of the predetermined component supply unit 13 arranged on the movable supply base 12 of the component supply portion 10 of the electronic component mounting machine via the chute 23. A band-shaped body 22 for receiving the stored electronic component assembly 1 is disposed in the storage section 21, and one end of the band-shaped body 22 has a chute 2 at one end.
3 is fixed near the bottom surface of the base end portion, and the other end is wound around the winding means 24. The winding means 24 winds up the band-shaped body 22 to push up the electronic component assembly 1 in the storage portion 21, The electronic component assembly 1 is stored in the storage unit 14 via the chute 23 in order.
【0018】以上のように本実施例によれば、部品供給
ユニット13を移動可能な供給台12上に配設し、収容
している電子部品集合体1を収納部14に向けて投入可
能な複数の部品補給手段20を供給台12の移動方向に
並列して配設することにより、部品補給手段20から電
子部品集合体1を収納部14に自動供給できる。As described above, according to the present embodiment, the component supply unit 13 is arranged on the movable supply table 12, and the electronic component assembly 1 accommodated therein can be loaded toward the storage portion 14. By disposing a plurality of component replenishing means 20 in parallel in the moving direction of the supply table 12, the electronic component assembly 1 can be automatically supplied from the component replenishing means 20 to the storage portion 14.
【0019】(実施例3)以下本発明の第3の実施例に
ついて、図面を参照しながら説明する。(Third Embodiment) A third embodiment of the present invention will be described below with reference to the drawings.
【0020】図3および図4に示すように、第1の実施
例の構成の電子部品集合体1は、第2の実施例の部品供
給手段20により電子部品実装機の部品供給部10の収
納部14に供給される。部品供給部10はガイドレール
11a,11b,11cに沿って移動可能な供給台12
上にその移動方向に並列して複数の部品供給ユニット1
3が配設されている。各部品供給ユニット13には、電
子部品集合体1を収納可能な収納部14と、電子部品集
合体1を巻戻して引き出された電子部品集合テープ5を
収納部14から先端部の部品取り出し位置16に案内す
る案内経路15とが設けられている。部品供給ユニット
13の先端部に設けられた送り用スプロケット17によ
って、送り穴9に係合して電子部品集合テープ5は1ピ
ッチづつ引き出される。収納部14内には投入された電
子部品集合体1をその外周に接触して回転させる回転手
段18と電子部品集合テープ5を挟持して案内経路15
に送り出す送出手段19a,19bとが配設されてい
る。As shown in FIGS. 3 and 4, the electronic component assembly 1 having the configuration of the first embodiment is accommodated in the component supply unit 10 of the electronic component mounting machine by the component supply means 20 of the second embodiment. Is supplied to the section 14. The component supply unit 10 is a supply table 12 that is movable along guide rails 11a, 11b, and 11c.
A plurality of component supply units 1 arranged in parallel in the moving direction above
3 are provided. In each of the component supply units 13, a storage portion 14 capable of storing the electronic component assembly 1 and an electronic component assembly tape 5 that is rewound from the electronic component assembly 1 and pulled out from the storage portion 14 are located at the tip of the component extraction position. A guide route 15 for guiding to 16 is provided. The feed sprocket 17 provided at the tip of the component supply unit 13 engages the feed hole 9 to pull out the electronic component collecting tape 5 one pitch at a time. A guide path 15 is provided in the storage portion 14 by sandwiching the electronic component assembly tape 5 and a rotating means 18 for rotating the introduced electronic component assembly 1 in contact with the outer periphery thereof.
Sending means 19a, 19b for sending to the.
【0021】また、供給台12の移動経路の側部には、
各部品ユニット13の収納部14内に投入すべき電子部
品集合体1をそれぞれ収容した複数の部品補給手段20
が並列して配設されている。On the side of the moving path of the supply table 12,
A plurality of component replenishing means 20 respectively accommodating the electronic component assembly 1 to be loaded into the accommodating portion 14 of each component unit 13.
Are arranged in parallel.
【0022】以上のように構成された部品供給部10に
ついて、以下その動作を説明する。収納部14内に電子
部品集合体1が投入されると、回転手段18にて電子部
品集合体1が回転せしめられ、接合されずに接線方向に
ほぼ真っ直ぐ延出している先端部7が送出手段19a,
19bに係合して電子部品集合体1の回転が停止し、続
いてこの送出手段19a,19bにて電子部品集合テー
プ5が接着剤6による接合を解除されながら電子部品集
合体1から引き出されて案内経路15に沿って部品供給
ユニット13の先端部に向かって送出される。電子部品
集合テープ5の先端の送り穴9が送りスプロケット17
に係合すると送出手段19a,19bが停止して回転フ
リーの状態に切り換えられる。The operation of the component supply unit 10 constructed as above will be described below. When the electronic component assembly 1 is loaded into the storage portion 14, the electronic component assembly 1 is rotated by the rotating means 18, and the tip end portion 7 which is not joined and extends substantially straight in the tangential direction is the delivery means. 19a,
The rotation of the electronic component assembly 1 is stopped by engaging with the electronic component assembly 19b, and then the electronic component assembly tape 5 is pulled out from the electronic component assembly 1 while the joining by the adhesive 6 is released by the feeding means 19a, 19b. And is delivered toward the tip of the component supply unit 13 along the guide path 15. The feed hole 9 at the tip of the electronic component assembly tape 5 is the feed sprocket 17
When it is engaged with, the sending means 19a and 19b are stopped and switched to the rotation free state.
【0023】以後は、部品取り出し位置に16で電子部
品3が取り出される度に送りスプロケット17にて電子
部品集合テープ5が1ピッチずつ送られ、順次部品取り
出し位置16に電子部品3が供給される。部品取り出し
位置16では、図5に示すように、カバーテープ8が一
側縁側から上方に引き剥がされ、電子部品3が上方に向
けて取り出される。電子部品3を取り出した後のテープ
状の保持体2は逐次部品供給ユニット13の先端下部に
配置された切断手段(図示せず)にて切断廃棄される。After that, every time the electronic component 3 is taken out to the component taking-out position 16, the electronic sprocket 17 sends the electronic component collecting tape 5 one pitch at a time, and the electronic component 3 is successively supplied to the component taking-out position 16. . At the component take-out position 16, as shown in FIG. 5, the cover tape 8 is peeled off from one side edge side, and the electronic component 3 is taken out upward. The tape-shaped holder 2 after taking out the electronic component 3 is cut and discarded by the cutting means (not shown) arranged at the lower end of the tip of the sequential component supply unit 13.
【0024】以上のように本実施例によれば、電子部品
集合体1を収納可能な収納部14と電子部品集合テープ
5を収納部14から部品取り出し位置16に案内する案
内経路15を設け、収納部14内には電子部品集合体1
の外周に接触させて回転する回転手段18と電子部品集
合テープ5を挟持して案内経路15に送り出す送出手段
19a,19bを設けることにより、部品供給部10の
収納部14内に電子部品集合体1を投入するだけの簡単
な作業で部品供給部10に対する部品供給ができ、か
つ、収納部14から電子部品集合テープ5を引き出すこ
とにより部品取り出し位置16に向けて電子部品3を確
実に供給できる。As described above, according to this embodiment, the accommodating portion 14 capable of accommodating the electronic component assembly 1 and the guide path 15 for guiding the electronic component assembling tape 5 from the accommodating portion 14 to the component removing position 16 are provided. The electronic component assembly 1 is stored in the storage unit 14.
By providing the rotating means 18 that comes into contact with the outer periphery of the component and the feeding means 19a and 19b that sandwiches the electronic component collecting tape 5 and feeds the electronic component collecting tape 5 to the guide path 15, the electronic component assembly is accommodated in the housing portion 14 of the component supplying portion 10. It is possible to supply components to the component supply unit 10 by a simple operation of only inserting 1, and it is possible to reliably supply the electronic component 3 toward the component extraction position 16 by pulling out the electronic component assembly tape 5 from the storage unit 14. .
【0025】また各部品供給ユニット13の収納部14
にそれぞれ電子部品集合体1を投入し、これを回転手段
18にて回転させて電子部品集合テープ5の先端部7を
送出手段19a,19bに挟持させ、送出手段19a,
19bにて電子部品3を案内経路15を経て部品取り出
し位置16に供給することができ、従って収納部14に
電子部品集合体1を投入するだけの簡単な作業で部品取
り出し位置16に電子部品3を供給することができて容
易に自動化できる。さらに供給台12を移動させること
により所定の部品供給ユニット13を、所望の電子部品
集合体1を収容した部品補給手段20に対応して位置さ
せることができ、その選択動作および投入動作を自動化
することも容易にできる。The storage portion 14 of each component supply unit 13
The electronic component assembly 1 is placed in each of the above, and is rotated by the rotating means 18 so that the tip portion 7 of the electronic component assembly tape 5 is sandwiched between the delivering means 19a and 19b, and the delivering means 19a,
The electronic component 3 can be supplied to the component take-out position 16 via the guide path 15 at 19b. Therefore, the electronic component 3 can be moved to the component take-out position 16 by a simple operation of inserting the electronic component assembly 1 into the storage portion 14. Can be supplied and can be easily automated. Further, by moving the supply base 12, the predetermined component supply unit 13 can be positioned corresponding to the component replenishing means 20 accommodating the desired electronic component assembly 1, and the selecting operation and the inserting operation thereof are automated. It can be done easily.
【0026】また、収納部14内の電子部品集合体1は
芯や支持体無しで巻回して構成されている電子部品集合
テープ5がすべて引き出された後は収納部14内が完全
に空になるので新たに電子部品集合体1を投入するだけ
でよく、自動補給も容易にできる。The electronic component assembly 1 in the accommodating portion 14 is completely wound after the electronic component assembling tape 5 is wound up without any core or support. Therefore, it is only necessary to newly insert the electronic component assembly 1, and automatic replenishment can be easily performed.
【0027】[0027]
【発明の効果】以上のように本発明は、複数の電子部品
を配置して保持している電子部品集合テープを芯や支持
体無しで渦巻き状に巻回した構成、または巻回した電子
部品集合テープの内側または内側および外側に隣接して
いる部品が適当ピッチで互いに分離可能に接合され、か
つ電子部品集合テープの先端部が、内側部分と接合され
ずに所定の長さをほぼ真っ直ぐに延出させた構成、また
は一方向に移動可能な供給台上に配設した複数の部品供
給ユニットと、電子部品集合体を収納部に向けて投入す
る複数の部品補給手段を備えた構成、さらに収納部と、
電子部品集合テープを部品取り出し位置に案内する案内
経路を備え、収納部内には電子部品集合体の外周に接触
させて回転する回転手段と、電子部品集合テープを案内
経路に送り出す送出手段とを備えた構成により、部品実
装機の部品供給部に対する部品供給の自動化が容易にで
きる優れた電子部品集合体と電子部品集合体の供給装置
を実現できるものである。INDUSTRIAL APPLICABILITY As described above, the present invention has a structure in which an electronic component assembly tape having a plurality of electronic components arranged and held therein is spirally wound without a core or a support, or a wound electronic component. Components adjacent to the inside or inside and outside of the assembly tape are separably joined to each other at an appropriate pitch, and the tip of the electronic component assembly tape is not joined to the inside portion and is almost straight to a predetermined length. An extended configuration, or a configuration including a plurality of component supply units arranged on a supply table movable in one direction and a plurality of component replenishing means for charging an electronic component assembly toward a storage unit, With storage
A guide path for guiding the electronic component assembly tape to the component removal position is provided, and a rotating means for rotating the electronic component assembly tape in contact with the outer periphery of the electronic component assembly, and a delivery means for delivering the electronic component assembly tape to the guide path. With such a configuration, it is possible to realize an excellent electronic component assembly and an electronic component assembly supply device that facilitates automation of component supply to the component supply unit of the component mounter.
【図1】本発明の第1の実施例の電子部品集合体の要部
の概念を示した斜視図FIG. 1 is a perspective view showing the concept of essential parts of an electronic component assembly according to a first embodiment of the present invention.
【図2】本発明の第2の実施例の電子部品集合体の供給
装置の部品補給手段の概念を示した斜視図FIG. 2 is a perspective view showing the concept of a component replenishing means of a supply device for an electronic component assembly according to a second embodiment of the present invention.
【図3】同電子部品集合体の供給装置の概念を示した正
面図FIG. 3 is a front view showing the concept of a supply device for the electronic component assembly.
【図4】本発明の第3の実施例の電子部品集合体の供給
装置の部品供給部の概念を示した斜面図FIG. 4 is a perspective view showing a concept of a component supply unit of an electronic component assembly supply device according to a third embodiment of the present invention.
【図5】同電子部品集合体の供給装置の部品取り出し装
置における電子部品の取り出し状態を示した斜面図FIG. 5 is a perspective view showing an electronic component take-out state in the component take-out device of the electronic device assembly supply device.
2 保持体 3 電子部品 5 電子部品集合テープ 6 接着剤 7 先端部 2 holder 3 electronic components 5 Electronic component assembly tape 6 adhesive 7 Tip
Claims (4)
の電子部品を配置して保持している電子部品集合テープ
を、無芯や渦巻き状に巻回した電子部品集合体。1. An electronic component assembly in which an electronic component assembly tape, which holds a plurality of electronic components arranged in a longitudinal direction of a tape-shaped holder, is wound in a coreless or spiral shape.
および外側に隣接している部分が適当なピッチで互いに
分離可能に接合され、かつ、前記電子部品集合テープの
先端部が、内側部分と接合されずに所定の長さにほぼ真
っ直ぐに延出された請求項1記載の電子部品集合体。2. The electronic component assembly tape is such that the inner or inner and outer adjacent portions are detachably joined at an appropriate pitch, and the tip end portion of the electronic component assembled tape is joined to the inner portion. The electronic component assembly according to claim 1, wherein the electronic component assembly is extended straight to a predetermined length without being extended.
数の部品供給ユニットと、供給台の移動方向に並列して
配設した収容している請求項1または2記載の電子部品
集合体を収納部に向けて投入する複数の部品補給手段を
備えた電子部品集合体の供給装置。3. The electronic component according to claim 1, wherein a plurality of component supply units arranged on a supply table movable in one direction and a plurality of component supply units arranged in parallel in the moving direction of the supply table are housed. An electronic component assembly supply device comprising a plurality of component replenishing means for introducing the assembly toward a storage section.
を収納可能な収納部と電子部品集合テープを前記収納部
から部品取り出し位置に案内する案内経路を備え、前記
収納部内には前記電子部品集合体の外周に接触させて回
転する回転手段と、前記電子部品集合テープを挟持して
前記案内経路に送り出す送出手段を備えた請求項3記載
の電子部品集合体の供給装置。4. A storage unit capable of storing the electronic component assembly according to claim 1 or 2, and a guide path for guiding the electronic component assembly tape from the storage unit to a component take-out position, wherein the electronic unit is provided in the storage unit. 4. The electronic component assembly supply device according to claim 3, further comprising: a rotating device that rotates in contact with the outer periphery of the component assembly; and a delivery device that holds the electronic component assembly tape and feeds it to the guide path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176636A JPH0521990A (en) | 1991-07-17 | 1991-07-17 | Electronic component assembly and supply device for electronic component assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176636A JPH0521990A (en) | 1991-07-17 | 1991-07-17 | Electronic component assembly and supply device for electronic component assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0521990A true JPH0521990A (en) | 1993-01-29 |
Family
ID=16017047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3176636A Pending JPH0521990A (en) | 1991-07-17 | 1991-07-17 | Electronic component assembly and supply device for electronic component assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521990A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020079737A1 (en) * | 2018-10-15 | 2020-04-23 | パナソニックIpマネジメント株式会社 | Mounting substrate manufacturing system, component mounting system, and housing body transfer method |
| WO2020202737A1 (en) * | 2019-03-29 | 2020-10-08 | パナソニックIpマネジメント株式会社 | Carrier tape holding device, holder, and carrier tape package body |
| JP2021119611A (en) * | 2019-03-29 | 2021-08-12 | パナソニックIpマネジメント株式会社 | Carrier tape holding device, holder, and carrier tape package |
| JPWO2021192557A1 (en) * | 2020-03-25 | 2021-09-30 | ||
| JPWO2021192558A1 (en) * | 2020-03-25 | 2021-09-30 |
-
1991
- 1991-07-17 JP JP3176636A patent/JPH0521990A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020079737A1 (en) * | 2018-10-15 | 2021-09-02 | パナソニックIpマネジメント株式会社 | Mounting board manufacturing system, component mounting system and housing transfer method |
| US11729959B2 (en) | 2018-10-15 | 2023-08-15 | Panasonic Intellectual Property Management Co., Ltd. | Mounting substrate manufacturing system, component mounting system, and housing body transfer method |
| WO2020079737A1 (en) * | 2018-10-15 | 2020-04-23 | パナソニックIpマネジメント株式会社 | Mounting substrate manufacturing system, component mounting system, and housing body transfer method |
| CN113678579A (en) * | 2019-03-29 | 2021-11-19 | 松下知识产权经营株式会社 | Carrier tape holding device, holder, and carrier tape package |
| WO2020202737A1 (en) * | 2019-03-29 | 2020-10-08 | パナソニックIpマネジメント株式会社 | Carrier tape holding device, holder, and carrier tape package body |
| JP2021132211A (en) * | 2019-03-29 | 2021-09-09 | パナソニックIpマネジメント株式会社 | Carrier tape holder, holder and carrier tape package |
| JPWO2020202737A1 (en) * | 2019-03-29 | 2021-09-13 | パナソニックIpマネジメント株式会社 | Carrier tape holder, holder and carrier tape package |
| JP2021141329A (en) * | 2019-03-29 | 2021-09-16 | パナソニックIpマネジメント株式会社 | Carrier tape holding device, holder, and carrier tape package |
| US12466681B2 (en) | 2019-03-29 | 2025-11-11 | Panasonic Intellectual Property Management Co., Ltd. | Carrier tape holding device, holder, and carrier tape package body |
| US12006175B2 (en) | 2019-03-29 | 2024-06-11 | Panasonic Intellectual Property Management Co., Ltd. | Carrier tape holding device, holder, and carrier tape package body |
| CN113678579B (en) * | 2019-03-29 | 2023-09-29 | 松下知识产权经营株式会社 | Carrier tape holding device, holding body and carrier tape package |
| JP2021132210A (en) * | 2019-03-29 | 2021-09-09 | パナソニックIpマネジメント株式会社 | Carrier tape holding device, holder, and carrier tape package |
| JP2021119611A (en) * | 2019-03-29 | 2021-08-12 | パナソニックIpマネジメント株式会社 | Carrier tape holding device, holder, and carrier tape package |
| WO2021192558A1 (en) * | 2020-03-25 | 2021-09-30 | パナソニックIpマネジメント株式会社 | Carrier-tape processing device and carrier-tape processing method |
| JPWO2021192558A1 (en) * | 2020-03-25 | 2021-09-30 | ||
| WO2021192557A1 (en) * | 2020-03-25 | 2021-09-30 | パナソニックIpマネジメント株式会社 | Carrier tape processing device and carrier tape processing method |
| US12404135B2 (en) | 2020-03-25 | 2025-09-02 | Panasonic Intellectual Property Management Co., Ltd. | Carrier tape processing device and carrier tape processing method |
| JPWO2021192557A1 (en) * | 2020-03-25 | 2021-09-30 | ||
| US12486136B2 (en) | 2020-03-25 | 2025-12-02 | Panasonic Intellectual Property Management Co., Ltd. | Carrier-tape processing device and carrier-tape processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7848296B2 (en) | Feeder preparation system and control method | |
| JP4237621B2 (en) | Methods, systems, and arrangements for handling electronic component tapes | |
| JP7830593B2 (en) | Kitting equipment | |
| JP4522839B2 (en) | Component supply device and surface mounter | |
| JPH05175686A (en) | Tape reel and tape-component feed apparatus | |
| EP3349557B1 (en) | Tape feeder | |
| CN104206049B (en) | Carrier equipment, system and method for processing component band | |
| JPH0521990A (en) | Electronic component assembly and supply device for electronic component assembly | |
| JP2017011316A (en) | Cassette feeder replacement system for component mounters | |
| JP2024149706A (en) | Feeder Replacement System | |
| US20250203835A1 (en) | Kitting device extraction system | |
| JPH07242284A (en) | Parts supply cassette | |
| WO2025143223A1 (en) | Automatic tape kitting device | |
| JP3329304B2 (en) | Chip component supply device | |
| US20250212376A1 (en) | Component confirmation device | |
| CN101602444B (en) | Cassette for adhesion film tape storage | |
| JP2935892B2 (en) | Chip-type electronic component separation and supply device | |
| CN112123355A (en) | Robot hand and robot | |
| WO2023188381A1 (en) | Setup system and setup method | |
| JPH05198968A (en) | Electronic component assembly and electronic component feed apparatus | |
| WO2025046773A1 (en) | Feeder | |
| JPS6252960B2 (en) | ||
| WO2025181946A1 (en) | Reel management system | |
| JP2004128007A (en) | Electronic component supply device | |
| WO2025234038A1 (en) | Tape removal system |