JPH0521991B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a partial plating device for simultaneously partially plating parts having a plurality of bent shapes formed on a hoop material using a plurality of nozzles provided in a plating head.

Conventionally, in a partial plating device for partially plating the bent portion of a hoop material having bent parts, as shown in Fig. 1, the plating electrode is used to add plating liquid,
With work 4 (hoop material) set to negative,
The plating liquid is flowed from the plating liquid tank 7 via the filter 8 by the pump 9, and the pressure balance between the liquid pressure in the plating liquid supply hose 5 and the atmospheric pressure is maintained by the throttle valve adjustment screw 3 of the plating head 1, and the plating liquid is supplied. After adjusting the liquid level in the nozzle 19 on the hose 5 to be constant, the bent part of the workpiece 4 was put into the nozzle 19 and plated. However, the pulsation of the pump 9 causes the liquid surface in the nozzle 19 to become uneven, making it extremely difficult and time-consuming to adjust the throttle using the throttle valve adjustment screw 3. If the unevenness occurs, stable plating quality cannot be obtained. Nakatsuta. Further, even if the pump 9 is adjusted once, the rotational speed of the pump 9 changes due to voltage fluctuations when the pump 9 is operated for a long time, making it difficult to maintain a constant liquid level. The present invention has been made to eliminate such drawbacks.

The gist of the partial plating device of the present invention includes a plating liquid tank in which plating liquid is collected and stored, a pump connected to the plating liquid tank, and a plating liquid tank disposed above the plating liquid tank and connected to the pump. and an upper plating liquid tank comprising an inflow tank into which the pumped plating liquid flows and an outflow tank from which the plating liquid overflowing from the inflow tank is disposed below the upper plating liquid tank, and a plating head through which one end of a plating liquid supply hose connected to the inflow tank is inserted;
a flow rate adjusting means attached to the plating head and adjusting the flow rate of the plating liquid; a nozzle formed in the plating liquid supply hose in the plating head;
a work guide for arranging a workpiece to be plated at a position facing the nozzle; and a plating liquid receiver that receives the plating liquid flowing out from the nozzle and the plating liquid supply hose and returns the received plating liquid to the plating liquid tank. The outflow tank and the plating liquid tank are connected by a plating liquid overflow hose, and the plating liquid overflowing the inflow tank is collected into the plating liquid tank via the outflow tank. It is characterized by becoming.

One embodiment of the present invention will be described with reference to FIG.
The plating liquid is sucked up to the upper plating liquid tank 13 via. The upper plating liquid tank 13 is connected to a plurality of nozzles 1 (not shown) via a solenoid valve 14.
It is divided into two parts: an inflow tank 13a which flows into the plating head 1 to which the plating liquid supply hose 15 is attached, and an outflow tank 13b which has an overflow function to keep the liquid level constant in order to eliminate variations in flow rate and hydraulic pressure between the plating liquid supply hoses 15. The outflow tank 13b is connected to the plating liquid tank 16 by a plating liquid overflow hose 18. The plating electrode is wired so that the plating liquid is connected to the positive terminal and the workpiece 4 is connected to the negative terminal. It is on the plating liquid supply hose 15. The liquid level in the nozzle is adjusted by using the throttle valve adjusting screw 3, which is the flow rate adjusting means of the plating head 1, to balance the pressure between the liquid pressure in the plating liquid supply hose 15 and the atmospheric pressure, as in FIG.
2 is a work guide for guiding the work 4.

In the above configuration, when the workpiece 4 is fixedly fed and positioned by the set pitch, the plating head 1 moves in the direction of the arrow in the plating liquid head movement direction 12, and the bent part of the workpiece 4 is transferred to the plating liquid supply hose 15. Insert it into the nozzle at the top and set it for the set time. After the set time, the plating head 1 escapes in the direction of the arrow in the plating head movement direction 11, and plating is completed.

As described above, according to the present invention, by providing an upper plating liquid tank with an overflow mechanism in the upper part of the device, the liquid level in the tank can be kept constant at all times, and plating liquid using gravity can be used. This method eliminates the unevenness of the liquid surface in the nozzle and improves the plating quality, and also makes it possible to adjust the nozzle liquid level in a very short time using an aperture adjustment screw, which was conventionally difficult and time consuming. In addition, since the unevenness of the nozzle liquid surface is eliminated, the plating liquid no longer flows and adheres to areas other than the bent parts of the workpiece, improving the appearance quality.
Stable partial plating can be performed.

[Brief explanation of drawings]

FIG. 1 is a sectional view of main parts for explaining a conventional device. FIG. 2 is a sectional view of a main part of an embodiment of the present invention. 1... Metsuki head, 2... Work guide, 3
... Throttle valve adjustment screw, 4... Work (hoop material),
5... Plating liquid supply hose, 6... Plating liquid saucer, 7... Plating liquid tank, 8... Filter,
9...Pump, 10...Pump mounting base, 11...
Plating liquid head moving direction, 12...Plating liquid head moving direction, 13...Upper plating liquid tank, 13
a... Inflow tank, 13b... Outflow tank, 14... Solenoid valve, 15... Plating liquid supply hose, 16... Plating liquid tank, 17... Plating liquid supply hose, 18
...Metsuki liquid overflow hose, 19...
nozzle.

Claims (1)

[Claims] 1 a plating liquid tank in which the plating liquid is collected and stored; a pump connected to the plating liquid tank;
an upper plating liquid disposed above the plating liquid tank, connected to the pump, and comprising an inflow tank into which the pumped plating liquid flows, and an outflow tank into which the plating liquid overflowing from the inflow tank flows out; a plating head which is disposed below the upper plating liquid tank and through which one end of a plating liquid supply hose connected to the inflow tank is inserted; and a flow rate which is attached to the plating head and through which the flow rate of the plating liquid is adjusted. an adjusting means, a nozzle formed on the plating liquid supply hose in the plating head, a work guide for arranging a workpiece to be plated at a position facing the nozzle, and flow out from the nozzle and the plating liquid supply hose. It has a plating liquid receiving tray that receives the plating liquid and returns the received plating liquid to the plating liquid tank, and the outflow tank and the plating liquid tank are connected by a plating liquid overflow hose, and the plating liquid overflows the inflow tank. A partial plating device characterized in that the plating liquid is collected into the plating liquid tank via the outflow tank.