JPH05228669A - 光線による穴開きウェブの製法および装置 - Google Patents

光線による穴開きウェブの製法および装置

Info

Publication number
JPH05228669A
JPH05228669A JP4274777A JP27477792A JPH05228669A JP H05228669 A JPH05228669 A JP H05228669A JP 4274777 A JP4274777 A JP 4274777A JP 27477792 A JP27477792 A JP 27477792A JP H05228669 A JPH05228669 A JP H05228669A
Authority
JP
Japan
Prior art keywords
web
light
light beam
mirror
masking plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4274777A
Other languages
English (en)
Japanese (ja)
Inventor
Kazuhiko Kurihara
和彦 栗原
Hiroshi Yazawa
宏 矢沢
Shoichi Yazawa
章一 矢沢
Yoshiki Kuroiwa
由喜 黒岩
Shuichi Murakami
修一 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polymer Processing Research Institute Ltd
Original Assignee
Polymer Processing Research Institute Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymer Processing Research Institute Ltd filed Critical Polymer Processing Research Institute Ltd
Priority to JP4274777A priority Critical patent/JPH05228669A/ja
Priority to CA002086202A priority patent/CA2086202A1/en
Priority to US07/996,562 priority patent/US5382773A/en
Priority to DE69218569T priority patent/DE69218569T2/de
Priority to TW081110376A priority patent/TW212153B/zh
Priority to EP92311800A priority patent/EP0549357B1/en
Priority to ES92311800T priority patent/ES2100312T3/es
Publication of JPH05228669A publication Critical patent/JPH05228669A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/36—Wood or similar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/38—Fabrics; Fibrous materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Laser Beam Processing (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Nonwoven Fabrics (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Advancing Webs (AREA)
JP4274777A 1991-12-27 1992-09-01 光線による穴開きウェブの製法および装置 Pending JPH05228669A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP4274777A JPH05228669A (ja) 1991-12-27 1992-09-01 光線による穴開きウェブの製法および装置
CA002086202A CA2086202A1 (en) 1991-12-27 1992-12-23 Apparatus and method for fabricating a perforated web by light
US07/996,562 US5382773A (en) 1991-12-27 1992-12-24 Apparatus and method for fabricating a perforated web by light
DE69218569T DE69218569T2 (de) 1991-12-27 1992-12-24 Vorrichtung zur Herstellung einer perforierten Stoffbahn durch Licht
TW081110376A TW212153B (2) 1991-12-27 1992-12-24
EP92311800A EP0549357B1 (en) 1991-12-27 1992-12-24 Apparatus for fabricating a perforated web by light
ES92311800T ES2100312T3 (es) 1991-12-27 1992-12-24 Aparato para fabricar una banda continua perforada mediante luz.

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3-361472 1991-12-27
JP36147291 1991-12-27
JP4274777A JPH05228669A (ja) 1991-12-27 1992-09-01 光線による穴開きウェブの製法および装置

Publications (1)

Publication Number Publication Date
JPH05228669A true JPH05228669A (ja) 1993-09-07

Family

ID=26551194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4274777A Pending JPH05228669A (ja) 1991-12-27 1992-09-01 光線による穴開きウェブの製法および装置

Country Status (7)

Country Link
US (1) US5382773A (2)
EP (1) EP0549357B1 (2)
JP (1) JPH05228669A (2)
CA (1) CA2086202A1 (2)
DE (1) DE69218569T2 (2)
ES (1) ES2100312T3 (2)
TW (1) TW212153B (2)

Cited By (10)

* Cited by examiner, † Cited by third party
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US6054086A (en) * 1995-03-24 2000-04-25 Nippon Petrochemicals Co., Ltd. Process of making high-strength yarns
US6127293A (en) * 1994-12-16 2000-10-03 Nippon Petrochemicals Co., Ltd. Laminated bodies and woven and nonwoven fabrics comprising α-olefin polymeric adhesion materials catalyzed with cyclopentadienyl catalyst
US6821348B2 (en) 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
JP2016518988A (ja) * 2013-03-26 2016-06-30 トカノ・ホールディング・ベスローテン・フェンノートシャップ 紙を選択的に炭化する装置及び方法
JP2017519118A (ja) * 2014-04-18 2017-07-13 ジーディーエム エス．ピー．エー．Ｇｄｍ Ｓ．Ｐ．Ａ． 材料ウェブを切断する装置
JP2018507111A (ja) * 2014-12-24 2018-03-15 ポスコＰｏｓｃｏ 鋼板表面の溝形成方法およびその装置
WO2019044879A1 (ja) * 2017-09-01 2019-03-07 株式会社ワイヤード レーザ加工装置、レーザ加工方法およびこれを用いて加工された薄板
JP2019042799A (ja) * 2017-09-01 2019-03-22 株式会社ワイヤード レーザ加工装置、レーザ加工方法およびこれを用いて加工された薄板
JP2021194855A (ja) * 2020-06-15 2021-12-27 大日本印刷株式会社 孔付きシートの製造方法

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GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
JP3211525B2 (ja) * 1993-04-22 2001-09-25 オムロン株式会社 薄材メッシュ、その製造方法及びその製造装置
DE4435532A1 (de) * 1994-10-05 1996-04-11 Mann & Hummel Filter Verfahren zur Herstellung von Filtern
SE513841C2 (sv) * 1994-12-22 2000-11-13 Sca Hygiene Prod Ab Förfarande för hål- eller slitsbildning i ett materialskikt och samtidig sammanfogning av detta skikt med ett annat materialskikt
FR2730657B1 (fr) * 1995-02-22 1997-03-28 Solaic Sa Procede et installation pour realiser des trous dans le film isolant d'une bande support pour modules de cartes electroniques
FR2740714B1 (fr) * 1995-11-02 1998-01-23 Heidelberg Harris Sa Dispositif de coupe de matiere
GB9601049D0 (en) * 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
US6117294A (en) * 1996-01-19 2000-09-12 Micron Technology, Inc. Black matrix material and methods related thereto
US5879494A (en) * 1996-09-23 1999-03-09 Minnesota Mining And Manufacturing Company Method of aperturing thin sheet materials
EP0835714A1 (en) * 1996-10-09 1998-04-15 LVD Company NV Laser focusing unit for laser beam devices
DE19722799A1 (de) * 1997-05-30 1998-12-03 Hauni Maschinenbau Ag Verfahren zum Bearbeiten eines Streifens und Anordnung in einer Filteransetzmaschine
AT407615B (de) 1997-07-02 2001-05-25 Inst Spanlose Fertigung Und Ho Verfahren zum biegen mit laserunterstützung
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
FR2794675B1 (fr) * 1999-06-11 2001-08-31 Brodart Microperforation laser de films thermoplastiques ou cellulosiques par fibres optiques
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US7265439B1 (en) 1999-11-30 2007-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Low cost, high speed, high efficiency infrared transceiver
DE10066062A1 (de) * 2000-08-04 2004-05-27 Sca Hygiene Products Gmbh Vorrichtung zum Trennen und/oder Perforieren
AU2002243288A1 (en) * 2000-10-30 2002-06-24 Pactiv Corporation Laser for forming bags from a web of material
US7367931B2 (en) * 2000-10-30 2008-05-06 Pactiv Corporation Laser cutoff stacker assembly
DE10154508A1 (de) † 2001-11-07 2003-05-22 Mlt Micro Laser Technology Gmb Vorrichtung zur Substratbehandlung mittels Laserstrahlung
DE50201160D1 (de) * 2002-05-16 2004-11-04 Leister Process Technologies S Verfahren und Vorrichtung zum Verbinden von Kunststoffmaterialien mit hoher Schweissgeschwindigkeit
ITPN20040078A1 (it) * 2004-10-25 2005-01-25 Gmi Srl Dispositivo di taglio ed incisione a laser di materiali per macchine da ricamo automatiche a controllo elettronico, e-o per plotter o roller e programma di lavorazione a ricamo di materiali di vario genere per elaboratori elettronici di controllo di
ITBO20060586A1 (it) * 2006-08-03 2006-11-02 El En Spa Dispositivo per il taglio laser di un nastro continuo.
IT1394891B1 (it) * 2008-07-25 2012-07-20 Matteo Baistrocchi Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica
ITUD20080240A1 (it) * 2008-11-12 2010-05-13 Proel S R L Macchina da ricamo con dispositivo laser di marcatura e taglio
TWI385033B (zh) * 2009-08-19 2013-02-11 Univ Nat Pingtung Sci & Tech 微槽孔過篩板之製作方法
EP2477782A1 (en) * 2009-09-18 2012-07-25 Echelon Laser Systems, Lp Laser methods to create easy tear off materials and articles made therefrom
US8585956B1 (en) 2009-10-23 2013-11-19 Therma-Tru, Inc. Systems and methods for laser marking work pieces
US9360187B2 (en) * 2010-10-04 2016-06-07 Hamamatsu Photonics K. K. Light source
RU2539342C1 (ru) * 2010-10-27 2015-01-20 Ханьнань Ппк Нетворк Текнолоджи Ко. Лтд Печатный материал с защитой от подделки с термопереводным узором, специальная фольга для термопереноса и способ изготовления такого материала
PL2658674T3 (pl) * 2010-12-30 2017-08-31 3M Innovative Properties Co Przyrząd do przekształcania laserowego wykorzystujący element wsporczy z zewnętrzną warstwą ze złota; sposób przekształcania laserowego arkusza materiału przy wykorzystaniu takiego przyrządu
CN102642090B (zh) * 2012-04-01 2015-03-25 汤振华 可回转激光掩模在线式切割或刻印系统
US20140228194A1 (en) * 2013-02-13 2014-08-14 Multi-Pack Solutions Systems and methods for forming openings in water soluble packets
PL2994314T3 (pl) * 2013-05-06 2018-01-31 Giesecke & Devrient Mobile Security Gmbh Strona danych do książeczki paszportowej, folia łącząca dla niej i sposób wytwarzania
CA2871901C (en) * 2014-10-24 2021-07-20 Multi-Pack Solutions Systems and methods for forming dual layer water soluble packets
CN107072849B (zh) 2014-11-06 2020-10-30 宝洁公司 莫尔效应层合体及其制备方法
US11247428B2 (en) * 2016-11-07 2022-02-15 Marstonmap, Llc Apparatus and method for producing microperforated patches and labels applicable to modified atmosphere packaging
WO2018152272A1 (en) 2017-02-16 2018-08-23 The Procter & Gamble Company Absorbent articles with substrates having repeating patterns of apertures comprising a plurality of repeat units
EP3388188B1 (en) * 2017-03-29 2020-09-09 Preco, Inc. Reverse draft hole apparatus and method
CH714377B1 (de) * 2017-11-30 2021-10-15 Laesser Ag Verfahren und Vorrichtung, um mittels einer Stickmaschine flächige Applikationen auf einem Stickboden zu applizieren.
EP3765232B1 (en) * 2018-03-16 2024-05-01 Preco, LLC Laser-made microperforations in films
US12127925B2 (en) 2018-04-17 2024-10-29 The Procter & Gamble Company Webs for absorbent articles and methods of making the same
EP4621115A3 (en) 2019-04-24 2025-10-29 The Procter & Gamble Company Highly extensible nonwoven webs and absorbent articles having such webs
EP4070908A1 (de) * 2021-04-09 2022-10-12 INTERLAS GmbH & Co. KG Mikroperforationsverfahren und -vorrichtung mit einer sich bewegenden bahn

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JPS63188486A (ja) * 1987-01-30 1988-08-04 Japan Tobacco Inc 帯状シ−ト材料の穿孔方法及び装置
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JPH0354053A (ja) * 1989-07-20 1991-03-08 Tokico Ltd トラクション制御装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127293A (en) * 1994-12-16 2000-10-03 Nippon Petrochemicals Co., Ltd. Laminated bodies and woven and nonwoven fabrics comprising α-olefin polymeric adhesion materials catalyzed with cyclopentadienyl catalyst
US6054086A (en) * 1995-03-24 2000-04-25 Nippon Petrochemicals Co., Ltd. Process of making high-strength yarns
US6821348B2 (en) 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US7241688B2 (en) 2002-02-14 2007-07-10 3M Innovative Properties Company Aperture masks for circuit fabrication
US7297361B2 (en) 2002-02-14 2007-11-20 3M Innovative Properties Company In-line deposition processes for circuit fabrication
JP2016518988A (ja) * 2013-03-26 2016-06-30 トカノ・ホールディング・ベスローテン・フェンノートシャップ 紙を選択的に炭化する装置及び方法
JP2017519118A (ja) * 2014-04-18 2017-07-13 ジーディーエム エス．ピー．エー．Ｇｄｍ Ｓ．Ｐ．Ａ． 材料ウェブを切断する装置
JP2018507111A (ja) * 2014-12-24 2018-03-15 ポスコＰｏｓｃｏ 鋼板表面の溝形成方法およびその装置
WO2019044879A1 (ja) * 2017-09-01 2019-03-07 株式会社ワイヤード レーザ加工装置、レーザ加工方法およびこれを用いて加工された薄板
JP2019042799A (ja) * 2017-09-01 2019-03-22 株式会社ワイヤード レーザ加工装置、レーザ加工方法およびこれを用いて加工された薄板
KR20200020866A (ko) * 2017-09-01 2020-02-26 가부시키가이샤 와이야도 레이저 가공 장치, 레이저 가공 방법 및 이것을 이용하여 가공된 박판
US11338394B2 (en) 2017-09-01 2022-05-24 Wired Co., Ltd. Laser processing apparatus, laser processing method and thin plate processed using the same
JP2021194855A (ja) * 2020-06-15 2021-12-27 大日本印刷株式会社 孔付きシートの製造方法

Also Published As

Publication number Publication date
EP0549357B1 (en) 1997-03-26
US5382773A (en) 1995-01-17
DE69218569D1 (de) 1997-04-30
CA2086202A1 (en) 1993-06-28
EP0549357A1 (en) 1993-06-30
TW212153B (2) 1993-09-01
ES2100312T3 (es) 1997-06-16
DE69218569T2 (de) 1997-11-13

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