JPH05237652A - Controller for reflow device - Google Patents
Controller for reflow deviceInfo
- Publication number
- JPH05237652A JPH05237652A JP4033091A JP3309192A JPH05237652A JP H05237652 A JPH05237652 A JP H05237652A JP 4033091 A JP4033091 A JP 4033091A JP 3309192 A JP3309192 A JP 3309192A JP H05237652 A JPH05237652 A JP H05237652A
- Authority
- JP
- Japan
- Prior art keywords
- reflow device
- reflow
- information
- printed circuit
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板の半田溶
融を行うリフロー装置の制御装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control device for a reflow device that melts solder on a printed circuit board.
【０００２】[0002]
【従来の技術】従来、リフロー装置の温度条件設定は、
過去の経験をもとに、作業者が手動で入力データの設定
を行っていた。2. Description of the Related Art Conventionally, the temperature condition setting of a reflow device is as follows.
Based on past experience, the operator manually set the input data.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記従来
の構成では、リフロー装置に詳しい経験者でないと装置
の条件設定が難しく、また経験者であっても、新基板へ
の機種切り替えの度にリフロー装置の条件設定を行わな
ければならないので、その工程を必要とし、手間がかか
り、時間も長くかかってしまうという問題を有してい
た。However, in the above-described conventional configuration, it is difficult to set the conditions of the reflow device unless the user has experience in reflow equipment, and even if the user has experience, the reflow equipment is changed every time the model is switched to a new board. Since the above conditions have to be set, there is a problem in that the process is required, which is troublesome and takes a long time.
【０００４】また、リフロー装置の設定を行う作業者の
ノウハウによって条件設定の善し悪しを判断するため、
同じリフロー装置であっても、設定を行う作業者が変わ
れば、設定条件も異なり、出来上がってくる基板にばら
つきが生じるという問題があった。Further, in order to judge whether the condition setting is good or bad based on the know-how of the operator who sets the reflow apparatus,
Even with the same reflow apparatus, if the operator who performs the setting changes, the setting conditions also differ, and there is a problem in that the resulting substrates vary.
【０００５】本発明は上記従来の問題を解決するもの
で、半田溶融を行うための製造条件をもとにリフロー装
置内の温度条件を自動的に設定することができるリフロ
ー装置の制御装置を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and provides a control device for a reflow device capable of automatically setting temperature conditions in the reflow device based on manufacturing conditions for melting solder. The purpose is to do.
【０００６】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するために、プリント基板の材質，厚さ，サイズ等の基
板情報と、この基板情報をもとにあらかじめ登録されて
いるデータベースと、プリント基板に取り付けられた温
度検出体との信号を入力しリフロー装置内の温度条件を
設定する演算手段を備えた構成を有している。In order to achieve the above object, the present invention provides board information such as material, thickness and size of a printed board, and a database registered in advance based on the board information. It has a configuration including a calculation means for inputting a signal from a temperature detection body attached to a printed circuit board and setting a temperature condition in the reflow device.
【０００７】[0007]
【作用】上記した構成において、演算手段が基板情報，
データベースおよび温度検出体の信号を入力するとリフ
ロー装置内の温度条件を演算処理するため、自動的に温
度設定できる。In the above structure, the calculating means is the substrate information,
When the signals of the database and the temperature detector are input, the temperature condition in the reflow device is calculated, so that the temperature can be set automatically.
【０００８】[0008]
【実施例】以下、本発明の一実施例について、図１〜図
３を参照しながら説明する。図に示すように、基板情報
１はプリント基板（図示せず）の材質，厚さおよびサイ
ズの情報であり、データベース２は基板情報１をもとに
あらかじめ初期設定値を登録しているものであり、温度
検出体３はプリント基板に取り付けられた熱電対であ
る。そして、基板情報１，データベース２および温度検
出対３の信号を演算手段４に取り込んでリフロー装置５
の温度条件を自動的に設定する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. As shown in the figure, the board information 1 is information on the material, thickness and size of a printed circuit board (not shown), and the database 2 is based on the board information 1 and pre-registered with initial setting values. Yes, the temperature detector 3 is a thermocouple attached to the printed circuit board. Then, the signals of the board information 1, the database 2 and the temperature detection pair 3 are taken into the calculating means 4 and the reflow device 5 is used.
Automatically set the temperature condition of.
【０００９】次に図２に基づいてその動作を説明する。
すなわち、ステップ１で基板情報１として材質，厚さお
よびサイズの入力を行う。ステップ２では、ステップ１
で入力された基板情報１をもとに、あらかじめ登録され
ていたデータベース２の検索を行い、ここで得られた条
件設定下でリフロー装置５の立ち上げを行い、ステップ
３で測定用のプリント基板をリフロー装置５内部に流
す。ステップ４で予熱ゾーン，リフローゾーンにおける
測定用のプリント基板上の温度測定を行う。ステップ５
では、あらかじめ設定されていた目標値とステップ４で
計測した実測値との比較を行い、この比較結果において
（実測値−目標値）の絶対値が０または０に近似してい
ればステップ６に進み、プリント基板の生産を開始す
る。（実測値−目標値）の絶対値が０以上であれば、ス
テップ２に戻り再設定を行う。Next, the operation will be described with reference to FIG.
That is, in step 1, the material, thickness, and size are input as the board information 1. In Step 2, Step 1
The pre-registered database 2 is searched based on the board information 1 input in step 1, the reflow device 5 is started up under the condition settings obtained here, and the printed circuit board for measurement is set in step 3. Flow into the reflow device 5. In step 4, the temperature on the printed circuit board for measurement in the preheating zone and the reflow zone is measured. Step 5
Then, the preset target value is compared with the measured value measured in step 4, and if the absolute value of (measured value-target value) is 0 or close to 0 in this comparison result, the process proceeds to step 6. Proceed to start production of printed circuit boards. If the absolute value of (measured value-target value) is 0 or more, the process returns to step 2 and resets.
【００１０】図３はリフロー装置条件設定を行う場合の
演算方法と、パラメータ条件を示すものである。例え
ば、生産を行うプリント基板の材質がガラスエポキシ
で、厚みが１．６mm、サイズが３３０×２５０、目標値
がＴであったとすると、リフロー装置５の初期設定とし
て、データベース２の中から上記パラメータ条件にあっ
たリフロー装置５の温度として初期値ｘoと、フィード
バック係数ｋoが設定される。初期値ｘoのもとで測定用
のプリント基板で測定した実測値がθ1であった時、２
回目に設定を行うリフロー装置５の設定温度ｘ1は、ｘ1
＝ｋo・（Ｔ−θo）＋ｘoで求められる。FIG. 3 shows a calculation method and a parameter condition when the reflow apparatus condition is set. For example, if the material of the printed circuit board to be produced is glass epoxy, the thickness is 1.6 mm, the size is 330 × 250, and the target value is T, then the above parameters from the database 2 are set as the initial settings of the reflow device 5. An initial value x o and a feedback coefficient k o are set as the temperature of the reflow device 5 that meets the conditions. When the measured value measured on the printed circuit board for measurement under the initial value x o is θ 1 , 2
The set temperature x 1 of the reflow device 5 to be set for the second time is x 1
= K o · (T−θ o ) + x o .
【００１１】フィードバック係数の漸化式をｋn＝０．
８・ｋn-1とした時、ｎ回目でのリフロー装置５の設定
温度ｘnｎは、ｘn＝ｋn・（Ｔ−θn-1）＋ｘn-1として
計算により算出されることになる。The feedback coefficient recurrence formula is set to k n = 0.
When it is set to 8 · k n−1 , the set temperature x n n of the reflow device 5 at the n-th time should be calculated as x n = k n · (T−θ n−1 ) + x n−1. become.
【００１２】[0012]
【発明の効果】上記実施例から明らかなように本発明の
リフロー装置の制御装置は、プリント基板の材質，厚
さ，サイズ等の基板情報と、この基板情報をもとにあら
かじめ登録されているデータベースと、プリント基板に
取り付けられた温度検出体との信号を入力しリフロー装
置内の温度条件を設定する演算手段を備えたものであ
り、この構成とすることにより、リフロー装置内の温度
条件を自動的に設定することができ、プリント基板の品
質を向上できる。As is apparent from the above embodiment, the control device of the reflow apparatus of the present invention is pre-registered based on the board information such as the material, thickness and size of the printed board and the board information. It is equipped with a calculation means for inputting signals from the database and the temperature detector attached to the printed circuit board to set the temperature condition in the reflow device. It can be set automatically and the quality of the printed circuit board can be improved.
【図１】本発明の一実施例におけるリフロー装置の制御
装置のブロック図FIG. 1 is a block diagram of a control device of a reflow device according to an embodiment of the present invention.
【図２】同制御装置の動作フローチャートFIG. 2 is an operation flowchart of the control device.
【図３】（ａ）同制御装置の演算方法を説明するための
図 （ｂ）パラメータ条件を説明するための図3A is a diagram for explaining a calculation method of the control device, and FIG. 3B is a diagram for explaining parameter conditions.
１ 基板情報 ２ データベース ３ 温度検出体 ４ 演算手段 ５ リフロー装置 1 substrate information 2 database 3 temperature detector 4 computing means 5 reflow device
Claims (1)
装置の制御装置であって、前記プリント基盤の材質，厚
さ，サイズ等の基板情報と、この基板情報をもとにあら
かじめ登録されているデータベースと、前記プリント基
板に取り付けられた温度検出体との信号を入力しリフロ
ー装置内の温度条件を設定する演算手段を備えたリフロ
ー装置の制御装置。1. A control device of a reflow device for melting solder of a printed circuit board, wherein board information such as material, thickness and size of the printed circuit board, and a database registered in advance based on this board information. And a control means for the reflow device, which comprises a calculation means for inputting a signal from the temperature detecting member attached to the printed circuit board and setting a temperature condition in the reflow device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4033091A JPH05237652A (en) | 1992-02-20 | 1992-02-20 | Controller for reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4033091A JPH05237652A (en) | 1992-02-20 | 1992-02-20 | Controller for reflow device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05237652A true JPH05237652A (en) | 1993-09-17 |
Family
ID=12377004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4033091A Pending JPH05237652A (en) | 1992-02-20 | 1992-02-20 | Controller for reflow device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05237652A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101426344B (en) | 2007-11-02 | 2011-03-16 | 上海华为技术有限公司 | Reflux temperature curve setting method and apparatus thereof |
-
1992
- 1992-02-20 JP JP4033091A patent/JPH05237652A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101426344B (en) | 2007-11-02 | 2011-03-16 | 上海华为技术有限公司 | Reflux temperature curve setting method and apparatus thereof |
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