JPH05261U - Reflow heating device - Google Patents

Abstract

(57) [Summary] [Purpose] By reflow soldering of component mounting board,
A heating method that mainly uses forced convection heat by hot air and a heating method that also uses radiant heat by infrared irradiation can be easily switched as needed to appropriately cope with a change in substrate. [Configuration] The heater 22 is opened by opening the infrared control body 23.
The infrared rays generated by the substrate W are irradiated onto the substrate W through the infrared ray transmitting portion 42. At the same time, the hot air heated through the heater 22 is blown onto the substrate through the infrared transmitting section 42, and the radiant heat of infrared rays and the convective heat of hot air are used together to reflow the solder paste of the substrate. At this time, the hot air control units 48 facing each other
Rotates in a direction that limits the air volume. Meanwhile, heater
When the infrared control bodies 23 facing each other under 22 are closed,
The infrared control body 23 blocks the infrared light emitted to the substrate W. At this time, since the hot air control bodies 48 facing each other are in the fully open state, reflow occurs only by the forced convection heat of the hot air passing between the hot air control bodies 48.

Description

[Detailed description of the device]

[0001]   [Purpose of device]

[0002]

[Industrial applications]

  The present invention relates to a reflow heating device used for reflow soldering. Is.

[0003]

[Prior art]

  As a conventional reflow heating device, as shown in FIG. Inside, while circulating the air flow generated by the blower 2 along the guide plate 3, The infrared rays emitted from the heater 4 are blocked, and the air (heat Only the wind) is applied to the component mounting board W, and the forced convection heat is transferred to the board W to obtain solder paste. A single heating device for reflowing the paste, as disclosed in JP-A-61-289697. Radiant heat transfer by infrared rays radiated from the heater and through the heater as Reflow soldering the component mounting board by using forced convection heat transfer with hot air A combined heating device is commonly known.

[0004]   The independent heating device using only the hot air has excellent temperature distribution uniformity, It has advantages such as small temperature difference and low temperature soldering. It is difficult to raise the temperature, and it takes time to heat it. There is a drawback that it becomes high as well as the degree.

[0005]   The combined heating device of radiant heat and forced convection heat rapidly applies infrared radiant heat. It has the advantage that it can generate heat and that the temperature of the component body does not easily rise above the temperature of the board. However, since the amount of infrared absorption differs depending on the color of the component body, etc., the temperature difference Is likely to occur and the reflow temperature becomes high.

[0006]   Users should find the ideal temperature for the reflow soldering of their component mounting boards. Use a hot air-only heating device or a combination type It is selected from thermal equipment, purchased and used.

[0007]

[Problems to be solved by the device]

  In this way, the ideal temperature However, the target of reflow soldering is completely different from the new product. Easily replace expensive heating equipment when changing to a component mounting board Production with an unsatisfactory temperature profile that does not match the modified substrate Often continue.

[0008]   The present invention has been made in view of such a point, and the forced convection heat by hot air is generated. Main heating method and heating method using radiant heat from infrared irradiation It can be easily switched as needed to change the reflow soldering work. It is an object of the present invention to provide a heating device for reflow that can be appropriately dealt with.

[0009]   [Constitution of device]

[0010]

[Means for Solving the Problems]

  According to the first aspect of the invention, radiant heat transfer by infrared rays emitted from the heater 22 , Is transported along the heater 22 by forced convection heat transfer by hot air that has passed through the heater 22 In the heating device for reflow soldering the work W to be processed, An infrared control body 23 for controlling the infrared irradiation amount is provided between the base station W and the rack W so as to be openable and closable. It is a reflow heating device.

[0011]   The invention according to claim 2 irradiates from a plurality of heaters 22 arranged at predetermined intervals. Radiant heat transfer by the generated infrared rays and forced convection heat by the hot air passing through each of the heaters 22. The work W conveyed along each heater 22 is reflow-soldered by transmission. In the heating device, a single heater is provided between each heater 22 and the work W. Attached to each other with a pair of rotating shafts 43 arranged via an infrared transmitting portion 42 facing each other. And the rotation shafts 43 arranged via the infrared transmitting section 42 are rotated in opposite directions. Opening and closing the infrared radiation control unit 23 to control the amount of infrared radiation, and each infrared control The infrared control bodies 23 are mounted so as to face each other on the respective rotary shafts 43 common to the body 23. By the amount of rotation in the opening direction, it rotates in the mutual closing direction to control the hot air passage amount. This is a reflow heating device including a number of hot air control bodies 48.

[0012]

[Action]

  The invention according to claim 1 is an infrared control body between the heater 22 and the work W. By closing 23, the infrared rays radiated to the work W are limited and mainly the hot air The work W is reflow heated by the forced convection heat. Also, open the infrared control unit 23. By doing so, infrared radiant heat and forced convection heat are used together to reflow the workpiece W. heat.

[0013]   The invention according to claim 2 is that the infrared control body 23 is closed and heated mainly by hot air. Also, when the infrared control body 23 is opened and infrared radiant heat and forced convection heat are used together. Also, hot-air control mounted on the rotary shaft 43 common to the infrared control body 23 so as to face each other. The body 48 is rotated in the mutually opening direction of the infrared control body 23, and thus is rotated in the mutually closing direction. The ones that move and also open each other by the amount of rotation of the infrared control bodies 23 in the direction to close each other. Rotate in the opposite direction and control so that the hot air passage amount does not change so much.

[0014]

【Example】

  Hereinafter, the present invention will be described in detail with reference to the embodiments shown in FIGS.

[0015]   FIG. 2 shows the entire structure of the reflow soldering device, which is installed inside the device main body 11 The side furnace body 12 is provided, the inside furnace body 13 is provided inside the outside furnace body 12, and the inside A heating unit 14 is arranged above the furnace body 13. Hinges 15 on top of device body 11 The lid 16 is attached by means of the openable and closable, and the outer furnace body 12 can be separated from the lid 16. The upper part 12a of the outer furnace body is integrally attached by a connecting member (not shown). The heating unit 14 is integrally attached to 12a by a connecting member (not shown). It Therefore, when the lid 16 of the apparatus body 11 is opened, the heating unit 14 also Since it is opened above 13, maintenance of this heating unit 14 and infrared rays described later This is convenient when adjusting the dose manually.

[0016]   The heating unit 14 includes a plurality of sheathed heaters 22 arranged between the left and right portions of the frame 21. The radiant heat due to the infrared rays radiated from each heater 22 attached to each heater 22 A heating device that reflow-solders a work by using forced convection heat generated by hot air. Infrared control body 23, which will be described later, is provided below each heater 22. . Further, for the purpose of making the air volume sent to the heater 22 above the frame 21 uniform. A punching plate (perforated plate) 24 is attached.

[0017]   A substrate transfer conveyor 31 is arranged below the heating unit 14. This The carrier 31 is a pair of left and right cores that penetrate the inside of the furnace through the openings 32 for loading and unloading substrates. Umbrella frames are arranged in parallel and along the left and right conveyor frames, respectively. An endless chain is provided in an elongated shape, and the soldered work is placed between the left and right chains. The component mounting substrate W, which serves as a connector, is horizontally conveyed in a suspended state.

[0018]   Below the substrate transfer conveyor 31, the heater 22 is energized to control the temperature inside the furnace. A temperature sensor 33 such as a thermocouple for controlling the temperature is inserted.

[0019]   A pair of sirocco fibers provided on a common rotary shaft 34 are provided on the left and right sides of the inner furnace body 13. 35 are provided. The rotating shaft 34 is driven by a motor 37 via a belt transmission mechanism 36. Driven. By controlling the rotation speed of this motor 37, the sirocco fan The amount of air in the furnace circulated by 35 is controlled.

[0020]   Then, the air sucked from the center of the furnace by this sirocco fan 35 The material is discharged between the side furnace body 12 and the inner furnace body 13 and rises, and the heating unit 14 is heated from above. The temperature is raised by the heater 22 through the punching plate 24, and the infrared control body 23 described later is used. Is sprayed onto the substrate W to reflow the solder paste of the substrate W by forced convection heat. It

[0021]   A perforated nozzle 38 for blowing cold air onto the substrate W is installed at the bottom of the outer furnace body 12. It has been burned. The cold air blown from the multi-hole nozzle 38 is applied to the substrate W with a low melting point solder. When using, the temperature inside the furnace is forced to protect the components under the board from high heat. It is necessary when lowering it.

[0022]   Next, as shown in FIG. 1, the heating unit 14 is installed in the frame 21. The plurality of sheathed heaters 22 are arranged at regular intervals, and an empty space is provided on both sides of each heater 22. An air rectifying plate 41 is provided.

[0023]   Further, an infrared transmission part 42 is provided below each heater 22 for each heater. A pair of rotating shafts 43 are arranged, and the rotating shafts 43 through the respective infrared transmitting portions 42 are mutually Is attached to the infrared control body 23. The rotary shafts 43 are infrared rays The mounting portion of the control body 23 has a regular hexagonal cross section, but the frame 21 is a circular cross section. It is rotatably fitted.

[0024]   An arm 44 shown by a solid line is integrally attached to the rotary shaft 43 located at the lower right of each heater 22. Each arm 44 is rotatably attached to a common interlocking link 45. The rotary shaft 43 located at the lower left of each heater 22 has an arm 46 indicated by a chain double-dashed line. The arms 46 are integrally attached, and each arm 46 is also pivotally attached to a common interlocking link 47. ing.

[0025]   One interlocking link 45 and the other interlocking link 47 are shown manually or There are no solenoids, air cylinders, etc. When the infrared control body 23 is moved to, the infrared control bodies 23 facing each other are rotated in the opposite directions to open and close. Then, the infrared light emitted from the heater 22 is blocked in the closed state.

[0026]   Further, the infrared control body 23 is attached to each common rotary shaft 43 provided with the infrared control body 23. A hot air control body 48 is attached opposite to each other on the opposite side. This hot air control body 48 is rotated in the direction in which the infrared control bodies 23 are rotated in the direction in which the infrared control bodies 23 are rotated in the direction in which they are mutually opened. It moves to control the hot air passage amount.

[0027]   Then, as shown in FIG. 3A, by opening the infrared control body 23, While irradiating the infrared IR generated from the heater 22 to the substrate through the infrared transmitting section 42, , The hot air heated by the heater 22 is blown onto the substrate through the infrared transmitting section 42 to generate infrared IR. Reflow heating of component mounting board using both radiant heat and forced convection heat from hot air To do. At this time, the hot air control bodies 48 facing each other rotate in the direction of limiting the air volume. ing.

[0028]   In addition, as shown in FIG. 3B, infrared rays that face each other under the heater 22. By closing the control body 23, the infrared rays emitted from the heater 22 to the lower side are shielded. . At this time, since the hot air control bodies 48 facing each other are in the fully open state, this pair The component mounting board is lifted by the forced convection heat of the hot air passing between the facing hot air control bodies 48. Heat low.

[0029]   In this way, even when the infrared control body 23 is closed and heated by only hot air, the red When the outside line control unit 23 is opened and infrared radiation heat and forced convection heat are used together, The hot air control body 48 attached to the control body 23 and the common rotary shaft 43 so as to face each other is an infrared ray. Since the line control bodies 23 are rotated in the mutually opening directions, they are also rotated in the mutually closing directions, and By rotating the infrared control bodies 23 in the mutually closing directions, the infrared control bodies 23 are rotated in the mutually opening directions, Control so that the hot air passage amount does not change so much.

[0030]

[Effect of device]

  According to the invention as set forth in claim 1, radiant heat by infrared irradiation and forced by hot air In a heating device that also uses convective heat, the amount of infrared irradiation between the heater and the work Since the infrared control body that controls the air flow is provided so that it can be opened and closed, Heating method that uses radiant heat from infrared irradiation It can be easily switched according to the needs of the machine, and it can respond appropriately to changes in the work piece. The thermal device can provide the optimum temperature profile for multiple types of workpieces.

[0031]   According to the invention described in claim 2, the infrared control body and the hot air control body are provided on the rotation shaft. Since it is installed so that the opening and closing are reversed, the amount of hot air passing through is variable even if the infrared irradiation amount is variably controlled. Can be maintained so that it does not fluctuate, and the effect of the invention of claim 1 is ensured. It can be something.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a reflow heating device of the present invention.

FIG. 2 is a cross-sectional view of a reflow type soldering device including the same heating device.

FIG. 3 is a cross-sectional view showing the operation of the above heating device.

FIG. 4 is a sectional view of a conventional reflow soldering device.

[Explanation of symbols]

W work 22 heater 23 Infrared control body 42 Infrared transmission part 43 rotation axis 48 Hot air control unit

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Creator Niki Masuda             11 Kamihirose Higashikubo 591, Sayama City, Saitama Prefecture             Tamura Manufacturing Co., Ltd. (72) Creator Nobuhide Abe             11 Kamihirose Higashikubo 591, Sayama City, Saitama Prefecture             Tamura Manufacturing Co., Ltd.

Claims (2)

[Scope of utility model registration request] 1. A heating device for reflow soldering a work conveyed along a heater by radiant heat transfer by infrared rays radiated from a heater and forced convection heat transfer by hot air passing through the heater. The reflow heating device is characterized in that an infrared control body for controlling the infrared irradiation amount is provided between the two so as to be openable and closable. 2. A work conveyed along each heater is transferred by radiant heat transfer by infrared rays emitted from a plurality of heaters arranged at predetermined intervals and forced convection heat transfer by hot air passing through each heater. In a heating device for reflow soldering, the heaters and the workpiece are attached to each other so as to face each other with a pair of rotating shafts arranged between the heaters via an infrared transmitting portion, and the infrared transmitting portion is interposed therebetween. A plurality of infrared control bodies for controlling the infrared irradiation amount by opening and closing by rotating the arranged rotary shafts in opposite directions to each other, and attached to each rotary shaft common to each infrared control body so as to face each other, A heating apparatus for reflow, comprising: a plurality of hot air control bodies for controlling the amount of hot air passing by rotating the infrared control bodies in mutually opening directions and rotating in mutually closing directions. .