JPH0526741Y2 - - Google Patents
Info
- Publication number
- JPH0526741Y2 JPH0526741Y2 JP14257088U JP14257088U JPH0526741Y2 JP H0526741 Y2 JPH0526741 Y2 JP H0526741Y2 JP 14257088 U JP14257088 U JP 14257088U JP 14257088 U JP14257088 U JP 14257088U JP H0526741 Y2 JPH0526741 Y2 JP H0526741Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- attachment
- integrated circuit
- molding
- male connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 8
- 238000001721 transfer moulding Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、集積回路に雄コネクタ部を一体形
成した集積回路パツケージに関する。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to an integrated circuit package in which a male connector portion is integrally formed with an integrated circuit.
従来、集積回路は例えば、実公昭52−3645号公
報に開示されているごときリード線によつて例え
ば、プリント基板に電気的接続を行つていた。
Conventionally, integrated circuits have been electrically connected to, for example, a printed circuit board by lead wires such as those disclosed in Japanese Utility Model Publication No. 52-3645.
しかしながら、近時に於いて、コネクタを用い
た装置に着脱自在な集積回路の要求が生じてお
り、前記した従来の技術では対応できない。すな
わち、前記した従来の技術では半田付けや特殊な
差込み端子を用いて他の装置に接続せざるを得
ず、その為、他の装置に対して頻繁に着脱を行な
うには不適当であつた。
However, in recent years, there has been a demand for removable integrated circuits in devices using connectors, which cannot be met by the above-mentioned conventional techniques. In other words, in the conventional technology described above, it is necessary to connect to other devices by soldering or using special plug-in terminals, which makes it unsuitable for frequent attachment and detachment to other devices. .
この考案は、前記した従来の技術の有する問題
点に着目してなされたものであり、トランスフア
モールド金型を用いてパツケージを成形した集積
回路に於いて、前記パツケージは成形前に予め端
子部に挟着され成形後に取外し可能なアタツチメ
ントによる凹部を有し、該凹部を雄コネクタ部と
して構成したことを特徴とする集積回路パツケー
ジを提供する。
This idea was made by focusing on the problems of the conventional technology described above, and in an integrated circuit in which a package is molded using a transfer molding mold, the terminal portion of the package is pre-molded. Provided is an integrated circuit package characterized in that it has a recessed part formed by an attachment that is sandwiched between the two parts and is removable after molding, and the recessed part is configured as a male connector part.
集積回路をトランスフアモールドする場合、先
ず集積回路の端子部にアタツチメントを挟着す
る。そして、金型を用いてトランスフアモールド
が終了した後、前記アタツチメントを端子部から
取外す。
When transfer molding an integrated circuit, an attachment is first clamped onto the terminal portion of the integrated circuit. After transfer molding is completed using a metal mold, the attachment is removed from the terminal portion.
該アタツチメントを取外すと集積回路に凹部が
形成される。 Removal of the attachment forms a recess in the integrated circuit.
該凹部は雄コネクタ部として構成され、他の装
置に接続された雌コネクタ（図示せず）に対し嵌
合して使用される。 The recess is configured as a male connector portion and is used by fitting into a female connector (not shown) connected to another device.
添付図面は、この考案の好適な実施例を示した
図面である。
The accompanying drawings show preferred embodiments of this invention.
第１図に於いて、１は集積回路Ａのパツケージ
であり、該パツケージ１の側面に向けて開口され
た雄コネクタ部２を有している。 In FIG. 1, 1 is a package for an integrated circuit A, and has a male connector portion 2 opened toward the side surface of the package 1. As shown in FIG.
更に前記雄コネクタ部２は複数の端子部３を有
している。 Furthermore, the male connector section 2 has a plurality of terminal sections 3.
詳述すると、前記パツケージ１は第２図に示す
ごとくトランスフアモールドによつて成形された
ものであり、エポキシ樹脂等の樹脂によつて形成
されている。 To be more specific, the package 1 is molded by transfer molding as shown in FIG. 2, and is made of resin such as epoxy resin.
第２図に於いて、４は回路基板であり、電子素
子５及び前記複数の端子部３を固着している。 In FIG. 2, reference numeral 4 denotes a circuit board to which the electronic element 5 and the plurality of terminal parts 3 are fixed.
また６は第１部材６１と第２部材６２を支軸６
３によつて回動自在に接続したアタツチメントで
あり、パツケージ１の成形前に複数の端子部３に
挟着され、成形後に於いて複数の端子部３及びパ
ツケージ１から取外される。 6 also supports the first member 61 and the second member 62 on the support shaft 6.
It is an attachment rotatably connected by 3, and is clamped to the plurality of terminal parts 3 before molding of the package 1, and is removed from the plurality of terminal parts 3 and the package 1 after molding.
また、７及び８はトランスフアモールド金型の
上型及び下型であり、９は樹脂を注入するゲート
である。 Further, 7 and 8 are upper and lower molds of the transfer molding mold, and 9 is a gate for injecting resin.
而して、加熱溶融した樹脂をゲート９から注入
すれば、上型７及び下型８の接合された内部空間
Ｓに前記樹脂が充填される。そして、該樹脂の冷
却後、成形されたパツケージ１を金型から外し、
アタツチメント６を複数の端子部３から取外すこ
とによつて第１図に示すごとき形状の雄コネクタ
部２がパツケージ１に一体形成される。 When the heated and molten resin is injected through the gate 9, the interior space S where the upper mold 7 and the lower mold 8 are joined is filled with the resin. After cooling the resin, the molded package 1 is removed from the mold,
By removing the attachments 6 from the plurality of terminal parts 3, the male connector part 2 having the shape shown in FIG. 1 is integrally formed with the package 1.
尚、この考案は上述の実施例に限定されず、例
えば第３図に示すごとく複数の端子部３を２段構
えにする場合はアタツチメント６′を第３図に示
すごとき形状にすればよい。すなわち、複数の端
子部３はアタツチメント６′を構成する支軸６
３′及び６４によつて回動自在な第１部材６１′、
第２部材６２′及び第３部材６５によつて２カ所
で挟持するよう構成すればよい。 Note that this invention is not limited to the above-described embodiment. For example, when a plurality of terminal portions 3 are arranged in two stages as shown in FIG. 3, the attachment 6' may be shaped as shown in FIG. That is, the plurality of terminal portions 3 are connected to the support shaft 6 constituting the attachment 6'.
a first member 61' rotatable by 3' and 64;
It may be configured to be held in two places by the second member 62' and the third member 65.
この考案は、前述のごとくパツケージの成形前
に於いて予め端子部にアタツチメントを挟着し、
成形後に於いて前記アタツチメントを複数の端子
部から取外すことにより、パツケージに雄コネク
タ部を形成すべく構成したことに特徴を有し、前
記雄コネクタ部によつて集積回路を他の装置に頻
繁に着脱することができる効果を奏する。
As mentioned above, this idea involves attaching an attachment to the terminal part in advance before molding the package.
The package is characterized in that a male connector portion is formed in the package by removing the attachments from the plurality of terminal portions after molding, and the integrated circuit is frequently connected to other devices by the male connector portion. It has the effect of being removable.
第１図は、この考案の好適な実施例を示す斜視
図である。第２図は、第１図に示すものを成形す
るための金型及び被成形部品の断面図である。第
３図は、他のアタツチメントを例示した側面図で
ある。
１……パツケージ、２……雄コネクタ部、３…
…複数の端子部、４……回路基板、５……電子素
子、６……アタツチメント。
FIG. 1 is a perspective view showing a preferred embodiment of this invention. FIG. 2 is a sectional view of a mold and a molded part for molding what is shown in FIG. 1. FIG. 3 is a side view illustrating another attachment. 1...Package cage, 2...Male connector part, 3...
...A plurality of terminal parts, 4...Circuit board, 5...Electronic element, 6...Attachment.
Claims (1)
形成したパツケージに於いて、前記パツケージは
成形前に予め端子部に挟着され成形後に取外し可
能なアタツチメントによる凹部を有し、該凹部を
雄コネクタ部として構成したことを特徴とする集
積回路パツケージ。 In a package in which an integrated circuit is formed using a transfer molding mold, the package has a recess formed by an attachment that is clamped to the terminal portion before molding and is removable after molding, and the recess is used as a male connector portion. An integrated circuit package characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14257088U JPH0526741Y2 (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14257088U JPH0526741Y2 (en) | 1988-10-31 | 1988-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262721U JPH0262721U (en) | 1990-05-10 |
| JPH0526741Y2 true JPH0526741Y2 (en) | 1993-07-07 |
Family
ID=31408644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14257088U Expired - Lifetime JPH0526741Y2 (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526741Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4548199B2 (en) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | Method for manufacturing electronic circuit device |
| JP2009033065A (en) * | 2007-07-30 | 2009-02-12 | Mitsubishi Electric Corp | Fin integrated semiconductor module and manufacturing method thereof |
| DE102008040676A1 (en) * | 2008-07-24 | 2010-01-28 | Robert Bosch Gmbh | Sealing frame and method for covering a component |
| JP2018146264A (en) * | 2017-03-01 | 2018-09-20 | 矢崎総業株式会社 | Insulation state detection device |
-
1988
- 1988-10-31 JP JP14257088U patent/JPH0526741Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0262721U (en) | 1990-05-10 |
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