JPH05273758A - ミクロ構造素子の製造方法 - Google Patents

ミクロ構造素子の製造方法

Info

Publication number: JPH05273758A
Authority: JP; Japan
Prior art keywords: polymer; developer; fine; polyactide; minutes
Prior art date: 1991-12-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

JP4319889A

Other languages

English (en)

Japanese (ja)

Inventor

Peter Hoessel

ペーター、ヘセル

Gerhard Dr Hoffmann

ゲールハルト、ホフマン

Juergen Langen

ユルゲン、ランゲン

Holger Reinecke

ホルガー、ライネケ

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

BASF SE

Original Assignee

BASF SE

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-12-14

Filing date

1992-11-30

Publication date

1993-10-22

1992-11-30 Application filed by BASF SE filed Critical BASF SE

1993-10-22 Publication of JPH05273758A publication Critical patent/JPH05273758A/ja

Status Withdrawn legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title claims description 11
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 33
229920001577 copolymer Polymers 0.000 claims abstract description 20
229920000642 polymer Polymers 0.000 claims abstract description 20
229920000954 Polyglycolide Polymers 0.000 claims abstract description 9
AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Polymers OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims abstract description 8
230000001678 irradiating effect Effects 0.000 claims abstract description 5
230000005469 synchrotron radiation Effects 0.000 claims abstract description 5
230000001476 alcoholic effect Effects 0.000 claims abstract description 3
229920000747 poly(lactic acid) Polymers 0.000 claims abstract description 3
238000000034 method Methods 0.000 claims description 18
229920003232 aliphatic polyester Polymers 0.000 claims description 12
150000001412 amines Chemical class 0.000 claims description 3
239000003795 chemical substances by application Substances 0.000 claims description 2
238000000748 compression moulding Methods 0.000 abstract description 6
238000001125 extrusion Methods 0.000 abstract description 4
238000001746 injection moulding Methods 0.000 abstract description 4
229920000728 polyester Polymers 0.000 abstract 3
RKDVKSZUMVYZHH-UHFFFAOYSA-N 1,4-dioxane-2,5-dione Chemical compound O=C1COC(=O)CO1 RKDVKSZUMVYZHH-UHFFFAOYSA-N 0.000 abstract 1
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 14
230000007547 defect Effects 0.000 description 11
229920003229 poly(methyl methacrylate) Polymers 0.000 description 11
239000004926 polymethyl methacrylate Substances 0.000 description 11
229920001519 homopolymer Polymers 0.000 description 9
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
238000005323 electroforming Methods 0.000 description 7
229910052751 metal Inorganic materials 0.000 description 7
239000002184 metal Substances 0.000 description 7
JJTUDXZGHPGLLC-IMJSIDKUSA-N 4511-42-6 Chemical compound C[C@@H]1OC(=O)[C@H](C)OC1=O JJTUDXZGHPGLLC-IMJSIDKUSA-N 0.000 description 6
230000000052 comparative effect Effects 0.000 description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
229910052802 copper Inorganic materials 0.000 description 5
239000010949 copper Substances 0.000 description 5
238000005336 cracking Methods 0.000 description 5
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
238000000576 coating method Methods 0.000 description 4
238000005516 engineering process Methods 0.000 description 4
238000004377 microelectronic Methods 0.000 description 4
230000005855 radiation Effects 0.000 description 4
SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 3
229940006015 4-hydroxybutyric acid Drugs 0.000 description 3
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
239000006096 absorbing agent Substances 0.000 description 3
239000011248 coating agent Substances 0.000 description 3
239000008188 pellet Substances 0.000 description 3
239000000047 product Substances 0.000 description 3
239000000243 solution Substances 0.000 description 3
239000010936 titanium Substances 0.000 description 3
229910052719 titanium Inorganic materials 0.000 description 3
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
238000005266 casting Methods 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
230000003287 optical effect Effects 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
SCRCZNMJAVGGEI-UHFFFAOYSA-N 1,4-dioxane-2,5-dione;oxepan-2-one Chemical compound O=C1COC(=O)CO1.O=C1CCCCCO1 SCRCZNMJAVGGEI-UHFFFAOYSA-N 0.000 description 1
JRHWHSJDIILJAT-UHFFFAOYSA-N 2-hydroxypentanoic acid Chemical compound CCCC(O)C(O)=O JRHWHSJDIILJAT-UHFFFAOYSA-N 0.000 description 1
IUPHTVOTTBREAV-UHFFFAOYSA-N 3-hydroxybutanoic acid;3-hydroxypentanoic acid Chemical compound CC(O)CC(O)=O.CCC(O)CC(O)=O IUPHTVOTTBREAV-UHFFFAOYSA-N 0.000 description 1
WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 description 1
OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
229920013642 Biopol™ Polymers 0.000 description 1
UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000002318 adhesion promoter Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
230000000712 assembly Effects 0.000 description 1
238000000429 assembly Methods 0.000 description 1
229910052790 beryllium Inorganic materials 0.000 description 1
ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
229910002091 carbon monoxide Inorganic materials 0.000 description 1
239000013065 commercial product Substances 0.000 description 1
238000001035 drying Methods 0.000 description 1
239000011888 foil Substances 0.000 description 1
235000019253 formic acid Nutrition 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
230000010354 integration Effects 0.000 description 1
238000001459 lithography Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
239000012528 membrane Substances 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
239000013307 optical fiber Substances 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
235000005985 organic acids Nutrition 0.000 description 1
239000005022 packaging material Substances 0.000 description 1
229920001432 poly(L-lactide) Polymers 0.000 description 1
229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
239000000843 powder Substances 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000007151 ring opening polymerisation reaction Methods 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000007858 starting material Substances 0.000 description 1
239000010959 steel Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
230000008961 swelling Effects 0.000 description 1
230000000930 thermomechanical effect Effects 0.000 description 1
YFHICDDUDORKJB-UHFFFAOYSA-N trimethylene carbonate Chemical compound O=C1OCCCO1 YFHICDDUDORKJB-UHFFFAOYSA-N 0.000 description 1
PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
- G03F7/2039—X-ray radiation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0844—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using X-ray
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/04—Polyesters derived from hydroxycarboxylic acids
- B29K2067/043—PGA, i.e. polyglycolic acid or polyglycolide
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/04—Polyesters derived from hydroxycarboxylic acids
- B29K2067/046—PLA, i.e. polylactic acid or polylactide
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/109—Polyester
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
- Y10S430/168—X-ray exposure process

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
Toxicology (AREA)
Spectroscopy & Molecular Physics (AREA)
Treatments Of Macromolecular Shaped Articles (AREA)
Micromachines (AREA)
Extrusion Moulding Of Plastics Or The Like (AREA)
Materials For Photolithography (AREA)
Crystals, And After-Treatments Of Crystals (AREA)
Polyesters Or Polycarbonates (AREA)
Laminated Bodies (AREA)

JP4319889A 1991-12-14 1992-11-30 ミクロ構造素子の製造方法 Withdrawn JPH05273758A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE4141352A DE4141352A1 (de)	1991-12-14	1991-12-14	Verfahren zur herstellung von mikrostrukturkoerpern
DE4141352.0		1991-12-14

Publications (1)

Publication Number	Publication Date
JPH05273758A true JPH05273758A (ja)	1993-10-22

Family

ID=6447113

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4319889A Withdrawn JPH05273758A (ja)	1991-12-14	1992-11-30	ミクロ構造素子の製造方法

Country Status (8)

Country	Link
US (1)	US5518865A (2)
EP (1)	EP0547419B1 (2)
JP (1)	JPH05273758A (2)
KR (1)	KR930012919A (2)
AT (1)	ATE163096T1 (2)
DE (2)	DE4141352A1 (2)
ES (1)	ES2111601T3 (2)
TW (1)	TW223175B (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0683051A (ja) *	1992-03-19	1994-03-25	Ocg Microelectron Materials Inc	放射線に感光性の混合物のための増感剤としてのポリラクチド化合物
JP2024111098A (ja) *	2020-09-17	2024-08-16	旭化成株式会社	ネガ型感光性樹脂組成物、硬化膜および化合物

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4223888A1 (de) *	1992-07-21	1994-01-27	Basf Ag	Verfahren zur Herstellung von Mikrostrukturkörpern
DE4229244A1 (de) *	1992-09-02	1994-03-03	Basf Ag	Verfahren zur Herstellung von Mikrostrukturkörpern
DE4324079A1 (de) *	1993-07-19	1995-01-26	Basf Ag	Verfahren zur Herstellung von Mikrostrukturkörpern
DE4424236A1 (de) *	1994-07-09	1996-01-18	Deutsche Bundespost Telekom	Verfahren zur Strukturierung der Oberfläche eines aus einem Polymer bestehenden Körpers und nach dem Verfahren hergestellte Anordnungen
US6199318B1 (en)	1996-12-12	2001-03-13	Landec Corporation	Aqueous emulsions of crystalline polymers for coating seeds
DE19741492A1 (de) *	1997-09-19	1999-03-25	Microparts Gmbh	Verfahren zur Herstellung von Mikrostrukturkörpern
SE515104C2 (sv)	1999-02-12	2001-06-11	Aamic Ab	Metod för att framställa en formkropp samt en formkropp sålunda framställd
CA2379755A1 (en) *	1999-07-16	2001-01-25	Advanced Design Concept Gmbh	Fringed surface structures obtainable in a compression molding process
US6946182B1 (en)	1999-07-16	2005-09-20	Allgeuer Thomas T	Fringed surface structures obtainable in a compression molding process
DE19950452A1 (de) *	1999-10-20	2001-04-26	Creavis Tech & Innovation Gmbh	Strukturierte Oberflächen mit zelladhäsions- und zellproliferationshemmenden Eigenschaften
DE19953039A1 (de)	1999-11-03	2001-05-23	Hcd Gmbh	Verfahren zur Herstellung eines mehrschichtigen oberflächenstrukturierten Halbzeugs aus thermoplastischen Kunststoffen
US6872438B1 (en)	2000-07-17	2005-03-29	Advanced Design Concept Gmbh	Profile or molding having a fringed surface structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3039110A1 (de) *	1980-10-16	1982-05-13	Siemens AG, 1000 Berlin und 8000 München	Verfahren fuer die spannungsfreie entwicklung von bestrahlten polymethylmetacrylatschichten
DE3246825A1 (de) *	1982-02-24	1983-09-01	Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen	Positives resistmaterial
US4744365A (en) *	1986-07-17	1988-05-17	United States Surgical Corporation	Two-phase compositions for absorbable surgical devices
DE3778111D1 (de) *	1986-10-24	1992-05-14	Boehringer Ingelheim Kg	Verfahren zur herstellung und reinigung thermolabiler verbindungen.
JPS63236321A (ja) *	1987-03-25	1988-10-03	Fujitsu Ltd	Ｘ線露光装置
NL8702563A (nl) *	1987-10-28	1989-05-16	Cca Biochem B V	Polymeer lactide, werkwijze voor het bereiden van een dergelijk polymeer lactide, alsmede een samenstelling, die een dergelijk polymeer lactide bevat.
US5298367A (en) *	1991-03-09	1994-03-29	Basf Aktiengesellschaft	Production of micromoldings having a high aspect ratio

1991
- 1991-12-14 DE DE4141352A patent/DE4141352A1/de not_active Withdrawn
1992
- 1992-11-30 DE DE59209181T patent/DE59209181D1/de not_active Expired - Fee Related
- 1992-11-30 JP JP4319889A patent/JPH05273758A/ja not_active Withdrawn
- 1992-11-30 AT AT92120404T patent/ATE163096T1/de active
- 1992-11-30 EP EP92120404A patent/EP0547419B1/de not_active Expired - Lifetime
- 1992-11-30 ES ES92120404T patent/ES2111601T3/es not_active Expired - Lifetime
- 1992-12-09 KR KR1019920023662A patent/KR930012919A/ko not_active Ceased
- 1992-12-14 TW TW081110013A patent/TW223175B/zh active
1995
- 1995-03-06 US US08/400,011 patent/US5518865A/en not_active Expired - Fee Related

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0683051A (ja) *	1992-03-19	1994-03-25	Ocg Microelectron Materials Inc	放射線に感光性の混合物のための増感剤としてのポリラクチド化合物
JP2024111098A (ja) *	2020-09-17	2024-08-16	旭化成株式会社	ネガ型感光性樹脂組成物、硬化膜および化合物

Also Published As

Publication number	Publication date
ES2111601T3 (es)	1998-03-16
KR930012919A (ko)	1993-07-21
EP0547419A1 (de)	1993-06-23
ATE163096T1 (de)	1998-02-15
DE59209181D1 (de)	1998-03-12
EP0547419B1 (de)	1998-02-04
TW223175B (2)	1994-05-01
DE4141352A1 (de)	1993-06-17
US5518865A (en)	1996-05-21

Legal Events

Date

Code

Title

Description

2000-02-01

A300

Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20000201

Publication	Publication Date	Title
US5518865A (en)	1996-05-21	Production of microstructure elements
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US6251567B1 (en)	2001-06-26	Process for manufacturing microstructured bodies
US8845948B2 (en)	2014-09-30	Cytocompatible three-dimensional structures fabricated by microstereolithography
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Martínez-García et al.	2023	3D Printing‐Assisted Nanoimprint Lithography of Polymers
US5415977A (en)	1995-05-16	Production of micromoldings having a high aspect ratio
Khosla et al.	2012	New technologies for large-scale micropatterning of functional nanocomposite polymers
US5302421A (en)	1994-04-12	Production of microstructure elements
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JPH05273758A - ミクロ構造素子の製造方法 - Google Patents

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