JPH0527497Y2 - - Google Patents
Info
- Publication number
- JPH0527497Y2 JPH0527497Y2 JP856190U JP856190U JPH0527497Y2 JP H0527497 Y2 JPH0527497 Y2 JP H0527497Y2 JP 856190 U JP856190 U JP 856190U JP 856190 U JP856190 U JP 856190U JP H0527497 Y2 JPH0527497 Y2 JP H0527497Y2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply pipe
- anode plate
- plating
- droplets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 19
- 239000000498 cooling water Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 5
- 239000003595 mist Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案は、被処理物に陽極板を対設してそのメ
ツキ処理を施すメツキ処理装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a plating processing apparatus that performs plating processing on a workpiece by disposing an anode plate opposite to the workpiece.
［考案が解決しようとする課題］
メツキ処理装置にあつては、処理液槽内に浸漬
した被処理物を陰極側とし、該被処理物に陽極板
を対向させて、両者間に通電することにより該被
処理物にメツキ処理が施される。この陽極板への
通電は処理液槽の側傍上に差し渡される給電棒に
該陽極板に設けたフツクを吊持することにより行
なわれる。[Problems to be solved by the invention] In the case of plating processing equipment, the object to be treated immersed in the treatment liquid tank is used as the cathode, the anode plate is placed opposite to the object to be treated, and electricity is applied between the two. The plating process is performed on the object to be processed. Electricity is supplied to the anode plate by suspending a hook provided on the anode plate from a power supply rod extending over the side of the processing liquid tank.
ところで、処理液槽内の酸またはアルカリを成
分とするメッキ液は温度が30℃〜60℃であるため
に恒常的に蒸発し、また通電による電気分解に伴
つてミストが発生する。このためミストが通電に
より発熱している給電棒及び陽極板に設けたフツ
クに付着し、乾燥して結晶となり、さらに堆積成
長していく。通電を終るとミストの発生はなくな
るが、処理液は依然として高温に保たれているか
ら蒸気が発生し、通電による発熱のなくなつた給
電棒及び陽極板に設けたフツクに堆積成長した結
晶を溶解して給電棒及び陽極板に設けたフツクの
表面の腐食を生じ、該フツクと給電棒との間で導
通不良を生じて陽極板への通電が不安定となり、
処理不良が発生する。 By the way, the plating solution containing acid or alkali as a component in the processing solution tank constantly evaporates because the temperature is between 30° C. and 60° C., and mist is generated as a result of electrolysis caused by energization. For this reason, the mist adheres to the hook provided on the power supply rod and the anode plate, which generate heat due to energization, dries, becomes crystals, and further accumulates and grows. Once the electricity is turned off, the mist will no longer be generated, but since the processing liquid is still kept at a high temperature, steam will be generated and dissolve the crystals that have grown and accumulated on the hooks on the power supply rod and the anode plate, which no longer generate heat due to electricity. This causes corrosion on the surface of the hook provided on the power supply rod and the anode plate, causing poor continuity between the hook and the power supply rod, making the current supply to the anode plate unstable.
Processing defects occur.
そこで、この導通不良を防止するために頻繁に
処理を中断して給電棒、フツク等の点検と洗浄を
行うことが必要となり、このため稼動率が低下
し、生産性の低下を招来していた。 Therefore, in order to prevent this conduction failure, it is necessary to frequently interrupt the process to inspect and clean the power supply rod, hook, etc., which reduces the operating rate and leads to a decrease in productivity. .
この問題点を解決する手段として、給電棒とし
て内部に冷却水を通した給電パイプを使用し、給
電パイプに陽極板のフツクを吊持して該給電パイ
プから陽極板に通電する陽極板通電装置が提案さ
れ得る。 As a means to solve this problem, an anode plate energization device uses a power supply pipe with cooling water passed inside as a power supply rod, suspends the hook of the anode plate from the power supply pipe, and supplies current to the anode plate from the power supply pipe. may be proposed.
この構成にあつては給電パイプに冷却水を通す
と、該給電パイプが冷却され、そのパイプ表面に
結露を生じ、液滴となつて該表面を流れ、その流
下により該表面が自然洗浄され、付着したミスト
が洗い流されて、その結晶化が防止されるもので
ある。 In this configuration, when cooling water is passed through the power supply pipe, the power supply pipe is cooled, dew condensation occurs on the pipe surface, and the water flows down the surface in the form of droplets, and the surface is naturally cleaned by the flow. The attached mist is washed away and its crystallization is prevented.
ところで、給電パイプは材質が銅または銅の合
金のため、給電パイプ表面に付着した酸、アルカ
リミストを含む液滴によりその表面が溶解される
ことになる。このため結露により滴下する液滴中
には銅が含有することとなり、その液滴のニツケ
ルメツキ、亜鉛メツキ等のメツキ液中への滴下に
より、該メツキ液が銅で汚染され、これに伴つて
メツキ不良を生じるおそれがある。 By the way, since the power supply pipe is made of copper or a copper alloy, the surface of the power supply pipe is dissolved by droplets containing acid or alkali mist adhering to the surface of the power supply pipe. For this reason, the droplets that drop due to dew condensation contain copper, and when these droplets fall into the plating solution for nickel plating, zinc plating, etc., the plating solution is contaminated with copper, and as a result, the plating solution is contaminated with copper. Failure to do so may result in defects.
本考案はかかる問題点を解決することを目的と
するものである。 The present invention aims to solve such problems.
［課題を解決するための手段］
本考案は、内部に冷却水を通した給電パイプに
陽極板のフツクを吊持し、該給電パイプから陽極
板に通電すると共に、前記給電パイプの直下に該
パイプに沿つて集滴樋を配設したことを特徴とす
るメツキ処理装置である。[Means for Solving the Problems] The present invention suspends the hook of the anode plate from a power supply pipe through which cooling water is passed, and energizes the anode plate from the power supply pipe. This is a plating processing device characterized by having a drip collection gutter arranged along the pipe.
［作用］
給電パイプに冷却水を通すと、該給電パイプが
冷却され、その給電パイプの表面に結露が生じ、
液滴となつて給電パイプ表面を流れる。そしてこ
の液滴の流下により給電パイプ表面が自然洗浄さ
れ、給電パイプの表面に付着したミストが洗い流
され、その結晶化が防止される。一方、該給電パ
イプから流下した液滴は集滴樋に回収され外部へ
排出される。[Function] When cooling water is passed through the power supply pipe, the power supply pipe is cooled, and dew condensation occurs on the surface of the power supply pipe.
The liquid forms droplets and flows on the surface of the power supply pipe. The surface of the power supply pipe is naturally cleaned by the falling droplets, the mist adhering to the surface of the power supply pipe is washed away, and its crystallization is prevented. On the other hand, the droplets flowing down from the power supply pipe are collected by the droplet collection gutter and discharged to the outside.
［実施例］
本考案の一実施例を添付図面について説明す
る。[Example] An example of the present invention will be described with reference to the accompanying drawings.
第１，２図について、処理液槽１内には、その
前後に陽極板２，２が間隔を置いて対向して配置
される。そして該陽極板２，２の間にはハンガー
４に支持された被処理物ｗが浸漬し、該被処理物
ｗはハンガー４を介して直流電源１２の陰極側に
接続される。 1 and 2, in the processing liquid tank 1, anode plates 2, 2 are disposed facing each other with an interval in front and behind the processing liquid tank 1. A workpiece w supported by a hanger 4 is immersed between the anode plates 2 and 2, and the workpiece w is connected to the cathode side of a DC power source 12 via the hanger 4.
前記処理液槽１の両側壁上には、該側壁から立
設した係止片５に支持されて、銅または銅合金か
ら成る給電パイプ６，６が配設される。そして前
記陽極板２，２の上端に設けた導電性フツク３を
該給電パイプ６に係止し、該陽極板２，２は処理
液槽１内で上述の所要位置に吊持されている。 On both side walls of the processing liquid tank 1, power supply pipes 6, 6 made of copper or copper alloy are disposed, supported by locking pieces 5 erected from the side walls. The conductive hooks 3 provided at the upper ends of the anode plates 2, 2 are engaged with the power supply pipe 6, and the anode plates 2, 2 are suspended at the above-mentioned required positions within the processing liquid tank 1.
前記給電パイプ６は直流電源１２の陽極側に接
続されていると共に、その内部は冷却水の供給管
路７ａ、排出管路７ｂと接続されており、供給管
路７ａ、排出管路７ｂにより冷却水が流動してい
る。この冷却水は例えば10℃以下とする。尚、８
ａ，８ｂは点検等のため必要に応じて設ける開閉
弁である。 The power supply pipe 6 is connected to the anode side of the DC power supply 12, and the inside thereof is connected to a cooling water supply pipe 7a and a discharge pipe 7b. Water is flowing. The temperature of this cooling water is, for example, 10°C or lower. In addition, 8
Reference numerals a and 8b are on-off valves provided as necessary for inspection and the like.
さらに前記給電パイプ６の直下には該給電パイ
プ６に沿つて集滴樋１０が配設される。該集滴樋
１０の下底には排出管１１が接続され、該集滴樋
１０に流下した液は排出管１１から外部に排出さ
れる。 Further, a drip collection gutter 10 is disposed directly below the power supply pipe 6 and along the power supply pipe 6. A discharge pipe 11 is connected to the bottom of the drip collection gutter 10, and the liquid flowing down into the drip collection gutter 10 is discharged from the discharge pipe 11 to the outside.
かかる構成にあつて、直流電源１２を起動させ
ると給電パイプ６、フツク３、陽極板２，２か
ら、直流電源１２の陰極側に接続している被処理
物ｗへと電流が流れ、被処理物ｗにメツキ処理が
施される。 In this configuration, when the DC power supply 12 is started, a current flows from the power supply pipe 6, the hook 3, and the anode plates 2, 2 to the workpiece w connected to the cathode side of the DC power supply 12. A plating process is applied to the object w.
ところで、前記処理液槽１内のメツキ液ｌは温
度が30℃〜60℃であるために恒常的に蒸発し、ま
たメツキ処理に際してミストが発生する。そして
この酸・アルカリミストは給電パイプ６及びフツ
ク３に付着する。 By the way, since the temperature of the plating liquid 1 in the treatment liquid tank 1 is 30 DEG C. to 60 DEG C., it constantly evaporates and mist is generated during the plating process. This acid/alkali mist then adheres to the power supply pipe 6 and the hook 3.
しかるに第３図に示すように給電パイプ６はそ
の内部を流れる冷却水により冷却され、その表面
に結露ｘを生じ、かつ該結露ｘが液滴ｙとなつて
流下する。このため、給電パイプ６の周面は液滴
ｙに洗われて自然洗浄されると共に、常に湿潤し
た状態となつており、ミストが付着しても洗い流
され、給電パイプ６の表面で乾燥し結晶化するこ
とはない。而して、ミストの付着による結晶の堆
積成長と、結晶の溶解の繰り返しに伴う給電パイ
プ６とフツク３，３の腐食による通電不良が防止
される。 However, as shown in FIG. 3, the power supply pipe 6 is cooled by the cooling water flowing inside it, forming dew condensation x on its surface, and the dew condensation x turns into droplets y and flows down. Therefore, the peripheral surface of the power supply pipe 6 is naturally washed by the droplets y, and is always in a moist state, so even if mist adheres to it, it is washed away and dries on the surface of the power supply pipe 6, forming crystals. It will not change. This prevents failure of current flow due to accumulation and growth of crystals due to adhesion of mist and corrosion of the power supply pipe 6 and hooks 3 due to repeated melting of crystals.
一方、前記給電パイプ６から液滴ｙは集滴樋１
０に受け止められ排出管１１から排出される。 On the other hand, the droplet y from the power supply pipe 6 flows into the collection gutter 1.
0 and is discharged from the discharge pipe 11.
前記酸・アルカリミストを含む液滴ｙは、給電
パイプ６の表面から溶解した銅を含有しているお
それがあるが、集滴樋１０に液滴ｙが回収される
ために、銅が処理液槽１内のメツキ液ｌに混入す
ることはない。従つて、集滴樋１０の配設により
メツキ液ｌの汚染が防止されることとなる。 The droplets y containing the acid/alkali mist may contain copper dissolved from the surface of the power supply pipe 6, but since the droplets y are collected in the droplet collection gutter 10, the copper is not absorbed into the treatment liquid. It does not get mixed into the plating solution 1 in the tank 1. Therefore, the arrangement of the drip collection gutter 10 prevents the plating liquid 1 from being contaminated.
［考案の効果］
本考案は給電パイプ６に冷却水を通してその表
面に結露ｘを生じさせ、液滴ｙの流下により該表
面が自然洗浄されるようにすると共に、その液滴
ｙを集滴樋１０によつて回収し、メツキ液ｌ内に
混入しないようにした。このため、メツキ液から
発生するミストが付着してもすぐに洗い流され、
その付着による結晶の堆積成長と結晶の溶解の繰
り返しに伴う給電パイプ６とフツク３，３の腐食
による導通不良を防止できると共に、給電パイプ
６の表面からミストを含む液滴ｙにより溶解され
た銅がメツキ液ｌを汚染することなくメツキ不良
を防止できる等の優れた効果がある。[Effects of the invention] The present invention allows cooling water to pass through the power supply pipe 6 to form dew condensation x on its surface, so that the surface is naturally cleaned by the falling droplets y, and the droplets y are collected in a collection gutter. 10 to prevent it from being mixed into the plating solution 1. Therefore, even if the mist generated from the plating liquid adheres to the surface, it will be washed away immediately.
It is possible to prevent conduction defects due to corrosion between the power supply pipe 6 and the hooks 3, 3 due to repeated crystal deposition growth and crystal dissolution due to the adhesion, and copper melted by droplets y containing mist from the surface of the power supply pipe 6. It has excellent effects such as being able to prevent plating defects without contaminating the plating solution.
添付図面は本考案の実施例を示し、第１図は処
理液槽１の縦断側面図、第２図は同斜視図、第３
図は給電パイプ６の縦断側面図である。
１……処理液槽、２，２……陽極板、３……フ
ツク、６……給電パイプ、１０……集滴樋、ｌ…
…メツキ液、ｘ……結露、ｙ……液滴、ｗ……被
処理物。
The accompanying drawings show an embodiment of the present invention, in which Fig. 1 is a longitudinal sectional side view of the processing liquid tank 1, Fig. 2 is a perspective view thereof, and Fig. 3 is a longitudinal side view of the processing liquid tank 1.
The figure is a longitudinal side view of the power supply pipe 6. 1... Processing liquid tank, 2, 2... Anode plate, 3... Hook, 6... Power supply pipe, 10... Drip collection gutter, l...
... plating liquid, x... dew condensation, y... droplet, w... object to be treated.
Claims (1)
被処理物にメツキ処理を施すメツキ処理装置にあ
つて、内部に冷却水を通した給電パイプに陽極板
のフツクを吊持し、該給電パイプから陽極板に通
電すると共に、前記給電パイプの直下に該給電パ
イプに沿つて集滴樋を配設したことを特徴とする
メツキ処理装置。 In a plating processing device in which an anode plate is placed opposite to an object to be treated in a treatment liquid tank and the object is plated, the hook of the anode plate is suspended from a power supply pipe through which cooling water is passed inside. A plating processing apparatus characterized in that electricity is supplied to the anode plate from the power supply pipe, and a drip collecting gutter is disposed directly below the power supply pipe and along the power supply pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP856190U JPH0527497Y2 (en) | 1990-01-30 | 1990-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP856190U JPH0527497Y2 (en) | 1990-01-30 | 1990-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0399774U JPH0399774U (en) | 1991-10-18 |
| JPH0527497Y2 true JPH0527497Y2 (en) | 1993-07-13 |
Family
ID=31512187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP856190U Expired - Lifetime JPH0527497Y2 (en) | 1990-01-30 | 1990-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0527497Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3516933B2 (en) * | 2001-07-06 | 2004-04-05 | 木田精工株式会社 | Continuous electroplating claw feed transport device |
| JP4949747B2 (en) * | 2006-06-19 | 2012-06-13 | 中井銘鈑株式会社 | Exhibition sample fixture |
-
1990
- 1990-01-30 JP JP856190U patent/JPH0527497Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0399774U (en) | 1991-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| UA66412C2 (en) | System and method for removal of coating from the article | |
| KR101640693B1 (en) | Method for treating of plastic substrates and a device for an at least partial regeneration of a treatment solution | |
| JP4054416B2 (en) | Mold cleaning equipment | |
| EP0510586B1 (en) | Toxic fumes removal process for plating tank | |
| JP4031093B2 (en) | Mold cleaning equipment | |
| CH403720A (en) | Process and device for the purification of fumes from an alumina electrolysis workshop | |
| CN210754049U (en) | Cold precipitation high-salt wastewater treatment spray decontamination equipment | |
| CN105452535A (en) | Anode and method for manufacturing same | |
| JP3673808B2 (en) | Water scale prevention method | |
| CN209193564U (en) | Ammonium acid fluoride efficient crystallization equipment | |
| CA2136169C (en) | Filter unit and equipment for the removal of sludge from salt baths | |
| US6322675B1 (en) | Copper removal system for absorption cooling unit | |
| CN215691709U (en) | Phosphorous acid film evaporator | |
| CN218743989U (en) | Bar cooling device | |
| CN215757558U (en) | A high-safety galvanized steel wire galvanizing device | |
| CN221421270U (en) | A purification device for carbonate impurities in electroplating solution | |
| US5935457A (en) | Machining fluid processing apparatus for electric discharge machine | |
| CN217939176U (en) | A desalination device system for a distillation still | |
| CN221480145U (en) | Online circulation purifier | |
| CN219297243U (en) | Wastewater purification device with multi-layer treatment | |
| JPH0311239Y2 (en) | ||
| JPH1050654A (en) | Wafer-treating apparatus | |
| CN212770970U (en) | Etching waste liquid treatment equipment | |
| CN213939560U (en) | Thawing apparatus is used in chicken processing | |
| CN212380398U (en) | Novel silicon chip cleaning basket |