JPH05285642A - Automatic soldering device - Google Patents

Abstract

(57) [Summary] [Purpose] Flux residue is less likely to remain on the holding claws and the lower part of the substrate, which prevents defective substrate transfer. [Structure] In an automatic soldering device, a drop hole 16 through which flux flows is formed in a step claw of a holding claw 14 that is a holding portion to which flux flows during soldering. The pits 16 provide an escape area for the flux flow during soldering, and the holding claws 14 and the substrate 12
Flux residue is hard to remain at the bottom. Therefore, the substrate 12
It is possible to prevent defective conveyance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus for soldering an electronic component to a board by passing the board through an overflow type solder tank while holding the board by a holding portion (corresponding to a holding claw). Is.

[0002]

2. Description of the Related Art Generally, in an automatic soldering machine,
The electronic component is soldered to the board 12 by holding the board 12 by holding the holding claw 10 as a holding part on a part of the periphery of the board 12 and passing the board 12 through an overflow solder bath. .. FIG. 3 (A) shows an example of a state in which the conventional automatic soldering apparatus holds the substrate 12 from both sides thereof by the pair of holding claws 10. FIG. 3B is an enlarged view of a portion where the holding claw 10 holds the substrate 12, and this portion has a step formed by projecting a lower portion thereof, and the substrate 12 is hooked on the step. do it,
The substrate 12 is held. As shown in FIG. 3B, when the substrate 12 passes through the solder bath, the flux applied to the entire lower surface of the substrate 12 to improve the solderability is due to the jet flow and heat of the solder to cause the lower surface of the substrate 12 to flow. Move in the direction of arrow L in the figure. Substrate 12 in the solder bath
In the portion where the holding claws 10 are not provided, most of the flux remains only on the lower surface of the substrate 12. On the other hand, in the portion where the holding claws 10 are present, the moving flux is, as shown in FIG.
At 0 A, there is a dead end, and there is no escape, so it remains as a flux residue on the lower part of the substrate 12 and the holding claws 10 (particularly the corner portion 10 A of the step on the side of the substrate 12). For this reason, the holding claw 1 remains even after the substrate 12 leaves the solder bath.
The flux residue remains at 0, and the soldering completed substrate 12 is obtained.

[0003]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The flux residue left at 0 causes stains on the belt and chain of the in-line transfer line after the solder bath. If the flux residue is excessively attached, the substrate 12 is adhered and secondary transfer such as transfer failure occurs. May cause disability. In addition, when the substrate 12 is transported, the legs of the insertion part are exposed under the substrate 12, and therefore, in most cases, the substrate 1
The holding claws 10 are hooked and conveyed here by using a portion having a width of 5 mm to 3 mm from the two end faces, but since most flux residue remains at that portion, the adhesiveness of the residue when the substrate 12 is conveyed. Therefore, there is a problem in that it causes a transportation failure. The present invention has been made to solve the above-mentioned conventional problems, and it is an object of the present invention to provide an automatic soldering device capable of preventing a defective conveyance of a substrate by preventing a flux residue from remaining on a claw member and a lower portion of the substrate. And

[0004]

SUMMARY OF THE INVENTION The present invention provides an automatic soldering apparatus for soldering an electronic component to a board by passing the board through an overflow type solder bath while holding the board by the holding section. The above problem is solved by forming a flux residue prevention part for flowing the flux to the outside of the holding part.

According to the present invention, in the automatic soldering apparatus, the flux residue preventing portion for flowing the flux to the outside of the holding portion is formed at the portion of the holding portion where the flux flows during soldering. The flux residue prevention portion allows an escape area for the flux flow at the time of soldering, prevents the residue of the flux residue from remaining on the holding portion and the lower portion of the substrate, and thus prevents the defective conveyance of the substrate.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. The present embodiment is an automatic soldering apparatus for soldering electronic components to the board 12 by passing the board 12 through an overflow type solder bath while holding the board 12 with holding claws 14 as holding parts, as shown in FIG. In addition, a hollow portion (shown by diagonal lines in FIG. 1; hereinafter referred to as a pit 16) that is a flux residue prevention portion is provided in a part of the holding claw 14 of the substrate 12. FIG. 1A shows a state in which the substrate 12 is held by the holding claw 14, and FIG. 1B shows the vicinity of the tip of the holding claw 14 on the substrate 12 holding side. 2A is a plan view of the holding claw 14, FIG. 2B is a front view, and FIG. 2C is a side view. That is, this pitfall 16
Is in the plane direction of the substrate 12 (that is, in the direction in which the flux flows) near the tip,
A hole is formed in the holding claw 14 so as to penetrate from the substrate 12 side of the stepped corner portion 14A to the outside of the holding claw 14 (direction of arrow S).

In the conventional holding claw 14 of FIG. 3, the flux applied to the entire lower surface of the substrate 12 moves to the arrow R in the figure by the solder jet 18 and heat. However, the flux is in a dead end state at the corner portion 14A of the holding claw 14, and remains in the bottom surface of the substrate 12 and the corner portion 14A of the step of the holding claw 14 and remains as a flux residue which is the largest factor of the substrate 12 transportation failure. In order to prevent this, in this embodiment, the holding claw 14 is provided with a flux drop hole 16. This allows the flux to escape, so that the flux does not remain on the lower surface of the substrate 12. In addition, in the above-described embodiment, the holding claw 1 in which the pit 16 is formed as shown in FIGS.
No. 4 (corresponding to the holding portion) is given, but the scope of the present invention is not limited to this, and any other holding portion can be used as long as it is a holding portion in which the flux residue prevention portion is formed at the place where the flux flows. A holding part having a form of flux residue prevention part is also within the scope of the present invention.

[0007]

As described above, according to the present invention, the flux residue is less likely to remain on the holding portion and the lower portion of the substrate,
It is possible to prevent defective conveyance of the substrate. Further, there is an excellent effect that the equipment investment after the soldering device is suppressed in order to reduce the influence of the flux residue.

[Brief description of drawings]

FIG. 1 (A) is a front view showing a holding claw of an embodiment of the present invention, and FIG. 1 (B) is an enlarged explanatory view of a C portion of FIG. 1 (A).

2 (A) is a plan view of the holding claw of FIG.
2B is a front view of the holding claw, and FIG. 2C is a side view of the holding claw.

FIG. 3 (A) is a front view showing a conventional holding claw, FIG.
FIG. 3B is an enlarged explanatory diagram of a portion D in FIG.

[Explanation of symbols]

 12 substrate 14 holding claw 16 drop hole

Claims (1)

[Claims] 1. An automatic soldering device for soldering an electronic component to a substrate by passing the substrate through an overflow type solder bath while holding the substrate by the holding part, wherein the flux of the holding part is outside the holding part. An automatic soldering device that is equipped with a flux residue prevention part that flows to one side.