JPH0528754Y2 - - Google Patents
Info
- Publication number
- JPH0528754Y2 JPH0528754Y2 JP18625687U JP18625687U JPH0528754Y2 JP H0528754 Y2 JPH0528754 Y2 JP H0528754Y2 JP 18625687 U JP18625687 U JP 18625687U JP 18625687 U JP18625687 U JP 18625687U JP H0528754 Y2 JPH0528754 Y2 JP H0528754Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- spinner device
- center
- spindle
- resist film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 9
- 229920003051 synthetic elastomer Polymers 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000005061 synthetic rubber Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 36
- 238000000034 method Methods 0.000 description 7
- 238000004528 spin coating Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は、半導体ウエハやガラス基板の表面部
にレジスト膜を形成したり、スプレー現像する際
などに用いられるスピンナー装置に関するもので
ある。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a spinner device used for forming a resist film on the surface of a semiconductor wafer or a glass substrate, or for spray development.
〈従来技術およびその問題点〉
半導体集積回路の製造工程において、基板表面
にレジスト膜を形成するにあたつては、塗布液
を、スピンドルの回転遠心力を利用する事によ
り、基板全面に塗布するスピンコート法が一般的
に用いられている。このスピンコート法は、第２
図ａに示すように、まずスピンドル上面に基板を
吸着させて保持する。次いでスピンドルの回転を
停止させた状態で基板上面の中心部にレジスト液
を滴下した後にスピンドルを回転させ、その回転
遠心力によりレジスト液を基板全面に拡がらせ、
基板表面に均一な厚さでレジスト膜を形成しよう
とするものである。<Prior art and its problems> In the manufacturing process of semiconductor integrated circuits, when forming a resist film on the surface of a substrate, a coating liquid is applied to the entire surface of the substrate by using the rotating centrifugal force of a spindle. Spin coating is commonly used. This spin coating method
As shown in Figure a, first, a substrate is attracted and held on the upper surface of a spindle. Next, with the rotation of the spindle stopped, the resist solution is dropped onto the center of the upper surface of the substrate, and then the spindle is rotated, and the resist solution is spread over the entire surface of the substrate by the rotational centrifugal force.
The purpose is to form a resist film with a uniform thickness on the surface of a substrate.
この際、スピンドル上面に基板を吸着させるに
あたつては、スピンドル中心部に設けた吸気孔よ
りバキユーム操作をもつて保持固定させるわけで
あるが、基板裏面に対してバキユーム操作がおよ
ぶ領域（以下バキユーム範囲と称する。）では、
基板の温度が低下し、レジスト膜を形成する基板
表面において温度むらが発生する。 At this time, when adsorbing the substrate to the top surface of the spindle, it is held and fixed by vacuum operation from the air intake hole provided in the center of the spindle. (referred to as the Bakyum range).
The temperature of the substrate decreases, and temperature unevenness occurs on the surface of the substrate on which the resist film is formed.
レジスト膜形成時に基板表面に温度むらがある
と、バキユーム範囲にあたる表面温度の低いとこ
ろでは、レジスト膜が高い粘性をもつて塗布さ
れ、バキユーム範囲外の常温の基板表面では、通
常の粘性をもつレジスト膜が形成され、膜厚にむ
らが生じる。 If there is temperature unevenness on the substrate surface during resist film formation, the resist film will be applied with high viscosity at low surface temperatures in the vacuum range, and the resist film will have normal viscosity on the substrate surface at room temperature outside the vacuum range. A film is formed, resulting in uneven film thickness.
このように基板表面に形成されたレジスト膜に
膜厚のむらがあると、後工程においてパターンを
形成する際に、現像速度及びパターン精度にもむ
らが生じるため、フオトマスクのように特に微細
なパターン形成を要求される製品いおいては問題
となるところであつた。 If the resist film formed on the surface of the substrate has uneven thickness, it will cause unevenness in development speed and pattern accuracy when forming a pattern in the subsequent process. This is a problem for products that require
こういつた問題を解決する目的で第２図ｂに示
すようなスピンナー装置が考案された。 In order to solve these problems, a spinner device as shown in FIG. 2b was devised.
すなわち、第４図の斜線部に示すような基板の
有効領域（基板表面において、パターンが形成さ
れる領域）を覆うバキユーム範囲を有するスピン
ドルによつて基板を吸着させて保持するものであ
る。これにより、基板の有効領域内においては、
スピンコート時に表面温度のむらがなく、レジス
ト膜も一様に形成され、後工程のパターン形成で
も現像速度に差異はなくなるというものである。 That is, the substrate is attracted and held by a spindle having a vacuum range that covers the effective area of the substrate (the area on the substrate surface where a pattern is formed) as shown by the shaded area in FIG. As a result, within the effective area of the board,
There is no unevenness in surface temperature during spin coating, a resist film is formed uniformly, and there is no difference in development speed during pattern formation in the subsequent process.
しかし、バキユーム範囲が広すぎるため、第２
図ｂに示すように、保持させた基板が反つてしま
い、やはり後工程のパターン形成において精度上
の問題がつきまとつていた。 However, because the vacuum range is too wide, the second
As shown in FIG. b, the held substrate warped, resulting in problems with accuracy in pattern formation in subsequent steps.
〈考案の目的〉
本考案はこのような現況に対してなされたもの
で、基板表面にレジスト膜を形成するにあたり、
基板表面の有効領域内で、バキユーム操作での保
持による温度むらがない−すなわち、レジスト膜
の塗布むらがなく、しかも保持時に基板の反りが
ないスピンナー装置を得ようとするものである。<Purpose of the invention> The present invention was made in response to this current situation.
It is an object of the present invention to provide a spinner device in which there is no temperature unevenness due to holding by vacuum operation within the effective area of the substrate surface, that is, there is no uneven coating of the resist film, and the substrate is not warped during holding.
〈問題点を解決するための手段〉
すなわち本考案は、中心部に吸気孔を設けた基
台の上面部には凹所が設けられており、該凹所内
には該吸気孔と一致する位置に穴のあいた皿状の
裏打ち材、および上面が平滑で下部に外周方向か
ら中心部に向かつた吸気溝が設けられたテーブル
が載置された構造をもつことを特徴とするスピン
ナー装置である。<Means for solving the problem> In other words, in the present invention, a recess is provided in the upper surface of the base having an air intake hole in the center, and a recess is provided in the recess at a position that coincides with the air intake hole. This spinner device is characterized by having a structure in which a plate-shaped backing material with holes is placed thereon, and a table is placed on which the top surface is smooth and the bottom surface is provided with intake grooves extending from the outer circumference toward the center. .
第１図は本考案によるスピンナー装置の一実施
例の概観を示す断面説明図であり、以下第１図に
従つて本考案の説明を行なう。 FIG. 1 is an explanatory sectional view showing an overview of an embodiment of a spinner device according to the present invention, and the present invention will be explained below with reference to FIG.
吸気孔の設けられたスピンドル８の上面に、中
心部に吸気孔５が設けられ、上面部に凹所が設け
られた基台１を設置する。前記基台１の凹所に
は、シリコンゴムを材質とし、中心部に吸気穴を
有する皿状の裏打ち材２と、上面が平滑で下部に
外周方向から中心部に向かつた吸気溝６が設けら
れた、アクリル系樹脂を材質とし厚さ３mm以上の
テーブル３が載置され、これら基台１、裏打ち材
２、テーブル３はPEEKネジ４にて一体化されて
いる。テーブル３は基板７の有効領域を支持する
ような表面積を有している。かかる構成よりなる
スピンナー装置の裏打ち材２の周端部が基板の周
辺部を裏面から受け支えるような状態になるよう
に、テーブル３の上面に基板７を載置する。 A base 1 having an intake hole 5 in the center and a recess in the upper surface is installed on the upper surface of the spindle 8 provided with the intake hole. In the recess of the base 1, there is a dish-shaped lining material 2 made of silicone rubber and having an intake hole in the center, and an intake groove 6 with a smooth upper surface and an intake groove 6 directed from the outer circumference toward the center in the lower part. A table 3 made of acrylic resin and having a thickness of 3 mm or more is placed thereon, and the base 1, backing material 2, and table 3 are integrated with PEEK screws 4. The table 3 has a surface area that supports the effective area of the substrate 7. The substrate 7 is placed on the upper surface of the table 3 so that the peripheral edge of the backing material 2 of the spinner device having such a configuration receives and supports the peripheral portion of the substrate from the back surface.
その後、スピンドルの吸気孔よりバキユーム操
作にて、基板を装置に吸着させて保持し、スピン
コート法によるレジストの塗布を行なう。 Thereafter, the substrate is attracted and held in the apparatus by a vacuum operation through the intake hole of the spindle, and a resist is applied by a spin coating method.
〈作用〉
本考案によるスピンナー装置では、基板裏面に
おけるバキユーム範囲が、テーブル３の外側と、
裏打ち材２が基板を受け支えている部分の間に限
定されるため、基板表面においては、テーブルが
基板に接触している部分に相当する領域内（つま
り、基板表面の有効領域も包含する領域）での表
面温度の分布は、バキユーム操作に関わらず一様
である。<Operation> In the spinner device according to the present invention, the vacuum range on the back surface of the substrate is the outside of the table 3,
Since the backing material 2 is limited between the parts that support the substrate, on the substrate surface, it is within the area corresponding to the part where the table is in contact with the substrate (that is, the area that also includes the effective area of the substrate surface). ) is uniform regardless of vacuum operation.
この際、テーブル下部の吸気溝６でのバキユー
ム操作によるテーブル上面の温度低下を考慮し
て、テーブルに３mm以上の厚みをもたせ、熱伝達
の影響がないようにしたものである。 At this time, in consideration of the temperature drop on the top surface of the table due to the vacuum operation in the intake groove 6 at the bottom of the table, the table is made to have a thickness of 3 mm or more to avoid the influence of heat transfer.
また、テーブルが基板を平滑な上面にて受ける
ため、装置への載置により基板が反るという心配
がない。 Furthermore, since the table receives the substrate with its smooth upper surface, there is no worry that the substrate will warp when placed on the apparatus.
さらに、裏打ち材２の周端部が、基板裏面の周
辺部を受け支えているため、スピンコート法によ
るレジスト塗布を行なつても基板裏面へのレジス
トのまわり込みを防止できる。 Furthermore, since the peripheral end of the backing material 2 supports the peripheral part of the back surface of the substrate, it is possible to prevent the resist from running around to the back surface of the substrate even when resist is applied by spin coating.
加えて、スピンナー装置の材質として樹脂やシ
リコンゴムを用いれば基板を前記装置に取り付け
る際に、基板を損傷させる危惧が少なくなる。 In addition, if resin or silicone rubber is used as the material for the spinner device, there is less risk of damaging the substrate when attaching it to the device.
〈考案の効果〉
本考案によるスピンナー装置は以上のようなも
のであり、スピンコート法により基板表面にレジ
スト膜を形成するにあたつて、有効領域内での塗
布むらが改善でき、従つて後工程においてパター
ンを形成する際にも高精度でむらのないパターン
を得ることが可能となるものである。<Effects of the invention> The spinner device according to the invention is as described above, and when forming a resist film on the surface of a substrate by the spin coating method, it is possible to improve coating unevenness within the effective area, thereby improving the Even when forming a pattern in a process, it becomes possible to obtain a highly accurate and uniform pattern.
第１図は、本考案のスピンナー装置の概略を示
す断面説明図であり、第２図ａおよび第２図ｂ
は、従来技術による基板の取り付け方法を示す断
面説明図である。第３図ａおよび第３図ｂは、本
考案のスピンナー装置のテーブルの説明図であ
り、それぞれ、底面および側面から見た説明図で
ある。第４図は基板の説明図であり、斜線部がパ
ターンの形成されうる有効領域である。
１……基台、２……裏打ち材、３……テーブ
ル、４……PEEKネジ、５……吸気孔、６……吸
気溝、７……基板、８……スピンドル、９……ね
じ穴、１０……基板。
FIG. 1 is a cross-sectional explanatory diagram showing the outline of the spinner device of the present invention, and FIG. 2a and FIG. 2b are
1 is a cross-sectional explanatory diagram showing a method of attaching a board according to the prior art. FIGS. 3a and 3b are explanatory diagrams of the table of the spinner device of the present invention, as seen from the bottom and side, respectively. FIG. 4 is an explanatory diagram of the substrate, and the shaded area is an effective area where a pattern can be formed. 1... Base, 2... Backing material, 3... Table, 4... PEEK screw, 5... Intake hole, 6... Intake groove, 7... Board, 8... Spindle, 9... Screw hole , 10...Substrate.
Claims (1)
凹所が設けられており、該凹所内には該吸気孔
と一致する位置に穴のあいた皿状の裏打ち材、
および上面が平滑で下部に外周方向から中心部
に向かつた吸気溝が設けられたテーブルが載置
されたことを特徴とするスピンナー装置。 ２） 基台およびテーブルが、合成樹脂もしくは
ゴムよりなることを特徴とする実用新案登録請
求の範囲第１項記載のスピンナー装置。 ３） テーブルが、３mm以上の厚みを有すること
を特徴とする実用新案登録請求の範囲第１項記
載のスピンナー装置。[Claims for Utility Model Registration] 1) A recess is provided in the upper surface of the base with an air intake hole in the center, and a plate with a hole at a position corresponding to the air intake hole is provided in the recess. shaped lining material,
and a spinner device, characterized in that a table is placed thereon, the upper surface being smooth and the lower part provided with intake grooves extending from the outer circumference toward the center. 2) The spinner device according to claim 1, wherein the base and the table are made of synthetic resin or rubber. 3) The spinner device according to claim 1, wherein the table has a thickness of 3 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18625687U JPH0528754Y2 (en) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18625687U JPH0528754Y2 (en) | 1987-12-07 | 1987-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0189735U JPH0189735U (en) | 1989-06-13 |
| JPH0528754Y2 true JPH0528754Y2 (en) | 1993-07-23 |
Family
ID=31477489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18625687U Expired - Lifetime JPH0528754Y2 (en) | 1987-12-07 | 1987-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528754Y2 (en) |
-
1987
- 1987-12-07 JP JP18625687U patent/JPH0528754Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0189735U (en) | 1989-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5985363A (en) | Method of providing uniform photoresist coatings for tight control of image dimensions | |
| US4822639A (en) | Spin coating method and device | |
| US4068019A (en) | Spin coating process for prevention of edge buildup | |
| JPS61214520A (en) | Coating device | |
| US6207357B1 (en) | Methods of forming photoresist and apparatus for forming photoresist | |
| JP2675766B2 (en) | Photoresist coating method and apparatus | |
| JPS60198818A (en) | Photoresist developing device | |
| JPS6245378A (en) | Coating apparatus | |
| JPH0632673Y2 (en) | Resist coating device | |
| JPS60161767A (en) | Automatic rotary coating machine | |
| JP2001319851A (en) | Photoresist coating method | |
| JPH0338835Y2 (en) | ||
| JPH0632674Y2 (en) | Photoresist coating device | |
| JPS6342526Y2 (en) | ||
| JPS593430A (en) | Formation of photoresist film | |
| JP2526071Y2 (en) | Rotary suction head of spin coater | |
| JPH05259051A (en) | Spin coating equipment for semiconductor substrates | |
| JPH02260415A (en) | Conveyance apparatus | |
| JPH0254518A (en) | Spin coater | |
| JPH0716531A (en) | Vacuum adsorption spinner, coating method of coating liquid using the same, and developing method of coating film | |
| JPS60226124A (en) | Resist coating apparatus | |
| JPS6323705Y2 (en) | ||
| JPS62285421A (en) | Resist coater | |
| JPS62195121A (en) | Spin coater | |
| KR200141175Y1 (en) | Bake unit of coater for semiconductor process |