JPH0528800Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and in particular to improvement of a hybrid integrated circuit for the purpose of electromagnetic shielding.

(B) Conventional technology As shown in FIG. 3, a conventional folded board using an insulating film consists of two metal boards 21 and 22, an insulating film 23 connecting the boards 21 and 22, and a folding board provided on the film 23. The conductive path 24 includes a plurality of circuit elements (not shown) fixed on the conductive path 24, such as a semiconductor integrated circuit, a chip resistor, or a chip capacitor.

The metal substrates 21 and 22 are made of aluminum with good thermal conductivity and have a thickness of 0.5 to 1.0 mm.The substrates 21 and 22 are separated by their respective thicknesses using a connecting agent such as epoxy resin, and connected with an insulating film 23 such as polyimide. do. A copper foil serving as a conductive path 24 is pasted on the opposite main surface of the insulating film 23, the copper foil is selectively etched to form a conductive path 24 of a desired shape, and a circuit element (not shown) is placed on the conductive path. After assembling the insulating film 23 at the spaced apart part of the boards 21 and 22, the board 2 is assembled as shown in FIG.
1 and 22 are brought into contact with each other, and the entire body is molded with resin 25, leaving the external leads 26, to be integrated.

The above-mentioned technique is described in Japanese Patent Publication No. 11809/1983.

Further, in a hybrid integrated circuit in which two metal substrates are separated and fixed with a case material, as shown in FIG.
There is also a hybrid integrated circuit in which the circuit boards 31, 30 are fixed, separated and fixed by a case member 32 made of insulating resin, and the respective boards 31, 31 are electrically connected through leads 33 and filled with resin 34 to be integrated.

Such a hybrid integrated circuit is described in Japanese Utility Model Publication No. 55-8316.

(c) Problems that the invention aims to solve However, the foldable hybrid integrated circuit shown in Figures 3 and 4 was originally intended for miniaturization, and the metal substrates are in close contact with each other. There was a problem in that it was not possible to provide a high-output type hybrid integrated circuit that was unsuitable for mounting circuit elements that generated heat.

In the conventional example shown in FIG. 5, the two metal substrates were electrically connected by soldering using lead wires, which resulted in a problem of reduced workability and reliability. In addition, since such hybrid integrated circuits are not entirely covered with metal, if a shielding effect is required, shielding from electromagnetic waves from the outside and inside is not completely achieved, so there may be adverse effects such as malfunctions due to electromagnetic waves. There was a problem with this.

(d) Means for solving the problems The present invention was made in view of the problems mentioned above, and as shown in Figs. 1 and 2, two metal sheets separated by an insulating film 3 are used. The insulating film 3 is bent and fixed to the case material 4 so that the circuit elements 8 of the substrates 1 and 2 face each other.The case material 4 is made of a metal material, and the case material 4 and the two metal substrates 1, This problem is solved by providing a partition plate 5 that divides the space formed by 2 into two.

(E) Effect As described above, according to the present invention, the case material 4 that fixes the two metal substrates 1 and 2 connected by the insulating film 3 is formed of metal, and the case material 4 and the metal substrate 1 are further bonded together. , 2 is provided, the circuit element 10 on the surface of the hybrid integrated circuit is sealed, and electromagnetic waves from the outside can be shielded.

Furthermore, the partition plate 5 can shield electromagnetic waves emitted from the circuits formed on the respective metal substrates 1 and 2.

(F) Embodiments The present invention will be described in detail below based on the embodiments shown in FIGS. 1 and 2.

The hybrid integrated circuit of the present invention consists of two metal substrates 1 and 2.
, an insulating film 3 that separates two metal substrates 1 and 2, a case material 4 made of metal, a partition plate 5 provided inside the case material 4, and a lid body 6. .

The two metal plates 1 and 2 are aluminum substrates, the surfaces of which are coated with an aluminum oxide film by anodic oxidation, and are spaced apart by a predetermined distance.
An insulating film 3 is provided on the metal substrates 1 and 2 which are spaced apart from each other in order to separate and couple the respective substrates 1 and 2. Holes 7 for screwing are provided at the four corners of each of the metal substrates 1 and 2.

The insulating film 3 is made of flexible insulating resin such as polyimide resin.
It is attached to 2. The insulating film 3 is one in which copper foil is pre-integrated. After this insulating film 3 is adhered to the metal substrates 1 and 2, the copper foil is etched into a desired shape to form a conductive pattern. A path 8 is formed. At this time, although not shown, the conductive path 8 is formed so as to span the respective metal substrates 1 and 2. A protective film 19 made of resin such as an insulating film is formed on the insulating film 3 between the metal substrates 1 and 2 in order to protect the conductive path 8 from the case material 4.
A conductive pad 9 is formed at the peripheral edge of one side of each of the metal substrates 1 and 2. A plurality of circuit elements 10 such as power semiconductor elements and chip elements are fixed on the conductive paths 8 of the respective metal substrates 1 and 2, and external leads 11 and 12 are fixed on the conductive pads.

The case material 4 is made of metal (the same aluminum as the substrate is used in this embodiment), and as shown in FIGS. Partition plate 5 that separates 2
and a lid body 6.

The frame portion 13 is formed into a frame shape for fixing the two metal substrates 1 and 2 apart from each other, and leg portions 14 extending from the frame portion 13 are provided at both lower ends of the frame portion 13. Stoppers 15 are provided at both ends of the leg portions 14 to be inserted into insertion holes previously provided in a printed circuit board such as a mounting board. At each corner of the upper surface of the frame part 13, a protrusion part 16 for fitting with the lid body 6 is provided integrally with the frame part 13.

The partition plate 5 is provided approximately at the center inside the frame portion 13. That is, the partition plate 5 is provided parallel to the substrates 1 and 2 so as to divide the space formed by the case material 4 and the two metal substrates 1 and 2 into two.

In order to accommodate the folded portion of the insulating film 3 placed on the top surface of the frame portion 13, the lid body 6 has a surface that contacts the top surface of the frame portion 13, leaving the periphery as shown in FIG.
Formed in a concave shape. Further, a convex portion 17 is formed at both ends of the lid body 6 to fit between the protruding portions 16 of the frame portion 13.

metal substrates 1 separated and connected by an insulating film 3;
2 is arranged so that the insulating film 3 is bent on the upper surface of the frame 13 of the case material 4, and the two metal substrates 1 and 2 are brought into contact with each other so as to sandwich the frame 13, and then the respective metal substrates 1, After aligning the holes 7 provided at the four corners of 2 with the holes 7' provided in the case material 4, they are locked using metal screws 18. At this time, the case material 4 and the conductive path 8 are not separated by the protective film 19. Furthermore, in order to seal the insulating film 13 on the upper surface of the frame 13, the convex part 17 of the lid body 6 and the space between the protrusions 16 of the frame part 13 are fitted and screwed together using metal screws 18. become

As described above, in the hybrid integrated circuit of the present invention, all exposed surfaces are formed of metal, so that the shielding effect against external noise is improved, and a hybrid integrated circuit with excellent electromagnetic shielding effect can be provided.

(G) Effects of the invention As detailed above, according to the invention, metal substrates separated and connected by insulating films are integrated by screwing them together using a metal case material.
The metal case and the metal substrate are at the same potential, improving the shielding effect and shielding electromagnetic waves from the outside, making it possible to prevent malfunctions caused by electromagnetic waves that conventionally occur.

Furthermore, the present invention has the advantage that the case material is provided with a partition plate, so that the internal noise generated from each metal substrate, that is, the primary circuit and the secondary circuit, can be shielded by the partition plate.

[Brief explanation of the drawing]

FIG. 1 is a perspective exploded view showing an embodiment of the present invention, FIG. 2 is a sectional view of this embodiment, and FIGS. 3 to 5 are sectional views showing a conventional example. 1 and 2 are metal substrates, 3 is an insulating film, 4 is a case material, 5 is a partition plate, 6 is a lid body, 7 is a hole, 8 is a conductive path, 9 is a conductive bat, 10 is a circuit element, 11,
12 is an external lead, 13 is a frame portion, 14 is a leg portion, 1
5 is a stopper, 16 is a protrusion, 17 is a convex portion, 18
19 is a screw, and 19 is a protective film.

Claims (1)

[Scope of utility model registration request] two metal substrates, an insulating film that connects the two metal substrates at a distance, a conductive path of a desired shape formed on the insulating film, a plurality of circuit elements fixed on the conductive path; It has a frame portion that bends the insulating film so that the circuit elements face each other and fixes the two metal substrates apart from each other, and a partition plate that divides the space formed by the frame portion and the two metal substrates into two. The device includes a metal case material, and a metal plate lid that is in contact with the upper surface of the case material and hermetically seals the bent portion of the film, wherein both the substrates, the lid, and the case material are A hybrid integrated circuit characterized by being integrated in an electrically connected state.