JPH0529666A - Coated thermocouple - Google Patents
Coated thermocoupleInfo
- Publication number
- JPH0529666A JPH0529666A JP3181096A JP18109691A JPH0529666A JP H0529666 A JPH0529666 A JP H0529666A JP 3181096 A JP3181096 A JP 3181096A JP 18109691 A JP18109691 A JP 18109691A JP H0529666 A JPH0529666 A JP H0529666A
- Authority
- JP
- Japan
- Prior art keywords
- sol
- thermocouple
- metal oxide
- coated
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 24
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 239000010419 fine particle Substances 0.000 claims abstract description 9
- 239000012702 metal oxide precursor Substances 0.000 claims abstract description 6
- 238000003980 solgel method Methods 0.000 claims abstract description 3
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010445 mica Substances 0.000 claims description 6
- 229910052618 mica group Inorganic materials 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 239000002612 dispersion medium Substances 0.000 claims description 4
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 4
- -1 organic compound salt Chemical class 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 150000004703 alkoxides Chemical class 0.000 claims description 2
- 238000006460 hydrolysis reaction Methods 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 239000002243 precursor Substances 0.000 abstract description 5
- 238000001179 sorption measurement Methods 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical class [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 1
- 239000003444 phase transfer catalyst Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- QBAZWXKSCUESGU-UHFFFAOYSA-N yttrium(3+);trinitrate;hexahydrate Chemical compound O.O.O.O.O.O.[Y+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O QBAZWXKSCUESGU-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- OERNJTNJEZOPIA-UHFFFAOYSA-N zirconium nitrate Chemical class [Zr+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O OERNJTNJEZOPIA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
(57)【要約】
【目的】 絶縁層が薄くコンパクトであり、可撓性に優
れ、ガス吸着源を備えない熱電対にする。
【構成】 熱電対素線1の外方に金属酸化物層2を設
け、金属酸化物層2の外方に耐熱性有機樹脂層3を設け
る。金属酸化物層は、金属酸化物の前駆体微粒子を分散
したゾルをゾルゲル法によって調製し、このゾル中に熱
電対素線を浸積し、熱電対素線を陰極として通電して金
属酸化物の前駆体微粒子を付着させ、それを加熱処理す
ることによって形成する。
(57) [Abstract] [Purpose] To make a thermocouple with a thin insulating layer, compact size, excellent flexibility, and no gas adsorption source. [Structure] A metal oxide layer 2 is provided outside the thermocouple element 1, and a heat-resistant organic resin layer 3 is provided outside the metal oxide layer 2. The metal oxide layer is prepared by using a sol-gel method to prepare a sol in which metal oxide precursor fine particles are dispersed, immersing a thermocouple wire in the sol, and applying the thermocouple wire as a cathode to energize the metal oxide. It is formed by depositing precursor fine particles of and heat treating it.
Description
【0001】[0001]
【産業上の利用分野】この発明は、温度計測に用いられ
る被覆熱電対に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coated thermocouple used for temperature measurement.
【0002】[0002]
【従来の技術】熱電対としては、セラミックス製の碍子
管に導体が通された形式のものや、酸化マグネシウムな
どの金属酸化物微粒子が詰められた、ステンレス合金等
からなる耐熱合金製の管に熱電対素線が通された形式の
シース熱電対などが従来より知られている。2. Description of the Related Art Thermocouples are of a type in which a conductor is passed through a ceramic insulator tube, or a heat-resistant alloy tube made of a stainless alloy, etc., filled with fine particles of metal oxides such as magnesium oxide. 2. Description of the Related Art A sheath thermocouple of a type in which a thermocouple wire is passed has been conventionally known.
【0003】[0003]
【発明が解決しようとする課題】セラミックス製の碍子
管を用いて絶縁を行なっていた熱電対では、可撓性に乏
しく、かさばる等の欠点を有している。また、高真空中
で使用する場合は、碍子は本来多孔性であることや、表
面積が大きいことから、多量のガスを吸着するという問
題点がある。The thermocouple, which is insulated by using the ceramic insulator tube, has the drawback of being poor in flexibility and being bulky. Further, when used in a high vacuum, the insulator is inherently porous and has a large surface area, so that it has a problem of adsorbing a large amount of gas.
【0004】シース熱電対は、耐熱性の合金管と熱電対
素線とによって構成されているため、外径が大きくなる
ことや、端末の処理が困難であるという問題があった。Since the sheath thermocouple is composed of a heat-resistant alloy tube and a thermocouple wire, there are problems that the outer diameter is large and the terminal is difficult to process.
【0005】この発明の目的は、絶縁層が薄くコンパク
トであり、可撓性に優れ、かつガスの吸着源を備えてい
ない熱電対を提供することにある。An object of the present invention is to provide a thermocouple having a thin insulating layer, compact size, excellent flexibility, and no gas adsorption source.
【0006】[0006]
【課題を解決するための手段】この発明に従う被覆熱電
対は、熱電対素線に金属酸化物層を被覆し、さらに金属
酸化物層の外方に耐熱性有機樹脂層を被覆したことを特
徴としている。The coated thermocouple according to the present invention is characterized in that the thermocouple wire is coated with a metal oxide layer, and the heat-resistant organic resin layer is coated outside the metal oxide layer. I am trying.
【0007】金属酸化物層は、金属酸化物の前駆体微粒
子を分散したゾルをゾルゲル法によって調製し、このゾ
ルの中に前記熱電対素線を浸積し、熱電対素線を陰極と
して通電して金属酸化物の前駆体微粒子を付着させ、こ
れを加熱処理することによって形成することができる。The metal oxide layer is prepared by preparing a sol in which metal oxide precursor fine particles are dispersed by a sol-gel method, immersing the thermocouple wire in the sol, and energizing the thermocouple wire as a cathode. Then, the precursor fine particles of the metal oxide are attached, and the precursor particles can be formed by heat treatment.
【0008】耐熱性有機樹脂層は、ポリイミド、ポリア
ミドイミドおよびシリコン樹脂からなる群から選択され
た化合物であることが好ましい。この耐熱性有機樹脂層
は、300℃程度以下の環境下では、金属酸化物層の有
効な保護層として機能し、可撓性の向上や耐磨耗性を向
上させる。The heat resistant organic resin layer is preferably a compound selected from the group consisting of polyimide, polyamideimide and silicon resin. This heat-resistant organic resin layer functions as an effective protective layer of the metal oxide layer in an environment of about 300 ° C. or lower, and improves flexibility and abrasion resistance.
【0009】この発明において、ゾルの分散媒の誘電率
を高めるため、有機化合物塩および/または金属の無機
塩を添加することができる。In the present invention, an organic compound salt and / or a metal inorganic salt can be added in order to increase the dielectric constant of the dispersion medium of the sol.
【0010】この発明において、熱電対素線を浸積する
ゾルは、金属酸化物に対応する金属アルコキシドもしく
は金属カルボン酸エステルの加水分解反応および縮合反
応により調製されたものであることが好ましい。In the present invention, the sol into which the thermocouple wire is immersed is preferably prepared by the hydrolysis reaction and condensation reaction of the metal alkoxide or metal carboxylic acid ester corresponding to the metal oxide.
【0011】また、金属酸化物は、酸化ケイ素、酸化ア
ルミニウム、酸化ジルコニウム、および酸化マグネシウ
ムからなる群から選択された化合物の少なくとも1種を
含むことが好ましい。The metal oxide preferably contains at least one compound selected from the group consisting of silicon oxide, aluminum oxide, zirconium oxide, and magnesium oxide.
【0012】またセラミックス粉末は、マイカ粉末、酸
化ケイ素、窒化ケイ素、炭化ケイ素、酸化アルミニウ
ム、窒化ホウ素および窒化アルミニウムからなる群から
選択された化合物の少なくとも1種であることが好まし
い。Further, the ceramic powder is preferably at least one compound selected from the group consisting of mica powder, silicon oxide, silicon nitride, silicon carbide, aluminum oxide, boron nitride and aluminum nitride.
【0013】また、熱電対素線の表面は、加熱により酸
化処理されていることが好ましい。このような酸化処理
により、金属酸化物層の熱電対素線に対する密着性を高
めることができる。The surface of the thermocouple wire is preferably oxidized by heating. By such an oxidation treatment, the adhesion of the metal oxide layer to the thermocouple wire can be enhanced.
【0014】図1は、この発明の一実施例を示す断面図
である。図1を参照して、熱電対素線1のまわりには、
金属酸化物層2が設けられている。金属酸化物層2のま
わりには耐熱性有機樹脂層3が設けられている。FIG. 1 is a sectional view showing an embodiment of the present invention. Referring to FIG. 1, around the thermocouple wire 1,
A metal oxide layer 2 is provided. A heat resistant organic resin layer 3 is provided around the metal oxide layer 2.
【0015】[0015]
【発明の作用効果】熱電対は、ゼーベック効果による熱
起電力を利用した温度計測技術であるが、この熱起電力
の大きさは接触する2種の金属の組成にのみ起因する。
このため、特願平1−322376号に記載されている
ようなセラミックスが付着しやすいステンレス等の合金
を熱電対素線の表面に形成することは不可能である。The thermocouple is a temperature measuring technique utilizing the thermoelectromotive force by the Seebeck effect, and the magnitude of this thermoelectromotive force is due only to the composition of two kinds of metals in contact with each other.
For this reason, it is impossible to form an alloy such as stainless steel, to which ceramics are likely to adhere, on the surface of the thermocouple element wire, as described in Japanese Patent Application No. 1-322376.
【0016】この発明では、熱電対素線を金属酸化物の
前駆体微粒子を分散したゾル中に浸積し、熱電対素線を
陰極として通電することによって、金属酸化物の前駆体
微粒子を電気泳動させて、熱電対素線の表面に強制的に
付着させている。In the present invention, the thermocouple element wire is immersed in a sol in which the fine particles of the metal oxide precursor are dispersed, and the thermocouple element wire is used as a cathode to energize the fine particles of the metal oxide precursor to generate electricity. It is electrophoresed and forced to adhere to the surface of the thermocouple wire.
【0017】この発明における好ましい1つの実施態様
では、ゾルの電気泳動効率を増加させるために、有機化
合物塩および/または無機塩を添加する。これにより電
気泳動効率が上昇し、より低い印加電圧および/または
より短い通電時間で、金属酸化物の前駆体微粒子を熱電
対素線の表面に付着させることができる。その結果、厚
いセラミックスの被覆を形成させることができる。In a preferred embodiment of the present invention, an organic compound salt and / or an inorganic salt is added to increase the electrophoretic efficiency of the sol. This increases the electrophoretic efficiency, and the precursor particles of the metal oxide can be attached to the surface of the thermocouple element with a lower applied voltage and / or a shorter energization time. As a result, a thick ceramic coating can be formed.
【0018】このような分散媒の誘電率を高める有機化
合物塩としては、相関移動触媒に用いられるような有機
アンモニウム塩などがある。また金属の無機塩として
は、アルミニウム、マグネシウム、カリウム、およびジ
ルコニウムの硝酸塩、硫酸塩、塩化物、ならびに水酸化
物からなる群より選択された化合物の少なくとも1種を
用いることができる。As an organic compound salt for increasing the dielectric constant of the dispersion medium, there is an organic ammonium salt used for a phase transfer catalyst. As the metal inorganic salt, at least one compound selected from the group consisting of aluminum, magnesium, potassium, and zirconium nitrates, sulfates, chlorides, and hydroxides can be used.
【0019】さらに大きな膜厚を得るためには、金属酸
化物の前駆体のゾル中に、セラミックスの微粉末を混合
させてもよい。セラミックス微粉末としては、マイカ粉
末、酸化ケイ素、窒化ケイ素、炭化ケイ素、および窒化
アルミニウムからなる群から選ばれる化合物の少なくと
も1種を用いることができる。To obtain a larger film thickness, fine powder of ceramics may be mixed in the sol of the precursor of the metal oxide. As the ceramic fine powder, at least one kind of compound selected from the group consisting of mica powder, silicon oxide, silicon nitride, silicon carbide, and aluminum nitride can be used.
【0020】また、金属酸化物層は、本来靭性に乏しく
過酷な曲げ加工の際には曲げ破壊を起こしやすい。この
発明では、金属酸化物層を可撓性に富む耐熱有機樹脂層
が覆っているため、被覆熱電対全体として非常に可撓性
に富む。Further, the metal oxide layer is originally poor in toughness and is prone to bending fracture during severe bending. In this invention, since the metal oxide layer is covered with the highly heat-resistant organic resin layer having high flexibility, the coated thermocouple as a whole is extremely flexible.
【0021】この発明の熱電対は、絶縁層が薄く、コン
パクトである。また可撓性に優れており、多量のガスを
吸着することがないので、真空中においても用いること
ができる。The thermocouple of the present invention has a thin insulating layer and is compact. Further, since it is excellent in flexibility and does not adsorb a large amount of gas, it can be used even in vacuum.
【0022】[0022]
【実施例】実施例1
直径0.32mmのCA熱電対のプラス脚(ニッケルお
よびクロムを主とした合金)とマイナス脚(ニッケルを
主とした合金)のそれぞれの素線を、まず大気中で80
0℃15分間加熱処理した。次に、テトラブトキシジル
コニウム5モル%、水8モル%、氷酢酸10モル%、お
よびブチルアルコール77モル%の混合溶液を作製し、
さらに室温で2時間攪拌し、ゾル液を調製した。このゾ
ルの溶液100mlに対し、硝酸イットリウム6水和物
を2g室温で添加した。Example 1 First, each wire of a positive leg (alloy mainly containing nickel and chromium) and a negative leg (alloy mainly containing nickel) of a CA thermocouple having a diameter of 0.32 mm was first exposed to the atmosphere. 80
Heat treatment was performed at 0 ° C. for 15 minutes. Next, a mixed solution of 5 mol% tetrabutoxyzirconium, 8 mol% water, 10 mol% glacial acetic acid, and 77 mol% butyl alcohol was prepared,
Furthermore, it stirred at room temperature for 2 hours, and prepared the sol liquid. To 100 ml of this sol solution, 2 g of yttrium nitrate hexahydrate was added at room temperature.
【0023】以上のように調製したゾルの中に、上述の
熱電対素線を浸積し、200Vの直流電圧を2分間印加
したところ、熱電対素線の表面にゲルとして70μm程
度の白色の膜が生成した。When the above-mentioned thermocouple wire was immersed in the sol prepared as described above and a DC voltage of 200 V was applied for 2 minutes, a white gel of about 70 μm was formed as a gel on the surface of the thermocouple wire. A film formed.
【0024】以上のようにしてゲルがコーティングされ
たプラス脚およびマイナス脚の各熱電対素線を900℃
で10分間加熱処理した後、急冷した。冷却後、厚さ5
μmのイットリア部分安定化ジルコニア膜が形成されて
いた。The gel-coated plus-leg and minus-leg thermocouple wires were set to 900 ° C.
After heat treatment for 10 minutes, it was rapidly cooled. After cooling, thickness 5
A yttria partially stabilized zirconia film having a thickness of μm was formed.
【0025】次に、デュポン社製ポリイミドワニス(P
yre ML)16重量%のものを、N−メチル−2−
ピロリドンで希釈し、5重量%としたものをセラミック
ス被覆熱電対素線上に塗布した。400℃の炉中を3.
5m/分で通過し焼成することにより、厚み3μmのポ
リイミド皮膜を形成させた。Next, a polyimide varnish (P
16% by weight of N-methyl-2-
What was diluted with pyrrolidone to make 5% by weight was applied onto a ceramic-coated thermocouple wire. 2. In a furnace at 400 ° C.
A polyimide film having a thickness of 3 μm was formed by passing through at 5 m / min and firing.
【0026】得られたものについて絶縁破壊電圧を測定
したところ、1.6kVであった。また、可撓性につい
ては、直径1mmの円筒に得られた熱電対素線を巻き付
けても皮膜に何ら亀裂が発生しなかった。また、1方向
式摩耗試験では、502g、往復式(w=0.6kg)
では、12回であり、耐摩耗性も良好な結果を示した。The dielectric breakdown voltage of the obtained product was measured and found to be 1.6 kV. Regarding the flexibility, no crack was generated in the film even when the obtained thermocouple element was wound around a cylinder having a diameter of 1 mm. In the one-way wear test, 502g, reciprocating type (w = 0.6kg)
Then, it was 12 times, and the wear resistance also showed good results.
【0027】プラス脚およびマイナス脚の各熱電対素線
の端末を溶融接合し、熱電対として使用したところ70
0℃まで良好な結果が得られた。When the ends of the thermocouple wires of the positive leg and the negative leg were fusion-bonded and used as a thermocouple, 70
Good results were obtained up to 0 ° C.
【0028】実施例2
直径0.16mmのCA熱電対のプラス脚(ニッケルお
よびクロムを主とした合金)とマイナス脚(ニッケルを
主とした合金)のそれぞれの熱電対素線を準備した。Example 2 A thermocouple element wire having a positive leg (alloy mainly containing nickel and chromium) and a negative leg (alloy mainly containing nickel) of a CA thermocouple having a diameter of 0.16 mm was prepared.
【0029】テトラエチルオルトシリケイト4モル%、
水40モル%、エチルアルコール56モル%の混合溶液
に硝酸をテトラエチルオルトシリケイトのモル数に対し
て100分の1の量だけ滴下し、温度80℃において2
時間反応させたゾルを調製し、さらに公称粒径14μm
のマイカ粉末を5g混合し電解液を調製した。4 mol% tetraethyl orthosilicate,
Nitric acid was added dropwise to a mixed solution of 40 mol% of water and 56 mol% of ethyl alcohol in an amount of 1/100 of the molar number of tetraethylorthosilicate, and the temperature was adjusted to 2 at 80 ° C.
Prepare a sol that has reacted for a period of time, and have a nominal particle size of
An electrolytic solution was prepared by mixing 5 g of the mica powder of.
【0030】以上のように調製したゾル中に、上述の熱
電対素線を浸積し、350Vの直流電圧を2分間印加し
たところ、熱電対素線の表面には皮膜として20μm程
度の白色の膜が精製した。When the above thermocouple element wire was immersed in the sol prepared as described above and a DC voltage of 350 V was applied for 2 minutes, a white film of about 20 μm was formed as a film on the surface of the thermocouple element wire. The membrane was purified.
【0031】このようにしてゲルがコーティングされた
プラス脚およびマイナス脚の各熱電対素線を、100℃
で1時間加熱した後、急冷した。冷却後、厚さ18μm
の酸化ケイ素・マイカ複合膜が形成されていた。The gel-coated positive and negative leg thermocouple wires were heated at 100 ° C.
After heating for 1 hour, it was quenched. After cooling, thickness 18 μm
The silicon oxide / mica composite film of No. 3 was formed.
【0032】次に、シリコン樹脂H−19−2(東レ−
ダウコーニング社製)をキシレンに希釈して、10%溶
液とした。このシリコン樹脂溶液を上述の酸化ケイ素・
マイカ複合膜を形成した熱電対素線の外方に塗布し、3
00℃で5分間加熱焼成した。この塗布および加熱焼成
を5回繰返すことにより、膜厚10μmの塗膜を得た。Next, silicone resin H-19-2 (Toray
Dow Corning) was diluted in xylene to give a 10% solution. This silicone resin solution
Apply to the outside of the thermocouple wire with the mica composite film formed,
It was baked by heating at 00 ° C. for 5 minutes. By repeating this coating and heating and baking 5 times, a coating film having a film thickness of 10 μm was obtained.
【0033】得られた熱電対素線を評価したところ、絶
縁破壊電圧が1.0kVであり、可撓性は直径1mmの
円筒にこの素線を巻き付けても皮膜に何の亀裂も発生し
ないものであった。When the obtained thermocouple element was evaluated, the dielectric breakdown voltage was 1.0 kV, and the flexibility was such that even if this element wire was wound around a cylinder having a diameter of 1 mm, no crack was generated in the film. Met.
【0034】プラス脚およびマイナス脚の各熱電対素線
の端末を溶融接合し、熱電対として使用したところ70
0℃までの良好な結果が得られた。When the ends of the plus leg and minus leg thermocouple wires were fusion-bonded and used as a thermocouple, 70
Good results up to 0 ° C were obtained.
【図1】この発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
1 熱電対素線 2 金属酸化物層 3 耐熱性有機樹脂層 1 thermocouple wire 2 Metal oxide layer 3 Heat-resistant organic resin layer
Claims (9)
によって調製し、このゾルの中に前記熱電対素線を浸積
し、前記熱電対素線を陰極として通電して金属酸化物の
前駆体微粒子を付着させ、これを加熱処理することによ
って前記熱電対素線の外方に設けられる金属酸化物層
と、 前記金属酸化物層の外方に設けられる耐熱性有機樹脂層
とを備える、被覆熱電対。1. A sol in which a thermocouple wire and metal oxide precursor fine particles are dispersed is prepared by a sol-gel method, and the thermocouple wire is immersed in this sol to form the thermocouple wire. A metal oxide precursor fine particles are deposited by energizing as a cathode, and a metal oxide layer is provided outside the thermocouple wire by heat-treating it, and provided outside the metal oxide layer. And a heat-resistant organic resin layer to be coated.
めるため、有機化合物塩を含有している、請求項1に記
載の被覆熱電対。2. The coated thermocouple according to claim 1, wherein the sol contains an organic compound salt in order to increase the dielectric constant of the dispersion medium of the sol.
めるため、金属の無機塩を含有している、請求項1に記
載の被覆熱電対。3. The coated thermocouple according to claim 1, wherein the sol contains an inorganic salt of a metal in order to increase the dielectric constant of the dispersion medium of the sol.
ている、請求項1に記載の被覆熱電対。4. The coated thermocouple according to claim 1, wherein the sol contains ceramic powder.
金属アルコキドもしくは金属のカルボン酸エステルの加
水分解反応および重合反応により調製されたものであ
る、請求項1に記載の被覆熱電対。5. The coated thermocouple according to claim 1, wherein the sol is prepared by a hydrolysis reaction and a polymerization reaction of a metal alkoxide or a carboxylic acid ester of a metal corresponding to the metal oxide.
アルミニウム、酸化ジルコニウムおよび酸化マグネシウ
ムからなる群から選択される化合物の少なくとも1種を
含む、請求項1に記載の被覆熱電対。6. The coated thermocouple of claim 1, wherein the metal oxide layer comprises at least one compound selected from the group consisting of silicon oxide, aluminum oxide, zirconium oxide and magnesium oxide.
酸化ケイ素、炭化ケイ素、窒化ケイ素、酸化アルミニウ
ム、窒化ホウ素および窒化アルミニウムからなる群から
選択された化合物の少なくとも1種である、請求項4に
記載の被覆熱電対。7. The ceramic powder is mica powder,
The coated thermocouple according to claim 4, which is at least one compound selected from the group consisting of silicon oxide, silicon carbide, silicon nitride, aluminum oxide, boron nitride and aluminum nitride.
酸化処理が施されている、請求項1記載の被覆熱電対。8. The coated thermocouple according to claim 1, wherein the surface of the thermocouple wire is oxidized by heating.
ポリアミドイミドおよびシリコン樹脂からなる選択され
た化合物の少なくとも1種を含む、請求項1に記載の被
覆熱電対。9. The heat-resistant organic resin layer is polyimide,
The coated thermocouple according to claim 1, comprising at least one selected compound consisting of polyamide-imide and silicone resin.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3181096A JPH0529666A (en) | 1991-07-22 | 1991-07-22 | Coated thermocouple |
| PCT/JP1991/001057 WO1992002960A1 (en) | 1990-08-09 | 1991-08-07 | Thermocouple |
| DE69129065T DE69129065T2 (en) | 1990-08-09 | 1991-08-07 | THERMOCOUPLE |
| EP91914196A EP0495997B1 (en) | 1990-08-09 | 1991-08-07 | Thermocouple |
| CA002067230A CA2067230C (en) | 1990-08-09 | 1991-08-07 | Thermocouple |
| TW080106972A TW306075B (en) | 1990-08-09 | 1991-09-03 | |
| US08/325,536 US5498296A (en) | 1990-08-09 | 1994-10-18 | Thermocouple |
| US08/845,576 US5747727A (en) | 1990-08-09 | 1997-04-25 | Method of making a thermocouple |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3181096A JPH0529666A (en) | 1991-07-22 | 1991-07-22 | Coated thermocouple |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529666A true JPH0529666A (en) | 1993-02-05 |
Family
ID=16094766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3181096A Withdrawn JPH0529666A (en) | 1990-08-09 | 1991-07-22 | Coated thermocouple |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529666A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100345823B1 (en) * | 1998-11-25 | 2002-07-24 | 마츠시다 덴코 가부시키가이샤 | Thermoelectric Module |
-
1991
- 1991-07-22 JP JP3181096A patent/JPH0529666A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100345823B1 (en) * | 1998-11-25 | 2002-07-24 | 마츠시다 덴코 가부시키가이샤 | Thermoelectric Module |
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