JPH05315403A - Film carrier for tab and its manufacture - Google Patents
Film carrier for tab and its manufactureInfo
- Publication number
- JPH05315403A JPH05315403A JP11493392A JP11493392A JPH05315403A JP H05315403 A JPH05315403 A JP H05315403A JP 11493392 A JP11493392 A JP 11493392A JP 11493392 A JP11493392 A JP 11493392A JP H05315403 A JPH05315403 A JP H05315403A
- Authority
- JP
- Japan
- Prior art keywords
- film
- tab
- lead
- film carrier
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000005452 bending Methods 0.000 claims abstract description 27
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 239000011253 protective coating Substances 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims abstract description 3
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 description 10
- 239000009719 polyimide resin Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】リードに集中する応力を分散させ、耐折り曲げ
性を向上させると共に容易に、かつ経済的に製造する。
【構成】ベースフィルム１の一面に銅リードパターンを
形成してなるＴＡＢ用フィルムキャリアである。フィル
ム１に折り曲げ用スリット穴５を有し、スリット穴５に
位置するリードの少なくとも一面に、フィルム１よりも
弾性率が小さく厚みが薄い可撓性樹脂保護被膜１１，１
２を形成する。このフィルムキャリアは、一面に接着剤
層を有するフィルム１にスリット穴５、スプロケットホ
ール２、デバイスホール３等を設け、接着剤を介して銅
箔をラミネートした後、スリット穴５の開孔に位置した
銅箔表面に液状樹脂を塗布、乾燥して可撓性樹脂保護被
膜１１を形成し、次いで銅箔をエッチング加工してリー
ドパターンを形成する。
(57) [Abstract] [Purpose] To disperse the stress concentrated on the leads, improve the bending resistance, and manufacture easily and economically. [Structure] A film carrier for TAB in which a copper lead pattern is formed on one surface of a base film 1. The film 1 has a bending slit hole 5, and at least one surface of the lead located in the slit hole 5 has a flexible resin protective coating 11, 1 having a smaller elastic modulus and a thinner thickness than the film 1.
Form 2. This film carrier is provided with slit holes 5, sprocket holes 2, device holes 3, etc. on a film 1 having an adhesive layer on one surface, and after laminating a copper foil with an adhesive, the film holes are positioned at the openings of the slit holes 5. A liquid resin is applied to the surface of the copper foil thus formed and dried to form a flexible resin protective coating 11, and then the copper foil is etched to form a lead pattern.
Description
【０００１】[0001]
【産業上の利用分野】本発明は折り曲げ実装性に優れた
ＴＡＢ用フィルムキャリア及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB film carrier excellent in bending mountability and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】近年、ＩＣ等の半導体実装において、Ｔ
ＡＢ（Tape Automated Bonding）方式が、パッケージの
薄型化、多ピン化、組立自動化に好適な方向として盛ん
に用いられるようになってきた。2. Description of the Related Art In recent years, in semiconductor mounting such as IC, T
The AB (Tape Automated Bonding) method has been actively used as a suitable direction for thinning the package, increasing the number of pins, and assembling automation.
【０００３】一般に、ＴＡＢ方式に使用されるフィルム
キャリアは、図２に示すように、フィルム送り用のスプ
ロケットホール２、素子配設用のデバイスホール３、ア
ウタリードホール４等を穿孔した接着剤付きポリイミド
フィルム等のベースフィルム１に銅箔をラミネートし、
フォトエッチング加工により銅箔をエッチングして、Ｉ
Ｃ素子の電極と接合するためのインナリード６及び外部
基板との接続用アウタリード７ａ，７ｂを含む所望のリ
ードパターンを形成した後、リード表面にめっきを施し
て製造される。In general, a film carrier used in the TAB system is provided with an adhesive having a sprocket hole 2 for feeding a film, a device hole 3 for arranging elements, an outer lead hole 4, etc., as shown in FIG. Laminate copper foil on base film 1 such as polyimide film,
The copper foil is etched by photo-etching process and I
It is manufactured by forming a desired lead pattern including inner leads 6 for joining with the electrodes of the C element and outer leads 7a, 7b for connection with an external substrate, and then plating the lead surfaces.
【０００４】このようなＴＡＢの特長を利用した用途の
１つとして、ＯＡ機器等のディスプレイ装置に用いる液
晶パネルの駆動素子がある。One of the applications utilizing such characteristics of TAB is a driving element for a liquid crystal panel used in a display device such as an OA device.
【０００５】この液晶駆動用ＴＡＢに用いるフィルムキ
ャリアの場合、一方に出力信号用アウタリード７ａが、
他方には入力信号用アウタリード７ｂがそれぞれ形成さ
れ、出力信号用アウタリード７ａは液晶基板の周縁部に
形成された電極上に対向させ異方性導電接着剤を介して
接続され、入力信号用アウタリード７ｂは外部基板端子
に半田付けして実装される。In the case of the film carrier used for the liquid crystal driving TAB, the output signal outer lead 7a is provided on one side,
The input signal outer leads 7b are formed on the other side, and the output signal outer leads 7a are opposed to and connected to the electrodes formed on the peripheral portion of the liquid crystal substrate via an anisotropic conductive adhesive. Are mounted by soldering to external board terminals.
【０００６】一方、近年の装置の小型化、高密度化の要
求に伴い、この液晶基板周縁部の駆動素子実装面積を縮
小するために、図４に示すように、ＴＡＢフィルムキャ
リアを基板の端部で折り曲げる実装方式が用いられてお
り、この種の用途に用いられるフィルムキャリアは、基
板との密着性を保ちながら鋭角での折り曲げを容易にす
るため、ベースフィルム１の折り曲げ部分にスリット穴
５を予め設けて、銅箔リードのみを折り曲げるようにし
たものが一般的に知られている。なお、８はＩＣチッ
プ、９は液晶パネル、１０は接着剤である。On the other hand, in order to reduce the drive element mounting area at the peripheral portion of the liquid crystal substrate in accordance with the recent demand for miniaturization and high density of the device, as shown in FIG. 4, the TAB film carrier is mounted on the edge of the substrate. The film carrier used for this type of application uses a mounting method of bending at a portion, and in order to facilitate bending at an acute angle while maintaining close contact with the substrate, a slit hole 5 is formed in the bent portion of the base film 1. It is generally known that a copper foil lead is bent in advance and only the copper foil lead is bent. In addition, 8 is an IC chip, 9 is a liquid crystal panel, and 10 is an adhesive.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら前述の構
成の場合、折り曲げ部分（スリット穴５の部分）におい
てはベースフィルム１がないため、実装時の機械的応力
や熱サイクル等による応力が、薄い銅箔リードに集中し
てリードのクラックや破断を生じ易いという問題点があ
る。However, in the case of the above configuration, since there is no base film 1 in the bent portion (the portion of the slit hole 5), the mechanical stress at the time of mounting and the stress due to the heat cycle etc. are thin copper. There is a problem that cracks and fractures of the leads are likely to occur concentrated on the foil leads.
【０００８】本発明は以上の問題点に鑑みなされたもの
で、その目的は折り曲げ実装性、信頼性に優れたＴＡＢ
用フィルムキャリア及びその製造方法を提供することに
ある。The present invention has been made in view of the above problems, and an object thereof is a TAB excellent in bending mountability and reliability.
To provide a film carrier and a manufacturing method thereof.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するため
に第１の発明は、可撓性絶縁フィルムの一面に銅リード
パターンを形成してなるＴＡＢ用フィルムキャリアであ
って、前記フィルムにこのフィルム及び前記銅リードパ
ターンを折り曲げるためのスリット穴を有し、かつ前記
スリット穴上に位置するリードの少なくとも一面に、弾
性率がベースフィルムより小さく厚みがベースフィルム
より薄い可撓性樹脂保護被膜を形成したことを特徴とす
る。In order to solve the above-mentioned problems, a first invention is a film carrier for TAB comprising a flexible insulating film and a copper lead pattern formed on one surface thereof. A flexible resin protective coating having a slit hole for bending the film and the copper lead pattern, and at least one surface of the lead located on the slit hole, the elastic modulus is smaller than the base film and the thickness is thinner than the base film. It is characterized by being formed.
【００１０】第２の発明は、一面に接着剤層を有する可
撓性絶縁フィルムに折り曲げ用スリット穴を含む複数の
開孔を設け、接着剤を介して銅箔をラミネートした後、
前記折り曲げ用スリット穴の開孔に位置した銅箔表面に
液状樹脂を塗布、乾燥して可撓性樹脂保護被膜を形成
し、次いで銅箔をエッチング加工してリードパターンを
形成することを特徴とする。In a second aspect of the invention, a flexible insulating film having an adhesive layer on one surface thereof is provided with a plurality of openings including bending slit holes, and after laminating a copper foil with an adhesive,
Liquid resin is applied to the copper foil surface located in the opening of the bending slit hole, dried to form a flexible resin protective coating, and then the copper foil is etched to form a lead pattern. To do.
【００１１】[0011]
【作用】第１発明により、折り曲げスリット穴上に位置
する銅リード表面に形成した可撓性樹脂保護被膜によっ
て折り曲げ実装時に銅リードに集中する応力を分散させ
ることができ、耐折り曲げ性が向上する。According to the first aspect of the present invention, the flexible resin protective coating formed on the surface of the copper lead located on the bending slit hole can disperse the stress concentrated on the copper lead during bending mounting, and the bending resistance is improved. ..
【００１２】第２発明により、接続信頼性に優れたフィ
ルムキャリアを容易に、かつ経済的に製造することがで
きる。According to the second invention, a film carrier having excellent connection reliability can be manufactured easily and economically.
【００１３】[0013]
【実施例】以下、本発明の実施例を添付図面を参照しな
がら説明する。Embodiments of the present invention will be described below with reference to the accompanying drawings.
【００１４】第１実施例 本実施例に係るＴＡＢ用フィルムキャリアの全体構成
は、前述した従来のＴＡＢ用フィルムキャリアとほぼ同
様であるので、同一部分には同一符号を付してその説明
を省略する。 First Embodiment Since the overall structure of the TAB film carrier according to the present embodiment is almost the same as that of the conventional TAB film carrier described above, the same parts are designated by the same reference numerals and the description thereof will be omitted. To do.
【００１５】本実施例のＴＡＢ用フィルムキャリアにお
いては、前記従来のＴＡＢ用フィルムキャリア構成に加
え、図１（Ａ），（Ｂ）に示すように、ベースフィルム
１の折り曲げ用スリット穴５上に位置する出力信号用ア
ウタリード７ａの一面に、弾性率がベースフィルム１よ
り小さく厚みがベースフィルム１より薄く設定され、リ
ード７ａのクラックや破断を防止する可撓性樹脂保護被
膜１１が形成されている。なお、図１（Ａ）は本実施例
に係るＴＡＢ用フィルムキャリアを示す断面図であっ
て、図２のＡ−Ａ線矢視断面図（上半分の断面図）に対
応した断面図である。図１（Ｂ）は図２のＢ−Ｂ線矢視
断面図に対応する断面図である。In the TAB film carrier of this embodiment, in addition to the conventional TAB film carrier structure, as shown in FIGS. 1 (A) and 1 (B), the base film 1 has a slit 5 for bending. A flexible resin protective coating 11 is formed on one surface of the outer lead 7a for the output signal, the elastic modulus of which is smaller than that of the base film 1 and the thickness thereof is smaller than that of the base film 1, and the lead 7a is prevented from cracking or breaking. .. 1A is a cross-sectional view showing the TAB film carrier according to this embodiment, and is a cross-sectional view corresponding to the cross-sectional view taken along the line AA of FIG. 2 (the cross-sectional view of the upper half). .. 1B is a sectional view corresponding to the sectional view taken along the line BB of FIG.
【００１６】次に、上記構成のＴＡＢ用フィルムキャリ
アは次のようにして製造する。Next, the TAB film carrier having the above structure is manufactured as follows.
【００１７】厚さ７５μｍのポリイミドフィルム（東
レ、デュポン社カプトンＶ、引張弾性率３００ｋｇ／ｍ
ｍ2 ）に厚さ２０μｍのエポキシ樹脂接着剤を塗布した
ベースフィルム１に、スプロケットホール２、デバイス
ホール３、アウタリードホール４及び幅０．５ｎｍの折
り曲げ用スリット穴５をプレス穿孔し、厚さ３５μｍの
電解銅箔をラミネートする。75 μm-thick polyimide film (Kapton V, DuPont Toray, tensile elastic modulus 300 kg / m
m 2 ), a sprocket hole 2, a device hole 3, an outer lead hole 4 and a bending slit hole 5 with a width of 0.5 nm are press-punched on a base film 1 having a thickness of 20 μm and an epoxy resin adhesive applied. A 35 μm electrolytic copper foil is laminated.
【００１８】次にスクリーン印刷法により、ポリイミド
樹脂と溶剤からなる塗料をベースフィルム１のスリット
穴５内の銅箔上に塗布し、１５０℃で１時間加熱乾燥し
て厚さ１５μｍのポリイミド樹脂被膜（可撓性樹脂保護
被膜１１）を形成する。このポリイミド樹脂被膜の引張
弾性率は４０ｋｇ／ｍｍ2 である。Next, a paint consisting of a polyimide resin and a solvent is applied onto the copper foil in the slit holes 5 of the base film 1 by a screen printing method, and dried by heating at 150 ° C. for 1 hour to form a polyimide resin film having a thickness of 15 μm. (Flexible resin protective coating 11) is formed. The tensile elastic modulus of this polyimide resin coating is 40 kg / mm 2 .
【００１９】次にフォトエッチング法により、表面銅箔
をエッチング加工してインナリード６、アウタリード７
ａ，７ｂを含むリードパターン（図２に示す従来例と同
様のパターン）を有するフィルムキャリアを得る。な
お、折り曲げ用スリット穴５上に形成した出力用アウタ
リード寸法は幅１００μｍ、ピッチ２００μｍである。Next, the surface copper foil is etched by a photo-etching method to form inner leads 6 and outer leads 7.
A film carrier having a lead pattern including a and 7b (the same pattern as the conventional example shown in FIG. 2) is obtained. The dimensions of the output outer leads formed on the bending slit holes 5 are 100 μm in width and 200 μm in pitch.
【００２０】ベースフィルム１に用いる材料としては、
前記ポリイミドの他に、ポリエステル等の耐熱性、絶縁
性及び可撓性に優れた材料を用いる。銅箔接着用接着剤
としては、前記エポキシ樹脂やポリイミド樹脂等を主体
とした熱硬化型接着剤を用いる。The material used for the base film 1 is
In addition to the polyimide, a material having excellent heat resistance, insulation and flexibility such as polyester is used. As the adhesive for bonding the copper foil, a thermosetting adhesive mainly containing the epoxy resin or polyimide resin is used.
【００２１】折り曲げ部リード（スリット穴５に位置す
るリード部分）を保護する液状樹脂（可撓性樹脂保護被
膜１１）は、ベースフィルム１よりも弾性率が小さく、
可撓性に優れた被膜の形成が可能なものであって、フィ
ルムキャリアの製造工程、ＴＡＢ実装工程等で必要な耐
薬品性、耐熱性、絶縁性等を備えたものであればよい。
例えば、前記ポリイミド樹脂塗料の他に、エポキシ樹脂
塗料等の任意の可撓性耐熱樹脂塗料を用いることができ
る。The liquid resin (flexible resin protective coating 11) for protecting the bent leads (lead portions located in the slit holes 5) has a smaller elastic modulus than the base film 1,
It is possible to form a coating film having excellent flexibility and to have chemical resistance, heat resistance, insulation and the like required in the film carrier manufacturing process, the TAB mounting process and the like.
For example, in addition to the polyimide resin paint, any flexible heat resistant resin paint such as epoxy resin paint can be used.
【００２２】また、上記樹脂被膜の塗布法としては、前
記スクリーン印刷法の他に、ボンディング法等の任意の
方法が使用できる。ただし、上記樹脂被膜の塗布をリー
ドパターン形成後に行うと、スリット穴５内において支
持するものがなく、かつ不安定な微細リードへの均一な
塗布が難しく、またリード間隙に過剰の樹脂が付着しや
すく、これが周辺部リードを汚染して実装時の接続不良
を招くおそれがあるため、銅箔のエッチング加工前にベ
ースフィルム１側より行うと、確実に且つ能率的に被膜
を形成でき、信頼性、経済性に優れた折り曲げ実装用Ｔ
ＡＢフィルムキャリアの製造が可能となる。In addition to the screen printing method, any method such as a bonding method can be used as the method for applying the resin coating. However, if the resin coating is applied after the lead pattern is formed, there is nothing to support in the slit holes 5, and it is difficult to apply it uniformly to the unstable fine lead, and excessive resin adheres to the lead gap. Since it is easy to do so, it may contaminate the peripheral leads and lead to connection failure during mounting. Therefore, if the etching is performed from the side of the base film 1 before etching the copper foil, the film can be formed reliably and efficiently, and the reliability is improved. , T for bending mounting with excellent economy
It becomes possible to manufacture an AB film carrier.
【００２３】以上の構成により、折り曲げ実装時におい
て、従来はアウタリードに集中していた応力を可撓性樹
脂保護被膜１１に分散させることができ、耐折り曲げ性
が向上する。With the above-mentioned structure, at the time of bending and mounting, the stress concentrated in the outer leads in the past can be dispersed in the flexible resin protective film 11, and the bending resistance is improved.
【００２４】さらに、可撓性樹脂保護被膜１１はアウタ
リード７ａのエッチング加工前に、ベースフィルム１側
より行うようにしたので、周辺部リードへの樹脂による
汚染を生じることがなく、接続信頼性に優れたフィルム
キャリアを容易に、かつ経済的に製造することができ
る。Further, since the flexible resin protective coating 11 is formed from the side of the base film 1 before the outer lead 7a is etched, the peripheral leads are not contaminated by the resin and the connection reliability is improved. An excellent film carrier can be manufactured easily and economically.
【００２５】第２実施例 本実施例のＴＡＢ用フィルムキャリアは、図５（Ａ），
（Ｂ）に示すように、前記第１実施例のＴＡＢ用フィル
ムキャリアでスリット穴５に位置するアウタリード７ａ
の一側面（図５（Ａ）における下側面）に施した可撓性
樹脂保護被膜１１に加えて、スリット穴５に位置するア
ウタリード７ａの他側面にも可撓性樹脂保護被膜１２を
施し、アウタリード７ａをその両側から挟持するように
設けている。 Second Embodiment The TAB film carrier of this embodiment is shown in FIG.
As shown in (B), the outer lead 7a located in the slit hole 5 in the TAB film carrier of the first embodiment.
In addition to the flexible resin protective coating 11 applied to one side surface (the lower side surface in FIG. 5A), the flexible resin protective coating 12 is applied to the other side surface of the outer lead 7a located in the slit hole 5, The outer leads 7a are provided so as to be sandwiched from both sides thereof.
【００２６】上記構成のＴＡＢ用フィルムキャリアは次
のようにして製造する。The TAB film carrier having the above structure is manufactured as follows.
【００２７】一側面の可撓性樹脂保護被膜１１を施すま
では前記第１実施例の製造方法により行う。この製造方
法より作成したフィルムキャリアのスリット穴５上のパ
ターン側リード７ａの他側面に、さらにスクリーン印刷
法により第１実施例と同一条件でポリイミド樹脂を塗布
し、熱処理して１５μｍの厚さの可撓性樹脂保護被膜１
２を形成する。Until the flexible resin protective coating 11 on one side is applied, the manufacturing method of the first embodiment is carried out. A polyimide resin was further applied to the other side surface of the pattern side lead 7a on the slit hole 5 of the film carrier prepared by this manufacturing method by the screen printing method under the same conditions as in the first embodiment, and heat-treated to have a thickness of 15 μm. Flexible resin protective film 1
Form 2.
【００２８】なお、２回目の印刷（スクリーン印刷法に
よる印刷）の際には、各アウタリード７ａ間の隙間は１
回目に形成した樹脂保護被膜１１で覆われているので、
リード７ａ間からの樹脂の漏れはなく、良好な印刷精度
を得ることができる。During the second printing (printing by the screen printing method), the gap between the outer leads 7a is 1
Since it is covered with the resin protective film 11 formed the next time,
There is no resin leakage between the leads 7a, and good printing accuracy can be obtained.
【００２９】以上の各実施例のそれぞれの方法により得
られたフィルムキャリアについてリード破断実験を行っ
た。なお、この２つの実施例によるフィルムキャリアと
比較するために、比較例としてポリイミド樹脂塗料（可
撓性樹脂保護被膜１１，１２）を塗布しないことを除
き、他は前記第１及び第２実施例において行った方法と
まったく同様の方向によりフィルムキャリアを作成し
た。A lead breaking test was conducted on the film carriers obtained by the respective methods of the above examples. In addition, in order to compare with the film carrier according to these two examples, as a comparative example, except that the polyimide resin coating (flexible resin protective coatings 11 and 12) is not applied, the others are the same as the first and second examples. A film carrier was prepared in the same direction as in the method described in 1.
【００３０】この実験は図６に示すように、フィルムキ
ャリアをクランプ支持具１２で挟持してリード面側及び
フィルム面側に交互に９０゜ずつ往復して折り曲げ、１
往復の折り曲げを１回としてリード破断までの曲げ回数
を調べた。なお、フィルムキャリアを折り曲げるときの
クランプ支持具１２側の接触面はＲ０．５ｍｍの局面に
した。この結果、保護被膜を形成しない比較例では２０
〜３０回でリードが破断した。これに対して第１及び第
２実施例の方法によるフィルムキャリアでは、いずれも
５０〜６０回で破断した。In this experiment, as shown in FIG. 6, the film carrier was sandwiched between the clamp supports 12 and alternately reciprocated by 90 ° between the lead surface side and the film surface side and bent.
The number of times of bending until the lead was broken was examined by setting the reciprocal bending to once. The contact surface on the clamp support 12 side when the film carrier was bent was set to a phase of R0.5 mm. As a result, it is 20 in the comparative example in which the protective film is not formed.
The lead broke after about 30 times. On the other hand, in the film carriers according to the methods of the first and second examples, each of them broke after 50 to 60 times.
【００３１】この実験結果から、耐折り曲げ性が大幅に
向上することが分かる。From this experimental result, it can be seen that the bending resistance is significantly improved.
【００３２】なお、前記第１実施例においては可撓性樹
脂保護被膜１１をスリット穴５内側（図１中の下側）か
ら施したが、スリット穴５外側からのみ施してもよい。
この場合も前記第１実施例と同様の作用、効果を奏する
ことができる。Although the flexible resin protective coating 11 is applied from the inside of the slit hole 5 (the lower side in FIG. 1) in the first embodiment, it may be applied only from the outside of the slit hole 5.
In this case also, the same operation and effect as those of the first embodiment can be obtained.
【００３３】[0033]
【発明の効果】以上詳述したように本発明のＴＡＢ用フ
ィルムキャリア及びその製造方法によれば、以下の効果
を奏する。As described in detail above, the TAB film carrier of the present invention and the method for producing the same have the following effects.
【００３４】折り曲げスリット穴上の銅リード表面に、
可撓性に優れた樹脂からなる保護被膜を形成したので、
折り曲げ実装時に銅リードへの応力集中を防止して、耐
折り曲げ性を大幅に向上させることができる。On the copper lead surface on the bending slit hole,
Since a protective film made of resin with excellent flexibility is formed,
It is possible to prevent stress concentration on the copper leads during bending mounting, and to significantly improve bending resistance.
【図１】本発明の第１実施例に係るＴＡＢ用フィルムキ
ャリアを示す断面図（図２のＡ−Ａ線矢視及びＢ−Ｂ線
矢視断面図に対応する断面図）である。FIG. 1 is a cross-sectional view showing a film carrier for TAB according to a first embodiment of the present invention (a cross-sectional view corresponding to the cross-sectional view taken along the line AA and the line BB in FIG. 2).
【図２】従来のＴＡＢ用フィルムキャリアを示す平面図
である。FIG. 2 is a plan view showing a conventional TAB film carrier.
【図３】図２のＡ−Ａ線矢視断面図である。3 is a cross-sectional view taken along the line AA of FIG.
【図４】ＴＡＢ用フィルムキャリアの実装状態を示す断
面図である。FIG. 4 is a cross-sectional view showing a mounted state of a TAB film carrier.
【図５】本発明の第２実施例に係るＴＡＢ用フィルムキ
ャリアを示す断面図（図２のＡ−Ａ線矢視及びＢ−Ｂ線
矢視断面図に対応する断面図）である。FIG. 5 is a sectional view showing a film carrier for TAB according to a second embodiment of the present invention (a sectional view corresponding to the sectional view taken along the line AA and the line BB in FIG. 2).
【図６】リード破断実験例を示す説明図である。FIG. 6 is an explanatory diagram showing an example of a lead breakage experiment.
１ ベースフィルム ２ スプロケットホール ３ デバイスホール ４ アウタリードホール ５ スリット穴 ６ インナリード ７ａ，７ｂ 接続用アウタリード １１，１２ 可撓性樹脂保護被膜 1 base film 2 sprocket hole 3 device hole 4 outer lead hole 5 slit hole 6 inner lead 7a, 7b outer lead for connection 11, 12 flexible resin protective coating
Claims (2)
ーンを形成してなるＴＡＢ用フィルムキャリアにおい
て、前記フィルムにこのフィルム及び前記銅リードパタ
ーンを折り曲げるためのスリット穴を有し、かつ前記ス
リット穴上に位置するリードの少なくとも一面に、弾性
率がベースフィルムより小さく厚みがベースフィルムよ
り薄い可撓性樹脂保護被膜を形成したことを特徴とする
ＴＡＢ用フィルムキャリア。1. A TAB film carrier comprising a flexible insulating film and a copper lead pattern formed on one surface thereof, the film having slit holes for bending the film and the copper lead pattern, and the slit. A film carrier for TAB, wherein a flexible resin protective coating having a smaller elastic modulus than the base film and a thinner thickness than the base film is formed on at least one surface of the lead located on the hole.
ムに折り曲げ用スリット穴を含む複数の開孔を設け、接
着剤を介して銅箔をラミネートした後、前記折り曲げ用
スリット穴の開孔に位置した銅箔表面に液状樹脂を塗
布、乾燥して可撓性樹脂保護被膜を形成し、次いで銅箔
をエッチング加工してリードパターンを形成することを
特徴とするＴＡＢ用フィルムキャリアの製造方法。2. A flexible insulating film having an adhesive layer on one surface thereof is provided with a plurality of openings including bending slit holes, and after laminating a copper foil with an adhesive, the bending slit holes are opened. Production of a film carrier for TAB, characterized in that a liquid resin is applied to the surface of the copper foil located in the hole and dried to form a flexible resin protective coating, and then the copper foil is etched to form a lead pattern. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11493392A JPH05315403A (en) | 1992-05-07 | 1992-05-07 | Film carrier for tab and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11493392A JPH05315403A (en) | 1992-05-07 | 1992-05-07 | Film carrier for tab and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05315403A true JPH05315403A (en) | 1993-11-26 |
Family
ID=14650259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11493392A Pending JPH05315403A (en) | 1992-05-07 | 1992-05-07 | Film carrier for tab and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05315403A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980032687A (en) * | 1996-10-09 | 1998-07-25 | 윌리엄비.켐플러 | Carrier Tape, and Carrier Tape Manufacturing Method |
| CN112585665A (en) * | 2018-08-28 | 2021-03-30 | 夏普株式会社 | Display device |
-
1992
- 1992-05-07 JP JP11493392A patent/JPH05315403A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980032687A (en) * | 1996-10-09 | 1998-07-25 | 윌리엄비.켐플러 | Carrier Tape, and Carrier Tape Manufacturing Method |
| CN112585665A (en) * | 2018-08-28 | 2021-03-30 | 夏普株式会社 | Display device |
| CN112585665B (en) * | 2018-08-28 | 2023-04-18 | 夏普株式会社 | Display device |
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