JPH053307Y2 - - Google Patents
Info
- Publication number
- JPH053307Y2 JPH053307Y2 JP10598888U JP10598888U JPH053307Y2 JP H053307 Y2 JPH053307 Y2 JP H053307Y2 JP 10598888 U JP10598888 U JP 10598888U JP 10598888 U JP10598888 U JP 10598888U JP H053307 Y2 JPH053307 Y2 JP H053307Y2
- Authority
- JP
- Japan
- Prior art keywords
- foam
- styrene
- thickness
- resin
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Building Environments (AREA)
- Laminated Bodies (AREA)
Description
（産業上の利用分野）
本考案は、建築物の内装、外装或は屋上などの
断熱材として使用できるスチレン系樹脂積層発泡
板に関する。
（従来の技術及び解決すべき課題）
従来より建築用の断熱材としては、ポリスチレ
ン樹脂を押出発泡したものや、発泡性ポリスチレ
ン粒子を蒸気成形したものが使用されてきた。
しかし、従来使用されているポリスチレン樹脂
よりなる断熱材は物性的に不十分な点が多く、こ
の物性を改良する目的で種々のスチレン系誘導体
や共重合体樹脂を発泡化することが試みられてき
た。例えば、特開昭62−211133号ではα−メチル
スチレンが、又、特開昭61−278544号ではＰ−メ
チルスチレンが使用され、更に特開昭57−72830
号ではアクリル酸、メタアクリル酸、無水マレイ
ン酸を含有するスチレン系樹脂共重合体が用いら
れているが、これらの樹脂は単独では高発泡体を
得ることは難しく、又得られたものは脆いという
欠点もあつた。
本考案者は上記の欠点を解決するために、種々
検討した結果、本考案を完成するに至つたもの
で、本考案の目的は物性、特に耐熱性の改良され
た高発泡のポリスチレン系樹脂積層発泡板を提供
するにある。
（課題を解決するための手段）
本考案は、厚さ10〜100mm、密度15〜50Kg／m3
のスチレン系樹脂発泡体の少なくとも一方の面
に、アクリル酸、メタクリル酸、無水マレイン酸
の少なくとも一成分を含む、スチレン成分が75〜
95重量％で且つビカツト軟化点が115℃以上のス
チレン系共重合体樹脂からなり、スチレン系樹脂
発泡体の厚さの0.1〜0.5倍の厚さを有する密度50
〜200Kg／m3の発泡体を積層したことを特徴とす
るスチレン系樹脂積層発泡板である。
すなわち、本考案は、スチレン系樹脂発泡体の
少なくとも一方の面に特定のスチレン系共重合体
樹脂からなる発泡体を積層したものである。
本考案について、更に詳細に述べる。
本考案における基本層となるスチレン系樹脂発
泡体とはポリスチレン又はスチレン成分95重量％
以上のスチレン含有共重合体から成る密度15〜50
Kg／m3を有する発泡体であつて、このような密度
を有するスチレン系発泡体とは、約20倍〜70倍程
度に発泡した通常ポリスチレン樹脂発泡体として
呼ばれているものである。密度が15Kg／m3以下の
低密度を有する発泡体では機械的強度が低く、そ
して、又50Kg／m3以上では断熱材としての機能を
期待できない。
この基本層の少なくとも一方の面に積層する発
泡体は、アクリル酸、メタクリル酸、無水マレイ
ン酸の少なくとも一成分を含むスチレンとの共重
合体樹脂よりなつている。しかして、この共重合
体樹脂のスチレン成分の含量は75〜95重量％であ
つて、75％重量以下の共重合体樹脂では機械的強
度が弱く、95重量％以上のものでは耐熱性が不十
分である。
そして、共重合体樹脂のビカツト軟化点は115
℃以上であり、115℃以下では耐熱性が不十分で、
例えば、この積層体をアスフアルト熱工法で屋根
断熱材として使用する場合、軟化してしまい使用
に耐えない。
そして、この共重合体からなる発泡体の密度は
50〜200Kg／m3を有する高発泡のものであり、基
本層であるスチレン系樹脂発泡体の厚さの0.1〜
0.5倍の厚さを有するものである。このように共
重合体からなる発泡体の密度及び厚さを限定した
理由としては、基本層の機械的な物性、断熱性の
維持がされないためである。
本考案に係る積層発泡板の製造方法としては、
如何なる方法でもよいが、その一例を示すと、予
め押出発泡によりスチレン系樹脂発泡体及び共重
合体樹脂から成る発泡体を製造し、これら両者を
熱融着もしくは接着剤等により積層することによ
つて容易に得られる。
本発明に係る積層発泡板は特に耐熱性及び耐溶
剤性、防湿性に優れており、特に屋上断熱剤とし
て使用することに適しておりこの積層発泡板の表
面にアスフアルト熱加工により防水加工を行うこ
とができる。
実施例
密度35Kg／m3のスチレン系樹脂発泡体（積水化
成品(株)製、登録商標エスレンフオームSK）の25
mm厚さのものの一面に第１表に示すそれぞれのス
チレン共重合体樹脂よりなる発泡体を積層した。
(Field of Industrial Application) The present invention relates to a styrene resin laminated foam board that can be used as a heat insulating material for the interior, exterior, or rooftop of buildings. (Prior Art and Problems to be Solved) Conventionally, as thermal insulation materials for buildings, materials obtained by extruding foamed polystyrene resin or materials obtained by vapor molding expandable polystyrene particles have been used. However, conventionally used heat insulating materials made of polystyrene resin have many insufficient physical properties, and attempts have been made to foam various styrene derivatives and copolymer resins in order to improve these properties. Ta. For example, α-methylstyrene is used in JP-A-62-211133, P-methylstyrene is used in JP-A-61-278544, and JP-A-57-72830 uses α-methylstyrene.
In this issue, a styrene-based resin copolymer containing acrylic acid, methacrylic acid, and maleic anhydride is used, but it is difficult to obtain highly foamed products using these resins alone, and the products obtained are brittle. There was also a drawback. In order to solve the above-mentioned drawbacks, the inventor of the present invention has completed various studies and has completed the present invention. There is foam board to offer. (Means for solving the problem) The present invention has a thickness of 10 to 100 mm and a density of 15 to 50 kg/m 3
A styrene component containing at least one component of acrylic acid, methacrylic acid, and maleic anhydride is present on at least one side of the styrenic resin foam.
Consisting of 95% by weight styrene copolymer resin with a Vikatsu softening point of 115°C or higher, with a density of 50 and having a thickness of 0.1 to 0.5 times the thickness of the styrene resin foam.
This is a styrene resin laminated foam board characterized by laminating foams of ~200Kg/m 3 . That is, in the present invention, a foam made of a specific styrene copolymer resin is laminated on at least one surface of a styrene resin foam. The present invention will be described in more detail. The styrenic resin foam that is the basic layer in this invention is polystyrene or styrene content of 95% by weight.
Consisting of styrene-containing copolymers with a density of 15 to 50
Kg/m 3 , and the styrene foam having such a density is what is usually called a polystyrene resin foam that has been expanded to about 20 to 70 times. A foam having a low density of 15 Kg/m 3 or less has low mechanical strength, and a foam of 50 Kg/m 3 or more cannot be expected to function as a heat insulating material. The foam laminated on at least one side of the base layer is made of a copolymer resin with styrene containing at least one component of acrylic acid, methacrylic acid, and maleic anhydride. However, the content of the styrene component in this copolymer resin is 75 to 95% by weight, and copolymer resins with less than 75% by weight have weak mechanical strength, and those with more than 95% by weight have poor heat resistance. It is enough. And the Vikatsu softening point of the copolymer resin is 115
℃ or higher, and below 115℃, the heat resistance is insufficient.
For example, when this laminate is used as a roof insulation material using the asphalt thermal construction method, it becomes soft and cannot be used. And the density of the foam made of this copolymer is
It is highly foamed with a weight of 50 to 200 Kg/ m3 , and is 0.1 to 0.1 of the thickness of the styrene resin foam that is the basic layer.
It is 0.5 times thicker. The reason why the density and thickness of the foam made of the copolymer are limited in this way is that the mechanical properties and heat insulation properties of the base layer cannot be maintained. The method for manufacturing the laminated foam board according to the present invention is as follows:
Any method may be used, but one example is to produce a foam made of a styrene resin foam and a copolymer resin in advance by extrusion foaming, and then laminate the two using heat fusion or adhesive. It is easily obtained. The laminated foam board according to the present invention has particularly excellent heat resistance, solvent resistance, and moisture resistance, and is particularly suitable for use as a rooftop insulation material.The surface of the laminated foam board is waterproofed by asphalt heat treatment. be able to. Example 25 of styrene resin foam (manufactured by Sekisui Plastics Co., Ltd., registered trademark Eslen Foam SK) with a density of 35 kg/m 3
A foam made of each of the styrene copolymer resins shown in Table 1 was laminated on one side of the styrene copolymer resin having a thickness of mm.
【表】
表中、実施例１の共重合体樹脂は、積水化成品
(株)製：ダイラーク＃232、実施例２は旭化成(株)
製：AX−Ｔである。
得られた積層発泡体についてそれぞれ次のよう
な耐熱試験を行つた。
縦、横250mmに積層発泡板を切り取り、これを
試料とし、この試料表面上に溶融したアスフアル
トを柄杓でたらし、櫛べらで伸ばし、アスフアル
ト固化後、中央部を切断し、残留厚さを小さい方
から５点測定し、次の式にしたがつて、最大融け
率、厚さ残留率を計算した。
最大融け率＝（元厚さ）−（残留厚さ 最小値）／（
元厚さ）
×100
厚さ残留率＝（残留厚さ 最大値）／（元厚さ）×10
0
なお、使用した溶融アスフアルトの温度は、
190℃（高温）及び160℃（低温）であつた。
以上、各実施例で得られた積層発泡体について
得られた結果を第２表に示す。なお、比較のため
ブランクとして前記25mm厚さのスチレン系樹脂発
泡体単体の場合の試験結果も併記する。[Table] In the table, the copolymer resin of Example 1 is manufactured by Sekisui Plastics Co., Ltd.
Manufactured by Co., Ltd.: Dailarc #232, Example 2 is made by Asahi Kasei Co., Ltd.
Manufacturer: AX-T. The following heat resistance tests were conducted on each of the obtained laminated foams. Cut a laminated foam board to a length and width of 250 mm, use this as a sample, pour molten asphalt onto the sample surface with a ladle, spread it with a comb, and after the asphalt solidifies, cut the center part to reduce the residual thickness. Measurements were taken at 5 points from both sides, and the maximum melting rate and thickness residual rate were calculated according to the following formula. Maximum melting rate = (original thickness) - (minimum residual thickness) / (
Original thickness) × 100 Thickness residual rate = (Residual thickness maximum value) / (Original thickness) × 10
0 The temperature of the molten asphalt used is
The temperature was 190℃ (high temperature) and 160℃ (low temperature). Table 2 shows the results obtained for the laminated foams obtained in each example. For comparison, the test results for the 25 mm thick styrene resin foam alone are also shown as a blank.
【表】
なお、実施例は何れも融け代が0.5mm以下であ
り、最少目盛0.5mmのスケールで測定したので、
各実施例の融け代は測定が不可能であつた。
以上の試験より、本考案に係る積層発泡体はア
スフアルト熱工法において、アスフアルト防水工
事最終工程のアスフアルトはけ塗り後敷き込みに
際し、スチレン系樹脂発泡層が溶けることなく、
施行することができることを示している。
（効果）
以上述べたように、本考案に係る積層発泡体
は、スチレン系樹脂発泡体の少なくとも一方の面
に特定のスチレン系共重合体樹脂からなる発泡体
を積層することにより、従来のスチレン系発泡体
に比して、特に耐熱性、耐溶剤性が改良され、こ
れを屋上断熱材として使用してアスフアルト熱工
法を施行した場合、これによつて何らの溶融を生
ずることに従つて断熱材としての有効厚さを減少
させることなく又、防湿性能の優れた断熱材とし
て使用できる効果を奏する。[Table] In addition, in all of the examples, the melting margin was 0.5 mm or less, and the measurements were made using a scale with a minimum graduation of 0.5 mm, so
It was impossible to measure the melting amount for each example. From the above tests, the laminated foam according to the present invention can be used in the asphalt thermal construction method without the styrene resin foam layer melting when it is laid after asphalt brushing in the final step of asphalt waterproofing work.
It shows that it can be enforced. (Effects) As described above, the laminated foam according to the present invention can be produced by laminating a foam made of a specific styrene copolymer resin on at least one surface of a styrene resin foam, which is similar to the conventional styrene foam. The heat resistance and solvent resistance are particularly improved compared to foams, and when the asphalt thermal construction method is implemented using this as a rooftop insulation material, it will not cause any melting and will result in insulation. It also has the effect of being able to be used as a heat insulating material with excellent moisture-proofing performance without reducing the effective thickness of the material.
第１図は、本考案に係るスチレン系樹脂積層発
泡板の斜視図である。
１……スチレン系樹脂発泡体、２……スチレン
系共重合体樹脂発泡体。
FIG. 1 is a perspective view of a styrene resin laminated foam board according to the present invention. 1...Styrenic resin foam, 2...Styrenic copolymer resin foam.
Claims (1)
系樹脂発泡体の少なくとも一方の面に、アクリル
酸、メタクリル酸、無水マレイン酸の少なくとも
一成分を含むスチレン成分が75〜95重量％で且つ
ビカツト軟化点が115℃以上のスチレン系共重合
体樹脂からなり、前記スチレン系樹脂発泡体の厚
さの0.1〜0.5倍の厚さを有する密度50〜200Kg／
m3の発泡体を積層したことを特徴とするスチレン
系樹脂積層発泡板。 A styrene resin foam with a thickness of 10 to 100 mm and a density of 15 to 50 kg/m 3 has a styrene component containing at least one component of acrylic acid, methacrylic acid, and maleic anhydride in an amount of 75 to 95% by weight on at least one side. It is made of a styrene copolymer resin with a Vikatsu softening point of 115°C or higher, has a thickness of 0.1 to 0.5 times the thickness of the styrene resin foam, and has a density of 50 to 200 kg/
A styrene-based resin laminated foam board characterized by laminating m3 foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598888U JPH053307Y2 (en) | 1988-08-12 | 1988-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598888U JPH053307Y2 (en) | 1988-08-12 | 1988-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0227326U JPH0227326U (en) | 1990-02-22 |
| JPH053307Y2 true JPH053307Y2 (en) | 1993-01-27 |
Family
ID=31339097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10598888U Expired - Lifetime JPH053307Y2 (en) | 1988-08-12 | 1988-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH053307Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7257721B1 (en) * | 2022-10-14 | 2023-04-14 | 笠原工業株式会社 | Thermal insulation earthquake-resistant panel and insulation earthquake-resistant wall construction method |
-
1988
- 1988-08-12 JP JP10598888U patent/JPH053307Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0227326U (en) | 1990-02-22 |
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