JPH05335796A - Electronic component inserting machine - Google Patents

Abstract

(57) [Abstract] [Purpose] Even for electronic parts with lead wires with weak springback force after molding, the electronic parts do not fall out along the V groove of the insertion guide, and insertion reliability is improved. An object is to provide an electronic component insertion device that can be secured. [Structure] The lead wire 12 is bent along a molding lever 16 and the tip portion of the molded lead wire 12 is attached to the substrate 1.
No. 4, a pair of insertion guides 18 facing each other at regular intervals having V-grooves 17 for guiding the insertion holes 14a.
Are supported by the guide block 19 so as to be able to stroke at a predetermined angle θ with respect to the insertion direction E so that the distance between them decreases in the insertion direction E and approaches the board insertion position. Therefore, even with respect to the electronic component 11 having the lead wire 12 having a weak springback force after molding, the electronic component 1 is guided along the V groove 17 of the insertion guide 18.
Insertion reliability can be secured without the 1 dropping out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting device, and more particularly to an electronic component inserting device for inserting an electronic component into a predetermined position.

[0002]

2. Description of the Related Art A conventional electronic component inserting apparatus is shown in FIGS.
Was configured as shown in. That is, the lead wire 2 of the molded electronic component 1 having the V groove 3 at the lower end for regulating the position of the lead wire 2 of the electronic component 1 to be inserted in the direction perpendicular to the axial direction.
The pusher 6 for inserting the lead wire 2 into the predetermined insertion hole 5 of the board 4 and the openable / closable molding lever 7 for preventing the lead wire 2 from falling out of the V groove 3 when molding the lead wire 2.
And an insertion guide 9 having a V groove 8 for molding the lead wire 2 of the electronic component 1 and guiding it during insertion.

[0003]

In the above structure, after the lead wire 2 of the electronic component 1 is molded, the lead wire 2 is pressed against the V groove 8 of the insertion guide 9 by the spring back, and the electronic component 1 is As shown in FIG. 6, it does not fall off and stays in its place, and only when it is pushed in by the pusher 6, it moves in the insertion direction E shown by the arrow. However, the strength of the springback is 1
Depending on the lead wire diameter and wire material, there may be cases where sufficient force cannot be obtained. In such a case, before the lead wire 2 of the electronic component 1 is molded and stays in place and is pushed by the pusher 6, the electronic component 1 falls off along the V groove 8 of the insertion guide 9. When the balance between the left and right is unbalanced, it is inserted into the insertion hole 5 in a one-sided floating state as shown in FIG. 7, and the insertion reliability is reduced.

The present invention solves the above-mentioned conventional problems. Even for an electronic component having a lead wire with a weak springback force after molding, the electronic component is dropped along the V groove of the insertion guide. It is an object of the present invention to provide an electronic component insertion device that can ensure insertion reliability without being damaged.

[0005]

In order to achieve the above-mentioned object, an electronic component inserting apparatus of the present invention forms the lead wire of an electronic component having lead wires at both ends in the axial direction into a predetermined shape, and When inserting the lead wire into the insertion hole of the substrate,
The pair of insertion guides are provided so as to face each other at a constant interval for guiding the lead wire in the insertion direction, and the insertion guide is lowered in the insertion direction to approach the insertion position of the substrate. The guide block is supported so that it can be stroked at a predetermined angle with respect to the insertion direction so as to be narrow.

[0006]

With the above construction, since the pair of insertion guides provided so as to face each other move in the insertion direction and become closer to the insertion position of the substrate, the distance between the insertion guides becomes smaller. Even for an electronic component having a lead wire, the electronic component will not fall off along the V groove of the insertion guide, and the insertion reliability can be ensured.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component inserting apparatus according to an embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1 and FIG. 2, the electronic component inserting apparatus has an inserting unit 10, and its configuration will be described first.

The insertion unit 10 is a lead wire 1 of an electronic component 11 having lead wires 12 at both ends in the axial direction of insertion.
2 in the direction perpendicular to the axial direction of the lead wire 12
Has a V-shaped groove 13 for receiving the lead wires 12 for regulating the lead wire 12 to form a constant insertion pitch, and pushes the lead wire 12 of the electronic component 11 into the insertion hole 14a of the substrate 14 at the time of insertion. Is provided corresponding to the pusher 15, prevents the lead wire 12 from falling off from the V groove 13 of the pusher 15 at the time of molding the lead wire 12 of the electronic component 11, and can be molded into a predetermined shape.
A pair of molding levers 1 that can swing with respect to the pusher 15
6 and the lead wire 12 are bent along a molding lever 16 and the tip end of the molded lead wire 12 is placed on the substrate 14
Is provided with a pair of insertion guides 18 each having a V-shaped groove 17 that guides into a predetermined insertion hole 14a, and the pair of pushers 15 and the insertion guides 18 having a constant interval descend in the insertion direction E indicated by the arrow. Then, the insertion direction E is adjusted so that the space becomes narrower as it approaches the insertion position of the board.
In contrast, the guide block 19 is supported so that it can be stroked at a predetermined angle θ, and the molding lever 16 is also swingably supported by the guide block 19. Further, the insertion guide 18 is inserted through a horizontal shaft 21 supported by a block 20, the pusher 15 is inserted through a horizontal shaft 23 supported by a block 22, and the insertion guide 18 and the pusher 15 are respectively inserted in the block 2
It is moved up and down in conjunction with the elevation of 0 and 22. Molding lever 1
6 is a horizontal shaft 25 supported by a block 24
And is rocked in conjunction with the elevation of the block 24.

Next, the operation of the above configuration will be described. First, the origin state of the operation will be described. As shown in FIG. 1, the insertion guide 18 and the pusher 15 are in respective raised positions, and the molding lever 16 is in a closed state facing the pusher 15. First, as the block 22 descends, the V groove 13 of the pusher 15 descends to a position where it abuts the molding lever 16, and at the same time, the lead wire 12 of the electronic component 11 is held. Next, as the block 20 descends, the insertion guide 18 descends to a position where it abuts on the substrate 14, and at the same time, the lead wire 12 is bent and formed along the forming lever 16 by the V groove 17. Next, as the block 24 is raised, the molding lever 16 is swung in a direction away from the pusher 15 and to a position where it does not hinder the lowering of the pusher 15. Since the gap between the pair of insertion guides 18 facing each other is lowered in the insertion direction E and becomes closer to the insertion position of the substrate 14, the gap is reduced. Weak lead 1
V of the insertion guide 18 also for the electronic component 11 having 2
The electronic component 11 does not drop off along the groove 17 (see FIG. 2). Finally, the pusher 15 is lowered by lowering the block 22, the lead wire 12 is inserted into a predetermined insertion hole 14a of the substrate 14, and the inserting operation of the electronic component 11 is completed. After that, the blocks 20 and 22 rise, the block 24 descends, and the insertion guide 18, pusher 15, and molding lever 16 return to the original state.

As described above, even with respect to an electronic component having a lead wire with a weak springback force, the electronic component does not fall off along the V groove of the insertion guide, so that the insertion reliability can be secured.

[0012]

As is apparent from the above description of the embodiments, according to the electronic component insertion apparatus of the present invention, a pair of guides are provided when the electronic component is molded into a predetermined shape and inserted into a predetermined position. The insertion guides provided facing each other move downward in the insertion direction and stroke at a predetermined angle with respect to the insertion direction so that the spacing becomes narrower as they approach the board insertion position. Even for an electronic component having a weak lead wire, it is possible to provide an electronic component insertion device capable of ensuring insertion reliability without the electronic component dropping off along the V groove of the insertion guide.

[Brief description of drawings]

FIG. 1 is a front cross-sectional view showing the configuration of an electronic component insertion device according to an embodiment of the present invention.

FIG. 2 is a front sectional view of an essential part showing a state in which a lead wire of an electronic component molded into a predetermined shape is inserted into an insertion hole of a board.

FIG. 3 is a view on arrow AA in FIG.

FIG. 4 is a front sectional view showing the configuration of a conventional electronic component insertion device.

FIG. 5 is a view taken along the line BB in FIG.

FIG. 6 is a front sectional view of an essential part showing a state in which a lead wire of an electronic component molded into a predetermined shape of a conventional electronic component insertion device is inserted into an insertion hole of a substrate.

FIG. 7 is a front sectional view of an essential part showing an example in which the electronic component has fallen off.

[Explanation of symbols]

 11 electronic component 12 lead wire 14 substrate 14a insertion hole 18 insertion guide 19 guide block

Claims (1)

[Claims] 1. A lead wire of an electronic component having lead wires at both ends in an axial direction is formed into a predetermined shape, and the lead wire is inserted when the lead wire is inserted into an insertion hole of a substrate. A pair of insertion guides provided facing each other at a constant interval for guiding in a direction, and the insertion guide is lowered in the insertion direction so that the interval becomes narrower as it approaches the insertion position of the substrate, An electronic component insertion device comprising a structure supported by a guide block so that it can be stroked at a predetermined angle with respect to the insertion direction.