JPH0533599U - Electronic component mounting device - Google Patents

Abstract

(57) [Summary] [Purpose] When changing the mounting height of the electronic component body to the board, use one strip plate of the same component,
Be able to handle changes in the mounting height. [Structure] An electronic component body 7 having holes 5, 5 formed in an elastic and insulating strip-shaped plate 1 and legs 8, 8 penetrating the holes 6, 6 formed in a substrate 3. Is placed on the inverted U-shaped apex portion 9 formed by bending the strip-shaped plate 1, and H-shaped locking portions 2, 2 are provided at the ends of both ends of the strip-shaped plate 1. A comb-shaped hole 4 into which the stoppers 2, 2 are fitted is provided in the substrate 3 and
The V-shaped locking portion 2 is formed of a small width portion a and a large portion b, and the comb-shaped hole 4 is formed in a state where the small width hole c and the large portion d are connected.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component mounting apparatus for vertically mounting and fixing electronic components such as light emitting diodes and transistors on a substrate such as a printed wiring board.

[0002]

[Prior Art]

 As a conventional general electronic component mounting device, there is known one shown in a mounting perspective view of FIG. 4 and a front view of FIG. That is, the mounting height H of the electronic component body a with respect to the board f is determined in advance, and the electronic component body a is placed in the recess d of the flat plate c interposed between the legs b and b. The both legs b, b are inserted into the holes h, h provided in the board f, and the hook-shaped pieces e, e provided at both ends of the lower side of the flat plate c are fitted in the holes g, g provided in the board f. By inserting and locking the electronic parts, the electronic parts are fixed upright on the board f. Alternatively, it is known that an electronic component is mounted and supported on a molded product tubular body whose mounting height is determined in advance.

[0003]

[Problems to be solved by the device]

 In the former electronic component mounting apparatus described above, the mounting height H of the electronic component main body a with respect to the board f is predetermined in the former case, so the mounting height H of the electronic component main body a should be changed. In that case, a new die allowance, etc. must be prepared in order to manufacture another flat plate c corresponding to the mounting height H, and in the latter case, the mounting of the electronic component body on the substrate Each time the height is changed, there is a problem that a molded product tubular body having a length corresponding to the height must be prepared. In view of such problems, the present invention changes the mounting height of the electronic component main body to the board by changing the mounting height by using only one strip-shaped plate which is the same component. It is an object of the present invention to provide an electronic component mounting device capable of coping with the above.

[0004]

Means for Solving the Problems In order to achieve the above object, in an electronic component mounting apparatus of the present invention, a hole is formed in a strip plate having elasticity and an insulating property, and a hole is formed in a substrate. The electronic component body having legs penetrating through the hole is placed on the inverted U-shaped top side formed by bending the strip plate, and the distance between both ends of the strip plate is set. In order to make it narrower and narrower, both ends of the strip-shaped plate are locked to the board. H-shaped locking parts are provided at the tips of both ends of the strip-shaped plate and the locking is performed. The comb-shaped hole into which the locking portion is inserted is provided in the substrate at a position facing the portion.

[0005]

[Action]

 Next, the operation of the present invention will be described. The H-shaped locking portions at both ends of the insulating strip-shaped plate bent elastically into a reverse U-shape are locked in the comb-shaped holes provided in the substrate. The reverse U-shape of the strip-shaped plate is used. Place the electronic component body on the top of the strip, and penetrate both legs of the electronic component body into the holes drilled in the strip and the holes drilled in the board. An electric circuit is formed by soldering and fixing it to the circuit part.

If the distance between both ends of the strip plate is narrowed, the U-shaped bending of the strip plate becomes large, and the height of the top side from the substrate surface can be increased. If the distance between both ends of the strip plate is increased, the bending of the strip plate in the inverted U shape becomes smaller and the height of the top side from the substrate surface can be reduced. It is possible to change the mounting height from the board surface of the electronic component body mounted on the top side of the shape to a high or low position.

[0007]

【Example】

 Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is an external perspective view showing an electronic component mounting device according to the present invention, and FIG. 2 is a front view showing a state in which only the board portion of the same is shown in section, with the distance between both ends of the strip plate expanded. 3 is a front view showing a state in which only the base plate portion of the above is cross-sectioned, and the distance between both ends of the strip plate is narrowed. In FIGS. 1, 2 and 3, holes 5 and 5 formed in an insulating strip 1 having elasticity and holes 6 and 8 formed in the substrate 3 are provided with legs 8 and 8 penetrating the holes. An electronic component body 7 such as a light emitting diode or a transistor is placed on an inverted U-shaped top portion 9 formed by bending the strip plate 1. Then, both ends of the strip plate 1 are locked to the substrate 3 so that the distance L between both ends of the strip plate 1 can be freely narrowed. H-shaped locking portions 2 and 2 are provided at both ends of the strip-shaped plate 1 and comb-shaped holes into which the locking portions 2 and 2 are fitted at positions facing the locking portions 2 and 2. 4 is provided on the substrate 3. Thus, the H-shaped engaging portions 2 at the ends of the strip-shaped plate 1 are formed by the narrow width portion a and the wide portion b, and the comb-shaped hole 4 is formed by the narrow width hole c and the wide portion. And are connected to each other.

Then, the H-shaped locking portions 2 at both ends of the insulating strip 1 bent in an inverted U shape by elasticity are locked in the comb-shaped holes 4 provided in the substrate 3. , The electronic component body 7 is placed on the inverted U-shaped top portion 9 of the strip-shaped plate 1, and both legs 8, 8 of the electronic component body 7 are bored in the strip-shaped plate 1. 5 and the holes 6, 6 formed in the board 3 are penetrated, and then both legs 8, 8 thereof are soldered and fixed to the circuit portion of the board 4 to connect the electronic component body 7 to an electric circuit. Here, as shown in FIG. 3, when the distance L ′ between both ends of the strip plate 1 is narrowed, the bending of the strip plate 1 in an inverted U-shape becomes large, and the top side 9 of the substrate 3 surface Can be increased to a height H '. Further, as shown in FIG. 2, when the strip plate 1 is expanded to the distance L between both ends, the inverted U-shaped flexure of the strip plate 1 becomes small and the top side portion 9 of the substrate 3 surface The height H can be reduced. Therefore, the mounting height of the electronic component body 7 mounted on the inverted U-shaped top portion 9 from the surface of the substrate 3 can be changed to the low position H or the high position H ′. In other words, when L> L ', H <H'.

[0009]

[Effect of the device]

 Since the present invention is configured as described above, it has the following effects. In other words, the mounting height of the electronic component body on the board can be easily changed to either high or low by using one strip-shaped plate that is the same component, and the assembly operation is simple. It also has the advantage that it can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is an external perspective view showing an electronic component mounting apparatus according to the present invention.

FIG. 2 is a front view showing a state in which only a substrate portion of the same is shown in a cross section, and a state in which a distance between both ends of a strip plate is expanded.

FIG. 3 is a front view showing a state in which only the substrate portion of the same is shown in a cross section, and a state in which a distance between both ends of the strip plate is narrowed.

FIG. 4 is an external perspective view of a conventional electronic component mounting device.

FIG. 5 is a front view showing a state in which only the substrate portion of the same is shown in section.

[Explanation of symbols]

 1 strip plate 2 H-shaped locking part 3 substrate 4 comb-shaped hole 5, 6 hole 7 electronic component body 8 leg of electronic component body 9 bent top side of strip plate

Claims (2)

[Scope of utility model registration request] 1. An electronic component body having a hole formed in an elastic and insulating strip-shaped plate and a leg penetrating the hole formed in a substrate, wherein the strip-shaped plate is bent. The strip-shaped plate is placed on the inverted U-shaped apex of the strip-shaped plate, and both ends of the strip-shaped plate are locked to the substrate so that the distance between both ends of the strip-shaped plate can be freely narrowed. Electronic component mounting device. 2. An H-shaped locking portion is provided at the ends of both ends of the strip plate, and a comb-shaped hole into which the locking portion is inserted is provided at a position facing the locking portion. The electronic component mounting device according to claim 1.