JPH05347370A - Heat dissipation member - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a new heat dissipation member with good heat dissipation characteristics. [Structure] Heat dissipation member (1) In Al or Al alloy (2) In iron or iron alloy (3) In W or Mo (4) In ceramic (5) Including diamond particles in synthetic resin (6) ) Copper or copper alloy member surface
(7) Al or Al alloy member surface (8) Iron or iron alloy member surface (9) W
Alternatively, the surface of the Mo member (10) is coated with a diamond film or a diamond-like carbon film on the surface of the ceramic member. [Effect] It is possible to provide a heat transfer member which has a high thermal conductivity, a good heat dissipation characteristic and a good heat exchange efficiency, and which can be downsized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a new heat dissipation member.

[0002]

2. Description of the Related Art Conventionally, the only heat radiation member mixed with diamond particles is a member mixed with diamond particles in copper, which has been used as a pedestal for sticking a power transistor or as an X-ray radiation target. Aluminum or aluminum alloys, or ceramics such as aluminum nitride, alumina, or silicon nitride are usually used for automobiles and radiators of automobiles, and aluminum or aluminum alloys, iron or iron alloys for automobile engines, or It has been customary to use ceramics such as aluminum nitride, alumina or silicon nitride.

[0003]

However, according to the above-mentioned prior art, there are problems that the thermal conductivity is low, the heat dissipation property is poor, and the device cannot be downsized.

An object of the present invention is to solve the problems of the prior art and to provide a new heat dissipation member having good heat dissipation characteristics.

[0005]

In order to solve the above problems and achieve the above objects, the present invention relates to a heat dissipation member,
(1) Mixing diamond particles in aluminum or aluminum alloy, and (2) Mixing diamond particles in iron or iron alloy, and (3) Mixing diamond particles in tungsten or molybdenum. And (4) mixing diamond particles in the ceramic, and (5) mixing diamond particles in the synthetic resin, and (6) diamond film or diamond-like on the surface of the copper or copper alloy member. Coating the carbon film,
And (7) coating the surface of the aluminum or aluminum alloy member with a diamond film or a diamond-like carbon film, and (8) coating the surface of the iron or iron alloy member with a diamond film or a diamond-like carbon film, and (9)
Coating the surface of the tungsten or molybdenum member with a diamond film or a diamond-like carbon film, and (1
0) Measures such as coating the surface of the ceramic member with a diamond film or a diamond-like carbon film are taken.

[0006]

The thermal conductivity of various heat radiating members is as follows.
That is, 237 W / mK for aluminum and 2 for aluminum alloy.
37 W / m · K or less, iron 80 W / m · K, iron alloy 8
10W for iron-nickel alloy system at 0W / mK or less
/ M ・ K or less, tungsten is 178 W / m ・ K,
138 W / mK for molybdenum, 398 W / mK for copper, 398 W / mK for copper alloy, 427 W / mK for silver, and 315 W / m for gold as other metal materials with relatively good thermal conductivity. m · K, and ceramic aluminum nitride is 5
00 W / mK or more, alumina or silicon nitride has good heat resistance, but thermal conductivity is 80 W / mK or less,
Synthetic resin is 10 W / m · K or less, whereas diamond is about 900 to 2000 W / m · K, and the effect of improving the thermal conductivity by mixing the diamond in the heat dissipation member or coating the surface. There is.

[0007]

EXAMPLES The present invention will be described in detail below with reference to examples.

When aluminum or aluminum alloy mixed with diamond particles is used for the heat radiation fins attached to electronic parts, the heat radiation efficiency can be improved and the size and weight of the device can be reduced. The same thing can be said for the radiation fins attached to the engine or the cooler. As a method of mixing diamond particles into aluminum or an aluminum alloy, there are a method of press-fitting, a method of mixing during powder sintering, and the like.

Next, if a mixture of diamond particles is used in a lead frame for a semiconductor device made of iron or an iron alloy, a cooling pipe of an engine, a cooling pipe of a power generator, etc., heat dissipation efficiency and heat conversion efficiency are improved. It is possible to reduce the size and weight of the device. As a method of mixing diamond particles into iron or an iron alloy, there are a method of press-fitting, a method of mixing during powder sintering, and the like.

Next, the heat radiation efficiency can be improved by mixing diamond particles into tungsten or molybdenum used as a pedestal of the semiconductor device during powder sintering.

Next, a ceramic green sheet such as alumina or aluminum nitride used as a printed circuit board for electronic parts (alumina particles or aluminum nitride particles made into a clay shape with a synthetic resin and its solvent and processed into a sheet shape) By mixing and baking diamond particles at the time of formation, the thermal conductivity of the printed circuit board can be improved and the heat dissipation efficiency can be improved. In addition, a mixture of silicon nitride particles and diamond particles used as an engine structural material is made into a clay with synthetic resin and its solvent, and is molded and fired to mix the diamond into the silicon nitride ceramic, thereby heat dissipation of the engine. The efficiency can be improved.

Next, instead of glass particles which are a filler for a printed circuit board made of a synthetic resin such as epoxy, diamond particles or particles whose surfaces are coated with a glass film by a CVD method or the like are used. The thermal conductivity can be improved.

Further, a diamond film, a diamond-like carbon film (a black film partially having a diamond structure) or a diamond film is formed on the surface or the inner surface of a pipe made of a copper target of an X-ray generator or a cooler of copper or a copper alloy. By coating with a diamond-like carbon film, it is possible to improve the thermal conductivity, improve the thermal conductivity, and improve the cooling efficiency by the action of black body radiation. Diamond particles may be previously mixed in the copper target, the cooler, the heat exchanger of the power generator, the pipe made of copper or a copper alloy, or the like. A method for coating a diamond film or a diamond-like carbon film (black film partially having a diamond structure) is described in S. Matsumoto e.
t. al., "Vapor Deposition of DiamondParticles from
Methane ", Japan Journal of Applied Physics, Vol.
21, No. 4, pp. L183-L185 (1982)., S. Yugo et. A
l., "Generation of diamond nuclei by electric
field in plasma chemical vapor deposition ", Appl.
Phys. Lett. 58 (10), 1036 (1991)., Etc., by a CVD method using methane gas or propane gas as a raw material or a CVD method from an acetylene torch.

Further, by coating the surface of the aluminum or aluminum alloy member or the aluminum or aluminum alloy member mixed with diamond with the diamond film or the diamond-like carbon film or the diamond film and the diamond-like carbon film by the CVD method or the like. Cooling efficiency can be improved by the improvement of thermal conductivity, the improvement of thermal conductivity and the effect of black body radiation.

Further, by coating the surface of the iron or iron alloy member or the iron or iron alloy member mixed with diamond with the diamond film or the diamond-like carbon film or the diamond film and the diamond-like carbon film by the CVD method or the like. Cooling efficiency can be improved by the improvement of thermal conductivity, the improvement of thermal conductivity and the effect of black body radiation.

Further, the surface of the tungsten or molybdenum member or the tungsten or molybdenum member mixed with diamond is coated with a diamond film or a diamond-like carbon film, or the diamond film and the diamond-like carbon film are formed by a CVD method or the like. By coating, the thermal conductivity can be improved, and the thermal conductivity can be improved and the cooling efficiency can be improved by the action of black body radiation.

Further, by coating a diamond film or a diamond-like carbon film on the surface of a ceramic member made of alumina, aluminum nitride, silicon nitride, or the like mixed with alumina, aluminum nitride, silicon nitride, or diamond, the thermal conductivity is improved or Cooling efficiency can be improved by the improvement of conductivity and the effect of black body radiation.

In the present embodiment, an example of application to a heat exchange pipe of an electronic component / member, an engine, a radiator or a cooler, and a power generator is shown. Devices that need to improve heat dissipation and heat exchange efficiency
It is needless to say that the present invention can be applied to other devices and members that need to improve heat dissipation and heat exchange efficiency, as only a few examples.

[0019]

EFFECTS OF THE INVENTION The present invention has the effect of providing a heat transfer member which has a high thermal conductivity, good heat dissipation characteristics and heat exchange efficiency, and which can be downsized.

Claims (10)

[Claims] 1. A heat radiating member comprising diamond particles mixed in aluminum or aluminum alloy. 2. A heat radiating member, characterized in that diamond particles are mixed into iron or iron alloy. 3. A heat radiating member comprising tungsten or molybdenum mixed with diamond particles. 4. A heat dissipation member characterized in that diamond particles are mixed in the ceramic. 5. A heat-dissipating member comprising diamond particles mixed in a synthetic resin. 6. A heat dissipation member characterized in that the surface of a copper or copper alloy member is coated with a diamond film or a diamond-like carbon film. 7. A heat dissipation member characterized in that a surface of an aluminum or aluminum alloy member is coated with a diamond film or a diamond-like carbon film. 8. A heat dissipation member characterized in that the surface of the iron or iron alloy member is coated with a diamond film or a diamond-like carbon film. 9. A heat dissipation member characterized in that a surface of a tungsten or molybdenum member is coated with a diamond film or a diamond-like carbon film. 10. A heat dissipation member characterized in that the surface of the ceramic member is coated with a diamond film or a diamond-like carbon film.