JPH0537491Y2 - - Google Patents

Info

Publication number
JPH0537491Y2
JPH0537491Y2 JP1988167142U JP16714288U JPH0537491Y2 JP H0537491 Y2 JPH0537491 Y2 JP H0537491Y2 JP 1988167142 U JP1988167142 U JP 1988167142U JP 16714288 U JP16714288 U JP 16714288U JP H0537491 Y2 JPH0537491 Y2 JP H0537491Y2
Authority
JP
Japan
Prior art keywords
aluminum
sheet
material layer
brazing material
core plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988167142U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0286194U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988167142U priority Critical patent/JPH0537491Y2/ja
Publication of JPH0286194U publication Critical patent/JPH0286194U/ja
Application granted granted Critical
Publication of JPH0537491Y2 publication Critical patent/JPH0537491Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988167142U 1988-12-23 1988-12-23 Expired - Lifetime JPH0537491Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988167142U JPH0537491Y2 (fr) 1988-12-23 1988-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988167142U JPH0537491Y2 (fr) 1988-12-23 1988-12-23

Publications (2)

Publication Number Publication Date
JPH0286194U JPH0286194U (fr) 1990-07-09
JPH0537491Y2 true JPH0537491Y2 (fr) 1993-09-22

Family

ID=31455171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988167142U Expired - Lifetime JPH0537491Y2 (fr) 1988-12-23 1988-12-23

Country Status (1)

Country Link
JP (1) JPH0537491Y2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086747A (ja) * 2001-09-10 2003-03-20 Hitachi Ltd 絶縁回路基板とその製法およびそれを用いた半導体パワー素子
JP2012117110A (ja) * 2010-12-01 2012-06-21 Showa Denko Kk アルミニウムろう付品の製造方法

Also Published As

Publication number Publication date
JPH0286194U (fr) 1990-07-09

Similar Documents

Publication Publication Date Title
JP4756200B2 (ja) 金属セラミックス回路基板
JP3226213B2 (ja) 半田材料及びそれを用いた電子部品
US20150055302A1 (en) Power module substrate with heatsink, power module substrate with cooler and power module
EP0132849A2 (fr) Substrats à grilles de connexion métalliques revêtues
EP2978019A1 (fr) Procédé de fabrication de corps collé et procédé de fabrication de substrat de module de puissance
JP2004115337A (ja) アルミニウム−セラミックス接合体
JPS61154764A (ja) 構造部材の金属結合の方法及び結合材料
JPS6252464B2 (fr)
US3780795A (en) Multilayer heat sink
US5796049A (en) Electronics mounting plate with heat exchanger and method for manufacturing same
JP3505950B2 (ja) 放熱板接合用基板
US20070012477A1 (en) Electronic component package including joint material having higher heat conductivity
JPH09234826A (ja) 金属−セラミックス複合基板及びその製造法
JP4057436B2 (ja) 銅基合金およびその銅基合金を使用する放熱板用材料
JP2004500692A5 (fr)
JP2503778B2 (ja) 半導体装置用基板
JP2002307165A (ja) ろう付け方法
JP2019079960A (ja) 接合構造体およびその製造方法
JPS59169694A (ja) 半田接着方法
JP2503779B2 (ja) 半導体装置用基板
JP2503775B2 (ja) 半導体装置用基板
JP2001118970A (ja) セラミックス層と金属導体層の接合体
US20070221704A1 (en) Method of manufacturing circuit device
KR102872422B1 (ko) 전자파 차폐가 원활한 복합 하이브리드 고방열 히트싱크
JP5691580B2 (ja) パワーモジュール用基板の製造装置および製造方法