JPH0539679Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic component insertion device for inserting electronic components such as a resistor array into a board at high density.

(Prior Art and Problems) Conventional electronic component insertion devices of this type include those that clamp the main body of the electronic component and those that clamp the leads of the electronic component. In a device that holds the main body of an electronic component, the positions of the main body and the lead must be precisely defined, and there are restrictions on the types of electronic components that can be used. In addition, the position of the lead is determined by the device that holds the lead of the electronic component, but after inserting the electronic component into the printed circuit board, the electronic component insertion device releases the electronic component and returns to the raised position. Free space was required in the surrounding area, which caused problems in realizing high-density packaging.

(Means for Solving the Problems) In view of the above points, the present invention provides that the main guide and sub guide for holding the leads of electronic components such as resistor arrays are arranged in a direction oblique to a vertical line (vertical line). An object of the present invention is to provide an electronic component insertion device that can descend and rise to clamp and release leads, thereby enabling high-density mounting of electronic components on a printed circuit board.

The present invention consists of a main guide provided so as to be slidable linearly in an oblique direction with respect to the vertical line of the main body block, and a main guide provided on both sides of the main guide so as to be freely openable and closable, and pivoted to the main guide side. a plate cam pivotally attached to both sides of the main body block; means for rotating the plate cam around a pivot point of the plate cam; and a plate cam and a main guide side. A cam of the plate cam is provided so that the main guide slides diagonally downward linearly as the plate cam rotates, and the cam of the plate cam is moved so that the tip of the sub-guide closes with respect to the main guide. With a configuration in which the upper end of the sub-guide is moved by a plane to sandwich the lead of the electronic component between the main guide and the sub-guide,
The above problems have been resolved.

(Function) In the electronic component insertion device of the present invention, the main guide and sub guide for holding the leads of an electronic component such as a resistor array (with a lead spacing of 2.54 mm) descend in an oblique direction with respect to a vertical line. , which rises to pinch and release the lead.
In other words, the main guide and sub guide descend diagonally downward in a straight line to chuck the leads of the electronic component, and then the whole guide descends vertically to insert the leads into the printed circuit board, and then the push rods work to insert the leads into the printed circuit board. Push down the electronic component to fully insert the lead into the printed circuit board, then the main guide and sub guide release the lead and rise straight upward diagonally with respect to the vertical line, after which the whole unit rises vertically and returns. do. With this configuration, there is no need for the main guide to move horizontally when releasing the lead.
Almost no empty space is required for the main guide and sub-guide to return, and high-density mounting can be achieved. For example, you can insert a resistor array between ICs,
Also, resistor arrays can be inserted with high density.

(Example) Hereinafter, an example of the electronic component insertion device according to the present invention will be described with reference to the drawings.

4 and 5 are examples of the shape of a resistor array as an electronic component to be inserted in the present invention. In this case, the resistor array 1 has a plurality of leads 3 (for example, 5 to 9 leads) drawn out from the main body 2. In the case of a resistor array for high-density packaging, the lead spacing is 2.54 mm pitch.

Details of the electronic component insertion device are shown in FIGS. 1 to 3. In these figures, a main body block 11 is fixed to the lower end of a vertical shaft 10 that is vertically supported so as to be vertically movable, and a push rod 12 vertically passes through an upper block 13 and a lower block 14 of the main body block 11. There is. The upper block 13 is provided with a compression spring 17 that urges the push rod 12 upward via a retaining ring 15 fitted on the push rod 12 and a cylindrical member 16 abutting the retaining ring.

A small air cylinder 20 is disposed in the recess of the upper block 13, and the movable tip of the air cylinder 20 abuts against a rear bent portion 21A of a slider 21 supported so as to be slidable laterally (forward and backward) relative to the main block 11. In order to restrict the range of lateral movement of the slider 21, stopper bolts 22, 23 are screwed into the rear bent portion 21A and the front bent portion 21B, respectively, and fixed with nuts, and a compression spring 24 is disposed around the stopper bolt 23 to bias the slider 21 to the left in Fig. 1. The amount of lateral movement of the slider 21 can be adjusted by adjusting the amount that the stopper bolts 22, 23 protrude.

On both sides of the main body block 11, a second
As shown in the drawings and FIG. 3, a plate cam 30 is pivotally mounted by a mounting shaft 31, and a pin 32 fixed to the plate cam 30 engages with a vertical groove 26 formed in the slider 21. ing. Therefore, plate cam 3
0 performs a rotational movement about the center C of the mounting shaft 31 by moving the slider 21 in the lateral direction.

On the other hand, the main guide 40 is fixed to the main guide attachment member 41 with screws 75 as shown in FIG. It is movably guided by a main body block 11. The angle θ is set to about 30 degrees, for example. A connecting member 42 is attached to the attachment member 41, and a stopper member 43 is further fixed thereto. Connecting member 4
2 has a shaft portion 44 that passes through the mounting member 41, and a retaining ring 45 at the end of the shaft portion 44 prevents it from coming off from the mounting member 41. The shaft portion 4
A compression spring 46 is disposed around the connecting member 4 and biases the connecting member 42 in a diagonally upward direction.
The pin 47 integrated into the connecting member 42 is engaged with the elongated hole 48 of each plate cam 30 on both sides of the main body block, and an extension spring is inserted between the pin 47 on the connecting member side and the pin 49 on the plate cam 30 side. 50 are provided.
Each extension spring 50 is provided to prevent the mounting member 41 from rattling against the main body block 11. The connecting member 42 and the pin 47 function as members for interlocking the plate cam 30 and the main guide 40.

Note that the lowered position of the main guide 40 is such that the tip of the stopper bolt 76 screwed onto the stopper member 43 and fixed with a nut is located at the main body block 11.
Stopper surface 77 where side bolt 51 is attached
(See Figure 3). After the main guide 40 reaches the lowered position and stops, the compression spring 46 contracts and the plate cam 3
0 is allowed to rotate further.

As shown in FIG. 3, wide attachment portions are integrally formed on both sides of the upper end portion of the main guide 40, and the sub guides 55 are attached to pins 56 at these portions.
They are each pivoted at. The tips of these pair of sub-guides 55 are located on both sides of the tip of the main guide 40, and can be opened and closed about pins 56. Adjustment bolt 5 is attached to the upper end of each sub guide 55.
7 are screwed together and fixed with nuts, each bolt 5
The tip of 7 is the cam surface (slope) 30 of the plate cam 30
It comes into contact with A. By adjusting the protrusion amount of each bolt 57, the opening amount of each sub-guide tip can be adjusted. Note that a compression spring 5 is provided between both sub-guides 55 to bias the tip of the sub-guide in the direction of opening.
8 is disposed to pass through the hole 59 of the main guide 40.

6 and 7 show the shapes of the tips of the main guide 40 and the sub guide 55. As shown in these figures, the lower end of the main guide 40 has a groove 60 corresponding to the lead 3 of the resistor array 1;
The lower end of the sub guide 55 is the groove 6 at both ends of the main guide.
It has a claw 61 that holds down the lead 3 that is fitted into the lead 3.

In the configuration of the above embodiment, the main guide 40 is placed above the printed circuit board 70 as shown by the solid line in FIG.
When the air cylinder 20 is operated while the sub-guide 55 is positioned, the slider 21 moves to the right in FIG. 1, and as shown in FIG. The cam 30 rotates clockwise around the fulcrum C. As a result, the connecting member 42 engaged with the plate cam 30 via the pin 47 and the main guide attachment member 41 interlocked with this are guided by the support body 11 and the first
It moves diagonally downward in a straight line as shown by arrow D in the figure.
That is, the main guide 40 linearly moves obliquely downward as shown by arrow D until the stopper bolt 76 fixed to the stopper member 43 abuts against the stopper surface 77 in FIG.
As shown in FIGS. 1 and 6, the main guide 40 reaches a lowered position in which the tip end engages with the lead 3 of the resistor array 1 which was held by another means. At this time, the sub guide 55 is still open.

Even after the main guide 40 reaches the lowered position,
By compressing the compression spring 46, the plate cam 30 can further rotate, and the stopper bolt 2
Since there is a gap between the stopper bolt 23 and the recess of the upper block 13, the slider 21 moves until the stopper bolt 23 comes into contact with the upper block 13, and the plate cam 30
is further rotated to the right in Figure 2. As a result, the adjustment bolt 57 of the sub-guide 55 is actuated by the cam surface 30A, and the tip of the sub-guide 55 closes as shown in FIG. 7 to sandwich the lead 3 of the resistor array 1 between it and the main guide 40.

After the leads 3 of the resistor array 1 are held between the main guide 40 and the sub guide 55, the vertical axis 1
The entire mechanism is lowered to a position close to the printed circuit board 70 by the action of the air cylinder that raises and lowers the lead 3, and the main guide 40 and sub guide 55 are in the position shown in FIG. 8, and the lead 3 is inserted into the insertion hole of the printed circuit board 70. . At this time, IC7 is placed on the printed circuit board 70.
Even if the first class members are placed close to each other, the insertion operation can be performed as shown in FIG. Thereafter, the push rod 12 descends to push down the main body 2 of the resistor array 1, and the leads 3 are deeply inserted into the holes on the printed circuit board.

After the resistance array 1 is inserted, the air cylinder 20 stops operating, the slider 21 returns to the left in FIG. 1 due to the force of the compression spring 24, the plate cam 30 also rotates to the left, and the sub-guide 55 opens and leads 3 is released, and then the main guide 40 returns diagonally upward to the position P2 indicated by the dashed dotted line in FIGS. 1 and 8.
The push rod 12 also returns to the raised position, and the vertical shaft 12 further rises, returning the entire mechanism to the raised position to wait for the insertion of the next component.

(Effects of the Invention) As explained above, the electronic component insertion device of the present invention includes a main guide that is movable obliquely with respect to the vertical axis of the support, and a sub-guide that is pivoted on the main guide side. The lead of the electronic component is sandwiched between the main guide and the sub guide when the main guide moves diagonally downward, and when the lead of the electronic component is released after the electronic component is inserted into the board, the lead of the electronic component is held in the horizontal direction. There is no need for the main guide, etc. to move, and almost no empty space is required for the main guide and sub-guide to return, making it possible to realize high-density packaging. For example, there is an advantage that a resistor array can be inserted between ICs, or that resistor arrays can be inserted with high density.

[Brief explanation of drawings]

Fig. 1 is a side sectional view showing an embodiment of the electronic component insertion device according to the present invention, Fig. 2 is a side view thereof, Fig. 3 is a rear view thereof, Fig. 4 is a front view of the resistor array, and Fig. 5 6 is a side view of the same side, FIG. 6 is an enlarged view of the configuration of the lower end of the main guide and sub guide, with the sub guide open, and FIG. 7 is a configuration of the lower end of the main guide and sub guide. FIG. 8 is an enlarged view of the sub-guide in a closed state, and a side view of the structure of the lower end portions of the main guide and the sub-guide. DESCRIPTION OF SYMBOLS 1...Resistance array, 3...Lead, 10...Vertical axis, 11...Support, 12...Push rod, 20...
...Air cylinder, 30...Plate cam, 31...Mounting shaft, 40...Main guide, 32, 47,
49, 56...Pin, 55...Sub guide.

Claims (1)

[Claims for Utility Model Registration] A main guide 40 provided so as to be slidable linearly in an oblique direction with respect to the vertical line of the main body block 11, and a main guide 40 provided on both sides of the main guide so as to be openable and closable. a sub-guide 55 pivotally attached to the main guide side; a plate cam 30 pivotally attached to both sides of the main body block; means for rotating the plate cam about the pivot point of the plate cam; A member that interlocks the plate cam and the main guide side is provided, and as the plate cam rotates, the main guide slides diagonally downward in a straight line, and the tip of the sub-guide is caused to move relative to the main guide. An electronic component insertion device characterized in that an upper end of the sub-guide is moved by a cam surface 30A of the plate cam 30 so as to close the lead of the electronic component between the main guide and the sub-guide.