JPH0543341A - Method for joining oxide superconducting bulk to metal - Google Patents
Method for joining oxide superconducting bulk to metalInfo
- Publication number
- JPH0543341A JPH0543341A JP3040814A JP4081491A JPH0543341A JP H0543341 A JPH0543341 A JP H0543341A JP 3040814 A JP3040814 A JP 3040814A JP 4081491 A JP4081491 A JP 4081491A JP H0543341 A JPH0543341 A JP H0543341A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- oxide
- superconducting bulk
- bulk
- based superconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 47
- 239000002184 metal Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 238000009694 cold isostatic pressing Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000002887 superconductor Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Ceramic Products (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は酸化物系超電導バルクと
金属を低接触抵抗で接合する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining an oxide-based superconducting bulk and a metal with low contact resistance.
【０００２】[0002]
【従来の技術】従来、酸化物系超電導バルクと金属の接
合には、酸化物系超電導体バルクに対して、電気抵抗が
小さく超電導特性を劣化させない金属であるＡｇ、Ａｕ
等の金属を蒸着して、酸化物系超電導バルクに金属電極
を形成する方法が行われている。また、Ａｇ、Ａｕ等の
金属を箔状に加工して熱処理により圧着する方法や、ス
プレー法による接合方法も行われている。2. Description of the Related Art Conventionally, for bonding an oxide-based superconducting bulk to a metal, metals such as Ag and Au which have a small electric resistance and do not deteriorate the superconducting characteristics of the oxide-based superconducting bulk.
There is a method of forming a metal electrode on an oxide-based superconducting bulk by vapor-depositing a metal such as. Further, a method of processing a metal such as Ag or Au into a foil shape and press-bonding it by heat treatment, or a joining method by a spray method is also used.
【０００３】[0003]
【発明が解決しようとする課題】上記の蒸着、スプレー
法により酸化物系超電導バルクに金属を接合する方法で
は接触抵抗が大きい難点がある。成形、焼結後の酸化物
系超電導バルク表面は付着物が付いていたり、非超電導
相の薄い膜が形成されていることがある。これにＡｇ、
Ａｕ等の金属を蒸着したり、箔状に加工して熱処理によ
り圧着する方法や、スプレー法による接合方法による場
合、酸化物系超電導体バルクと金属との界面に付着物や
非超電導相が存在し、高抵抗の接合となりやすい。However, the above method of joining a metal to an oxide-based superconducting bulk by vapor deposition or spraying has a problem that the contact resistance is large. The oxide-based superconducting bulk surface after molding and sintering may have an attached substance or a thin film of a non-superconducting phase. Ag,
When a metal such as Au is vapor-deposited, or it is processed into a foil and pressure-bonded by heat treatment, or when it is joined by a spraying method, there is a deposit or a non-superconducting phase at the interface between the oxide superconductor bulk and the metal. However, it tends to be a high resistance joint.
【０００４】[0004]
【課題を解決するための手段】酸化物系超電導バルクと
金属の接触抵抗を抑えるには、成形、焼結後のバルク表
面のゴミ、非超電導相を取り除き、バルク表面の改質を
行うことが有効である。そこで本発明では、焼結後のバ
ルク表面をアルゴンスパッタまたは希塩酸、希硝酸によ
るエッチングで処理し、清浄面とする。清浄面に対し、
低抵抗の金属または合金を蒸着するか、あるいは、これ
らの粉末を有機溶剤に分散したペーストを塗布するなど
して超電導バルクに金属の厚膜を形成する。金属厚膜の
形成されたバルクに低抵抗の金属または合金の薄肉テー
プを巻き付け、冷間静水圧プレス、熱処理を施して密着
させる。このような方法で酸化物系超電導バルク−金属
の良好な接合を得る。[Means for Solving the Problems] In order to suppress the contact resistance between an oxide-based superconducting bulk and a metal, it is necessary to remove dust and a non-superconducting phase on the bulk surface after molding and sintering to modify the bulk surface. It is valid. Therefore, in the present invention, the bulk surface after sintering is treated by argon sputtering or etching with diluted hydrochloric acid or diluted nitric acid to form a clean surface. For clean surfaces,
A low-resistance metal or alloy is vapor-deposited, or a paste in which these powders are dispersed in an organic solvent is applied to form a thick metal film on the superconducting bulk. A low-resistance metal or alloy thin-walled tape is wrapped around the bulk with the thick metal film formed, and cold isostatic pressing and heat treatment are performed to bring them into close contact. By such a method, a good oxide-based superconducting bulk-metal bond is obtained.
【０００５】[0005]
【作用】本発明の作用を以下に説明する。図１は成形、
焼結後の酸化物系超電導バルクの表面を説明図である。
超電導相１の上にゴミ等の付着物２があったり、非超電
導相３の膜が形成されているため、この状態で金属と接
合すると高抵抗の相が形成される。接触抵抗を抑えるた
めの前処理として、酸化物系超電導バルクの接合面の改
質を行い、非清浄面を除去する必要がある。表面の改質
方法としてはアルゴンスパッタ、または希塩酸、希硝酸
によるエッチングがある。いずれかの方法で清浄面を現
すとバルク表面は図２のようになる。The operation of the present invention will be described below. Figure 1 shows molding
It is an explanatory view of the surface of an oxide system superconducting bulk after sintering.
Since deposits 2 such as dust are present on the superconducting phase 1 or a film of the non-superconducting phase 3 is formed, a high resistance phase is formed when bonded to a metal in this state. As a pretreatment for suppressing the contact resistance, it is necessary to modify the bonding surface of the oxide-based superconducting bulk and remove the non-clean surface. As a method for modifying the surface, there is argon sputtering, or etching with diluted hydrochloric acid or diluted nitric acid. When the clean surface is revealed by either method, the bulk surface becomes as shown in FIG.
【０００６】図２の清浄面に金属厚膜５を形成させる。
用いる金属は抵抗の小さいもので、Ａｕ、Ａｇ、Ａｌ、
Ｃｕまたはこれらの合金が適当である。これらの金属を
酸化物系超電導体バルクの表面に蒸着させて厚膜を作
る。厚膜を作る方法としては金属粉末を有機溶剤に分散
させたペーストをバルク表面に塗布してもよい。このと
き分散させる金属粉末は１μｍ以下の微細なものが適当
である。有機溶剤としてはトリクロロエタン、トリクロ
ロエチレン、酢酸メチル等を用いることが出来る。バル
ク表面に金属厚膜を形成させると図３のようになる。A thick metal film 5 is formed on the clean surface of FIG.
The metal used has a low resistance, such as Au, Ag, Al,
Cu or alloys of these are suitable. A thick film is formed by depositing these metals on the surface of the oxide-based superconductor bulk. As a method for forming a thick film, a paste in which metal powder is dispersed in an organic solvent may be applied on the bulk surface. At this time, the fine metal powder to be dispersed is preferably 1 μm or less. As the organic solvent, trichloroethane, trichloroethylene, methyl acetate or the like can be used. When a thick metal film is formed on the bulk surface, it becomes as shown in FIG.
【０００７】上記の方法で図３に示す金属厚膜に覆われ
たバルクに、薄肉の金属テープ６を図４に示すように巻
き付ける。この場合も金属は抵抗の小さいもので、Ａ
ｕ、Ａｇ、Ａｌ、Ｃｕまたはこれらの合金が適当であ
る。テープは、肉厚が０．０１〜０．１ｍｍとし、充分
に焼きなましを行って加工のひずみを除いたものであ
る。銀テープの場合で３００℃で１〜３時間程度の処理
が必要である。また酸、アルコール等でテープ表面の付
着物を除去しておくことも必要である。The thin metal tape 6 is wound around the bulk covered with the thick metal film shown in FIG. 3 by the above method as shown in FIG. In this case as well, the metal has a low resistance.
u, Ag, Al, Cu or alloys thereof are suitable. The tape has a wall thickness of 0.01 to 0.1 mm and is sufficiently annealed to remove processing strain. In the case of silver tape, processing at 300 ° C. for about 1 to 3 hours is required. It is also necessary to remove the deposits on the tape surface with an acid, alcohol or the like.
【０００８】金属テープを巻き付けた超電導バルクに図
５に示すように冷間静水圧プレスを施し、バルクにテー
プ６を密着させる。プレス圧は２０００〜４０００ｋｇ
／ｃｍ2程度である。次に熱処理して超電導バルクと金
属の界面を反応させる。熱処理条件は５００〜９００℃
で１０〜１００時間である。熱処理後、図６に示すよう
に酸化物系超電導体−金属界面７が形成される。The superconducting bulk around which the metal tape is wound is subjected to cold isostatic pressing as shown in FIG. 5 to bring the tape 6 into close contact with the bulk. Press pressure is 2000-4000kg
It is about / cm 2 . Next, heat treatment is performed to react the interface between the superconducting bulk and the metal. Heat treatment conditions are 500-900 ° C
It takes 10 to 100 hours. After the heat treatment, an oxide-based superconductor-metal interface 7 is formed as shown in FIG.
【０００９】このような方法で、接触抵抗を抑えた、酸
化物系超電導バルクと金属の接合が可能となる。接合後
の超電導バルク−金属の界面には絶縁相、半導体相等は
形成されず、良好な接合状態を得ることが出来た。得ら
れた界面の接触抵抗は１０-8Ω・ｃｍ2以下と極めて低
いものであった。By such a method, it becomes possible to bond the oxide-based superconducting bulk and the metal while suppressing the contact resistance. An insulating phase, a semiconductor phase, etc. were not formed at the superconducting bulk-metal interface after joining, and a good joined state could be obtained. The contact resistance of the obtained interface was extremely low at 10 −8 Ω · cm 2 or less.
【００１０】[0010]
【発明の効果】以上のように、酸化物系超電導バルクの
非清浄面を取り除き、低抵抗の金属の厚膜形成後に金属
テープを巻き、熱処理する方法で金属と接合することに
より、１０-8Ω・ｃｍ2以下の接触抵抗を得ることが出
来る。この金属電極が設けられた超電導バルクを超電導
電流リードとして用いると、通電による発熱量を低減さ
せる効果がある。As is evident from the foregoing description, removed non-clean surface of the oxide superconductive bulk, after thick film of low-resistance metal winding a metal tape, by joining the metal in a way that a heat treatment, 10-8 A contact resistance of Ω · cm 2 or less can be obtained. If the superconducting bulk provided with this metal electrode is used as a superconducting current lead, it has an effect of reducing the amount of heat generated by energization.
【図１】非清浄面除去前の超電導バルク表面の模式図で
ある。FIG. 1 is a schematic view of a superconducting bulk surface before removing a non-clean surface.
【図２】非清浄面除去後の超電導バルク表面の模式図で
ある。FIG. 2 is a schematic view of a superconducting bulk surface after removing a non-clean surface.
【図３】金属厚膜形成後の超電導バルク表面の模式図で
ある。FIG. 3 is a schematic view of a superconducting bulk surface after forming a thick metal film.
【図４】超電導バルクの金属テープの巻き付け方を示す
図である。FIG. 4 is a view showing how to wind a superconducting bulk metal tape.
【図５】冷間静水圧プレスによる金属テープの密着方法
を示す説明図である。FIG. 5 is an explanatory diagram showing a method of adhering a metal tape by a cold isostatic press.
【図６】熱処理後の超電導バルク−金属界面の模式図で
ある。FIG. 6 is a schematic view of a superconducting bulk-metal interface after heat treatment.
１ 超電導相 ２ 付着物 ３ 非超電導相 ４ 超電導バルク ５ 金属厚膜 ６ 金属テープ ７ 超電導バルク−金属界面 1 superconducting phase 2 deposits 3 non-superconducting phase 4 superconducting bulk 5 metal thick film 6 metal tape 7 superconducting bulk-metal interface
Claims (1)
の表面の付着物およびに非超電導相部を除去する手段、
付着物およびに非超電導相部を除去した酸化物系超電導
バルクの表面に金属厚膜を形成する手段、充分焼きなま
した薄肉金属テープを金属厚膜上に巻き付けた後、冷間
静水圧プレスにより圧力を加えた後に熱処理することを
特徴とする酸化物系超電導バルクと金属の接合方法。1. A means for removing deposits and non-superconducting phase portions on the surface of an oxide-based superconducting bulk after molding and sintering.
Means for forming a thick metal film on the surface of the oxide-based superconducting bulk from which deposits and non-superconducting phase parts have been removed, sufficiently wound thin metal tape is wrapped around the thick metal film, and then pressed by a cold isostatic press. A method for joining an oxide-based superconducting bulk and a metal, which comprises heat-treating after adding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3040814A JPH0543341A (en) | 1991-02-14 | 1991-02-14 | Method for joining oxide superconducting bulk to metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3040814A JPH0543341A (en) | 1991-02-14 | 1991-02-14 | Method for joining oxide superconducting bulk to metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0543341A true JPH0543341A (en) | 1993-02-23 |
Family
ID=12591121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3040814A Pending JPH0543341A (en) | 1991-02-14 | 1991-02-14 | Method for joining oxide superconducting bulk to metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543341A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6143697A (en) * | 1998-08-17 | 2000-11-07 | Murata Manufacturing Co., Ltd. | Method for producing superconducting thick film |
| WO2005096440A1 (en) * | 2004-03-31 | 2005-10-13 | Council Of Scientific And Industrial Research | Process for the preparation of low contact resistance contact on a high transition temperature superconductors |
| JP2010205717A (en) * | 2009-09-14 | 2010-09-16 | Council Scient Ind Res | Method for manufacturing low contact resistance contacts on high transition temperature superconductors |
| CN117947386A (en) * | 2024-03-26 | 2024-04-30 | 成都晨发泰达航空科技股份有限公司 | High-density EB-PVD metal coating and preparation method thereof |
-
1991
- 1991-02-14 JP JP3040814A patent/JPH0543341A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6143697A (en) * | 1998-08-17 | 2000-11-07 | Murata Manufacturing Co., Ltd. | Method for producing superconducting thick film |
| WO2005096440A1 (en) * | 2004-03-31 | 2005-10-13 | Council Of Scientific And Industrial Research | Process for the preparation of low contact resistance contact on a high transition temperature superconductors |
| US7792560B2 (en) * | 2004-03-31 | 2010-09-07 | Council Of Scientific And Industrial Research | Process for the preparation of low contact resistant contact on a high transition temperature superconductors |
| US20110281734A1 (en) * | 2004-03-31 | 2011-11-17 | Council Of Scientific And Industrial Research | Process for the preparation of low contact resistant contact on a high transition temperature superconductors |
| US8306590B2 (en) | 2004-03-31 | 2012-11-06 | Council Of Scientific And Industrial Research | Process for the preparation of low contact resistant contact on a high transition temperature superconductors |
| JP2010205717A (en) * | 2009-09-14 | 2010-09-16 | Council Scient Ind Res | Method for manufacturing low contact resistance contacts on high transition temperature superconductors |
| CN117947386A (en) * | 2024-03-26 | 2024-04-30 | 成都晨发泰达航空科技股份有限公司 | High-density EB-PVD metal coating and preparation method thereof |
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