JPH0543483Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a heat radiating tool that can be attached to an electrical component that generates a lot of heat and promote the release of heat generated from the electrical component.

[Conventional technology]

Conventionally, electric components such as transistors that generate heat have been known to have a heat dissipation part with good thermal conductivity integrated in order to release the generated heat to the outside and cool it. There is.

Furthermore, some of these electrical components, such as power transistors, emit more heat than they emit (hereinafter referred to as "heat-emitting components"), and for this reason, the amount of heat generated every second is A heat dissipation device that can efficiently dissipate and release the heat of the day has been developed and is in use. That is, as shown in Figure 4, this heat dissipation device is usually made of a metal with high thermal conductivity (for example, aluminum, copper, iron, zinc, etc.) in order to increase the contact area with the outside air as much as possible and increase heat dissipation efficiency. A large number of folds 1 using
00 is formed. The heat dissipating tool 101 is designed to have a heat generating component 103 attached thereto using a metal fitting 102 or the like.

[Problem to be solved]

However, as explained above, such heat sinks are usually made of a material with good conductivity, such as aluminum or iron.
As shown in the figure, when the printed circuit board 104 on which the heat dissipation tool 101 and the heat generating component 103 are mounted is mounted on the chassis 109, the heat dissipation tool 101 side is electrically connected to the grounded chassis 109 side. It is necessary to make the potential equal to each other and thereby prevent the generation of noise and the like. On the other hand, the heat generating component 103 needs to be held at a predetermined potential due to its characteristics, and in the case described above, when installing the heat generating component 103 to the heat dissipation tool 101, use silicone rubber or mica. An insulating plate 105 made of a plate or the like is interposed between these and screwed together. However, the screws and the like used for screwing are usually made of conductive material, and therefore it is necessary to separately prepare a ring-shaped insulating material called a grommet.

In this way, when attaching a heat sink to a heat generating component, if the potentials of these two parts are different, it is necessary to interpose an insulating plate to prevent electrical contact between the two. For example, as shown in Figure 6. As shown, 3
Each different heat generating component 106 is connected to the heat sink 10.
7, each heat generating component 106
It is necessary to interpose an insulating plate 108 between the heat sink and the heat sink 107, which makes the installation work more troublesome.

Therefore, in view of the above-mentioned conventional drawbacks, the object of this invention is to provide a heat dissipation tool that allows easy attachment of heat-generating components and is easy to mount on a board.

[Problem to be solved]

That is, this invention is a heat dissipation device that is attached to an electrical component with high heat generation and releases the heat generated from the electrical component, and the heat dissipation device is made of a material with high thermal conductivity, non-conductivity, and elasticity. The heat dissipating device is formed with a large number of folds on its outer surface, and an electric component with high heat generation is inserted into the insertion hole that is opened on the side facing the substrate on which the heat dissipation device is attached, and The heat sink is configured to be mounted by being pushed into the mounting hole of the board.

[Effect]

The heat dissipation device of this invention is made of a material that is non-conductive and has good thermal conductivity, and the electrical components to be attached to this heat dissipation device are Even if the electric potential is set, the electric potential can be freely attached without worrying about the electric potential, and the occurrence of a short circuit with the heat sink can be effectively prevented.

In addition, the heat dissipation device of this invention is non-conductive, which prevents the generation of noise.Therefore, there is no need for electrical connections to the chassis side, which eliminates the troublesome connections between various parts as in the past. It does not require any electrical connection work.

〔Example〕

Hereinafter, embodiments of this invention will be described with reference to the accompanying drawings.

FIG. 1 shows a heat dissipating tool according to this invention, and the heat dissipating tool 6 of this embodiment has a large number of folds 6a formed on both sides in the longitudinal direction, and a bottom surface 6b.
A fitting hole 6c for fitting the heat generating component 7 is formed on the side, and has good thermal conductivity and non-conductivity, and moreover, the heat generating component 7 is inserted and held in a stable state. It is made of a material such as silicone rubber that has a high shrinkage ability. The opening size of the fitting hole 6c is formed to be slightly smaller than the external dimension of the heat generating component 7 in order to fit and hold the heat generating component 7 in a tight and stable state. The heat dissipating tool 6 is attached by pushing it with some force into the mounting hole 8a provided on the printed circuit board 8, and fitting it into the mounting hole 8a provided in the printed circuit board 8. The opening size of the heat sink 6 is formed to be slightly smaller than the outer size of the heat sink 6. Therefore, in this way, the heat sink 6 is connected to the printed circuit board 8.
By pushing the heat dissipating tool 6 into the insertion hole 6c, the entrance of the insertion hole 6c is also narrowed.
The heat-generating component 7 inserted inside is fixed even more securely.
Retained. In addition to the above-mentioned heat dissipation device of this invention, for example, in addition to screwing with screws, it is also possible to have a configuration in which a mounting hole is provided on the printed circuit board side and a mounting protrusion is integrally molded on the heat dissipation device side. It is.

〔effect〕

As explained above, the heat dissipation device according to the invention is made of a material that has high thermal conductivity, is non-conductive, and is stretchable. Regarding the electrical parts that are attached to the top of the heat sink along with the heat sink, there is no need for conventional insulating plates, screw insulation grommets, etc. Connection work is no longer necessary, in other words, installation work can be performed extremely easily.

That is, according to this invention, if the heat-generating component is inserted into the heat-radiating tool and the heat-generating component is pushed into the board while the heat-generating component is inserted and mounted, the restoring force will securely fix it to the board. This makes it extremely easy to attach the heat generating components to the heat sink and to mount the heat sink on the board.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the installation state of another heat radiating device and heat generating parts according to this invention, Fig. 2 is a plan view of the heat radiating device shown in Fig. 1 seen from the bottom side, and Fig. 3 is a conventional type. FIG. 4 is a perspective view showing how the heat radiating tool and the heat generating component are attached to the printed circuit board on the chassis, and FIG. 5 shows the heat generating components having different potentials. FIG. 3 is a perspective view showing a state in which the heat sink and the heat sink are attached to the printed circuit board on the chassis. 7... Electrical parts (heat generating parts), 6... Heat dissipation tool.

Claims (1)

[Scope of Claim for Utility Model Registration] A heat dissipation tool 6 that radiates heat generated from the electrical component 7 to which an electrical component 7 with high heat generation is attached, which heat dissipation tool 6 has high thermal conductivity and is non-conductive. A material having elasticity and elasticity is used, and is formed to have a large number of folds 6a on the outer surface, and a surface 6b facing the substrate 8 on which the heat sink 6 is attached.
The heat dissipating tool 6 is mounted by inserting the electrical component 7 that generates a lot of heat into the insertion hole 6c that is open on the side, and pushing it into the mounting hole 8a that is slightly smaller than the heat dissipating tool 6 of the board 8. A heat dissipation device characterized in that it is configured to do so.