JPH0546278Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor conversion device installed in a railway vehicle, and is particularly applicable to a semiconductor stack block in a semiconductor stack consisting of a plurality of semiconductor elements each having a heat pipe. The present invention relates to a semiconductor element heat radiator that has dustproof and waterproof functions on the low-pressure side of a heat pipe and is equipped with a seal structure that can detect abnormal temperatures on the low-pressure side of the heat pipe.

[Conventional technology]

Semiconductor conversion positions, such as inverters and choppers for vehicle drive, and inverters for auxiliary power supplies, are increasingly being used in railway vehicles.

Such a semiconductor conversion device for a railway vehicle is required to have cooling performance that corresponds to the increased capacity of semiconductor elements, and is also required to have dustproof and waterproof functions to prevent dust, rain, snow, etc. from entering the vehicle equipment.

The heat pipe cooling method is increasingly being adopted in semiconductor conversion devices for railway vehicles.

A semiconductor converter for a railway vehicle that uses the heat pipe cooling method consists of a semiconductor stack consisting of multiple semiconductor elements, and there are two types of insulated and non-insulated types for the insulated surface of the heating part of the heat pipe. Furthermore, there are those with shared heat pipe blocks and those with separate heat pipe blocks.

It goes without saying that in this type of heat pipe cooling type semiconductor stack, it is preferable to use semiconductor elements each having a heat pipe, since this provides flexibility.

On the other hand, it becomes necessary to make improvements to the dustproof and waterproof aspects of the pressure weld connection block of the semiconductor stack. Conventionally, in order to provide such a heat pipe block with dustproof and waterproof functions, a shield plate has been used to seal the air space between adjacent heat pipes.
The conventional method was to use semi-dry sticky viscoelastic putty (liquid putty) to fix the sheet.

[Problem that the invention attempts to solve]

In the configuration of a heat pipe cooling semiconductor stack consisting of a plurality of heat pipes that alternately sandwich a plurality of semiconductor elements as described above, the heating parts of the plurality of semiconductor elements and the plurality of heat pipes are arranged alternately and connected by pressure welding. However, the pressure connection block is supported at both ends.

On the other hand, such multiple heat pipes themselves are
Heat pipes and condensing parts protrude long and large from the heating part, and must be secured in accordance with the pressure-welded connection blocks mentioned above, but when assembling and supporting them, unnecessary parts are attached to the individual heating parts. It's something you can't apply force to.

Therefore, if the heat pipe block of the conventional method is made free and a liquid packing is used for the shield plate to make the press-connected connection block of the semiconductor stack dustproof and waterproof, assembly work is possible, but it becomes a troublesome work. Furthermore, after being put into use, it was hardened with putty, making it a hassle to replace the elements.

Furthermore, if heat pipes are individually cooled, it becomes necessary to detect abnormal temperatures of the heat pipes and then protect the semiconductor stack.

[Means for solving problems and their effects]

The present invention has been devised in view of the above-mentioned points, and includes at least a flexible packing rubber plate having an H-shaped cross section and specially fitted between the low-pressure sides of a plurality of insulated heat pipes. It exhibits dustproof and waterproof functions as a heat pipe block compatible with pressure-welding connection blocks of semiconductor stacks.
A simple device that can provide temperature protection on the low pressure side of the heat pipe has been realized.

Hereinafter, the present invention will be explained in detail based on the drawings.

〔Example〕

1 to 4 show an embodiment of the present invention, and FIGS. 1 and 2 are a front partially assembled view showing the main structure, a side view showing the main parts, and FIGS. FIG. 4 is a front view and a side view showing the main parts around the heat pipe.

First, in order to facilitate understanding of this embodiment, FIGS. 3 and 4, which show the portion around the heat pipe, will be described.

In FIGS. 3 and 4, 1 is a heat pipe, and 2 is a thin plate conductor material for providing dustproof and waterproof functions to a press-connected connection block of a semiconductor stack, which will be described later. Here, the heat pipe 1 may be of a known type having a heating section A, a heat pipe section H, and a condensing section C as main components and exhibiting cooling performance. Further, in the heat pipe 1 , T is a terminal, G is an insulator, and S is a support metal fitting.

That is, the insulator-shaped heat pipe 1 has a thin conductor material 2 attached to the low-pressure side, and the thin conductor material 2 is passed through the heat pipe section H between the insulator G and the condensing section C.

Next, an embodiment using such an insulated heat pipe will be described with reference to FIGS. 1 and 2.

1 and 2 show a partial configuration of an example of a three-phase inverter stack. That is, it shows a portion consisting of two switching elements S _UP and S _UN for one phase, two diodes D _UP and D _UN , and five heat pipes sandwiching these semiconductor elements.

In Figures 1 and 2, 3 is an Osae board;
4 is a spring receiver, 5 is a spring, 6 is an insulating spacer, 7
a, 7b, 7c, 7d, 7e are heat pipes, 8
is a holding bracket that holds the heat pipe block side,
9 and 9' are packing rubber plate materials, 10 is a general packing that covers the end face of the heat pipe block, and 11
is a thermal switch. Here, the heat pipes 7a, 7b, 7c, 7d, and 7e are of the same type as the heat pipe 1 shown in FIGS. 3 and 4.

It goes without saying that the terminals of the individual heat pipes may be different from each other in terms of the connection structure of the stack.

In the semiconductor stack configuration, three phases are stacked in the same way as the one phase shown in the figure, and they are connected by pressure to form the pressure connection block of the semiconductor stack, which is usually held in place by three parts of the support plates at both ends. Become something. In addition to the configuration of the pressure-welding connection block, the main component is a plurality of individually separated heat pipes that are configured as follows to have low-pressure dustproof and waterproof functions. .

That is, in order to separate the heat pipe block from the pressure welding connection block at multiple locations on the thin plate conductor material 2 shown in FIGS. 3 and 4, the heat pipe 7
A, 7b, 7c, 7d, and 7e are each provided with the thin plate conductor material 2, and packing rubber plate materials 9 and 9' that engage between the thin plate conductor materials 2, respectively.

Here, the packing rubber plates 9, 9' are made of a flexible rubber plate material, for example. Taking the packing rubber plate material 9 as an example, its cross-sectional shape is an H-shaped cross section with a pillar part that fills the space between the opposing thin plates and a U-shaped engagement part on both sides that engage the thin plates. It is something that has a shape. Further, it is clear that the packing rubber plate 9' may be of any type as long as it forms the left half or the right half of the cross-sectional shape of the packing rubber plate 9, as shown in the example. It should be noted that such a packing rubber plate material having an H-shaped cross section may be used as long as it is interposed between the thin conductor materials and has flexibility for matching in combination with the pitch of the pressure welding connecting block as described later. In particular, it is not limited to a flat shape, but may have a certain degree of chevron shape with both occlusal tips narrowed to improve adhesion to the thin plate material.

In this way, by arranging a thin plate conductor material for each heat pipe between a plurality of heat pipes and interlocking the packing rubber plate material between the opposing thin plate conductors, the heat pipe blocks can be aligned with the pressure welding connection block of the semiconductor stack. It can be sealed accordingly.

Further, it goes without saying that in a heat radiator having such a dust-proofing and water-discharging function, the packing rubber plate portion can be disassembled and reassembled.

Further, in this embodiment, as illustrated in FIG. 2, a thermal switch 11 is provided in the thin plate conductor material.

That is, a thermal switch is disposed on the thin conductor material of the heat pipe, and a malfunction such as a leak in the heat pipe can be quickly detected as an abnormal temperature on the low-pressure side of the heat pipe.

Note that such a thermal switch 11 may be attached to all of the heat pipes, or may be selected as appropriate, such as attached to a heat pipe for a plurality of specific switching elements, or even to a heat pipe for a specific diode. Of course, it is also possible to do so.

[Effect of idea]

As explained above, according to the present invention, the pressure-welded connecting block of the semiconductor stack using the semiconductor element with heat pipe has an exceptional dustproof and waterproof function, and has remarkable practicality in that it can handle abnormal temperatures of the heat pipe. equipment can be provided.

[Brief explanation of the drawing]

Figures 1 and 2 are a front partial assembly diagram and a side assembly diagram showing the main parts of an embodiment of the present invention, and Figures 3 and 4 are front views showing the main parts around the heat pipe. and a side view. 1 , 7a, 7b, 7c, 7d, 7e... heat pipe, 2... thin plate conductor material, 9, 9'... packing rubber plate material, 11... thermal switch.

Claims (1)

[Scope of utility model registration request] In a semiconductor conversion device for a railway vehicle consisting of a heat pipe cooling type semiconductor stack, the heating portions of a plurality of heat pipes that alternately sandwich a plurality of semiconductor elements are connected under pressure, and the plurality of heat pipes are connected to insulators of the heat pipes. A flexible packing rubber plate having an H-shaped cross section is provided between the condensing portions, through which a thin plate conductor material with its thick side facing each other is inserted, and each of the thin plate conductors is engaged with the opposite thin plate conductor material. A semiconductor element heatsink equipped with a seal structure characterized by a thermal switch connected to the semiconductor element heatsink.