JPH0547306A - Display panel - Google Patents
Display panelInfo
- Publication number
- JPH0547306A JPH0547306A JP23092591A JP23092591A JPH0547306A JP H0547306 A JPH0547306 A JP H0547306A JP 23092591 A JP23092591 A JP 23092591A JP 23092591 A JP23092591 A JP 23092591A JP H0547306 A JPH0547306 A JP H0547306A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- display panel
- conductive adhesive
- out end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000003566 sealing material Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 description 30
- 239000011324 bead Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、それぞれ1面に電極
を形成した1対の絶縁基板を所定の間隔をおいて対向配
置した表示パネルに係り、特に一方の絶縁基板に形成さ
れた電極の取り出し用端子を、他方の絶縁基板上に集約
させた表示パネルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display panel in which a pair of insulating substrates each having an electrode formed on one surface thereof are opposed to each other at a predetermined interval, and more particularly to an electrode formed on one insulating substrate. The present invention relates to a display panel in which takeout terminals are integrated on the other insulating substrate.
【0002】[0002]
【従来の技術】それぞれ電極を形成した1対の絶縁基板
を、所定の間隔をおいて対向配置した構成を有するガス
放電表示パネル等の表示パネルにあっては、各絶縁基板
をそれぞれ一定方向にずらして重ね合わせ、各絶縁基板
の一方端に形成される端縁部(非重複部分)に電極の取
り出し用端子を形成していた。このため、駆動回路と接
続するためには、パネルの両側からリード線などで引き
回さなくてはならず、特にパネルサイズが大きい場合や
パネルが細長い場合にはこのリード線が邪魔になるばか
りでなく、パネルからの取り出し部分が2ヶ所となるた
め、作業工程が複雑化する点で問題であった。2. Description of the Related Art In a display panel such as a gas discharge display panel having a structure in which a pair of insulating substrates each having electrodes formed thereon are opposed to each other at a predetermined interval, each insulating substrate is arranged in a fixed direction. The electrodes were taken out from each other and shifted to overlap with each other, and an electrode lead-out terminal was formed at an edge (non-overlapping portion) formed at one end of each insulating substrate. For this reason, in order to connect to the drive circuit, it is necessary to route the lead wires from both sides of the panel. Especially, when the panel size is large or the panel is long and thin, the lead wires are a hindrance. However, since there are two parts to be taken out from the panel, there is a problem in that the work process becomes complicated.
【0003】この解決策として、両絶縁基板の取り出し
用端子を、一方の絶縁基板上に集約させた表示パネルが
提案されている。すなわち、特開昭53−118365号公報に
おいて、図6に示すように、上部ガラス基板aと下部ガ
ラス基板bとを封着材cによって封止した後に、上部ガ
ラス基板aの封着部外方に導出された電極導出端部d
と、下部ガラス基板bの封着部外方に予め形成された端
子導体eとを、Cu−Beの合金で形成された接続片f
によって接続する、ガス放電パネルgが開示されてい
る。また、同公報においては、上記接続片fの代わり
に、図7に示すように、銀ペースト等の導電性接着剤h
によって、上記電極導出端部dと端子導体eとを接続す
る、ガス放電パネルiも開示されている。As a solution to this problem, there has been proposed a display panel in which the extraction terminals of both insulating substrates are integrated on one insulating substrate. That is, in JP-A-53-118365, as shown in FIG. 6, after sealing an upper glass substrate a and a lower glass substrate b with a sealing material c, the outside of the sealing portion of the upper glass substrate a Electrode lead-out end portion d led to
And a terminal conductor e formed in advance outside the sealing portion of the lower glass substrate b, and a connecting piece f formed of an alloy of Cu-Be.
There is disclosed a gas discharge panel g connected by. Further, in the publication, instead of the connecting piece f, as shown in FIG. 7, a conductive adhesive h such as silver paste is used.
Also discloses a gas discharge panel i for connecting the electrode lead-out end portion d and the terminal conductor e.
【0004】[0004]
【発明が解決しようとする課題】上記のガス放電パネル
g,iにおいては、上部ガラス基板aの取り出し用端子
たる端子部eが下部ガラス基板b上に形成されており、
該端子部eは上記接続片f或いは導電性接着剤hを介し
て電極導出端部dと接続されているため、下部ガラス基
板b上で上部ガラス基板aの電極を取り出すことができ
る。したがって、リード線を長く引き回す必要がなく、
リード処理が下部ガラス基板bの1ヶ所で済むので、作
業工程の簡素化が図れる。In the gas discharge panels g and i described above, the terminal portion e which is a take-out terminal of the upper glass substrate a is formed on the lower glass substrate b,
Since the terminal portion e is connected to the electrode lead-out end portion d via the connecting piece f or the conductive adhesive h, the electrode of the upper glass substrate a can be taken out on the lower glass substrate b. Therefore, it is not necessary to run the lead wire for a long time,
Since the lead process is performed only at one place on the lower glass substrate b, the working process can be simplified.
【0005】しかしながら、上記接続片f或いは導電性
接着剤hは、ともに上部ガラス基板a及び下部ガラス基
板bの対向面側で、上記封着材cの外方に配されるた
め、ガス放電パネルg,iの表示面積を大きくするため
封着材cを上部ガラス基板aの対向面側外端部に配置し
た場合には、接続片fや導電性接着剤hを配置するスペ
ースを上部ガラス基板aの対向面側に確保できないた
め、上記従来例は適用できないものであった。これを逆
にいえば、上記従来例を適用するには上部ガラス基板a
の対向面側で上記封着材cの外方に、上記接続片f等を
配置するためのスペースを必ず空けなければならないこ
とを意味し、表示面積の拡大に対する限界となる点で不
満の残るものであった。However, since both the connecting piece f and the conductive adhesive h are arranged outside the sealing material c on the opposing surface sides of the upper glass substrate a and the lower glass substrate b, the gas discharge panel. In the case where the sealing material c is arranged at the outer end of the upper glass substrate a on the opposite surface side in order to increase the display area of g and i, a space for arranging the connection piece f and the conductive adhesive h is provided in the upper glass substrate. The above conventional example cannot be applied because it cannot be secured on the facing surface side of a. Conversely, to apply the above conventional example, the upper glass substrate a
Means that a space for arranging the connecting piece f and the like must be provided outside the sealing material c on the opposite surface side, and there is a dissatisfaction in that it is a limit to the expansion of the display area. It was a thing.
【0006】本発明は、上記した従来例の問題点に鑑み
てなされたものであり、封着材を一方の絶縁基板の対向
面側外端部に配置したため該絶縁基板の対向面上に残余
のスペースを確保できない場合であっても、該絶縁基板
に形成された電極の取り出し用端子を他方の絶縁基板上
に集約することができる表示パネルを提供することを目
的とする。The present invention has been made in view of the above-mentioned problems of the conventional example, and since the sealing material is arranged at the outer end portion of one insulating substrate on the opposite surface side, the sealing material remains on the opposite surface of the insulating substrate. It is an object of the present invention to provide a display panel in which the lead-out terminals for electrodes formed on the insulating substrate can be integrated on the other insulating substrate even when the space cannot be secured.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る表示パネルは、第1の電極を1面に形
成した第1の絶縁基板と、第2の電極を1面に形成した
第2の絶縁基板とを、所定の間隔をおいて各電極形成面
が対向するように配置し、両基板の電極形成面周縁を封
着材を介して気密封止することにより、両基板間に空間
部を形成した表示パネルにおいて、上記第1の絶縁基板
の電極形成面以外の側面に上記第1の電極と電気的に接
続された電極導出端部を形成すると共に、上記第2の絶
縁基板の端縁部に上記電極導出端部に対応する端子部を
形成し、上記電極導出端部と上記端子部との間に導電性
接着材を配して両者を電気的に接続するよう構成した。
上記導電性接着材は、銀ペーストや半田などによって構
成される。In order to achieve the above-mentioned object, a display panel according to the present invention has a first insulating substrate having a first electrode formed on one surface and a second electrode provided on one surface. By disposing the formed second insulating substrate so that the electrode forming surfaces face each other at a predetermined interval, and sealing the peripheral edges of the electrode forming surfaces of both substrates with a sealing material, In a display panel in which a space is formed between substrates, an electrode lead-out end electrically connected to the first electrode is formed on a side surface of the first insulating substrate other than an electrode formation surface, and the second insulating substrate is formed. A terminal portion corresponding to the electrode lead-out end portion is formed at the edge portion of the insulating substrate, and a conductive adhesive is arranged between the electrode lead-out end portion and the terminal portion to electrically connect the two. Configured as
The conductive adhesive is composed of silver paste, solder or the like.
【0008】上記導電性接着材の内部に、芯部材を配置
することが望ましい。該芯部材としては、ガラスビー
ズ、ガラス棒、金属球、或いは上記電極導出端部と接触
する第1の接触片と上記端子部と接触する第2の接触片
とを有する金属板などを用いる。It is desirable to dispose a core member inside the conductive adhesive. As the core member, a glass bead, a glass rod, a metal ball, or a metal plate having a first contact piece that contacts the electrode lead-out end portion and a second contact piece that contacts the terminal portion is used.
【0009】[0009]
【作用】しかして、上記第1の絶縁基板の1面に形成さ
れた第1の電極は、上記電極導出端部及び導電性接着材
を介して、上記第2の絶縁基板の端縁部に形成された端
子部と電気的に接続されるので、第1の電極の取り出し
を第2の絶縁基板の端縁部で行うことができる。Thus, the first electrode formed on the one surface of the first insulating substrate is connected to the edge portion of the second insulating substrate via the electrode lead-out end portion and the conductive adhesive. Since it is electrically connected to the formed terminal portion, the first electrode can be taken out at the edge portion of the second insulating substrate.
【0010】上記電極導出端部は第1の絶縁基板の電極
形成面以外の側面に形成されるので、上記封着材を第1
の絶縁基板の電極形成面の外端部に配置したため、該封
着材の外方に残余のスペースを確保できない場合にも適
用できる。Since the electrode lead-out end portion is formed on a side surface other than the electrode formation surface of the first insulating substrate, the sealing material is formed on the first side surface of the first insulating substrate.
Since it is arranged at the outer end of the electrode forming surface of the insulating substrate, it can be applied to the case where a residual space cannot be secured outside the sealing material.
【0011】なお、上記導電性接着材の内部に上記芯部
材を配置することにより、上記導電性接着材が該芯部材
の表面に沿って万遍なく広がるため、上記電極導出端部
及び端子部との接触面積が増大する。その結果、電極導
出端部及び端子部間の接触抵抗が低下すると共に、両者
間の接続がより確実となる。また、導電性接着材に空洞
や亀裂が生じることを防止することができる。By disposing the core member inside the conductive adhesive material, the conductive adhesive material spreads evenly along the surface of the core member, so that the electrode lead-out end portion and the terminal portion. The contact area with is increased. As a result, the contact resistance between the electrode lead-out end portion and the terminal portion is reduced, and the connection between the both becomes more reliable. Further, it is possible to prevent the conductive adhesive from having a void or a crack.
【0012】[0012]
【実施例】以下に本発明を、図示の実施例に基づいて説
明する。図1は本実施例に係る交流型のガス放電表示パ
ネル2の部分断面図であり、該ガス放電表示パネル2
は、前面基板4と背面基板6とを、所定の間隔をおいて
対向配置してなる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiments. FIG. 1 is a partial cross-sectional view of an AC type gas discharge display panel 2 according to this embodiment.
The front substrate 4 and the rear substrate 6 are arranged to face each other with a predetermined gap.
【0013】上記前面基板4は、ガラス等よりなる透光
性絶縁基板8の下面10に、酸化スズ等によって構成され
た透明電極12を被着形成すると共に、該透明電極12の表
面を酸化鉛ガラス等の透光性誘電材からなる第1の誘電
体層14で被覆して構成される。また、上記透光性絶縁基
板8の右側面16には、上記透明電極12と一体的に形成さ
れた電極導出端部18が被着される。In the front substrate 4, a transparent electrode 12 made of tin oxide or the like is adhered and formed on a lower surface 10 of a translucent insulating substrate 8 made of glass or the like, and the surface of the transparent electrode 12 is lead oxide. It is formed by covering with a first dielectric layer 14 made of a transparent dielectric material such as glass. An electrode lead-out end portion 18 integrally formed with the transparent electrode 12 is attached to the right side surface 16 of the translucent insulating substrate 8.
【0014】上記背面基板6は、ガラスやセラミック等
の絶縁基板20の上面22に、銀パラジウム等の導電体によ
って構成された電極24を被着形成すると共に、該電極24
の表面を酸化鉛ガラス等からなる第2の誘電体層26で被
覆して構成される。また、上記絶縁基板20の上面22で、
上記前面基板4と重ならない部分(以下「端縁部28」と
称する)には、銀パラジウム等の導電体によって構成さ
れた端子部30が被着形成される。The rear substrate 6 has an electrode 24 made of a conductor such as silver palladium deposited on the upper surface 22 of an insulating substrate 20 such as glass or ceramic.
Is covered with a second dielectric layer 26 made of lead oxide glass or the like. Further, on the upper surface 22 of the insulating substrate 20,
A terminal portion 30 made of a conductor such as silver palladium is adhered to a portion that does not overlap the front substrate 4 (hereinafter referred to as "edge portion 28").
【0015】なお、図示は省略するが、上記第1の誘電
体層14の表面及び第2の誘電体層26の表面には、酸化マ
グネシウム等の耐スパッタ性物質からなる保護膜が形成
されている。また、同じく図示は省略するが、上記透光
性絶縁基板8と第1の誘電体層14との間、及び絶縁基板
20と第2の誘電体層26との間の適宜箇所には、表示領域
を区画するためのマスク層が形成されている。該マスク
層は、黒色ガラス等の遮光性部材によって構成される。Although not shown, a protective film made of a sputter-resistant material such as magnesium oxide is formed on the surface of the first dielectric layer 14 and the surface of the second dielectric layer 26. There is. Similarly, although not shown in the figure, the space between the translucent insulating substrate 8 and the first dielectric layer 14 and the insulating substrate
A mask layer for partitioning the display region is formed at an appropriate position between the 20 and the second dielectric layer 26. The mask layer is composed of a light-shielding member such as black glass.
【0016】上記構成よりなる前面基板4と背面基板6
とは、所定間隙、例えば100μm〜200μmの間隙
を隔てて、上記第1の誘電体層14と第2の誘電体層26と
が対向するように配置される。そして、前面基板4の下
面外端部32及び背面基板6の上面外端部34は、フリット
ガラス等の低融点ガラスによって構成された封着材36に
よって気密封止される。その結果、前面基板4と背面基
板6との間には、ガス放電用の空間部38が形成される。
該空間部38には、真空処理を施した後に、ネオン等の放
電ガスが充填される。The front substrate 4 and the rear substrate 6 having the above structure
Is disposed so that the first dielectric layer 14 and the second dielectric layer 26 face each other with a predetermined gap, for example, a gap of 100 μm to 200 μm. Then, the lower surface outer end portion 32 of the front substrate 4 and the upper surface outer end portion 34 of the rear substrate 6 are hermetically sealed by a sealing material 36 made of a low melting point glass such as frit glass. As a result, a space 38 for gas discharge is formed between the front substrate 4 and the rear substrate 6.
The space 38 is filled with a discharge gas such as neon after vacuum processing.
【0017】上記電極導出端部18と端子部30との間に
は、銀ペースト等によって構成される導電性接着材40が
配置され、電極導出端部18と端子部30とを電気的に接続
している。A conductive adhesive 40 made of silver paste or the like is disposed between the electrode lead-out end 18 and the terminal portion 30 to electrically connect the electrode lead-out end 18 and the terminal portion 30. is doing.
【0018】上記のように構成したため、前面基板4に
形成された透明電極12は、電極導出端部18、導電性接着
材40及び端子部30を介して、背面基板6の端縁部28に取
り出される。なお、図示は省略したが、上記背面基板6
の端縁部28には、背面基板6に配設された電極24の取り
出し用端子も形成されている。このように、背面基板6
の端縁部28において、前面基板4に形成された透明電極
12及び背面基板6に形成された電極24を取り出すことが
できる。Due to the above-mentioned configuration, the transparent electrode 12 formed on the front substrate 4 is connected to the edge portion 28 of the rear substrate 6 via the electrode lead-out end portion 18, the conductive adhesive 40 and the terminal portion 30. Taken out. Although not shown, the rear substrate 6 is not shown.
Terminals for taking out the electrodes 24 arranged on the rear substrate 6 are also formed on the edge portion 28 of the. In this way, the rear substrate 6
Transparent electrode formed on the front substrate 4 at the edge 28 of the
It is possible to take out the electrode 12 formed on the back substrate 6 and the back substrate 6.
【0019】つぎに、図2及び図3に基づいて、本実施
例におけるガス放電表示パネル2の製造方法について説
明する。まず、上記絶縁基板20の上面22に、表示パター
ンに対応した形状に電極24を配設し、該電極24の表面を
第2の誘電体層26で被覆すると共に、絶縁基板20の端縁
部28に端子部30を被着形成して上記背面基板6を形成す
る。そして、該背面基板6の上面外端部34に封着材36を
厚膜印刷によって塗布する。Next, a method of manufacturing the gas discharge display panel 2 in this embodiment will be described with reference to FIGS. First, an electrode 24 is provided on the upper surface 22 of the insulating substrate 20 in a shape corresponding to a display pattern, the surface of the electrode 24 is covered with a second dielectric layer 26, and the edge portion of the insulating substrate 20 is covered. The terminal portion 30 is adhered to 28 to form the back substrate 6. Then, the sealing material 36 is applied to the upper surface outer end portion 34 of the rear substrate 6 by thick film printing.
【0020】上記工程と並行して、上記透光性絶縁基板
8の下面10に、表示パターンに対応した形状に上記透明
電極12を配設し、該透明電極12の表面を上記第1の誘電
体層14で被覆すると共に、透光性絶縁基板8の右側面16
に上記透明電極12の延長部たる電極導出端部18を被着す
ることによって、上記前面基板4を形成する。そして、
該前面基板4の下面外端部32にも封着材36を厚膜印刷に
よって塗布する。In parallel with the above steps, the transparent electrode 12 is provided on the lower surface 10 of the transparent insulating substrate 8 in a shape corresponding to the display pattern, and the surface of the transparent electrode 12 is covered with the first dielectric. The right side surface 16 of the translucent insulating substrate 8 is covered with the body layer 14.
The front substrate 4 is formed by depositing the electrode lead-out end portion 18 which is an extension of the transparent electrode 12 on. And
The sealing material 36 is also applied to the outer surface 32 of the lower surface of the front substrate 4 by thick film printing.
【0021】上記前面基板4と背面基板6とを、背面基
板6の上面外端部34に塗布した封着材36と前面基板4の
下面外端部32に塗布した封着材36とが当接するよう位置
決めした後に、導電性接着材40を電極導出端部18と端子
部30との間に塗布し(図3)、所定時間加熱する。この
加熱処理を通じて、上記封着材36が溶融軟化して前面基
板4の下面外端部32と背面基板の上面外端部34とが気密
に封止されると同時に、上記導電性接着材40が焼結され
て電極導出端部18と端子部30とが電気的に接続される
(図1)。なお、上記加熱処理は、例えば450°Cで
1時間程度行われる。The front substrate 4 and the rear substrate 6 are contacted with the sealing material 36 applied to the upper surface outer end portion 34 of the rear substrate 6 and the sealing material 36 applied to the lower surface outer end portion 32 of the front substrate 4. After positioning so as to be in contact with each other, the conductive adhesive 40 is applied between the electrode lead-out end 18 and the terminal portion 30 (FIG. 3) and heated for a predetermined time. Through this heat treatment, the sealing material 36 is melted and softened to hermetically seal the lower surface outer end portion 32 of the front substrate 4 and the upper surface outer end portion 34 of the rear substrate, and at the same time, the conductive adhesive 40 Is sintered and the electrode lead-out end portion 18 and the terminal portion 30 are electrically connected (FIG. 1). The heat treatment is performed at 450 ° C. for about 1 hour, for example.
【0022】次に、図4に基づいて、本発明にかかる他
の実施例について説明する。本実施例は、上記実施例に
おける導電性接着材40の中心部に、芯部材たる球形のガ
ラスビーズ42が配されたことを特徴としており、その他
の構成は上記実施例と同様である。Next, another embodiment according to the present invention will be described with reference to FIG. The present embodiment is characterized in that the spherical glass beads 42 serving as the core member are arranged in the central portion of the conductive adhesive 40 in the above embodiment, and other configurations are the same as in the above embodiment.
【0023】該ガラスビーズ42を配することにより、導
電性接着材40がガラスビーズ42の表面に沿って万遍なく
広がるので、電極導出端部18及び端子部30との接触面積
が大きくなる。その結果、電極導出端部18及び端子部30
間の接触抵抗を低減できると共に、導電性接着材40によ
って両者がより確実に接続される。また、導電性接着材
40に空洞や亀裂が発生することを防止することもでき
る。By arranging the glass beads 42, the conductive adhesive 40 spreads evenly along the surface of the glass beads 42, so that the contact area with the electrode lead-out end portion 18 and the terminal portion 30 increases. As a result, the electrode lead-out end portion 18 and the terminal portion 30
The contact resistance between them can be reduced, and the two are more reliably connected by the conductive adhesive 40. Also, conductive adhesive
It is also possible to prevent the formation of cavities or cracks in 40.
【0024】上記ガラスビーズ42は、導電性接着材40を
塗布した後に埋め込んでもよいが、予め導電性接着材40
中に練り込んでおき、ガラスビーズ42を含んだ状態で塗
布するようにしてもよい。The glass beads 42 may be embedded after the conductive adhesive 40 is applied.
Alternatively, the glass beads 42 may be kneaded in and applied in a state of containing the glass beads 42.
【0025】上記ガラスビーズ42の代わりに、図5に示
すように、断面略L字状の金属板44を導電性接着材40の
芯部材として用いてもよい。すなわち、該金属板44を、
その第1の接触片46が側面16に形成された電極導出端部
18に、また第2の接触片48が端縁部28に形成された端子
部30にそれぞれ接触するよう配置すると共に、その周囲
に導電性接着材40を膜状に被着させる。この結果、電極
導出端部18と端子部30とが、上記金属板44を介して、よ
り確実に電気的に接続される。また、導電性接着材40に
よって、金属板44は強固に固定される。Instead of the glass beads 42, as shown in FIG. 5, a metal plate 44 having a substantially L-shaped cross section may be used as a core member of the conductive adhesive 40. That is, the metal plate 44,
The first contact piece 46 has the electrode lead-out end portion formed on the side surface 16.
18 and the second contact piece 48 is arranged so as to contact the terminal portion 30 formed on the edge portion 28, respectively, and the conductive adhesive 40 is applied in a film form on the periphery thereof. As a result, the electrode lead-out end portion 18 and the terminal portion 30 are more reliably electrically connected via the metal plate 44. Further, the metal plate 44 is firmly fixed by the conductive adhesive 40.
【0026】なお、上記金属板44の材質は特に限定され
ず、電気的良導体でさえあれば、いかなる金属で構成し
てもよい。また、導電性接着材40としては、上記実施例
におけると同様に銀ペーストを用いてもよいが、銀ペー
ストの代わりに半田を用いることもできる。その場合に
は、金属板44をりん青銅など半田と相性の良い材質で構
成するのが望ましい。The material of the metal plate 44 is not particularly limited, and may be made of any metal as long as it is a good electrical conductor. Further, as the conductive adhesive 40, a silver paste may be used as in the above embodiment, but solder may be used instead of the silver paste. In that case, it is desirable that the metal plate 44 be made of a material such as phosphor bronze that is compatible with solder.
【0027】上記各実施例においては、交流型のガス放
電表示パネル2を例に説明したが、本発明は、直流型の
ガス放電表示パネルや液晶パネルなど、それぞれ電極を
形成した1対の絶縁基板を所定間隔をおいて対向配置
し、その周縁を気密封止した構成を有する表示パネルに
広く適用可能である。In each of the above embodiments, the AC type gas discharge display panel 2 has been described as an example. However, the present invention is a DC type gas discharge display panel, liquid crystal panel or the like, and a pair of insulating members each having electrodes formed thereon. The present invention can be widely applied to a display panel having a structure in which substrates are opposed to each other with a predetermined interval and the peripheral edges are hermetically sealed.
【0028】[0028]
【発明の効果】本発明に係る表示パネルにおいては、第
1の電極を1面に形成した第1の絶縁基板の電極形成面
以外の側面に電極導出端部を形成するよう構成したの
で、封着材を第1の絶縁基板の電極形成面の外端部に形
成したために残余のスペースを電極形成面上に確保でき
ない場合でも、上記電極導出端部、導電性接着材及び端
子部を介して、上記第1の電極を第2の絶縁基板の端縁
部で取り出すことができる。この結果、外部駆動回路と
接続するためのリード処理を、第2の絶縁基板の端縁部
1ヶ所で済ますことができ、構成の簡素化及び製造の容
易化が図れると共に、表示パネルの信頼性が向上する。In the display panel according to the present invention, since the electrode lead-out end portion is formed on the side surface other than the electrode formation surface of the first insulating substrate having the first electrode formed on one surface, the sealing is achieved. Even when the remaining space cannot be secured on the electrode formation surface because the adhesive material is formed on the outer end portion of the electrode formation surface of the first insulating substrate, the electrode lead-out end portion, the conductive adhesive material, and the terminal portion are used. The first electrode can be taken out at the edge of the second insulating substrate. As a result, the lead processing for connecting to the external drive circuit can be performed at one edge portion of the second insulating substrate, which simplifies the configuration and facilitates the manufacturing, and the reliability of the display panel. Is improved.
【0029】また、上記導電性接着材の内部に上記芯部
材を配置することにより、上記導電性接着材が該芯部材
の表面に沿って万遍なく広がるため、上記電極導出端部
及び端子部との接触面積が増大する。この結果、電極導
出端部及び端子部間の接触抵抗を低減できると共に、両
者間の接続をより確実なものにできる。また、導電性接
着材に空洞や亀裂が生じることを防止できる。Further, by disposing the core member inside the conductive adhesive material, the conductive adhesive material spreads evenly along the surface of the core member, so that the electrode lead-out end portion and the terminal portion. The contact area with is increased. As a result, the contact resistance between the electrode lead-out end and the terminal can be reduced, and the connection between the two can be made more reliable. In addition, it is possible to prevent cavities and cracks from occurring in the conductive adhesive.
【図1】本発明に係る表示パネルの1実施例を示す部分
断面図である。FIG. 1 is a partial cross-sectional view showing one embodiment of a display panel according to the present invention.
【図2】上記実施例の製造方法を示す部分断面図であ
る。FIG. 2 is a partial cross-sectional view showing the manufacturing method of the above embodiment.
【図3】上記実施例の製造方法を示す部分断面図であ
る。FIG. 3 is a partial cross-sectional view showing the manufacturing method of the above embodiment.
【図4】本発明に係る表示パネルの他の実施例を示す部
分断面図である。FIG. 4 is a partial cross-sectional view showing another embodiment of the display panel according to the present invention.
【図5】本発明に係る表示パネルの他の実施例を示す部
分断面図である。FIG. 5 is a partial cross-sectional view showing another embodiment of the display panel according to the present invention.
【図6】従来例を示す部分断面図である。FIG. 6 is a partial cross-sectional view showing a conventional example.
【図7】従来例を示す部分断面図である。FIG. 7 is a partial cross-sectional view showing a conventional example.
2 ガス放電表示パネル 4 前面基板 6 背面基板 12 透明電極 16 右側面 18 電極導出端部 24 電極 28 端縁部 30 端子部 36 封着材 38 空間部 40 導電性接着材 42 ガラスビーズ 44 金属板 46 第1の接触片 48 第2の接触片 2 Gas Discharge Display Panel 4 Front Substrate 6 Rear Substrate 12 Transparent Electrode 16 Right Side 18 Electrode Lead Edge 24 Electrode 28 Edge Edge 30 Terminal 36 Sealing Material 38 Space 40 Conductive Adhesive 42 Glass Beads 44 Metal Plate 46 First contact piece 48 Second contact piece
Claims (4)
基板と、第2の電極を1面に形成した第2の絶縁基板と
を、所定の間隔をおいて各電極形成面が対向するように
配置し、両基板の電極形成面周縁を封着材を介して気密
封止することにより、両基板間に空間部を形成した表示
パネルにおいて、上記第1の絶縁基板の電極形成面以外
の側面に上記第1の電極と電気的に接続された電極導出
端部を形成すると共に、上記第2の絶縁基板の端縁部に
上記電極導出端部に対応する端子部を形成し、上記電極
導出端部と上記端子部との間に導電性接着材を配して両
者を電気的に接続したことを特徴とする表示パネル。1. A first insulating substrate having a first electrode formed on one surface thereof and a second insulating substrate having a second electrode formed on one surface thereof are separated from each other by a predetermined distance. In a display panel in which a space portion is formed between the two substrates by hermetically sealing the peripheral edges of the electrode formation surfaces of both substrates with a sealing material. An electrode lead-out end electrically connected to the first electrode is formed on a side surface other than the formation surface, and a terminal portion corresponding to the electrode lead-out end is formed at the edge of the second insulating substrate. A display panel is characterized in that a conductive adhesive is arranged between the electrode lead-out end and the terminal to electrically connect the two.
たことを特徴とする、請求項1に記載の表示パネル。2. The display panel according to claim 1, wherein the conductive adhesive is made of solder.
したことを特徴とする、請求項1または2に記載の表示
パネル。3. The display panel according to claim 1, wherein a core member is arranged inside the conductive adhesive material.
する第1の接触片と、上記端子部と接触する第2の接触
片とを有する金属板によって構成したことを特徴とす
る、請求項3に記載の表示パネル。4. The core member is formed of a metal plate having a first contact piece that comes into contact with the electrode lead-out end portion and a second contact piece that comes into contact with the terminal portion. The display panel according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3230925A JP2628241B2 (en) | 1991-08-19 | 1991-08-19 | Display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3230925A JP2628241B2 (en) | 1991-08-19 | 1991-08-19 | Display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0547306A true JPH0547306A (en) | 1993-02-26 |
| JP2628241B2 JP2628241B2 (en) | 1997-07-09 |
Family
ID=16915435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3230925A Expired - Fee Related JP2628241B2 (en) | 1991-08-19 | 1991-08-19 | Display panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2628241B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100432642B1 (en) * | 2001-09-20 | 2004-05-22 | 옥도영 | Plasma display panel and method of sealing the same |
| KR100751372B1 (en) * | 2006-03-13 | 2007-08-22 | 삼성에스디아이 주식회사 | Display panel |
| CN103154805A (en) * | 2010-10-15 | 2013-06-12 | 碧理科技有限公司 | Liquid crystal optical element and manufacturing method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49122663A (en) * | 1973-03-26 | 1974-11-22 | ||
| JPS50104562U (en) * | 1974-02-01 | 1975-08-28 | ||
| JPS50140232A (en) * | 1974-04-27 | 1975-11-10 |
-
1991
- 1991-08-19 JP JP3230925A patent/JP2628241B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49122663A (en) * | 1973-03-26 | 1974-11-22 | ||
| JPS50104562U (en) * | 1974-02-01 | 1975-08-28 | ||
| JPS50140232A (en) * | 1974-04-27 | 1975-11-10 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100432642B1 (en) * | 2001-09-20 | 2004-05-22 | 옥도영 | Plasma display panel and method of sealing the same |
| KR100751372B1 (en) * | 2006-03-13 | 2007-08-22 | 삼성에스디아이 주식회사 | Display panel |
| CN103154805A (en) * | 2010-10-15 | 2013-06-12 | 碧理科技有限公司 | Liquid crystal optical element and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2628241B2 (en) | 1997-07-09 |
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