JPH0560269B2 - - Google Patents
Info
- Publication number
- JPH0560269B2 JPH0560269B2 JP59016771A JP1677184A JPH0560269B2 JP H0560269 B2 JPH0560269 B2 JP H0560269B2 JP 59016771 A JP59016771 A JP 59016771A JP 1677184 A JP1677184 A JP 1677184A JP H0560269 B2 JPH0560269 B2 JP H0560269B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- force
- receiving surface
- sensitive
- directions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
- Pressure Sensors (AREA)
Description
【発明の詳細な説明】
[発明の属する技術分野]
この発明は、知能ロボツトや自動組立機のマニ
ピユレータ、あるいは移動ロボツトの足の裏等に
取付けて、人間における接触覚、力覚およびすべ
り覚等に相当する高度な感覚情報をフイードバツ
ク信号として制御系に出力する圧覚センサに関
し、特に多数の感圧モジユールをアレイ状に配設
した圧覚センサアレイを提供するものである。[Detailed Description of the Invention] [Technical Field to which the Invention Pertains] This invention relates to an intelligent robot, a manipulator of an automatic assembly machine, a mobile robot, etc., which is attached to the sole of the foot of a mobile robot, and is used to detect touch, force, and sliding sensations in humans. The present invention relates to a pressure sensor that outputs high-level sensory information corresponding to the feedback signal to a control system, and particularly provides a pressure sensor array in which a large number of pressure-sensitive modules are arranged in an array.
[従来技術とその問題点]
印加された力を直角座標系の3方向の分力に分
解して検出できる力覚センサとしては、第1図お
よび第2図に示すようなものがある。これらのセ
ンサは弾性リング体や十字形板ばねの弾性支持体
1と、その支持体の各方向に貼付けられた複数の
ストレンゲージ3とから成り、ロボツトの手首5
に相当する部分に取付けられて、これらのストレ
ンゲージにより手首から先に受ける力の大きさや
方向の合成力を検出するものであるが、印加され
た力の分布といつた精密な情報を提供するもので
はない。[Prior art and its problems] There are force sensors as shown in FIGS. 1 and 2 that can detect applied force by decomposing it into component forces in three directions in a rectangular coordinate system. These sensors consist of an elastic support 1 such as an elastic ring body or a cross-shaped leaf spring, and a plurality of strain gauges 3 attached in each direction to the support.
These strain gauges are attached to the part corresponding to the wrist and detect the magnitude and direction of the force applied to the wrist first, and provide precise information such as the distribution of the applied force. It's not a thing.
一方、印加された力の分布を検出する圧覚セン
サとしては、導電性ゴムを用いた第3図や第4図
A,Bに示すようなもの、さらに第5図に示すよ
うな多数の細い棒を用いたものがある。まず、
第3図に示すセンサは、リード線7を接続した
前面と後面の電極箔9および11とで厚さ約1mm
のカーボン・フアイバ・フエルト13を挟んでサ
ンドイツチ状にし、このカーボン・フアイバ・フ
エルト間の接触面積が力を加えることで変化し、
これが抵抗値の変化を引き起すことを利用してい
る。また、第4図Aに示すセンサは導電性のシリ
コンゴムコード15と金属電極17とを用い、や
はり加圧力によりそのゴムコードの接触面積に変
化が起こり、抵抗値が変化することを利用してい
る。第4図Bに示すセンサは、そのシリコンゴム
コード15と金属電極17とを格子状に配置し、
ITV(工業用テレビ)などに用いられている走査
方式を適用して検出している。さらに、第5図に
示すセンサは、垂直方向に摺動可能にして同一面
に取付けた多数の細い棒19の先端が被検物体の
形状に応動して上下動する動きを、不図示の差動
コイルやホール素子によつて検出することによ
り、3次元部品(立体部品)の形状認識を行うも
のである。 On the other hand, pressure sensors that detect the distribution of applied force include those shown in Figures 3 and 4 A and B that use conductive rubber, and those that use a large number of thin rods as shown in Figure 5. There are some that use First, the sensor shown in Fig. 3 has a thickness of approximately 1 mm between the electrode foils 9 and 11 on the front and rear surfaces to which the lead wire 7 is connected.
The carbon fiber felt 13 is sandwiched to form a sandwich shape, and the contact area between the carbon fiber felt changes by applying force.
The fact that this causes a change in resistance value is utilized. The sensor shown in FIG. 4A uses a conductive silicone rubber cord 15 and a metal electrode 17, and also takes advantage of the fact that the contact area of the rubber cord changes due to pressurizing force, and the resistance value changes. There is. The sensor shown in FIG. 4B has silicone rubber cords 15 and metal electrodes 17 arranged in a grid pattern,
Detection is done by applying the scanning method used in ITV (industrial television) and other devices. Furthermore, the sensor shown in FIG. 5 detects the vertical movement of the tips of a large number of thin rods 19, which are vertically slidable and attached to the same surface, in response to the shape of the object to be tested. The shape of a three-dimensional part (three-dimensional part) is recognized by detecting it using a moving coil or a Hall element.
しかしながら、力の分布を検出するこれらの各
センサは、受圧面に垂直な力の大きさの2次元分
布を検出するものであり、それ以外の方向につい
ての情報は与えられない。だが、人間の手のひら
や足の裏等の皮膚は垂直でない方向の力の分布状
態も精密に検知する。したがつて、従来のセンサ
では、人間の手のひらや足の裏等の有する圧覚機
能にできるだけ近いレベルの精密な圧覚機能を有
するロボツトのハンドや、人間レベルの対象物の
確実なソフトハンドリング把持等を実現すること
はできない。 However, each of these sensors that detect force distribution detects a two-dimensional distribution of force magnitude perpendicular to the pressure-receiving surface, and does not provide information about other directions. However, the skin on the human palms and soles of the feet can precisely detect the distribution of force in non-vertical directions. Therefore, with conventional sensors, robot hands have a precise pressure sensing function as close as possible to the pressure sensing function of human palms and soles of the feet, and soft handling grips of human-level objects are difficult to achieve. It cannot be realized.
[発明の目的]
この発明は、上述の問題点に鑑みて、受圧面に
垂直な分力のみならず、受圧面内の直角2方向の
分力の大きさ2次元分布をそれぞれ独立に検出で
きる圧覚センサアレイを提供することを目的とす
る。[Object of the Invention] In view of the above-mentioned problems, the present invention is capable of independently detecting not only the component force perpendicular to the pressure-receiving surface but also the two-dimensional distribution of the magnitude of the component force in two directions perpendicular to the pressure-receiving surface. The present invention aims to provide a pressure sensor array.
[発明の要点]
この発明は、受圧面に印加された力を、受圧面
に垂直な方向の分力Fzと、受圧面内の2方向の分
力Fx,Fyとの3分力に分解して検出できる感圧
モジユールを、基板上に高密度で面アレイ状に並
べて圧覚センサアレイを形成し、3つの分力の2
次元分布を精密に測定できるようにしたものであ
る。[Summary of the Invention] This invention converts the force applied to the pressure-receiving surface into three component forces: a component force F z in the direction perpendicular to the pressure-receiving surface, and component forces F x and F y in two directions within the pressure-receiving surface. A pressure sensor array is formed by arranging pressure-sensitive modules that can be separated and detected in a high-density area array on a substrate, and detects two of the three component forces.
This allows for precise measurement of dimensional distribution.
[発明の実施例]
以下、図面を参照してこの発明を詳細に説明す
る。[Embodiments of the Invention] Hereinafter, the present invention will be described in detail with reference to the drawings.
第6図はこの発明の実施例を示す。ここで、2
1は圧覚センサアレイを構成する受圧微細モジユ
ールとしての感圧モジユールであり、印加された
力を受ける上部の受圧板23と、その受圧板の下
に固着した1個または数個(通常は2個または3
個)の感圧セル25からなる。この感圧セル25
は、単結晶シリコンを例えばリング状の感圧構造
体とし、この感圧構造体の受圧面(すなわち、受
圧板23と接する面)に垂直な面に複数個の拡散
形ストレンゲージ27を形成し、これらのストレ
ンゲージの抵抗値の変化によつて、その受圧面に
印加され、力の3成分Fz,FxおよびFyを検出す
る。 FIG. 6 shows an embodiment of the invention. Here, 2
Reference numeral 1 designates a pressure-sensitive module as a pressure-receiving fine module constituting a pressure-sensor array, which includes an upper pressure-receiving plate 23 that receives applied force, and one or more (usually two) fixed under the pressure-receiving plate. or 3
The pressure-sensitive cells 25 are made up of 1) pressure-sensitive cells 25. This pressure sensitive cell 25
In this method, a ring-shaped pressure-sensitive structure is made of, for example, single crystal silicon, and a plurality of diffusion strain gauges 27 are formed on a surface perpendicular to the pressure-receiving surface of this pressure-sensitive structure (i.e., the surface in contact with the pressure-receiving plate 23). , the three force components F z , F x and F y applied to the pressure receiving surface are detected by changes in the resistance values of these strain gauges.
上述の感圧モジユール21を複数個、下部の共
通の基板29上に面アレイ状(マトリツクス状)
に高密度に並べて個着し、圧覚センサアレイを形
成する。その際、図示のように、感圧セル25の
下端部を基板29上の平行溝31またはセル毎に
設けた取付穴に垂直に嵌め合せて固着するとより
好ましい。なお、受圧板23の上部に、防塵や防
水等の機能を有する柔軟な比較的薄い保護膜を一
面に取付けてもよく、この薄膜と感圧セル25と
を直接に固着してもよい。また感圧セル25への
電源線や信号線が配線された基板29は、曲面上
に貼着できるような、ある程度柔軟なものでもよ
く、さらに圧覚センサアレイ全体をラバーのよう
な弾性体の中に介装してもよい。 A plurality of the pressure sensitive modules 21 described above are arranged in a plane array (matrix shape) on a common substrate 29 at the bottom.
They are individually attached in high-density rows to form a pressure sensor array. At this time, it is more preferable to vertically fit and fix the lower end of the pressure-sensitive cell 25 into the parallel groove 31 on the substrate 29 or into the mounting hole provided for each cell, as shown in the figure. Note that a flexible and relatively thin protective film having functions such as dustproofing and waterproofing may be attached to the entire upper part of the pressure receiving plate 23, and this thin film and the pressure sensitive cell 25 may be directly fixed. Further, the substrate 29 on which the power supply line and signal line to the pressure-sensitive cell 25 are wired may be a somewhat flexible material that can be attached to a curved surface, and the entire pressure-sensor array may be placed inside an elastic material such as rubber. may be interposed.
このように、受圧面に印加された力の3成分を
独立に検出する感圧モジユール21を面アレイ状
に多数並べて圧覚センサアレイを形成しているの
で、受圧板23に印加された力を基本的な直角座
標系の3方向分力に分解し、3方向分力の2次元
分布をそれぞれ独立に検出することができる。 In this way, a large number of pressure-sensitive modules 21 that independently detect the three components of the force applied to the pressure-receiving surface are arranged in a plane array to form a pressure-sensor array, so that the force applied to the pressure-receiving plate 23 can be basically detected. It is possible to decompose the force into components in three directions in a rectangular coordinate system, and detect the two-dimensional distribution of the forces in the three directions independently.
上述の感圧モジユール21からの3分力の圧力
信号は、基板29上に装着したスキヤナ増幅器集
積回路33によつて順次スキヤンされ、増幅され
て、後段の不図示のマイクロコンピユータの
CPU(中央演算処理部)による処理を容易にして
いる。このスキヤナ増幅器集積回路33からの出
力信号は不図示のA/D(アナログ−デジタル)
コンバータを経て上述のCPUに取り込まれ、基
本演算アルゴリズムで各点の3方向の分力、合成
力、3方向モーメント等が演算され、この演算結
果が不図示のメモリフアイルに格納される。 The three-component force pressure signal from the pressure-sensitive module 21 described above is sequentially scanned and amplified by the scanner amplifier integrated circuit 33 mounted on the board 29, and then sent to a microcomputer (not shown) at the subsequent stage.
It facilitates processing by the CPU (central processing unit). The output signal from the scanner amplifier integrated circuit 33 is an A/D (analog-digital) signal (not shown).
It is taken into the above-mentioned CPU via the converter, and the component force in three directions, the resultant force, the moment in three directions, etc. at each point are calculated using a basic calculation algorithm, and the calculation results are stored in a memory file (not shown).
そのメモリフアイルから読み出した受圧面の圧
力分布の時間的変化により、把持力不足による滑
りが演算され、保持力制御演算アルゴリズムによ
り滑りが起らぬソフトハンドリングが可能とな
る。また、把持・持ち上げ・挿入・回転等の基本
作業演算アルゴリズムを用いて高速・高レスポン
ス・高精度で上位コンピユータによるスーパーバ
イザリ制御や自律局所制御を行うことが可能とな
る。さらに、受圧板23の材質分布を適切に選定
することにより、演算により対象物の弾性を求め
ることが可能であるので、対象物の変形、破損を
避けたソフトハンドリングが可能であり、対象物
の材質判定、形状認識の補助入力とすることもで
きる。なお、スキヤナ増幅器33によるスキヤン
は、縦軸アドレスと横軸アドレスを用いて行うの
が配線数が少なくなるので好ましい。 Based on the temporal changes in the pressure distribution on the pressure receiving surface read from the memory file, slippage due to insufficient gripping force is calculated, and the holding force control calculation algorithm enables soft handling without slipping. In addition, it becomes possible to perform supervisory control and autonomous local control by a host computer at high speed, high response, and high precision using basic operation calculation algorithms such as grasping, lifting, insertion, and rotation. Furthermore, by appropriately selecting the material distribution of the pressure-receiving plate 23, it is possible to calculate the elasticity of the object, making it possible to perform soft handling that avoids deformation and damage of the object. It can also be used as auxiliary input for material determination and shape recognition. Note that it is preferable to perform scanning by the scanner amplifier 33 using vertical axis addresses and horizontal axis addresses because the number of wiring lines is reduced.
第7図は上述の感圧セル25のストレンゲージ
27の配置および配線の一例を示す。図示のよう
に、受圧面35と平行な線A−A′上の左右の外
縁および内縁近くに、形成された4個のストレン
ゲージ27−1〜27−4で、受圧面35に垂直
な力の成分Fzを検出し、また、その線A−A′と
直角の線B−B′の左右方向に角度α°傾いた2つの
線上の外縁近くに形成された4個のストレンゲー
ジ27−5〜27−8で、受圧面35に垂直な力
の一成分Fxを検出する。さらに、上述の角度α°傾
いた2つの線上のリング中央近くの材料力学的な
中立軸上の位置に形成された4個のストレンゲー
ジ27−9〜27−12で受圧面35に平行な力
の他の成分Fyを検出する。上述の角度α°は受圧面
8に垂直な力のみがその受圧面に印加されたと
き、ひずみを生じない位置の角度に選定され、例
えば図示のような円形リングの場合には39.6°の
近傍になる。 FIG. 7 shows an example of the arrangement and wiring of the strain gauge 27 of the pressure sensitive cell 25 described above. As shown in the figure, four strain gauges 27-1 to 27-4 formed near the left and right outer edges and inner edges on line A-A' parallel to the pressure-receiving surface 35 are used to apply force perpendicular to the pressure-receiving surface 35. Four strain gauges 27- are formed near the outer edges of two lines tilted at an angle α° in the left-right direction of the line B-B' which is perpendicular to the line A-A'. 5 to 27-8, one component F x of the force perpendicular to the pressure receiving surface 35 is detected. Furthermore, the four strain gauges 27-9 to 27-12 formed at positions on the mechanically neutral axis of the material near the center of the ring on the two lines tilted at the angle α° described above generate a force parallel to the pressure-receiving surface 35. Find other components F y of . The above-mentioned angle α° is selected at a position that does not cause distortion when only a force perpendicular to the pressure receiving surface 8 is applied to the pressure receiving surface, and for example, in the case of a circular ring as shown in the figure, it is around 39.6°. become.
このように、上述のストレンゲージ27−1〜
27−12の配置は高感度で、かつ他の2方向分
力に対して理論的に影響を受けない場所に設けら
れる。また、これらのストレンゲージ群は、例え
ば第8図A〜Cに示すように、それぞれブリツジ
に結線されて、力の成分に応じた電気信号Ez,
ExおよびEyを出力する。 In this way, the above-mentioned strain gauges 27-1 to
27-12 is placed at a location that is highly sensitive and is theoretically unaffected by force components in other two directions. In addition, these strain gauge groups are connected to bridges, respectively, as shown in FIGS. 8A to 8C, for example, and output electric signals E z ,
Print E x and E y .
さらに、上述の感圧セル25の製造方法の一例
について、第9図A,Bを参照して簡単に説明す
る。まず、所定の厚さ(例えば0.6mm)を有し、
所定の伝導形(例えばN形)と比抵抗(例えば1
〜10Ω・cm)を有し、かつ所定の結晶方位(例え
ば{111}方向の形成面)を有する単結晶シリコ
ンウエハ41の感圧セル相当領域43に第7図の
ような配置の拡散形ストレンゲージ27−1〜2
7−12の群、および金属配線をマスクレスイオ
ンビーム加工やAl蒸着などの集積回路製造技術
(プレーナ技術)によつて形成する。この製造技
術によれば、1枚のウエハ41に多数個の感圧セ
ルを作り込むことができる。 Furthermore, an example of a method for manufacturing the pressure-sensitive cell 25 described above will be briefly described with reference to FIGS. 9A and 9B. First, it has a predetermined thickness (e.g. 0.6 mm),
A given conductivity type (for example, N type) and specific resistance (for example, 1
~10 Ω·cm) and a predetermined crystal orientation (for example, a formation surface in the {111} direction), a diffusion type strain arranged as shown in FIG. Gauge 27-1~2
The groups 7 to 12 and metal wiring are formed by integrated circuit manufacturing technology (planar technology) such as maskless ion beam processing and Al vapor deposition. According to this manufacturing technique, a large number of pressure sensitive cells can be fabricated on one wafer 41.
感圧セルを作り込んだウエハ41からワーヤソ
ーカツト法やレーザ加工あるいはエツチカツトな
どの機械加工により、感圧セルを精度よく切り出
すことによつて、特性のよく揃つた小形(例えば
数mm〜1mm直径)のプレーナ形感圧セル25が得
られる。このように、半導体プロセスによつてス
トレンゲージ27を形成することができるので、
感圧モジユール21を極めて小形にすることがで
き、3分力の大きさの2次元分布を精密に検出す
ることができる。例えば、第6図には2個の感圧
セル25を1組として1個の感圧モジユール21
を形成したが、このような感圧モジユールを例え
ば1cm2当り25〜100個程度の高密度で基板29上
に集積した圧覚センサアレイを得ることができ
る。 By accurately cutting out pressure-sensitive cells from a wafer 41 on which pressure-sensitive cells have been fabricated using a wire saw cut method, laser processing, or mechanical processing such as etching cut, small-sized (for example, a few mm to 1 mm diameter) with well-uniformed characteristics can be made. A planar pressure sensitive cell 25 is obtained. In this way, since the strain gauge 27 can be formed by a semiconductor process,
The pressure sensitive module 21 can be made extremely small, and the two-dimensional distribution of the magnitude of three component forces can be detected precisely. For example, in FIG. 6, two pressure sensitive cells 25 are used as one set, and one pressure sensitive module
However, it is possible to obtain a pressure sensor array in which such pressure-sensitive modules are integrated on the substrate 29 at a high density of, for example, about 25 to 100 pressure-sensitive modules per cm 2 .
したがつて、この感圧センサアレイをロボツト
のハンドの手のひらや指に取付ければ、印加圧力
の3分力の2次元分布が精密に検出できるから、
所定の演算アルゴリズムを用いてCPUで演算す
ることにより人間における接触覚、力覚およびす
べり覚等に相当する高度な感覚情報をフイードバ
ツク信号としてハンド駆動制御系に帰還させるこ
とが可能となり、またこの圧覚センサアレイをロ
ボツトの足の裏に取付けることによつて高精度の
歩行制御が可能となる。 Therefore, by attaching this pressure-sensitive sensor array to the palm or fingers of a robot's hand, it is possible to precisely detect the two-dimensional distribution of the three components of applied pressure.
By performing calculations on the CPU using a predetermined calculation algorithm, it becomes possible to feed back high-level sensory information corresponding to the human sense of touch, force, and sliding as a feedback signal to the hand drive control system. By attaching a sensor array to the soles of the robot's feet, highly accurate walking control becomes possible.
なお、感圧セル25は第6図および第7図に示
す構成に必ずしも限定されない。例えば、リング
状感圧セルの場合にその内周面と外周面とにスト
レンゲージを形成してもよい。また、垂直南平面
にストレンゲージを形成してもよい。ただし、本
例で図示した感圧セル25を用いた場合には、次
のような利点を得ることができる。 Note that the pressure sensitive cell 25 is not necessarily limited to the configuration shown in FIGS. 6 and 7. For example, in the case of a ring-shaped pressure sensitive cell, strain gauges may be formed on the inner and outer peripheral surfaces thereof. Alternatively, a strain gauge may be formed in the vertical south plane. However, when the pressure sensitive cell 25 illustrated in this example is used, the following advantages can be obtained.
受圧板23にかかる荷重の分力を相互間の干
渉なしによく分離して検出できる。 The component forces of the load applied to the pressure receiving plate 23 can be well separated and detected without mutual interference.
受圧板に受けた荷重と検出出力との間の直線
性がよく、測定上のヒシテリシスがなく、かつ
ダイナミツクレンジが大きい。しかも、引張り
および圧縮の対として検出できる。 There is good linearity between the load applied to the pressure plate and the detected output, there is no hysteresis in measurement, and the dynamic range is large. Moreover, it can be detected as a pair of tension and compression.
寸法を極小化して高密度集積化できる。 Dimensions can be minimized and high-density integration can be achieved.
従来のIC技術で容易に作成できる
また、感圧モジユール21の近くにサーミスタ
ーのような温度検出器を設け、マイクロコンピユ
ータのCPUによりゲージ抵抗値の不均一補正や
温度補償を行うことにより、より高精度な3分力
の2次元分布測定が可能となる。 It can be easily created using conventional IC technology.In addition, by installing a temperature detector such as a thermistor near the pressure-sensitive module 21, and performing non-uniform gauge resistance correction and temperature compensation using the CPU of the microcomputer, it is possible to Highly accurate two-dimensional distribution measurement of three component forces becomes possible.
[発明の効果]
以上説明したように、この発明によれば、受圧
面に印加された力を直角座標系のたがいに直交す
る3方向の分力に分解して検出できる感圧モジユ
ールを、基板上に高密度でアレイ状に並べて圧覚
センサアレイを形成するようにしたので、印加さ
れた力の3分力の2次元分布を精密に検出するこ
とができる。[Effects of the Invention] As explained above, according to the present invention, a pressure-sensitive module capable of detecting force applied to a pressure-receiving surface by decomposing it into force components in three directions orthogonal to each other in a rectangular coordinate system is installed on a substrate. Since the pressure sensor array is formed by arranging them in an array at high density, it is possible to accurately detect the two-dimensional distribution of the three components of the applied force.
第1図および第2図はそれぞれ従来の力覚セン
サを示す斜視図、第3図、第4図A,Bおよび第
5図はそれぞれ従来の圧覚センサを示す斜視図、
第6図はこの発明の実施例を示す斜視図、第7図
は第6図の感圧セルのストレンゲージの配置およ
び配線例を示す説明図、第8図A〜Cはそれらの
ストレンゲージの結線状態を示す回路図、第9図
Aは第6図の感圧セルの製造方法の説明図で、第
9図BはそのA部を拡大して示す拡大図である。
1……弾性支持体、3……ストレンゲージ、5
……手首、7……リード線、9……前面電極箔、
11……後面電極箔、13……カーボン・フアイ
バ・フエルト、15……シリコンゴムコード、1
7……金属電極、19……細い棒、21……感圧
モジユール、23……受圧面、25……感圧セ
ル、27,27−1〜27−12……拡散形スト
レンゲージ、29……基板、31……平行溝、3
3……スキヤナ増幅器集積回路、35……受圧
面、41……単結晶シリコンウエハ、43……感
圧セル相当領域。
FIGS. 1 and 2 are perspective views showing conventional force sensors, FIGS. 3, 4 A, B, and 5 are perspective views showing conventional pressure sensors, respectively.
FIG. 6 is a perspective view showing an embodiment of the present invention, FIG. 7 is an explanatory diagram showing an example of the arrangement and wiring of the strain gauges of the pressure-sensitive cell in FIG. 6, and FIGS. FIG. 9A is an explanatory diagram of a method of manufacturing the pressure sensitive cell shown in FIG. 6, and FIG. 9B is an enlarged view showing part A thereof. 1... Elastic support, 3... Strain gauge, 5
... Wrist, 7 ... Lead wire, 9 ... Front electrode foil,
11...Rear electrode foil, 13...Carbon fiber felt, 15...Silicone rubber cord, 1
7... Metal electrode, 19... Thin rod, 21... Pressure sensitive module, 23... Pressure receiving surface, 25... Pressure sensitive cell, 27, 27-1 to 27-12... Diffusion type strain gauge, 29... ... Substrate, 31 ... Parallel groove, 3
3... Scanner amplifier integrated circuit, 35... Pressure receiving surface, 41... Single crystal silicon wafer, 43... Area corresponding to pressure sensitive cell.
Claims (1)
方向の分力と、前記受圧面内の2方向の分力との
3分力に分解して検出する感圧モジユールを、基
板上に複数個高密度でアレイ状に並べて構成する
と共に、前記基板上に前記感圧モジユールからの
3分力の圧力信号をスキヤンして増幅するスキヤ
ナ増幅器を配置してなることを特徴とする圧覚セ
ンサアレイ。1. A pressure-sensitive module that detects the force applied to the pressure-receiving surface by decomposing it into three component forces, that is, a component force in a direction perpendicular to the pressure-receiving surface and a component force in two directions within the pressure-receiving surface, is mounted on the board. A pressure sensor array comprising a plurality of pressure sensitive modules arranged in an array at high density, and a scanner amplifier for scanning and amplifying a pressure signal of three components from the pressure sensitive module on the substrate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59016771A JPS60160672A (en) | 1984-01-31 | 1984-01-31 | Sense of contact force sensor array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59016771A JPS60160672A (en) | 1984-01-31 | 1984-01-31 | Sense of contact force sensor array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60160672A JPS60160672A (en) | 1985-08-22 |
| JPH0560269B2 true JPH0560269B2 (en) | 1993-09-01 |
Family
ID=11925474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59016771A Granted JPS60160672A (en) | 1984-01-31 | 1984-01-31 | Sense of contact force sensor array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60160672A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7334489B2 (en) * | 2005-08-10 | 2008-02-26 | Custom Sensors & Technologies, Inc. | Dual rate force transducer |
| JP5156311B2 (en) * | 2007-09-19 | 2013-03-06 | 本田技研工業株式会社 | Transport system and contact sensor |
| JP2013257267A (en) * | 2012-06-14 | 2013-12-26 | Seiko Epson Corp | Force detection module, force detection device and robot |
| WO2022021038A1 (en) * | 2020-07-28 | 2022-02-03 | Shanghai Flexiv Robotics Technology Co., Ltd. | Multi-degree of freedom force and torque sensor and robot |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598782A (en) * | 1982-07-08 | 1984-01-18 | Fuji Photo Film Co Ltd | Radiation sensitized screen |
-
1984
- 1984-01-31 JP JP59016771A patent/JPS60160672A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60160672A (en) | 1985-08-22 |
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