JPH0560901A - Infrared optical element and manufacturing method thereof - Google Patents
Infrared optical element and manufacturing method thereofInfo
- Publication number
- JPH0560901A JPH0560901A JP3221514A JP22151491A JPH0560901A JP H0560901 A JPH0560901 A JP H0560901A JP 3221514 A JP3221514 A JP 3221514A JP 22151491 A JP22151491 A JP 22151491A JP H0560901 A JPH0560901 A JP H0560901A
- Authority
- JP
- Japan
- Prior art keywords
- silicone
- high purity
- lens
- polycrystalline silicon
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Surface Treatment Of Optical Elements (AREA)
- Optical Filters (AREA)
- Silicon Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、赤外線を集光あるいは
透過させる赤外線光学素子および、それを作成する方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared optical element that collects or transmits infrared light and a method for producing the same.
【0002】[0002]
【従来の技術】近年、赤外線を利用した機器や計測機器
が盛んに開発されている。特に遠赤外(5μm〜15μ
m)の光学機器(例えば、焦電型赤外線センサー等)の
開発が活発になってきている。2. Description of the Related Art In recent years, devices and measuring devices using infrared rays have been actively developed. Especially in the far infrared (5 μm to 15 μm
Development of the optical device (m) such as a pyroelectric infrared sensor is becoming active.
【0003】特に人体の位置や温度が測定できる焦電型
の赤外線センサーについては、人体の温度(体温)が3
00K付近であるため赤外線の波長が8μm〜12μm
に当り、この波長を透過する材料として、比較的安価な
単結晶の硅素(Si)、高価であるが性能の良いゲルマ
ニウム(Ge)、亜鉛化セレン(ZnSe)等の材料が
研磨や切削加工をほどこすことによってレンズやフィル
ターとして用いられてきた。(例えば、佐伯利一他、三
菱電気技報 vol.51No.11、1977年、P.745
〜P.748)Particularly in a pyroelectric infrared sensor capable of measuring the position and temperature of the human body, the temperature of the human body (body temperature) is 3
Since it is around 00K, the infrared wavelength is 8 μm to 12 μm.
As a material that transmits this wavelength, relatively inexpensive single crystal silicon (Si), expensive but high-performance germanium (Ge), selenium zinc oxide (ZnSe), etc. are used for polishing and cutting. It has been used as a lens or filter by rubbing. (For example, Riichi Saeki et al., Mitsubishi Electric Technical Report vol.51 No.11, 1977, P.745.
~ P.748)
【0004】[0004]
【発明が解決しようとする課題】従来安価な赤外線用の
レンズ系やフィルター系に用いられてきた硅素(Si)
は、CZ法(チョコラスキー法)やFZ法(フローティ
ング法)による単結晶が主に用いられてきた。しかしな
がら、CZ法は、1400℃以上の高温において石英ル
ツボ中で単結晶に成長させるため石英ルツボからの酸素
の混入が避けられない。またFZ法は、高真空中または
不活性ガス中において、高周波加熱により多結晶硅素を
単結晶化させるため、CZ法より酸素の混入は少ない
が、完全に酸素をなくすことが出来ない。そのためこれ
ら従来のCZ法やFZ法で作成した硅素は、微量の酸素
が混入しており、そのため約9μm付近に酸素による赤
外吸収帯を持っており、人体温検出には不都合であっ
た。また、亜鉛化セレン(ZnSe)やゲルマニウム
(Ge)は、9μm付近の赤外吸収は少ないが、高価で
あるという問題がある。SUMMARY OF THE INVENTION Silicon (Si) which has hitherto been used in inexpensive infrared lens systems and filter systems.
For C, a single crystal according to the CZ method (Chocolaski method) or the FZ method (floating method) has been mainly used. However, in the CZ method, since a single crystal is grown in a quartz crucible at a high temperature of 1400 ° C. or higher, mixing of oxygen from the quartz crucible cannot be avoided. Further, since the FZ method transforms polycrystalline silicon into a single crystal by high frequency heating in a high vacuum or in an inert gas, it contains less oxygen than the CZ method, but cannot completely eliminate oxygen. Therefore, the silicon produced by the conventional CZ method or FZ method contains a small amount of oxygen, and therefore has an infrared absorption band due to oxygen around 9 μm, which is inconvenient for human body temperature detection. Further, selenium zincate (ZnSe) and germanium (Ge) have a problem that they are expensive although they have little infrared absorption around 9 μm.
【0005】本発明は、上記問題点を解消し、安価で高
性能な赤外線光学素子を提供することを目的とする。An object of the present invention is to solve the above problems and provide an inexpensive and high-performance infrared optical element.
【0006】[0006]
【課題を解決するための手段】この目的を達成するため
に本発明は、高純度の硅素化合物と水素の混合ガスを9
00℃〜1200℃に加熱した基体上に流して得られる
純度が99.9999999%以上の多結晶硅素を使用
して、レンズやフィルター、回折格子等の光学素子とす
るものである。In order to achieve this object, the present invention uses a mixed gas of a high purity silicon compound and hydrogen as a gas.
An optical element such as a lens, a filter or a diffraction grating is formed by using a polycrystalline silicon having a purity of 99.999999999% or more obtained by flowing it onto a substrate heated to 00 ° C to 1200 ° C.
【0007】[0007]
【作用】本発明は、上記した高純度の多結晶硅素を使用
することにより、従来の単結晶硅素を使用したのでは得
られなかった赤外領域での高透過率のレンズやフィルタ
ーが得られるものである。これは、多結晶硅素を得る方
法として、高純度の硅素化合物と水素の混合ガスを使用
し、水素還元による熱分解析出法(CVD法)にて多結
晶硅素を得ているため、硅素中に酸素の混入がないから
である。したがって9μm帯の吸収もほとんどない多結
晶硅素のレンズやフィルターが得られる。According to the present invention, by using the above-mentioned high-purity polycrystalline silicon, a lens and a filter having a high transmittance in the infrared region, which cannot be obtained by using the conventional single-crystal silicon, can be obtained. It is a thing. This is because, as a method for obtaining polycrystalline silicon, a mixed gas of high-purity silicon compounds and hydrogen is used, and polycrystalline silicon is obtained by a thermal decomposition deposition method (CVD method) by hydrogen reduction. This is because there is no oxygen in the mixture. Therefore, a polycrystalline silicon lens or filter with almost no absorption in the 9 μm band can be obtained.
【0008】[0008]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0009】図1は、多結晶硅素を用いて、作成した赤
外線用レンズの断面図である。11はレンズ形状に加工
された多結晶硅素レンズ、12は反射防止膜である。図
2は、多結晶硅素を用いた赤外線フィルターの断面図で
ある。21は平面形状に加工された多結晶硅素フィルタ
−、22は反射防止膜である。また図3は、多結晶硅素
を作成するためのCVD装置の概略図である。 まず、
直径6mm、長さ600mmの円柱状の硅素棒32を用意
し、これを図3に示すように反応容器31内の所定箇所
にセットし、加熱用電源33によって通電加熱し、硅素
棒32を900℃にする。次に水素ボンベ34から流量
計37を通して、反応容器31に純度が99.9999
%の水素を毎分20l、硅素化合物ボンベ35から流量
計36を通して、反応容器31に純度が99.9999
%の硅素化合物のモノシラン(SiH4)を毎分10l
流し、16時間反応させて、直径約10cmの多結晶硅素
を得た。ここで、この多結晶硅素の純度を測定したとこ
ろ、99.9999999%の純度であった。FIG. 1 is a cross-sectional view of an infrared lens produced by using polycrystalline silicon. Reference numeral 11 is a polycrystalline silicon lens processed into a lens shape, and 12 is an antireflection film. FIG. 2 is a sectional view of an infrared filter using polycrystalline silicon. Reference numeral 21 is a polycrystalline silicon filter processed into a planar shape, and 22 is an antireflection film. Further, FIG. 3 is a schematic view of a CVD apparatus for producing polycrystalline silicon. First,
A cylindrical silicon rod 32 having a diameter of 6 mm and a length of 600 mm is prepared, set at a predetermined position in the reaction vessel 31 as shown in FIG. 3, and electrically heated by a heating power source 33, and the silicon rod 32 is set to 900 To ℃. Then, the purity is set to 99.9999 in the reaction vessel 31 from the hydrogen cylinder 34 through the flowmeter 37.
% Hydrogen at a rate of 20 l / min and a purity of 99.9999 in the reaction vessel 31 from the silicon compound cylinder 35 through the flow meter 36.
% Silicon monosilane (SiH 4 ) 10 l / min
It was made to flow and reacted for 16 hours to obtain polycrystalline silicon having a diameter of about 10 cm. Here, when the purity of this polycrystalline silicon was measured, it was 99.999999999%.
【0010】次に、この得られた多結晶硅素を曲率半径
が100mmの凸レンズ形状に加工し、反射防止膜12と
して硫化亜鉛(ZnS)を両面にそれぞれ2.25μm
コートして、赤外レンズとして、9μmの焦光特性を測
定した結果、良好な集光特性と光強度を得た。Next, the obtained polycrystalline silicon is processed into a convex lens shape having a radius of curvature of 100 mm, and zinc sulfide (ZnS) is used as the antireflection film 12 on both sides of 2.25 μm.
As a result of coating, an infrared lens having a focal point of 9 μm was measured, and good condensing characteristics and light intensity were obtained.
【0011】また、この多結晶硅素を中心から直径6mm
の所を除いた部分から、直径7mmφ、厚さ4mmの円板を
切り出し、この円板の両面を表面の最大荒さ(Rmax)
が、0.02μmとなるように鏡面加工を行い、両面に
反射防止膜22として硫化亜鉛(ZnS)を真空蒸着法
にて、2.25μmコーティングし、フィルターとし
た。そして、このZnSをコートした多結晶硅素の赤外
線の透過率(波長9μmの透過率)を測定した結果90
%であった。この結果を(表1)の資料No.1に示す。The polycrystalline silicon is 6 mm in diameter from the center.
A disk with a diameter of 7 mmφ and a thickness of 4 mm is cut out from the part except the part, and both sides of this disk have the maximum surface roughness (Rmax).
However, a mirror surface processing was performed so as to have a thickness of 0.02 μm, and zinc sulfide (ZnS) was coated on both surfaces as an antireflection film 22 by a vacuum deposition method to a thickness of 2.25 μm to obtain a filter. Then, the infrared transmittance (transmittance at a wavelength of 9 μm) of the polycrystalline silicon coated with ZnS was measured 90
%Met. The results are shown in Material No. 1 of (Table 1).
【0012】以下、同様の方法で多結晶硅素やフィルタ
ー作成時の原料ガスの種類、析出条件等を変えた時の硅
素の純度、赤外線透過率の結果等を(表1)の資料No.2
〜4に示す。なお、(表1)の資料No.5〜8は、本発明
以外の比較例である。In the following, the results of the polycrystalline silicon, the purity of the silicon and the infrared transmittance when the kind of the raw material gas at the time of making the filter, the kind of the deposition gas and the deposition conditions are changed by the same method (Table 1), Material No. 2
~ 4. In addition, Material Nos. 5 to 8 in (Table 1) are comparative examples other than the present invention.
【0013】[0013]
【表1】 [Table 1]
【0014】(表1)からわかるようにCVD法で作成
された高純度の多結晶硅素は、従来法で得られる単結晶
硅素よりも赤外線の透過率がよく、優れた赤外線光学素
子が得られる。As can be seen from (Table 1), the high-purity polycrystalline silicon produced by the CVD method has a better infrared transmittance than the single-crystal silicon obtained by the conventional method, and an excellent infrared optical element can be obtained. ..
【0015】[0015]
【発明の効果】以上の説明から明かなように、本発明の
CVD法による多結晶硅素を用いた赤外線光学素子は、
従来用いられてきCZ法やFZ法による単結晶硅素を用
いた赤外線光学素子よりも高性能であり、Ge、ZnS
e結晶を用いた赤外線光学素子よりも安価である。As is apparent from the above description, the infrared optical element using the polycrystalline silicon by the CVD method of the present invention is
Ge, ZnS, which has higher performance than the infrared optical element using the single crystal silicon by the CZ method or the FZ method, which has been conventionally used.
It is cheaper than the infrared optical element using the e crystal.
【図1】本発明の一実施例の赤外線レンズの断面図FIG. 1 is a sectional view of an infrared lens according to an embodiment of the present invention.
【図2】同実施例の赤外線フィルターの断面図FIG. 2 is a sectional view of the infrared filter of the same embodiment.
【図3】同実施例の多結晶硅素を作成するためのCVD
装置の概略図FIG. 3 is a CVD for producing the polycrystalline silicon of the same embodiment.
Device schematic
11 多結晶硅素レンズ 12、22 反射防止膜(ZnS) 21 多結晶硅素フィルター 31 反応容器 32 硅素棒 33 加熱用電源 34 水素ボンベ 35 硅素化合物ボンベ 36、37 流量計 11 Polycrystalline Silicon Lens 12, 22 Antireflection Film (ZnS) 21 Polycrystalline Silicon Filter 31 Reaction Vessel 32 Silicon Bar 33 Heating Power Source 34 Hydrogen Cylinder 35 Silicon Compound Cylinder 36, 37 Flowmeter
Claims (3)
度が99.9999999%以上の多結晶硅素をレンズ
形状あるいはフィルター形状に加工した赤外線光学素
子。1. An infrared optical element in which a polycrystalline silicon having a purity of 99.999999999% or more, which is formed by a CVD method (chemical vapor deposition method), is processed into a lens shape or a filter shape.
〜1200℃に加熱した基体上に流して得られる多結晶
硅素をレンズ形状に加工して赤外線光学レンズを得るこ
とを特徴とする赤外線光学素子の製造方法。2. A mixed gas of a silicon compound and hydrogen is heated to 900 ° C.
A method for producing an infrared optical element, characterized by processing an infrared optical lens by processing polycrystalline silicon obtained by pouring it onto a substrate heated to ˜1200 ° C. into a lens shape.
トリクロルシラン(SiHCl3)、ジクロルシラン
(SiHCl2)、および四塩化硅素(SiCl4)のい
ずれか一種である請求項2記載の赤外線光学素子の製造
方法。3. The silicon compound is monosilane (SiH 4 ),
The method for manufacturing an infrared optical element according to claim 2, wherein the method is any one of trichlorosilane (SiHCl 3 ), dichlorosilane (SiHCl 2 ), and silicon tetrachloride (SiCl 4 ).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221514A JPH0560901A (en) | 1991-09-02 | 1991-09-02 | Infrared optical element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221514A JPH0560901A (en) | 1991-09-02 | 1991-09-02 | Infrared optical element and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0560901A true JPH0560901A (en) | 1993-03-12 |
Family
ID=16767908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3221514A Pending JPH0560901A (en) | 1991-09-02 | 1991-09-02 | Infrared optical element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0560901A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007094431A (en) * | 2005-08-26 | 2007-04-12 | Matsushita Electric Works Ltd | Manufacturing method of semiconductor lens and semiconductor lens |
| WO2010074074A1 (en) * | 2008-12-24 | 2010-07-01 | 株式会社 村田製作所 | Infrared light-transmitting optical member and manufacturing method thereof, optical device, and optical apparatus |
| JP2010163353A (en) * | 2008-12-19 | 2010-07-29 | Tokuyama Corp | Optical member |
| JP2010170081A (en) * | 2008-12-25 | 2010-08-05 | Tokuyama Corp | Optical element for far infrared ray |
| WO2011033616A1 (en) * | 2009-09-16 | 2011-03-24 | 京セラオプテック株式会社 | Optical element and infrared ray sensor for living body |
| JP2012137479A (en) * | 2010-11-23 | 2012-07-19 | Raytheon Co | Wafer level packaged focal plane array |
| WO2016163419A1 (en) * | 2015-04-08 | 2016-10-13 | 国立大学法人京都大学 | METHOD FOR PROCESSING Cz-Si FOR INFRARED TRANSMITTING MEMBER, METHOD FOR MANUFACTURING INFRARED TRANSMITTING MEMBER, AND INFRARED TRANSMITTING MEMBER |
| WO2017126394A1 (en) * | 2016-01-18 | 2017-07-27 | 住友電気工業株式会社 | Optical component |
| JP2017128491A (en) * | 2016-01-18 | 2017-07-27 | 住友電気工業株式会社 | Optical components |
-
1991
- 1991-09-02 JP JP3221514A patent/JPH0560901A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007094431A (en) * | 2005-08-26 | 2007-04-12 | Matsushita Electric Works Ltd | Manufacturing method of semiconductor lens and semiconductor lens |
| JP2010163353A (en) * | 2008-12-19 | 2010-07-29 | Tokuyama Corp | Optical member |
| US8399836B2 (en) | 2008-12-24 | 2013-03-19 | Murata Manufacturing Co., Ltd. | Infrared ray transmissive optical member and manufacturing method thereof, optical device, and optical apparatus |
| WO2010074074A1 (en) * | 2008-12-24 | 2010-07-01 | 株式会社 村田製作所 | Infrared light-transmitting optical member and manufacturing method thereof, optical device, and optical apparatus |
| DE112009004379T5 (en) | 2008-12-24 | 2012-05-24 | Murata Manufacturing Co., Ltd. | Infrared ray transmitting optical element and manufacturing method therefor, optical device and optical device |
| JP5246892B2 (en) * | 2008-12-24 | 2013-07-24 | 株式会社村田製作所 | Infrared ray transmitting optical member and method for manufacturing the same, optical device, and optical apparatus |
| JP2010170081A (en) * | 2008-12-25 | 2010-08-05 | Tokuyama Corp | Optical element for far infrared ray |
| WO2011033616A1 (en) * | 2009-09-16 | 2011-03-24 | 京セラオプテック株式会社 | Optical element and infrared ray sensor for living body |
| JP2012137479A (en) * | 2010-11-23 | 2012-07-19 | Raytheon Co | Wafer level packaged focal plane array |
| WO2016163419A1 (en) * | 2015-04-08 | 2016-10-13 | 国立大学法人京都大学 | METHOD FOR PROCESSING Cz-Si FOR INFRARED TRANSMITTING MEMBER, METHOD FOR MANUFACTURING INFRARED TRANSMITTING MEMBER, AND INFRARED TRANSMITTING MEMBER |
| JPWO2016163419A1 (en) * | 2015-04-08 | 2018-01-25 | 国立大学法人京都大学 | Cz-Si processing method for infrared transmitting member, method for manufacturing infrared transmitting member, and infrared transmitting member |
| WO2017126394A1 (en) * | 2016-01-18 | 2017-07-27 | 住友電気工業株式会社 | Optical component |
| JP2017128491A (en) * | 2016-01-18 | 2017-07-27 | 住友電気工業株式会社 | Optical components |
| CN108474871A (en) * | 2016-01-18 | 2018-08-31 | 住友电气工业株式会社 | Optical element |
| US10807908B2 (en) | 2016-01-18 | 2020-10-20 | Sumitomo Electric Industries, Ltd. | Optical component |
| JP2020180378A (en) * | 2016-01-18 | 2020-11-05 | 住友電気工業株式会社 | Optical component |
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