JPH0562864A - Solid electrolytic capacitor and its manufacture - Google Patents
Solid electrolytic capacitor and its manufactureInfo
- Publication number
- JPH0562864A JPH0562864A JP22034691A JP22034691A JPH0562864A JP H0562864 A JPH0562864 A JP H0562864A JP 22034691 A JP22034691 A JP 22034691A JP 22034691 A JP22034691 A JP 22034691A JP H0562864 A JPH0562864 A JP H0562864A
- Authority
- JP
- Japan
- Prior art keywords
- solid electrolytic
- electrolytic capacitor
- capacitor
- metal case
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 66
- 239000007787 solid Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 4
- 239000011888 foil Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical class CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 12
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- 239000011737 fluorine Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000010419 fine particle Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 230000002431 foraging effect Effects 0.000 claims description 3
- 229920001519 homopolymer Polymers 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000032683 aging Effects 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- 239000007784 solid electrolyte Substances 0.000 abstract description 2
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 abstract 3
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は固体電解質として、ＴＣ
ＮＱ錯塩を用いた固体電解コンデンサに関するものであ
る。The present invention relates to a solid electrolyte, TC
The present invention relates to a solid electrolytic capacitor using NQ complex salt.
【０００２】[0002]
【従来の技術】電解質としてＴＣＮＱ錯塩を用いた有機
半導体固体電解コンデンサに関しては、本願出願人が既
に種々提案している。すなわち、特開昭５８−１９１４
１４号（Ｈ０１Ｇ ９／０２）等に開示されているＮ位
をアルキル基で置換したイソキノリンとのＴＣＮＱ錯塩
を用いた固体電解コンデンサは、特に優れた高周波特性
を持っているため、スイッチング電源用などに広く採用
されているが、近年、機器の小型化の必要性から、この
種のコンデンサも表面実装用部品（チップ部品）として
の対応を迫られている。The applicant of the present invention has already proposed various organic semiconductor solid electrolytic capacitors using a TCNQ complex salt as an electrolyte. That is, JP-A-58-1914
No. 14 (H01G 9/02) and the like, a solid electrolytic capacitor using a TCNQ complex salt with isoquinoline in which the N-position is substituted with an alkyl group has particularly excellent high-frequency characteristics, and therefore is used for switching power supplies, etc. However, in recent years, due to the need for miniaturization of equipment, this type of capacitor is also required to be used as a surface mounting component (chip component).
【０００３】しかしながら、上述の従来技術によるコン
デンサにおいては、表面実装用部品として必須の、半田
付け時の熱ストレス（通常２３０℃）には耐えられず、
著しい漏れ電流増大等の特性劣化を招くという欠点があ
った。However, the above-mentioned conventional capacitor cannot withstand the thermal stress (usually 230 ° C.) at the time of soldering, which is indispensable for surface mounting parts,
There is a drawback in that the characteristics such as a remarkable increase in leakage current are brought about.
【０００４】この欠点を改善するために、本願出願人
は、１５０℃以上の温度で電圧処理（エージング）を行
うことを提案している。すなわち、特開平２−２７８８
０７号公報（Ｈ０１Ｇ ９／０４）に記載されているよ
うに、コンデンサを、１５０℃以上の所定の温度に加熱
した円筒状穴あき熱板に収納し、定格電圧を印加しなが
らエージングを行うものであり、これによって、漏れ電
流による特性劣化を防ぐものである。In order to remedy this drawback, the applicant of the present application proposes to carry out a voltage treatment (aging) at a temperature of 150 ° C. or higher. That is, JP-A-2-2788
No. 07 (H01G 9/04), a capacitor is housed in a cylindrical perforated hot plate heated to a predetermined temperature of 150 ° C. or higher, and is subjected to aging while applying a rated voltage. This prevents the characteristic deterioration due to the leakage current.
【０００５】[0005]
【発明が解決しようとする課題】上述の従来技術によれ
ば漏れ電流による特性劣化を防ぐ事は可能であるが、コ
ンデンサを加熱した円筒状穴あき熱板に収納し定格電圧
を印加することは、極めて作業性が悪く、量産に適さな
いという欠点があった。According to the above-mentioned prior art, it is possible to prevent the characteristic deterioration due to the leakage current, but it is possible to store the capacitor in the heated cylindrical perforated heating plate and apply the rated voltage. However, the workability was extremely poor and it was not suitable for mass production.
【０００６】[0006]
【課題を解決するための手段】本発明は上述の従来技術
の欠点を解決するためのものであり、陽極箔と陰極箔と
をセパレータを介して巻回したコンデンサ素子と、該コ
ンデンサ素子に含浸後冷却固化されたＴＣＮＱ塩と、該
コンデンサを封入する金属ケースとからなる固体電解コ
ンデンサにおいて、前記金属ケースの底面をフッ素樹脂
で被覆したことを特徴とするものである。また、本発明
は、陽極箔と陰極箔とをセパレータを介して巻回したコ
ンデンサ素子と、該コンデンサ素子に含浸後冷却固化さ
れたＴＣＮＱ塩と、該コンデンサを封入する金属ケース
とからなる固体電解コンデンサにおいて、前記金属ケー
スの底面をフッ素樹脂で被覆するとともに、１５０℃以
上の温度の溶融した半田中に浸漬させエージングを行う
ことを特徴とするものである。DISCLOSURE OF THE INVENTION The present invention is to solve the above-mentioned drawbacks of the prior art. A capacitor element in which an anode foil and a cathode foil are wound around a separator, and the capacitor element is impregnated. A solid electrolytic capacitor comprising a post-cooled and solidified TCNQ salt and a metal case enclosing the capacitor is characterized in that the bottom surface of the metal case is coated with a fluororesin. Further, the present invention provides a solid electrolytic device comprising a capacitor element in which an anode foil and a cathode foil are wound with a separator interposed therebetween, a TCNQ salt which is cooled and solidified after impregnating the capacitor element, and a metal case enclosing the capacitor. In the capacitor, the bottom surface of the metal case is covered with a fluororesin and is immersed in molten solder having a temperature of 150 ° C. or higher for aging.
【０００７】[0007]
【作用】本発明では、固体電解コンデンサを１５０℃以
上の温度の溶融した半田中に浸漬させエージングを行う
ので、漏れ電流を修復するために生じる絶縁被膜の耐熱
性が増し、半田付け時に相当する高温下に放置した場合
でも漏れ電流の増大を押さえる。また、金属ケースの底
面をフッ素樹脂で被覆することにより、エージング後に
溶融半田から取り出した際、金属ケースに不要な半田が
付着することが防止される。In the present invention, the solid electrolytic capacitor is immersed in molten solder having a temperature of 150 ° C. or higher for aging, so that the heat resistance of the insulating coating produced to restore the leakage current is increased, which is suitable for soldering. It suppresses the increase in leakage current even when left at high temperature. Further, by covering the bottom surface of the metal case with the fluororesin, it is possible to prevent unnecessary solder from adhering to the metal case when the metal case is taken out from the molten solder after aging.
【０００８】[0008]
【実施例】以下、本発明の実施例を説明する。図１は本
発明に使用するコンデンサ素子を示す。まず、高純度
（９９．９９％以上）のアルミニウム箔を化学的処理に
より粗面化し、実効表面積を増加させるためのいわゆる
エッチング処理を行う。次に電解液中にて、電気化学的
にアルミニウム箔表面に酸化被膜（酸化アルミニウムの
薄膜）を形成する（化成処理）。次にエッチング処理、
化成処理を行ったアルミニウム箔を陽極箔１とし、対向
陰極箔２との間にセパレータ３としてマニラ紙をはさ
み、図１に示すように円筒状に巻き取る。このように、
アルミニウム箔に酸化被膜を形成した陽極箔１と陰極箔
２との両電極箔間にセパレータ３を巻回して、コンデン
サ素子６が形成される。なお、４、５はリード線であ
る。EXAMPLES Examples of the present invention will be described below. FIG. 1 shows a capacitor element used in the present invention. First, a so-called etching treatment for increasing the effective surface area is performed by roughening a high-purity (99.99% or more) aluminum foil by a chemical treatment. Next, an oxide film (a thin film of aluminum oxide) is electrochemically formed on the surface of the aluminum foil in the electrolytic solution (chemical conversion treatment). Next, etching process,
The aluminum foil which has been subjected to the chemical conversion treatment is used as the anode foil 1, sandwiched between the counter cathode foil 2 and the manila paper as the separator 3 and wound into a cylindrical shape as shown in FIG. in this way,
The separator element 3 is wound between both electrode foils of the anode foil 1 and the cathode foil 2, which are formed by forming an oxide film on the aluminum foil, to form the capacitor element 6. In addition, 4 and 5 are lead wires.
【０００９】次に、コンデンサ素子６に熱処理を施し、
セパレータ３を構成するマニラ紙を炭化することによっ
て、繊維の細径化による密度の低下を図る。なお、セパ
レータとして、マニラ紙をあらかじめ所定の温度と時間
（例えば２４０℃、４０分）で熱処理を施して炭化した
ものや、カーボン不織布を用い、陽極箔と陰極箔との間
にはさんで巻回してもよい。Next, heat treatment is applied to the capacitor element 6,
By carbonizing the manila paper forming the separator 3, the density is reduced due to the thinning of the fibers. As the separator, manila paper which has been carbonized by heat treatment at a predetermined temperature and time (for example, 240 ° C., 40 minutes) or a carbon nonwoven fabric is used, and is wound between the anode foil and the cathode foil. You can turn it.
【００１０】次に、図２に示すように、金属（アルミ）
ケース７内で ＴＣＮＱ塩、例えば、Ｎ，Ｎ−ペンタメ
チレンルチジニウム2・ＴＣＮＱ4とＮ−フェネチルルチ
ジニウム・ＴＣＮＱ2の等量混合物を３００℃で加熱融解
させ、その中に予熱した化成・炭化処理済みのコンデン
サ素子６を挿入し、融解したＴＣＮＱ塩をコンデンサ素
子６に含浸させ急冷する。その後、ＴＣＮＱ塩とは反応
しにくい樹脂９を封入し、さらにエポキシ樹脂等１０で
封口する。Next, as shown in FIG. 2, metal (aluminum)
In case 7, a TCNQ salt, for example, an equivalent mixture of N, N-pentamethylene rutidinium 2 · TCNQ 4 and N-phenethyl rutidinium · TCNQ 2 was heated and melted at 300 ° C., and preheated to the formation reaction. Insert the carbonized capacitor element 6, impregnate the molten TCNQ salt into the capacitor element 6, and quench. After that, a resin 9 that does not easily react with the TCNQ salt is sealed, and further sealed with an epoxy resin 10 or the like.
【００１１】さらに、図３に示すようにアルミケース７
の底面７ａをフッ素樹脂１１で被覆する。被覆の方法は
種々考えられるが、たとえば、フッ素を含む高分子の溶
液から溶媒を揮発させることによりフッ素被膜を形成す
るようにすれば、膜厚の管理が容易になる。また、水を
溶媒として用いれば安全性が高い。図４はこのようにし
て形成したフッ素被膜の状態を示す拡大図である。Further, as shown in FIG. 3, an aluminum case 7 is provided.
The bottom surface 7a of the is covered with the fluororesin 11. Although various coating methods are conceivable, for example, if the solvent is volatilized from a solution of a polymer containing fluorine to form a fluorine coating, the film thickness can be easily controlled. In addition, if water is used as a solvent, safety is high. FIG. 4 is an enlarged view showing the state of the fluorine coating thus formed.
【００１２】また、フッ素樹脂は次式で示されるような
構造の４フッ化されたホモポリマの、０．３ミクロン以
下の微粒子の密着したものを用いることにより、図５に
示すように、アルミケース７との密着強度の高い被膜が
形成される。Further, as the fluororesin, a tetrafluorinated homopolymer having a structure represented by the following formula, in which fine particles of 0.3 μm or less are adhered, is used. A film having high adhesion strength with No. 7 is formed.
【００１３】[0013]
【化１】 [Chemical 1]
【００１４】このようにして形成されたコンデンサを、
図６に示すような装置によりエージングを行う。すなわ
ち、半田槽１２内で半田１３を溶融し１５０℃以上の一
定温度（たとえば２２０℃）に維持し、この溶融半田１
３中にコンデンサを浸漬する。このとき、コンデンサの
陽極リード５と溶融半田１３との間に定格電圧を印加
し、エージングを行う。エージング時間は３０秒程度で
ある。The capacitor thus formed is
Aging is performed by an apparatus as shown in FIG. That is, the solder 13 is melted in the solder bath 12 and maintained at a constant temperature of 150 ° C. or higher (for example, 220 ° C.).
Immerse the capacitor in 3. At this time, a rated voltage is applied between the anode lead 5 of the capacitor and the molten solder 13 to perform aging. The aging time is about 30 seconds.
【００１５】このような方法により、エージングを作業
性よく行うことができるとともに、アルミケース７の底
面７ａをフッ素樹脂１１で被覆しているので、底面７ａ
に半田が付着することはない。なお、図７はアルミケー
ス７の底面７ａをフッ素樹脂１１で被覆しない従来のコ
ンデンサを、本発明による方法でエージングを行った場
合の図であり、アルミケース７の底面７ａに半田１３が
付着し、この除去作業が別途必要となる。With this method, aging can be performed with good workability, and since the bottom surface 7a of the aluminum case 7 is covered with the fluororesin 11, the bottom surface 7a is formed.
No solder will adhere to the. FIG. 7 is a diagram showing a case where a conventional capacitor in which the bottom surface 7a of the aluminum case 7 is not covered with the fluororesin 11 is aged by the method according to the present invention, and the solder 13 is attached to the bottom surface 7a of the aluminum case 7. , This removal work is required separately.
【００１６】[0016]
【発明の効果】以上のように本発明によれば、陽極箔と
陰極箔とをセパレータを介して巻回したコンデンサ素子
と、該コンデンサ素子に含浸後冷却固化されたＴＣＮＱ
塩と、該コンデンサを封入する金属ケースとからなる固
体電解コンデンサにおいて、前記金属ケースの底面をフ
ッ素樹脂で被覆したものであり、さらに、このように形
成した固体電解コンデンサを１５０℃以上の温度の溶融
した半田中に浸漬させエージングを行うようにしたの
で、作業性良くエージングを行うことができ、半田付け
後においても漏れ電流特性の極めて優れた固体電解コン
デンサを製造することができる。As described above, according to the present invention, a capacitor element in which an anode foil and a cathode foil are wound with a separator interposed therebetween, and a TCNQ which is cooled and solidified after impregnation of the capacitor element.
A solid electrolytic capacitor comprising a salt and a metal case encapsulating the capacitor, wherein the bottom surface of the metal case is coated with a fluororesin, and the solid electrolytic capacitor formed in this manner is used at a temperature of 150 ° C. or higher. Since aging is performed by immersing in a molten solder, aging can be performed with good workability, and a solid electrolytic capacitor having extremely excellent leakage current characteristics even after soldering can be manufactured.
【図１】本発明に用いるコンデンサ素子を示す斜視図で
ある。FIG. 1 is a perspective view showing a capacitor element used in the present invention.
【図２】本発明の固体電解コンデンサの断面図である。FIG. 2 is a sectional view of the solid electrolytic capacitor of the present invention.
【図３】本発明の固体電解コンデンサを示す図である。FIG. 3 is a diagram showing a solid electrolytic capacitor of the present invention.
【図４】本発明の固体電解コンデンサのフッ素被膜を示
す図である。FIG. 4 is a diagram showing a fluorine coating of the solid electrolytic capacitor of the present invention.
【図５】本発明の固体電解コンデンサのフッ素被膜を示
す図である。FIG. 5 is a diagram showing a fluorine coating of the solid electrolytic capacitor of the present invention.
【図６】本発明の固体電解コンデンサのエージング方法
を示す図である。FIG. 6 is a diagram showing an aging method for a solid electrolytic capacitor of the present invention.
【図７】従来技術による固体電解コンデンサのエージン
グ後の状態を示す図である。FIG. 7 is a diagram showing a state of a conventional solid electrolytic capacitor after aging.
１ 陽極箔 ２ 陰極箔 ３ セパレータ ４、５ リード線 ６ コンデンサ素子 ７ アルミケース ８ ＴＣＮＱ塩 ９ 樹脂 １０ エポキシ樹脂 １１ フッ素樹脂被膜 １２ 半田槽 １３ 半田 1 Anode foil 2 Cathode foil 3 Separator 4, 5 Lead wire 6 Capacitor element 7 Aluminum case 8 TCNQ salt 9 Resin 10 Epoxy resin 11 Fluorine resin coating 12 Solder tank 13 Solder
Claims (7)
巻回したコンデンサ素子と、該コンデンサ素子に含浸後
冷却固化されたＴＣＮＱ塩と、該コンデンサを封入する
金属ケースとからなる固体電解コンデンサにおいて、前
記金属ケースの底面をフッ素樹脂で被覆したことを特徴
とする固体電解コンデンサ。1. A solid electrolytic capacitor comprising a capacitor element in which an anode foil and a cathode foil are wound with a separator interposed therebetween, a TCNQ salt which is cooled and solidified after impregnating the capacitor element, and a metal case enclosing the capacitor. In the solid electrolytic capacitor, the bottom surface of the metal case is covered with a fluororesin.
いて、フッ素樹脂の被膜はフッ素を含む高分子の溶液か
ら溶媒を揮発させることにより形成されるフッ素を含む
高分子被膜であることを特徴とする固体電解コンデン
サ。2. The solid electrolytic capacitor according to claim 1, wherein the fluororesin coating is a fluorine-containing polymer coating formed by volatilizing a solvent from a fluorine-containing polymer solution. Solid electrolytic capacitor.
を特徴とする請求項２記載の固体電解コンデンサ。3. The solid electrolytic capacitor according to claim 2, wherein the solvent of the solution containing fluorine is water.
子の密着したものである請求項２記載の固体電解コンデ
ンサ。4. The solid electrolytic capacitor according to claim 2, wherein the fluororesin is a polymer fine particle containing fluorine adhered thereto.
マが４フッ化されたものである請求項４記載の固体電解
コンデンサ。5. The solid electrolytic capacitor according to claim 4, wherein the fine particles of the polymer containing fluorine are tetrafluorinated homopolymers.
クロン以下のものである請求項４記載の固体電解コンデ
ンサ。6. The solid electrolytic capacitor according to claim 4, wherein the fine particles of the polymer containing fluorine are 0.3 μm or less.
巻回したコンデンサ素子と、該コンデンサ素子に含浸後
冷却固化されたＴＣＮＱ塩と、該コンデンサを封入する
金属ケースとからなる固体電解コンデンサの製造方法に
おいて、前記金属ケースの底面をフッ素樹脂で被覆する
とともに、１５０℃以上の温度の溶融した半田中に浸漬
させエージングを行うことを特徴とする固体電解コンデ
ンサの製造方法。7. A solid electrolytic capacitor comprising a capacitor element in which an anode foil and a cathode foil are wound with a separator interposed therebetween, a TCNQ salt which is cooled and solidified after impregnating the capacitor element, and a metal case enclosing the capacitor. The method for manufacturing a solid electrolytic capacitor according to the above item (1), wherein the bottom surface of the metal case is covered with a fluororesin, and the metal case is immersed in molten solder having a temperature of 150 ° C. or higher for aging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22034691A JP2714281B2 (en) | 1991-08-30 | 1991-08-30 | Solid electrolytic capacitor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22034691A JP2714281B2 (en) | 1991-08-30 | 1991-08-30 | Solid electrolytic capacitor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0562864A true JPH0562864A (en) | 1993-03-12 |
| JP2714281B2 JP2714281B2 (en) | 1998-02-16 |
Family
ID=16749704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22034691A Expired - Fee Related JP2714281B2 (en) | 1991-08-30 | 1991-08-30 | Solid electrolytic capacitor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2714281B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6567988B1 (en) | 1996-09-02 | 2003-05-20 | Sony Corporation | Video signal transmission apparatus and video signal transmission method |
| KR20210132054A (en) | 2019-01-31 | 2021-11-03 | 셀 메디신 가부시키가이샤 | Inorganic salt protein complex medical device |
-
1991
- 1991-08-30 JP JP22034691A patent/JP2714281B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6567988B1 (en) | 1996-09-02 | 2003-05-20 | Sony Corporation | Video signal transmission apparatus and video signal transmission method |
| KR20210132054A (en) | 2019-01-31 | 2021-11-03 | 셀 메디신 가부시키가이샤 | Inorganic salt protein complex medical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2714281B2 (en) | 1998-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01225112A (en) | Method of manufacture of aluminum electrolytic capacitor and capacitor with unified anode obtained by the method | |
| JPH0562864A (en) | Solid electrolytic capacitor and its manufacture | |
| JP3550232B2 (en) | Method of manufacturing tab terminal for electrolytic capacitor | |
| JP3123772B2 (en) | Organic semiconductor solid electrolytic capacitors | |
| JPH06163323A (en) | Manufacture of organic semiconductor solid state electrolytic capacitor | |
| JP3438900B2 (en) | Solid electrolytic capacitors | |
| JPH0744131B2 (en) | Method for manufacturing solid electrolytic capacitor | |
| JP2950898B2 (en) | Manufacturing method of organic semiconductor solid electrolytic capacitor | |
| JP3326196B2 (en) | Method for manufacturing solid electrolytic capacitor | |
| JPH06151257A (en) | Manufacture of organic semiconductor solid electrolytic capacitor | |
| JP2755767B2 (en) | Manufacturing method of organic semiconductor solid electrolytic capacitor | |
| KR0154126B1 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| JP3123773B2 (en) | Organic semiconductor solid electrolytic capacitors | |
| KR100280291B1 (en) | Dielectric crack recovery method of aluminum thin film for aluminum electrolytic capacitor | |
| JPH09260215A (en) | Manufacture of solid electrolytic capacitor | |
| JP3162738B2 (en) | Solid electrolytic capacitors | |
| KR100434216B1 (en) | Making method of capacitor by using solid electrolyte | |
| JPH047086B2 (en) | ||
| JP2000277389A (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| JP3474986B2 (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| JP3093810B2 (en) | Method for manufacturing solid electrolytic capacitor | |
| JPH04312910A (en) | Production of solid-state electrolytic capacitor | |
| JPS60214519A (en) | Method of producing solid electrolytic condenser | |
| JP2001085277A (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| JPH0467331B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071031 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081031 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081031 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 12 Free format text: PAYMENT UNTIL: 20091031 |
|
| LAPS | Cancellation because of no payment of annual fees |