JPH0563345A - Printed board - Google Patents

Printed board

Info

Publication number
JPH0563345A
JPH0563345A JP22194691A JP22194691A JPH0563345A JP H0563345 A JPH0563345 A JP H0563345A JP 22194691 A JP22194691 A JP 22194691A JP 22194691 A JP22194691 A JP 22194691A JP H0563345 A JPH0563345 A JP H0563345A
Authority
JP
Japan
Prior art keywords
pad
printed board
recognition
soldering
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22194691A
Other languages
Japanese (ja)
Inventor
Tomiji Sato
富治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22194691A priority Critical patent/JPH0563345A/en
Publication of JPH0563345A publication Critical patent/JPH0563345A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To facilitate recognition of imperfect connection caused by not yet soldering, solder lack, etc., and recognition of electronic parts mounting or the like, by arranging pads divided into a plurality of segments, on a printed board. CONSTITUTION:On a printed board 6, pads 3a, 3b, 4a, 4b which are divided into a plurality of segments are formed as the mounting parts of lead 1, 2 of electronic parts. The pad 3b is connected with the pad 4a via a wiring pattern 5. When the soldering connection after mounted electronic parts are soldered is recognized, the recognition is possible by bringing a tester into contact with the adjacent pad, without touching the lead wires.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はプリント基板に関する。FIELD OF THE INVENTION This invention relates to printed circuit boards.

【０００２】[0002]

【従来の技術】従来のプリント基板について図面を参照
して詳細に説明する。図２は、従来の一例を示す斜視図
である。図２に示すプリント基板は、に電子部品の１リ
ード１１，１２当り１パッド１３，１４が用意されてい
る。この実装方法は、電子部品の半田付け後の半田付け
接続の確認に際し、リード１１，１２とパッド１３，１
４の両方をテスターにて触れる必要があった。2. Description of the Related Art A conventional printed circuit board will be described in detail with reference to the drawings. FIG. 2 is a perspective view showing a conventional example. The printed circuit board shown in FIG. 2 has one pad 13, 14 for each lead 11, 12 of an electronic component. This mounting method is used for confirming the soldered connection after the soldering of the electronic components, and the leads 11, 12 and the pads 13, 1
Both 4 had to be touched with a tester.

【０００３】[0003]

【発明が解決しようとする課題】上述した従来のプリン
ト基板は、実装した電子部品の半田付け後の半田付け接
続の確認に際し、半田付リードとパッドの両方をテスタ
ーにて触れる必要があり、未半田、半田不足等に依る接
続不良に対する確認が、困難な作業となる欠点があっ
た。In the conventional printed circuit board described above, it is necessary to touch both the soldering lead and the pad with the tester when confirming the soldering connection after soldering the mounted electronic parts. There is a drawback in that it is difficult to confirm a connection failure due to solder or insufficient solder.

【０００４】[0004]

【課題を解決するための手段】本発明のプリント基板
は、複数に分割されたパッドを備えている。The printed circuit board of the present invention comprises a plurality of divided pads.

【０００５】[0005]

【実施例】次に、本発明について図面を参照して詳細に
説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings.

【０００６】図１は、本発明の一実施例を示す斜視図で
ある。図１に示すプリント基板は、電子部品のリード
１，２の実装部としてパッド３ａ，３ｂ，４ａ，４ｂが
用意されている。パッド３ｂは、配線パターン５を経由
しパッド４ａに接続される。FIG. 1 is a perspective view showing an embodiment of the present invention. The printed circuit board shown in FIG. 1 is provided with pads 3a, 3b, 4a and 4b as mounting portions for leads 1 and 2 of electronic components. The pad 3b is connected to the pad 4a via the wiring pattern 5.

【０００７】[0007]

【発明の効果】本発明のプリント基板は、プリント基板
における電子部品の実装部を複数に分割されたパッドを
備えているようにしたので、実装した電子部品の半田付
け後の半田付け接続の確認に際し、リードに触れずに、
隣接するパッドをテスターにて触れることで可能とな
り、未半田、半田不足等に依る接続不良に対する確認、
並びに電子部品の実装等に対する確認が、容易になると
いう効果を有する。Since the printed circuit board of the present invention is provided with a pad in which the electronic component mounting portion of the printed circuit board is divided into a plurality of parts, it is possible to confirm the soldering connection after the mounted electronic component is soldered. Without touching the reed,
It becomes possible by touching adjacent pads with a tester, and confirmation of connection failure due to unsoldered solder, insufficient solder, etc.
In addition, it is possible to easily confirm the mounting of electronic components.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図２】従来の一例を示す斜視図である。FIG. 2 is a perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

１，２ リード ３ａ，３ｂ，４ａ，４ｂ パッド ５ 配線パターン ６ プリント基板 1, 2 leads 3a, 3b, 4a, 4b pad 5 wiring pattern 6 printed circuit board

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 複数分割された実装部を有することを特
徴とするプリント基板。1. A printed circuit board having a plurality of divided mounting portions.
JP22194691A 1991-09-03 1991-09-03 Printed board Pending JPH0563345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22194691A JPH0563345A (en) 1991-09-03 1991-09-03 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22194691A JPH0563345A (en) 1991-09-03 1991-09-03 Printed board

Publications (1)

Publication Number Publication Date
JPH0563345A true JPH0563345A (en) 1993-03-12

Family

ID=16774636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22194691A Pending JPH0563345A (en) 1991-09-03 1991-09-03 Printed board

Country Status (1)

Country Link
JP (1) JPH0563345A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174795A (en) * 1985-01-30 1986-08-06 株式会社東芝 Printed wiring board and checking for soldering of chip partto be mounted thereon
JPS61269394A (en) * 1985-05-24 1986-11-28 株式会社日立製作所 How to mount circuit components
JPH02222192A (en) * 1989-02-22 1990-09-04 Matsushita Electric Works Ltd Wiring pattern for printed board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174795A (en) * 1985-01-30 1986-08-06 株式会社東芝 Printed wiring board and checking for soldering of chip partto be mounted thereon
JPS61269394A (en) * 1985-05-24 1986-11-28 株式会社日立製作所 How to mount circuit components
JPH02222192A (en) * 1989-02-22 1990-09-04 Matsushita Electric Works Ltd Wiring pattern for printed board

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19970805