JPH0563663U - Flux applicator - Google Patents
Flux applicatorInfo
- Publication number
- JPH0563663U JPH0563663U JP546192U JP546192U JPH0563663U JP H0563663 U JPH0563663 U JP H0563663U JP 546192 U JP546192 U JP 546192U JP 546192 U JP546192 U JP 546192U JP H0563663 U JPH0563663 U JP H0563663U
- Authority
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- Prior art keywords
- circuit board
- printed circuit
- straightening
- flux
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 集塵機による吸引作用を整流板の全域におい
て均一化するとともに、もっとも吸引力の強い中央部と
プリント基板との間隔を大きくして溶媒の気化距離を十
分にとり、プリント基板の上面が余剰フラックスによっ
て汚損されるのを合理的に防止し、プリント基板の後処
理工程を軽減、もしくは、省略することにある。
【構成】 スプレー式フラックス塗布装置において、整
流板とプリント基板の間隔を、整流板の上流側と下流側
を小さく、中央部に至るに従い大きくすること、整流孔
の孔径を、整流板の中央に至るに従い小径としたことを
特徴とする。
(57) [Summary] [Purpose] The suction action by the dust collector is made uniform over the entire area of the straightening plate, and the distance between the center part, which has the strongest suction force, and the printed circuit board is widened to ensure a sufficient vaporization distance of the solvent and print. The reason is to reasonably prevent the upper surface of the substrate from being contaminated by excess flux, and to reduce or omit the post-processing step of the printed circuit board. [Composition] In the spray type flux coating device, the distance between the straightening vane and the printed circuit board is made smaller on the upstream side and the downstream side of the straightening vane, and is increased toward the central portion, and the diameter of the straightening hole is set to the center of the straightening vane. The feature is that the diameter becomes smaller as it goes.
Description
【０００１】[0001]
本考案は、ダクトフードに設けた整流板を改善したスプレー式のフラックス塗 布装置に関する。 The present invention relates to a spray-type flux coating device in which a straightening plate provided in a duct hood is improved.
【０００２】[0002]
従来技術の一例として、図５で示すような、左右一対の搬送チェーン１で構成 されるプリント基板搬送路の所定個所にフラックスのスプレー塗布ゾーンを設け 、このスプレー塗布ゾーンの上部に集塵機（図示略）に連結せるダクトフード２ を配設したスプレー式のフラックス塗布装置がある。 As an example of the prior art, as shown in FIG. 5, a flux spray coating zone is provided at a predetermined position of a printed circuit board transport path composed of a pair of left and right transport chains 1, and a dust collector (not shown) is provided above the spray coating zone. There is a spray type flux applicator in which a duct hood 2 which can be connected to
【０００３】 このようなフラックス塗布装置においては、ダクトフード２の上部中央に設け たダクト３が集塵機に連結されていることから、集塵機の吸引作用によりダクト フード２の中央部の吸引力が他の部分に比べて強力である。 従って、プリント基板４が搬送チェーン１によってダクトフード２の下方に進 入しその略中央部に到達すると、プリント基板４の周端縁部に負圧によるカルマ ン渦が生じ、スプレーノズル５から噴霧される霧状フラックスが矢印で示すよう にプリント基板４の上面に付着せしめられる。このことは、半田付け作業終了後 プリント基板４を洗浄する必要があるし、また、プリント基板上面に付着した不 必要なフラックスが半田付け工程後に悪影響を及ぼすという重大な課題がある。In such a flux coating device, since the duct 3 provided at the center of the upper portion of the duct hood 2 is connected to the dust collector, the suction force of the dust collector causes the suction force of the central portion of the duct hood 2 to be different. Powerful compared to the parts. Therefore, when the printed circuit board 4 is advanced below the duct hood 2 by the transport chain 1 and reaches the substantially central portion thereof, a Karman vortex due to a negative pressure is generated at the peripheral edge portion of the printed circuit board 4 and sprayed from the spray nozzle 5. The atomized flux is adhered to the upper surface of the printed circuit board 4 as shown by the arrow. This has a serious problem that the printed circuit board 4 needs to be cleaned after the soldering work is completed, and that unnecessary flux adhering to the upper surface of the printed circuit board adversely affects after the soldering process.
【０００４】 このような課題を解決する手段として、図６で示すように、ダクトフード２の 開口下部全域にハニカム構造の整流板６を張設したスプレー式のフラックス塗布 装置が提案されている。As a means for solving such a problem, as shown in FIG. 6, a spray-type flux applying apparatus has been proposed in which a rectifying plate 6 having a honeycomb structure is stretched over the entire lower portion of the opening of the duct hood 2.
【０００５】 この従来技術によれば、整流作用により図５で示した従来技術の課題の解決は なしうるが、整流板６とプリント基板４との距離が接近しているため、特にプリ ント基板４がダクトフード２のもっとも引きの強い中央部に到達したとき、集塵 機の吸引作用によって吸引されるフラックスの溶媒が気化せずに整流板６にその まま付着成長し、やがては、プリント基板４上に流動滴下するという不都合があ り、滴下付着したフラックスによってプリント基板４が汚損される。従って、上 記同様に半田付け工程後に悪い影響を及ぼすばかりでなく、半田付け後の洗浄処 理が要求されるという課題が残されている。According to this conventional technique, the problem of the conventional technique shown in FIG. 5 can be solved by the rectifying action, but since the distance between the rectifying plate 6 and the printed circuit board 4 is close, the print substrate is When 4 reaches the central part of the duct hood 2 where pulling is the strongest, the solvent of the flux sucked by the suction action of the dust collector does not vaporize and adheres and grows on the straightening plate 6 as it is. However, the printed circuit board 4 is contaminated by the flux that has been dropped and adhered. Therefore, similarly to the above, there is a problem that not only a bad influence is exerted after the soldering process but also a cleaning process after the soldering is required.
【０００６】 また、図７で示すように、ダクトフード２の開口下部全域にパンチング構造か らなる整流板７を張設したスプレー式のフラックス塗布装置が提案されている。Further, as shown in FIG. 7, there is proposed a spray type flux applicator in which a rectifying plate 7 having a punching structure is stretched over the entire lower portion of the opening of the duct hood 2.
【０００７】 この従来技術によれば、整流作用により図５で示した従来技術の課題は一応解 決しうるとしても、図６で示した従来技術と同様な課題が残されている。また、 図５，図６の従来技術は、何れもダクトフード２の中央部の引きが強く、両サイ ドの吸引とのバランスが悪くフラックスの均一塗布に影響を及ぼすとともに、整 流板全域に設けたハニカム構造の整流孔，パンチング構造の整流孔が同サイズ， 同間隔であることと、上述した吸引作用のアンバランスとがフラックスの均一塗 布に実に悪い影響を与えている。According to this conventional technique, even if the problem of the conventional technique shown in FIG. 5 can be solved by the rectifying action, the same problem as the conventional technique shown in FIG. 6 remains. In addition, in both of the conventional techniques shown in FIGS. 5 and 6, the central portion of the duct hood 2 is strongly pulled, the balance between suction of both sides is poor, and the uniform application of flux is affected. The fact that the rectifying holes of the honeycomb structure and the rectifying holes of the punching structure which are provided have the same size and the same interval and the imbalance of the suction action described above have a bad influence on the uniform coating of the flux.
【０００８】 本考案の目的は、集塵機による吸引作用を整流板の全域において均一化すると ともに、もっとも吸引力の強い中央部とプリント基板との間隔を大きくして溶媒 の気化距離を十分にとり、プリント基板の上面が余剰フラックスによって汚損さ れるのを合理的に防止し、プリント基板の後処理工程を軽減、もしくは、省略す ることにある。The object of the present invention is to make the suction action by the dust collector uniform over the entire area of the flow straightening plate, and to increase the distance between the central portion where the suction force is strongest and the printed circuit board to ensure a sufficient vaporization distance of the solvent and to perform printing. The reason is to reasonably prevent the upper surface of the board from being contaminated by excess flux, and to reduce or omit the post-processing step of the printed board.
【０００９】[0009]
従来技術の課題を解決する本考案の構成は、左右一対の搬送手段で構成される プリント基板搬送路の所定個所に、フラックスのスプレー塗布ゾーンを設け、該 スプレー塗布ゾーンの上部に、開口部に多孔状整流板を張設し、かつ、集塵手段 に連結せるダクトフードを配設したフラックス塗布装置において、上記整流板と プリント基板の間隔を、プリント基板の通過上流側と下流側を小さく、中央部に 至るに従い大きくしたこと、および、上記整流板に形成した整流孔の孔径を、整 流板の中央に至るに従い小径としたものである。 The configuration of the present invention, which solves the problems of the prior art, is to provide a flux spray coating zone at a predetermined position of a printed circuit board transport path composed of a pair of left and right transport means, and to provide an opening at the top of the spray coating zone. In a flux coating device in which a porous rectifying plate is stretched and a duct hood that is connected to the dust collecting means is arranged, the distance between the rectifying plate and the printed circuit board is set to be small on the upstream side and the downstream side of the printed circuit board. The diameter is made larger toward the center and the diameter of the flow straightening hole formed in the flow straightening plate is made smaller toward the center of the flow regulating plate.
【００１０】[0010]
次に、図面について本考案実施例の詳細を説明する。 図１は本考案装置の正面図、図２はダクトフード部の縦断正面図、図３は整流 板の平面図、図４は整流板の別実施例の平面図である。 Next, details of the embodiments of the present invention will be described with reference to the drawings. 1 is a front view of the device of the present invention, FIG. 2 is a vertical sectional front view of a duct hood, FIG. 3 is a plan view of a current plate, and FIG. 4 is a plan view of another embodiment of the current plate.
【００１１】 図１は本考案装置の全体を示しており、ハウジング１１には左右一対の搬送チ ェーン１２が水平に架設されており、この両搬送チェーン１２間に橋架的に支承 されたプリント基板１３を一端から他端に向けて搬送しつつスプレーノズル１４ から噴霧されるフラックスをプリント基板１３の下面に塗布するようにしてある 。また、上記スプレーノズル１４を中心とした上記搬送チェーン１２によるプリ ント基板搬送路の所定個所には、スプレー塗布ゾーンが形成してある。FIG. 1 shows the whole of the device of the present invention. A pair of left and right carrier chains 12 are horizontally installed on a housing 11, and a printed circuit board supported bridge-wise between the two carrier chains 12. The flux sprayed from the spray nozzle 14 is applied to the lower surface of the printed circuit board 13 while transporting 13 from one end to the other end. Further, a spray coating zone is formed at a predetermined position of the print substrate transfer path formed by the transfer chain 12 centering on the spray nozzle 14.
【００１２】 上記スプレーノズル１４の上方には上記スプレー塗布ゾーンの略全域をカバー するダクトフード１５が配設してあり、このダクトフード１５の上部中央に設け たダクト１６は集塵機（図示略）に接続され、余剰フラックスが吸引集塵される ようにしてある。尚、図中１７はスプレーガイド，１８はフラックスのタレ受け ，１９はフラックス加圧タンクである。A duct hood 15 is provided above the spray nozzle 14 so as to cover substantially the entire spray coating zone. A duct 16 provided at the center of the upper portion of the duct hood 15 is provided in a dust collector (not shown). It is connected so that excess flux is suctioned and collected. In the figure, 17 is a spray guide, 18 is a flux drop receiver, and 19 is a flux pressure tank.
【００１３】 次に、図２について本考案装置の要部を説明する。従来技術の項でも説明した が、ダクトフード１５の開口下部の略全域には多数の整流孔２０を設けた整流板 ２１が張設されている。特に本考案においては、上記整流板２１と搬送チェーン １２によって水平搬送されるプリント基板１３の間隔、即ち、プリント基板１３ の通過上流側端と下流側端の間隔Ｌ1を小さく、整流板２１の中央部に至るに従 い間隔Ｌ2を大きくしたものである。Next, the main part of the device of the present invention will be described with reference to FIG. As described in the section of the prior art, a rectifying plate 21 provided with a large number of rectifying holes 20 is stretched over substantially the entire lower portion of the opening of the duct hood 15. Particularly, in the present invention, the distance between the straightening plate 21 and the printed circuit board 13 horizontally conveyed by the conveying chain 12, that is, the distance L 1 between the upstream end and the downstream side end of the printed circuit board 13 is reduced so that the straightening plate 21 The distance L 2 is increased to reach the central portion.
【００１４】 尚、図２に示した整流板２１の端面形状は、中央部を上向きに突出させた円弧 形状としたが、上流側端と下流側端から中央部に至るに従い段階状に間隔を大き くしてもよいことから、図示形状のものに特定されることはない。また、整流板 ２１の中央部と上流側端間の形状と、整流板２１の中央部と下流側端間の形状を 非対称形とすることもありうるので、図示のものに特定されない。Note that the end face shape of the current plate 21 shown in FIG. 2 is an arc shape with the central portion protruding upward, but the intervals are stepwise from the upstream end to the downstream end toward the central portion. Since the size may be increased, it is not limited to the illustrated shape. Further, the shape between the central portion of the flow regulating plate 21 and the upstream side end and the shape between the central portion of the flow regulating plate 21 and the downstream side end may be asymmetrical, so they are not limited to those shown in the drawings.
【００１５】 整流板２１の略全域に穿設形成した整流孔２０は、図３に示すように、プリン ト基板１３の通過上手側から中央に至るに従い一定巾のグループ毎に孔径を小さ くし、また、中央から下手側に至るに従い一定巾のグループ毎に孔径を大きく形 成したものである。尚、図３の実施例によれば、孔径の異るグループ巾が均等割 合に形成されているが、集塵機による吸引力の均等化をより確実にするために、 グループ巾に変化をもたせることもありうるので、図示するものに特定されるこ とはない。As shown in FIG. 3, the straightening holes 20 formed in substantially the entire area of the straightening plate 21 have a small diameter for each group having a constant width from the upper hand side of the print substrate 13 to the center. In addition, the hole diameter is made larger for each group of constant width from the center to the lower side. According to the embodiment of FIG. 3, the group widths having different hole diameters are formed in equal proportions, but the group widths should be changed in order to ensure the equalization of suction force by the dust collector. However, it is not limited to what is shown in the figure.
【００１６】 また、図４に示す実施例は、整流板２１の上流側から中央、下流側から中央に 至るに従い順次整流孔２０の孔径を小さくしたものを示している。この実施例に よれば、整流板２１の中央から上流側、中央から下流側の整流孔２０の孔径を対 称的に形成しているが、孔径を非対称とすることもありうるので、図示のものに 特定はされない。Further, the embodiment shown in FIG. 4 shows that the diameter of the straightening holes 20 is sequentially reduced from the upstream side to the center of the straightening plate 21 and from the downstream side to the center. According to this embodiment, the diameters of the straightening holes 20 from the center to the upstream side and from the center to the downstream side of the straightening plate 21 are formed symmetrically. However, since the hole diameters may be asymmetrical, it is not illustrated. It is not specified to the thing.
【００１７】[0017]
図２の実施例において、集塵機の吸引作用はダクトフード１５の中央部の引き が強いが、整流板２１が図のように円弧状に形成されておりプリント基板１３と の距離が大きいことから吸引力は著しく減少せしめられ、吸引力は整流板の全域 において略均一化される。従って、従来技術のようにプリント基板上面部におけ る負圧の発生が小さく抑制しうるとともに、プリント基板１３の各端部から発生 する負圧による渦の発生を抑え、余剰フラックスがプリント基板上部に付着する ことがない。 In the embodiment of FIG. 2, the suction action of the dust collector is such that the central portion of the duct hood 15 is strongly pulled, but since the rectifying plate 21 is formed in an arc shape as shown in the figure and the distance from the printed circuit board 13 is large, suction is performed. The force is significantly reduced, and the suction force is made almost uniform over the entire straightening vane. Therefore, as in the prior art, the negative pressure on the upper surface of the printed circuit board can be suppressed to be small, and the generation of vortices due to the negative pressure generated from each end of the printed circuit board 13 can be suppressed, and the surplus flux can be removed from the upper part of the printed circuit board. It does not adhere to.
【００１８】 また、プリント基板１３が図で示すようにダクト１６の直下に到達したときに は、このプリント基板１３と整流板２１の間隔Ｌ2が最大条件にあるため、この 部分に吸引されるフラックスの溶媒は完全に気化され、液状のまま整流板２１に 付着成長しない。Further, when the printed circuit board 13 arrives just below the duct 16 as shown in the figure, the distance L 2 between the printed circuit board 13 and the rectifying plate 21 is in the maximum condition, so that it is sucked into this portion. The flux solvent is completely vaporized and does not adhere to and grow on the current plate 21 as a liquid state.
【００１９】 図３，図４に示すように、孔径の異った整流孔２０を整流板２１に形成したこ とと併せて、整流板２１を円弧状に形成したことにより、集塵機による吸引作用 の均一化が更に向上する。As shown in FIGS. 3 and 4, in addition to forming the straightening holes 20 having different hole diameters in the straightening vanes 21 and forming the straightening vanes 21 in an arc shape, a suction action by the dust collector is obtained. Uniformity is further improved.
【００２０】[0020]
上述のように本考案の構成によれば、次のような効果が図れる。 （ａ）スプレー塗布ゾーンを通過するプリント基板に霧状フラックスを塗布し、 余剰なフラックスは整流板をもつダクトフードを介して集塵機に吸引回収しうる ことは勿論のこと、 （ｂ）整流板構造を、該整流板と搬送手段にて水平搬送されるプリント基板の間 隔を、プリント基板の通過上流側と下流側の間隔を小さく、整流板の中央部に至 るに従い大きな間隔となるように構成したので、吸引作用の大きな中央部分の吸 引力が著しく減少せしめられ、集塵機の吸引力を整流板の全域にわたって分散均 一化することができ、従来技術の課題が合理的に解消しうる。 （ｃ）集塵機の吸引作用が最も大きく作用する整流板とプリント基板の間隔が最 も大きくしてあるので、この部分に吸引されるフラックスの溶媒は完全に気化さ れ、従来技術のような液状物の滴下によるプリント基板の汚損が防止でき、プリ ント基板の後処理作業が軽減しうる。 （ｄ）孔径の異った整流孔を整流板に形成したことと併せて、整流板を円弧形状 としたことにより、集塵機による吸引作用の均一化が更に一層向上しうる。 As described above, according to the configuration of the present invention, the following effects can be achieved. (A) Needless to say, atomized flux can be applied to the printed circuit board that passes through the spray application zone, and the excess flux can be sucked and collected by the dust collector through the duct hood having a current plate. (B) Current plate structure The distance between the straightening plate and the printed circuit board horizontally conveyed by the conveying means should be small, and the distance between the upstream side and the downstream side of the printed circuit board should be small and the distance should be large toward the center of the straightening plate. Since it is configured, the suction force of the central portion having a large suction action is significantly reduced, and the suction force of the dust collector can be dispersed and evened over the entire area of the straightening vane, and the problems of the conventional technology can be reasonably solved. (C) Since the distance between the baffle plate and the printed circuit board, where the suction action of the dust collector is the greatest, is the largest, the solvent of the flux sucked into this part is completely vaporized, and the liquid solvent as in the conventional technique is used. It is possible to prevent the printed board from being contaminated due to the dropping of the substance, and to reduce the post-processing work of the printed board. (D) By forming the straightening vanes having different hole diameters in the straightening vane and forming the straightening vane in an arc shape, the suction action by the dust collector can be further uniformized.
【図１】本考案装置の正面図である。FIG. 1 is a front view of the device of the present invention.
【図２】ダクトフード部の縦断正面図である。FIG. 2 is a vertical sectional front view of a duct hood portion.
【図３】整流板の平面図である。FIG. 3 is a plan view of a current plate.
【図４】整流板の別実施例の平面図である。FIG. 4 is a plan view of another embodiment of the current plate.
【図５】整流板をもたない従来のダクトフード部の縦断
正面図である。FIG. 5 is a vertical cross-sectional front view of a conventional duct hood portion that does not have a current plate.
【図６】ハニカム構造の整流板をもつ従来のダクトフー
ド部の縦断正面図である。FIG. 6 is a vertical cross-sectional front view of a conventional duct hood portion having a rectifying plate having a honeycomb structure.
【図７】パンチング構造の整流板をもつ従来のダクトフ
ード部の縦断正面図である。FIG. 7 is a vertical cross-sectional front view of a conventional duct hood portion having a punching structure rectifying plate.
１１ ハウジング １２ 搬送チェーン １４ スプレーノズル １５ ダクトフード １６ ダクト ２０ 整流孔 ２１ 整流板 11 Housing 12 Transport Chain 14 Spray Nozzle 15 Duct Hood 16 Duct 20 Straightening Hole 21 Straightening Plate
Claims (2)
ト基板搬送路の所定個所に、フラックスのスプレー塗布
ゾーンを設け、該スプレー塗布ゾーンの上部に、開口部
に多孔状整流板を張設し、かつ、集塵手段に連結せるダ
クトフードを配設したフラックス塗布装置において、上
記整流板とプリント基板の間隔を、プリント基板の通過
上流側と下流側を小さく、中央部に至るに従い大きくし
たことを特徴とするフラックス塗布装置。1. A flux spray coating zone is provided at a predetermined position of a printed circuit board transport path constituted by a pair of left and right transport means, and a porous straightening plate is stretched over the opening above the spray coating zone. Also, in the flux coating device provided with a duct hood that is connected to the dust collecting means, the distance between the straightening plate and the printed circuit board is made smaller on the upstream side and downstream side of the printed circuit board and increased toward the central portion. A flux applicator characterized by:
整流板の中央に至るに従い小径としたことを特徴とする
請求項１記載のフラックス塗布装置。2. The diameter of the straightening hole formed in the straightening plate is
The flux coating device according to claim 1, wherein the diameter is made smaller toward the center of the current plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP546192U JPH0563663U (en) | 1992-01-17 | 1992-01-17 | Flux applicator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP546192U JPH0563663U (en) | 1992-01-17 | 1992-01-17 | Flux applicator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0563663U true JPH0563663U (en) | 1993-08-24 |
Family
ID=11611871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP546192U Withdrawn JPH0563663U (en) | 1992-01-17 | 1992-01-17 | Flux applicator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0563663U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005539412A (en) * | 2002-04-10 | 2005-12-22 | ノキア コーポレイション | CDMA signal power estimation apparatus and method |
| CN118218730A (en) * | 2024-04-10 | 2024-06-21 | 北京航天试验技术研究所 | Argon arc welds argon filling rectifier |
-
1992
- 1992-01-17 JP JP546192U patent/JPH0563663U/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005539412A (en) * | 2002-04-10 | 2005-12-22 | ノキア コーポレイション | CDMA signal power estimation apparatus and method |
| CN118218730A (en) * | 2024-04-10 | 2024-06-21 | 北京航天试验技术研究所 | Argon arc welds argon filling rectifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960404 |