JPH056680Y2 - - Google Patents
Info
- Publication number
- JPH056680Y2 JPH056680Y2 JP13641786U JP13641786U JPH056680Y2 JP H056680 Y2 JPH056680 Y2 JP H056680Y2 JP 13641786 U JP13641786 U JP 13641786U JP 13641786 U JP13641786 U JP 13641786U JP H056680 Y2 JPH056680 Y2 JP H056680Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- lands
- wiring board
- line
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、プリント配線板に関し、特にランド
間の間隔の狭いプリント配線板に関するものであ
る。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board, and particularly to a printed wiring board with narrow spacing between lands.
（従来の技術）
プリント配線板は、ランド間をラインで接続し
任意の回路を形成している。2. Description of the Related Art In a printed wiring board, lands are connected with lines to form any desired circuit.
ところで、プリント配線板の組み込まれる機器
の小型化に伴い、高密度のプリント配線板が要求
されるようになつてきた。そしてプリント配線板
に電子部品を接続する場合、例えば、フロー炉を
通してランドに半田付けするが、高密度化すると
ランド間の間隔が狭くなり、浸漬進行方向によつ
ては半田ブリツジが生じ易くなる。 By the way, with the miniaturization of devices in which printed wiring boards are incorporated, there has been a demand for high-density printed wiring boards. When electronic components are connected to a printed wiring board, they are soldered to the lands through a flow furnace, for example, but as the density increases, the spacing between the lands becomes narrower, and depending on the dipping direction, solder bridging is more likely to occur.
（考案が解決しようとする問題点）
しかし、半田ブリツジが生じても、ランド間に
ラインが接続されている場合もあり、このライン
が半田ブリツジにより覆われても回路的には良品
であるが、外観からでは良品か不良品かの別を判
別し難い欠点があつた。(Problem that the invention aims to solve) However, even if a solder bridge occurs, there are cases where a line is connected between lands, and even if this line is covered by a solder bridge, it is still a good circuit. However, there was a drawback that it was difficult to tell whether the product was good or defective from its appearance.
本考案の目的は、以上の欠点を改良し、半田ブ
リツジによる良・不良を容易に判別しうるプリン
ト配線板を提供するものである。 The object of the present invention is to improve the above-mentioned drawbacks and provide a printed wiring board that can easily determine whether it is good or bad due to solder bridging.
（問題点を解決するための手段）
本考案は、上記の目的を達成するために、絶縁
基板に任意のプリント配線を設けたプリント配線
板において、間隔の狭いランド間に迂回するライ
ンが接続されていることを特徴とするプリント配
線板を提供するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention has a printed wiring board in which arbitrary printed wiring is provided on an insulating substrate, in which a detour line is connected between closely spaced lands. The present invention provides a printed wiring board characterized by:
（作用）
本考案によれば、ラインがランド間に真直ぐ接
続されずに迂回して接続されているために、半田
ブリツジが生じても少なくともラインの一部が露
出し、外観検査によつて、良・不良の判別を容易
に行なえる。(Function) According to the present invention, since the line is not connected straight between the lands but in a roundabout way, even if a solder bridge occurs, at least a part of the line is exposed. It is easy to distinguish between good and bad products.
（実施例）
以下、本考案を図示の実施例に基づいて説明す
る。(Example) Hereinafter, the present invention will be explained based on the illustrated example.
図において、１は、絶縁基板であり、紙フエノ
ール樹脂積層板や紙エポキシ樹脂積層板等を用い
る。２〜５は、ランドであり、孔６が形成されて
いる。７はランド２及び３に接続されたラインで
ある。８は、間隔の狭いランド４及び５間に接続
されたラインであり、迂回している。 In the figure, 1 is an insulating substrate, and a paper phenol resin laminate, a paper epoxy resin laminate, or the like is used. 2 to 5 are lands, in which holes 6 are formed. 7 is a line connected to lands 2 and 3. 8 is a line connected between lands 4 and 5 which are closely spaced, and is detoured.
（考案の効果）
以上の通り、本考案によれば、ランド間隔の狭
い箇所においてラインを迂回して接続しているた
めに、半田ブリツジが生じても全部が覆われるこ
となく、良・不良の判別を容易行なえるプリント
配線板が得られる。(Effects of the invention) As described above, according to the invention, since the lines are bypassed and connected in places where the land spacing is narrow, even if solder bridging occurs, the entire part is not covered, and it is possible to distinguish between good and defective parts. A printed wiring board that can be easily identified is obtained.
図は本考案の実施例の平面図を示す。
１……絶縁基板、２，３，４，５……ランド、
７，８……ライン。
The figure shows a top view of an embodiment of the invention. 1... Insulating substrate, 2, 3, 4, 5... Land,
7, 8... line.
Claims (1)
ト配線板において、間隔の狭いランド間に迂回す
るラインが接続されていることを特徴とするプリ
ント配線板。 1. A printed wiring board in which arbitrary printed wiring is provided on an insulating substrate, characterized in that detour lines are connected between lands with narrow intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13641786U JPH056680Y2 (en) | 1986-09-05 | 1986-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13641786U JPH056680Y2 (en) | 1986-09-05 | 1986-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343472U JPS6343472U (en) | 1988-03-23 |
| JPH056680Y2 true JPH056680Y2 (en) | 1993-02-19 |
Family
ID=31039509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13641786U Expired - Lifetime JPH056680Y2 (en) | 1986-09-05 | 1986-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056680Y2 (en) |
-
1986
- 1986-09-05 JP JP13641786U patent/JPH056680Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6343472U (en) | 1988-03-23 |
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