JPH056687Y2 - - Google Patents
Info
- Publication number
- JPH056687Y2 JPH056687Y2 JP9268686U JP9268686U JPH056687Y2 JP H056687 Y2 JPH056687 Y2 JP H056687Y2 JP 9268686 U JP9268686 U JP 9268686U JP 9268686 U JP9268686 U JP 9268686U JP H056687 Y2 JPH056687 Y2 JP H056687Y2
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film circuit
- circuit board
- printing
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007639 printing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は厚膜回路基板、特に厚膜回路パターン
の印刷構造に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a thick film circuit board, particularly to a printed structure of a thick film circuit pattern.
従来の厚膜回路基板の製造においては、絶縁基
板上に厚膜回路パターンを形成するときにスクリ
ーン印刷法による多層印刷が施される。
In the production of conventional thick film circuit boards, multilayer printing is performed using a screen printing method when forming a thick film circuit pattern on an insulating substrate.
上記のようにして絶縁基板の両面に多層印刷を
施したとき、厚膜回路基板表面には各印刷層の重
なりにより凹凸が発生するので、基板同士の重な
りまたはこすれ合いによつて回路パターンの凸部
に欠損が発生することがあるという欠点がある。
When multilayer printing is performed on both sides of an insulating substrate as described above, unevenness will occur on the surface of the thick film circuit board due to the overlapping of each printed layer. The disadvantage is that some parts may be damaged.
したがつて本考案が解決しようとする問題点、
換言すれば本考案の目的は回路パターンの印刷構
造を工夫することによつて上記の欠点を改善した
厚膜回路基板を提供することにある。 Therefore, the problems that this invention attempts to solve are:
In other words, an object of the present invention is to provide a thick film circuit board in which the above-mentioned drawbacks are improved by devising the printing structure of the circuit pattern.
本考案の厚膜回路基板は、両面に多層印刷を施
す厚膜回路基板において、各々の面に印刷する厚
膜ペーストを重ねて印刷する部分を、表裏両面の
相対する箇所に少なくとも２箇所以上設けること
によつて実現される。
The thick film circuit board of the present invention is a thick film circuit board in which multilayer printing is performed on both sides, and at least two or more parts are provided at opposing locations on both the front and back surfaces, where the thick film paste printed on each surface is overlapped. This is achieved by
以下、本考案について図面を参照しながら説明
する。
The present invention will be described below with reference to the drawings.
第１図ａ乃至第１図ｂは、本考案による厚膜回
路基板の一実施例の印刷構造を説明する断面図で
ある。同図ａにおいて絶縁基板１の両面に第一導
体層２をスクリーン印刷法により形成する際に、
絶縁基板１上のダミースペースに重ね印刷用の第
一導体パターン１２を２箇所以上、表裏の相対す
る箇所に形成する。続いて同様にして同図ｂに示
すように絶縁体層３、第二導体層４、抵抗体層
５、保護体層６およびそれと同時にそれぞれの重
ね印刷用パターン１３，１４，１５，１６を形成
する。 FIGS. 1a to 1b are cross-sectional views illustrating a printing structure of an embodiment of a thick film circuit board according to the present invention. In Figure a, when forming the first conductor layer 2 on both sides of the insulating substrate 1 by screen printing method,
Two or more first conductor patterns 12 for overlapping printing are formed in a dummy space on an insulating substrate 1 at opposing locations on the front and back sides. Subsequently, in the same manner as shown in FIG. do.
上記のようにして形成した厚膜回路基板は絶縁
基板１上のダミースペースに重ね印刷した部分が
回路パターン部分よりも凸起している。このよう
な厚膜回路基板を重ねたとき上記のダミースペー
ス部分は互いに接触するが回路パターン部分は接
触しない。したがつて回路パターン部分が擦れて
欠落するようなことはない。 In the thick film circuit board formed as described above, the portion printed over the dummy space on the insulating substrate 1 is more convex than the circuit pattern portion. When such thick film circuit boards are stacked, the dummy space portions mentioned above come into contact with each other, but the circuit pattern portions do not. Therefore, there is no possibility that the circuit pattern portion will be rubbed or missing.
なお上記の重ね印刷用パターン１２，１３，１
４，１５、および１６のそれぞれの形状は任意で
あり、大きさも同一である必要はない。 Note that the above overprinting patterns 12, 13, 1
The shapes of 4, 15, and 16 are arbitrary, and the sizes do not need to be the same.
以上、説明したように本考案の印刷構造によれ
ば表裏両面のそれぞれの最大印刷回数分の重ね印
刷部分を基板内の２箇所以上に形成するので、基
板同士が重なつた場合でも前記重ね印刷部分がス
ペーサとなつて厚膜回路パターン同士の接触がな
くなり、パターン欠損のない信頼性に優れた厚膜
回路基板が得られるという効果がある。
As explained above, according to the printing structure of the present invention, overlapping printing parts corresponding to the maximum number of printing times on both the front and back sides are formed in two or more places within the substrate, so even when the substrates overlap, the overlapping printing The portions act as spacers and there is no contact between the thick film circuit patterns, resulting in the effect that a highly reliable thick film circuit board without pattern defects can be obtained.
第１図ａ乃至第１図ｂは、本考案による厚膜回
路基板の印刷構造を説明するための断面図であ
る。
１……絶縁基板、２……第一導体層、３……絶
縁体層、４……第二導体層、５……抵抗体層、６
……保護体層、１２……重ね印刷用の第一導体パ
ターン、１３……重ね印刷用の絶縁体パターン、
１４……重ね印刷用の第二導体パターン、１５…
…重ね印刷用の抵抗体パターン、１６……重ね印
刷用の保護体パターン。
FIGS. 1a to 1b are cross-sectional views for explaining the printing structure of a thick film circuit board according to the present invention. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... First conductor layer, 3... Insulator layer, 4... Second conductor layer, 5... Resistor layer, 6
... Protector layer, 12 ... First conductor pattern for overprinting, 13 ... Insulator pattern for overprinting,
14...Second conductor pattern for overprinting, 15...
...resistance pattern for overprinting, 16...protector pattern for overprinting.
Claims (1)
て、各々の面に印刷する厚膜ペーストを重ねて印
刷する部分を表裏両面の相対する箇所に少なくと
も２箇所以上設けることを特徴とする厚膜回路基
板。 A thick film circuit board on which multilayer printing is performed on both the front and back surfaces, characterized in that at least two parts of the thick film paste printed on each surface are provided at opposing locations on both the front and back surfaces. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9268686U JPH056687Y2 (en) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9268686U JPH056687Y2 (en) | 1986-06-17 | 1986-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62204378U JPS62204378U (en) | 1987-12-26 |
| JPH056687Y2 true JPH056687Y2 (en) | 1993-02-19 |
Family
ID=30954613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9268686U Expired - Lifetime JPH056687Y2 (en) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056687Y2 (en) |
-
1986
- 1986-06-17 JP JP9268686U patent/JPH056687Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62204378U (en) | 1987-12-26 |
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