JPH0568837B2 - - Google Patents
Info
- Publication number
- JPH0568837B2 JPH0568837B2 JP59237080A JP23708084A JPH0568837B2 JP H0568837 B2 JPH0568837 B2 JP H0568837B2 JP 59237080 A JP59237080 A JP 59237080A JP 23708084 A JP23708084 A JP 23708084A JP H0568837 B2 JPH0568837 B2 JP H0568837B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- heat medium
- heat
- temperature
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Electrical Connectors (AREA)
- Processing Of Terminals (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は架橋ポリエチレン絶縁電力ケーブルの
如き架橋プラスチツク絶縁電力ケーブルの接続に
用いる金型装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mold apparatus for use in connecting cross-linked plastic insulated power cables, such as cross-linked polyethylene insulated power cables.
（従来技術）
架橋ポリエチレン絶縁電力ケーブルの如き架橋
プラスチツク絶縁電力ケーブルの接続部における
補強絶縁層の形成方法には、絶縁テープを巻回し
て金型により加熱成形して一体化する方法、あら
かじめ成形した絶縁筒を導体接続部に差込んで形
成する方法及び押出機等により溶融樹脂を金型内
に注入して形成する押出方法等があるが、押出形
成方法は接続部の信頼性においてすぐれており、
近時特に高圧電力ケーブルの補強絶縁層の形成方
法として多く採用されている。(Prior art) Methods for forming reinforcing insulating layers at the joints of cross-linked plastic insulated power cables such as cross-linked polyethylene insulated power cables include methods of winding an insulating tape and heat-forming it with a mold to integrate it; There are methods such as inserting an insulating cylinder into the conductor connection part and extrusion method of injecting molten resin into a mold using an extruder, etc., but the extrusion forming method is superior in terms of the reliability of the connection part. ,
Recently, this method has been widely adopted as a method for forming reinforcing insulating layers, especially for high-voltage power cables.
第５図このような押出形成に用いる金型の縦断
面図である。図面において、C1，C2は接続すべ
き架橋プラスチツク絶縁電力ケーブルで、１は架
橋プラスチツク絶縁層、２はケーブル導体であ
る。３はケーブル導体２の接続用スリーブ、４は
ケーブル導体接続部上に施した接続部内部半導電
層、５は補強絶縁層で金型７内に溶融樹脂を押出
機等により注入することにより形成される。 FIG. 5 is a vertical sectional view of a mold used for such extrusion forming. In the drawing, C 1 and C 2 are cross-linked plastic insulated power cables to be connected, 1 is the cross-linked plastic insulation layer, and 2 is the cable conductor. 3 is a sleeve for connecting the cable conductor 2, 4 is a semi-conductive layer inside the connection part applied on the cable conductor connection part, and 5 is a reinforcing insulating layer, which is formed by injecting molten resin into a mold 7 using an extruder or the like. be done.
上記溶融樹脂を金型７内に注入する前段階とし
て、樹脂の流れを良くすると共にケーブル絶縁層
１と溶融樹脂の界面６の接着を良くする目的で、
ケーブル絶縁層１及び接続用スリーブ３の温度を
あらかじめ上げておく必要がある。この際接続用
スリーブ３は金属製であるため熱容量が大きくて
昇温し難く、又ケーブル絶縁層１はプラスチツク
であるため余り高温にすると変形するおそれがあ
る。このため導体接続用スリーブ３が短時間に昇
温が可能となるような金型７内に熱絶縁層８を設
け、中央部ヒータ９と端部側ヒータ１０の独自に
温度設定を行ない、端部金型より中央部金型を高
温に保ち接続用スリーブ３に大きな熱量を与える
ようにしていた。 As a step before injecting the molten resin into the mold 7, in order to improve the flow of the resin and improve the adhesion between the cable insulation layer 1 and the interface 6 of the molten resin,
It is necessary to raise the temperature of the cable insulation layer 1 and the connection sleeve 3 in advance. At this time, since the connecting sleeve 3 is made of metal, it has a large heat capacity and is difficult to heat up, and since the cable insulating layer 1 is made of plastic, there is a risk of deformation if the temperature is too high. For this reason, a heat insulating layer 8 is provided in the mold 7 that allows the conductor connection sleeve 3 to heat up in a short time, and the temperature of the central heater 9 and the end heaters 10 is independently set. The central part mold was kept at a higher temperature than the part mold to give a larger amount of heat to the connecting sleeve 3.
（解決しようとする問題点）
上述した従来の金型を用いるときは次のような
問題点を有していた。(Problems to be Solved) When using the conventional mold described above, the following problems were encountered.
断熱のため金型内の熱絶縁層を設ける必要か
らその部分での金型が薄くなると共に、熱絶縁
層と金型の複合構造により内部圧力に対する機
械的強度が低下する。 Since it is necessary to provide a thermal insulating layer within the mold for heat insulation, the mold becomes thinner at that portion, and the composite structure of the thermal insulating layer and the mold reduces its mechanical strength against internal pressure.
風による金型の冷却を防止するため保温カバ
ーを設置すると、保温カバー内の空気の対流に
より熱絶縁層の効果が少なくなるため保温カバ
ーの設置が難しい。 If a heat insulating cover is installed to prevent the mold from being cooled by wind, it is difficult to install the heat insulating cover because air convection within the heat insulating cover reduces the effectiveness of the heat insulating layer.
溶融樹脂を凝固させる際、その体積減少を補
うため樹脂の冷却注入を行なうが、熱絶縁層が
あるため金型の放冷が悪くなり冷却注入時間が
長くなるため極端な場合には溶融樹脂の架橋反
応がおこるおそれがある。 When solidifying molten resin, cooling injection of the resin is performed to compensate for the volume reduction, but because of the thermal insulation layer, cooling of the mold becomes poor and the cooling injection time becomes longer, so in extreme cases, the molten resin is A crosslinking reaction may occur.
（問題点を解決するための手段）
本発明は上述の問題点を解消した架橋プラスチ
ツク絶縁電力ケーブル用接続用金型装置を提供す
るもので、金型をケーブルの長さ方向に複数のゾ
ーンに区分けし、各ゾーン内部にはそれぞれ熱媒
体通路を設け、各熱媒体通路の両端を金型とは別
に設置された複数の熱媒体循環装置のそれぞれに
連通させ、上記熱媒体循環装置により熱媒体をそ
れぞれの熱媒体通路に循環させることにより金型
の加熱冷却を行なうことを特徴とするものであ
る。(Means for Solving the Problems) The present invention provides a connecting mold device for cross-linked plastic insulated power cables that solves the above-mentioned problems. A heat medium passage is provided inside each zone, and both ends of each heat medium passage are communicated with each of a plurality of heat medium circulation devices installed separately from the mold. The mold is heated and cooled by circulating it through each heat medium path.
（実施例）
第１図は本発明に係る金型装置の実施例の縦断
正面図、第２図は金型の横断面図で、第５図と同
一記号は同一部位をあらわしている。(Embodiment) FIG. 1 is a longitudinal sectional front view of an embodiment of the mold apparatus according to the present invention, and FIG. 2 is a cross-sectional view of the mold, and the same symbols as in FIG. 5 represent the same parts.
本実施例においては図示に示すように、金型７
をケーブルの長さ方向に、例えば中央部ゾーンＡ
及び２つの端部ゾーンＢの３つのゾーンに区分
し、各ゾーン内部にはそれぞれ熱媒体通路１２を
設ける。そして上記各熱媒体通路１２の両端を金
型７とは別に設置された複数の熱媒体循環装置１
１に連通させ、上記熱媒体循環装置１１により熱
媒体をそれぞれの熱媒体通路１２に循環させて熱
媒体を金型７との熱交換により金型７を昇温又は
冷却する。ものである。 In this embodiment, as shown in the figure, the mold 7
along the length of the cable, for example in the central zone A
and two end zones B, and a heat medium passage 12 is provided inside each zone. A plurality of heat medium circulation devices 1 are installed separately from the mold 7 at both ends of each of the heat medium passages 12.
1, the heat medium circulation device 11 circulates the heat medium through each heat medium passage 12, and the heat medium exchanges heat with the mold 7 to raise or cool the mold 7. It is something.
熱媒体が熱源であるため金型７の中央部ゾーン
Ａを高温に保つと端部ゾーンＢも熱伝導により昇
温するが、端部ゾーンＢを循環する熱媒体の温度
を低く設定しておけば熱媒体の吸熱作用により金
型内に任意の温度勾配が設定できる。この温度勾
配は接続用スリーブ４の十分な昇温を得、ケーブ
ル絶縁層２の変形を防止するためには30℃以上持
たせることが好ましい。 Since the heat medium is the heat source, if the center zone A of the mold 7 is kept at a high temperature, the temperature of the end zone B will also rise due to heat conduction, but the temperature of the heat medium circulating in the end zone B should be set low. For example, an arbitrary temperature gradient can be set within the mold due to the endothermic action of the heat medium. This temperature gradient is preferably maintained at 30° C. or higher in order to obtain a sufficient temperature rise of the connecting sleeve 4 and to prevent deformation of the cable insulation layer 2.
一方金型７を冷却する際には金型７内の熱媒体
通路１２を循環する熱媒体を冷却して循環すれば
吸熱作用により短時間に金型７の降温が可能とな
る。なお熱媒体の循環装置１１には加熱用熱源と
冷却用熱交換器及び熱媒体循環用ポンプが内蔵さ
れている。 On the other hand, when cooling the mold 7, if the heat medium circulating in the heat medium passage 12 in the mold 7 is cooled and circulated, the temperature of the mold 7 can be lowered in a short time due to the endothermic action. The heat medium circulation device 11 includes a heating heat source, a cooling heat exchanger, and a heat medium circulation pump.
因みに第３図及び第４図は本発明の金型装置を
用いたときの加熱時間及び冷却時間と金型温度と
関係曲線を示しており、第３図より本発明の金型
装置では温度勾配が大きくとれ、接続スリーブの
昇温が短時間に行えることが分り、又第４図より
本発明の金型装置では金型が短時間に降温するこ
とが分る。 Incidentally, FIGS. 3 and 4 show the relationship between heating time, cooling time, mold temperature, and mold temperature when using the mold apparatus of the present invention. It can be seen that the temperature of the connecting sleeve can be increased in a short period of time and that the temperature of the connecting sleeve can be increased in a short period of time, and it can be seen from FIG.
（発明の効果）
上述した本発明の金型装置によれば次の利点を
有するものである。(Effects of the Invention) The mold device of the present invention described above has the following advantages.
金型の加熱あるいは冷却に熱媒体を用いるた
め昇温の際金型内部に大きな温度勾配が設定で
き、中央部ゾーンから大きな熱量が与えられる
ため接続用スリーブの昇温時間を短縮できる。 Since a heat medium is used to heat or cool the mold, a large temperature gradient can be set inside the mold when the temperature is raised, and a large amount of heat is applied from the central zone, so the time to heat up the connecting sleeve can be shortened.
空気等に比べ熱容量の大きい熱媒体を利用で
きるため冷却時間を短縮できる。 Cooling time can be shortened because a heat medium with a larger heat capacity than air or the like can be used.
空気の対流による温度変化に対応できるよう
媒体温度の設定が可能であるため保温カバーの
設置が可能となる。 Since the medium temperature can be set to accommodate temperature changes due to air convection, a heat insulating cover can be installed.
熱絶縁層の設置が不要となり一体の金型が構
成できるので、金型の機械的強度の低下が少な
い。 Since it is not necessary to install a heat insulating layer and an integrated mold can be constructed, there is little decrease in the mechanical strength of the mold.
第１図は本発明の金型装置の実施例の縦断面
図、第２図は金型の横断面図、第３図は加熱時間
と金型温度の関係曲線、第４図は冷却時間と金型
温度の関係曲線、第５図は従来の金型装置の縦断
面図を示す。
C1，C2……架橋プラスチツク絶縁電力ケーブ
ル、１……架橋プラスチツク絶縁層、２……導
体、３……導体接続用スリーブ、５……接続部補
強絶縁層、７……金型、１１……熱媒体循環装
置、１２……熱媒体通路。
Figure 1 is a longitudinal cross-sectional view of an embodiment of the mold apparatus of the present invention, Figure 2 is a cross-sectional view of the mold, Figure 3 is a relationship curve between heating time and mold temperature, and Figure 4 is a relationship between cooling time and mold temperature. FIG. 5 shows a longitudinal cross-sectional view of a conventional mold apparatus. C 1 , C 2 ... Cross-linked plastic insulated power cable, 1 ... Cross-linked plastic insulation layer, 2 ... Conductor, 3 ... Sleeve for connecting conductor, 5 ... Connection reinforcing insulating layer, 7 ... Mold, 11 ...Heat medium circulation device, 12...Heat medium passage.
Claims (1)
区分けし、各ゾーン内部にはそれぞれ熱媒体通路
を設け、各熱媒体通路の両端を金型とは別に設置
された複数の熱媒体循環装置のそれぞれに連通さ
せ、上記熱媒体循環装置により熱媒体をそれぞれ
の熱媒体通路に循環させることにより金型の加熱
冷却を行なうことを特徴とする架橋プラスチツク
絶縁電力ケーブル接続用金型装置。1 The mold is divided into multiple zones in the length direction of the cable, each zone is provided with a heat medium passage, and both ends of each heat medium passage are connected to multiple heat medium circulation devices installed separately from the mold. A mold device for connecting a cross-linked plastic insulated power cable, characterized in that the mold is heated and cooled by circulating a heat medium through each heat medium path by the heat medium circulation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59237080A JPS61116784A (en) | 1984-11-09 | 1984-11-09 | Die unit for crosslinked plastic insulated power cable connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59237080A JPS61116784A (en) | 1984-11-09 | 1984-11-09 | Die unit for crosslinked plastic insulated power cable connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61116784A JPS61116784A (en) | 1986-06-04 |
| JPH0568837B2 true JPH0568837B2 (en) | 1993-09-29 |
Family
ID=17010115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59237080A Granted JPS61116784A (en) | 1984-11-09 | 1984-11-09 | Die unit for crosslinked plastic insulated power cable connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61116784A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0853201A (en) * | 1994-08-10 | 1996-02-27 | Hiromi Hatakeyama | Dust box |
-
1984
- 1984-11-09 JP JP59237080A patent/JPS61116784A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0853201A (en) * | 1994-08-10 | 1996-02-27 | Hiromi Hatakeyama | Dust box |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61116784A (en) | 1986-06-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |