JPH0568860B2 - - Google Patents

Info

Publication number
JPH0568860B2
JPH0568860B2 JP59198703A JP19870384A JPH0568860B2 JP H0568860 B2 JPH0568860 B2 JP H0568860B2 JP 59198703 A JP59198703 A JP 59198703A JP 19870384 A JP19870384 A JP 19870384A JP H0568860 B2 JPH0568860 B2 JP H0568860B2
Authority
JP
Japan
Prior art keywords
case
terminal
resin
conductive pattern
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59198703A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6177353A (ja
Inventor
Naomasa Sugita
Tetsuro Suzuki
Yoshiharu Yotsumoto
Hisanori Muramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59198703A priority Critical patent/JPS6177353A/ja
Publication of JPS6177353A publication Critical patent/JPS6177353A/ja
Publication of JPH0568860B2 publication Critical patent/JPH0568860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Rectifiers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59198703A 1984-09-25 1984-09-25 半導体整流装置 Granted JPS6177353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59198703A JPS6177353A (ja) 1984-09-25 1984-09-25 半導体整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59198703A JPS6177353A (ja) 1984-09-25 1984-09-25 半導体整流装置

Publications (2)

Publication Number Publication Date
JPS6177353A JPS6177353A (ja) 1986-04-19
JPH0568860B2 true JPH0568860B2 (2) 1993-09-29

Family

ID=16395615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59198703A Granted JPS6177353A (ja) 1984-09-25 1984-09-25 半導体整流装置

Country Status (1)

Country Link
JP (1) JPS6177353A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2593471B2 (ja) * 1987-03-11 1997-03-26 株式会社東芝 半導体装置
EP1587140B1 (de) * 2004-03-12 2011-09-21 Robert Bosch Gmbh Elektronisches Bauteil mit einer Schaltung, die mit einer Gelschicht versehen ist und Verfahren zur Herstellung des Bauteils

Also Published As

Publication number Publication date
JPS6177353A (ja) 1986-04-19

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