JPH057066A - Method for manufacturing printed wiring board - Google Patents
Method for manufacturing printed wiring boardInfo
- Publication number
- JPH057066A JPH057066A JP15716491A JP15716491A JPH057066A JP H057066 A JPH057066 A JP H057066A JP 15716491 A JP15716491 A JP 15716491A JP 15716491 A JP15716491 A JP 15716491A JP H057066 A JPH057066 A JP H057066A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- injection
- printed wiring
- wiring board
- metal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は熱可塑性樹脂を射出成形
するプリント配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board by injection molding a thermoplastic resin.
【０００２】[0002]
【従来の技術】近年、プリント配線板を立体的な形状に
成形加工し、それ自体を電気機械あるいは電子機器の筐
体（ケース）として使用する、といった用途に対して、
熱可塑性樹脂を射出成形してなるプリント配線板が開発
され、既に一部実用化されるに至っている。2. Description of the Related Art In recent years, printed wiring boards have been molded into a three-dimensional shape and used themselves as a casing (case) for electric machines or electronic equipment.
A printed wiring board formed by injection molding a thermoplastic resin has been developed and has already been partially put into practical use.
【０００３】このプリント配線板を立体的な形状に形成
して電子機器の筐体として用いることで、従来の独立し
たプリント配線板を用いる場合と比較して電子機器の更
なる小型化が図れるとともに、回路部品のコストダウン
を図ることができるというメリットがある。By forming this printed wiring board in a three-dimensional shape and using it as a housing of an electronic device, the electronic device can be further miniaturized as compared with the case where a conventional independent printed wiring board is used. There is an advantage that the cost of circuit parts can be reduced.
【０００４】この射出成形によるプリント配線板の製造
方法としては、射出成形金型を用いて熱可塑性樹脂を射
出成形してプリント配線板の本体である基板を形成し射
出成形金型から離型させたのち、基板上にめっきレジス
トパターンを貼設し、無電解銅めっきなど化学めっきに
よるアディティブプロセスによってめっきレジストパタ
ーンが貼設されていない部分に金属導体配線パターンを
被着させている。このとき、合成樹脂製の基板と金属製
の金属導体配線パターンとの密着性をより強固にするた
めに、化学めっきの前処理として基板表面の樹脂を研磨
などで粗化し、あるいはあらかじめ合成樹脂に触媒を混
入させるなどして、被着させるべき金属導体配線パター
ンにアンカー効果を与える技術が用いられている。As a method for manufacturing a printed wiring board by this injection molding, a thermoplastic resin is injection molded using an injection molding die to form a substrate which is the main body of the printed wiring board, and is released from the injection molding die. After that, a plating resist pattern is stuck on the substrate, and a metal conductor wiring pattern is adhered to a portion where the plating resist pattern is not stuck by an additive process such as electroless copper plating by chemical plating. At this time, in order to further strengthen the adhesion between the synthetic resin substrate and the metal conductor wiring pattern made of metal, the resin on the substrate surface is roughened by polishing or the like in advance as a pretreatment for chemical plating. There is used a technique of giving an anchor effect to a metal conductor wiring pattern to be adhered by mixing a catalyst.
【０００５】射出成形によるプリント配線板は、配線パ
ターンの形成にこのようなアディティブプロセスを用い
ているので、従来のサブトラクティブ法によってエッチ
ングおよびめっきを繰り返して配線パターンが形成され
るプリント配線板のような煩雑な工程とは異なり、配線
パターンを形成する工程が極めて簡易なものとなってい
る。しかもエッチング液の後処理の問題や外層銅薄の無
駄の問題があるサブトラクティブ法と比較して、よりク
リーンで無駄が少なく製造コストを低くできるというメ
リットをも有している。Since a printed wiring board by injection molding uses such an additive process for forming a wiring pattern, it is like a printed wiring board in which a wiring pattern is formed by repeating etching and plating by a conventional subtractive method. Unlike the complicated process, the process of forming the wiring pattern is extremely simple. Moreover, compared with the subtractive method, which has the problem of post-treatment of the etching solution and the problem of waste of the outer copper thin film, it has the advantage of being cleaner, less wasteful, and lower in manufacturing cost.
【０００６】しかしながら、現在のところ、このアディ
ティブプロセスにより配線パターンを形成する方法で
は、無電解めっきプロセスにおけるめっき液濃度の局所
的な偏り等に因ってファインパターン化が困難であり、
また配線パターンの金属の被着に要する時間が数時間か
ら約半日程度と長く、もし短時間に被着させようとする
と被着密度や強度等が著しく劣悪化するために、それ以
上の時間短縮が困難で製造効率が低い、という問題があ
る。However, at present, in the method of forming a wiring pattern by this additive process, it is difficult to form a fine pattern due to local unevenness of the plating solution concentration in the electroless plating process,
Also, the time required for depositing the metal of the wiring pattern is as long as several hours to about half a day, and if it is attempted to deposit in a short time, the deposition density and strength will deteriorate significantly, so further shorten the time. Is difficult and the production efficiency is low.
【０００７】このように、射出成形によるプリント配線
板の配線パターン形成において、従来のようなアディテ
ィブプロセスを用いた製造方法では、ファインパターン
化が困難であり、また配線パターン形成時間が長くかか
る、という問題があった。As described above, in forming a wiring pattern on a printed wiring board by injection molding, it is difficult to form a fine pattern and it takes a long time to form a wiring pattern by a conventional manufacturing method using an additive process. There was a problem.
【０００８】[0008]
【発明が解決しようとする課題】本発明は、このような
問題に鑑みてなされたもので、その目的とするところ
は、射出成形によるプリント配線板の製造方法におい
て、配線パターンのファインパターン化が実現でき、か
つ配線パターンを短時間で形成できるようにし、さらに
配線パターンの被着強度を向上させた、射出成形による
プリント配線板の製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to form a fine wiring pattern in a method of manufacturing a printed wiring board by injection molding. It is an object of the present invention to provide a method of manufacturing a printed wiring board by injection molding, which can be realized, a wiring pattern can be formed in a short time, and the adhesion strength of the wiring pattern can be improved.
【０００９】[0009]
【課題を解決するための手段】本発明のプリント配線板
の製造方法は、熱可塑性樹脂を射出成形用金型にて射出
成形するプリント配線板の製造方法において、前記射出
成形用金型は内面にめっきレジストパターンが貼設さ
れ、かつ金属の離型性の良い材質よりなるものであっ
て、前記射出成形用金型の内面の前記めっきレジストパ
ターンが被着されていない部分に電気めっきにより金属
導体を被着させて所望の金属導体配線パターンを形成さ
せる工程と、前記射出成形用金型に熱可塑性樹脂を注入
してプリント配線板の基板を射出成形するとともに、前
記射出成形用金型の内面に被着されていた前記金属導体
配線パターンを前記基板に転写する工程と、前記金属導
体配線パターンおよび前記基板を前記射出成形用金型か
ら離型する工程と、前記金属導体配線パターンを加熱し
て、その温度を前記熱可塑性樹脂の溶融温度以上に加熱
する工程と、を具備することを特徴としている。A method for manufacturing a printed wiring board according to the present invention is a method for manufacturing a printed wiring board in which a thermoplastic resin is injection-molded in an injection-molding die, wherein the injection-molding die has an inner surface. A plating resist pattern is affixed to, and is made of a material having a good metal releasability, and a portion of the inner surface of the injection-molding die on which the plating resist pattern is not deposited is metal-plated by electroplating. A step of depositing a conductor to form a desired metal conductor wiring pattern, and injecting a thermoplastic resin into the injection molding die to injection-mold a substrate of a printed wiring board, and A step of transferring the metal conductor wiring pattern adhered to the inner surface to the substrate; a step of releasing the metal conductor wiring pattern and the substrate from the injection molding die; And heating the metal conductor wiring pattern, it is characterized by comprising the steps of heating the temperature above the melting temperature of the thermoplastic resin.
【００１０】[0010]
【作用】射出成形用金型の内面に電気めっきにより金属
導体を被着させて金属導体配線パターンを形成したの
ち、その射出成形用金型に熱可塑性樹脂を注入して基板
を射出成形する。このとき、前述の金属導体配線パター
ンは、射出成形用金型からの離型性が良いので、注入さ
れた熱可塑性樹脂側即ち基板に転写されて、所望の金属
導体配線パターンが貼設されたプリント配線板が形成さ
れる。そしてこのままの状態では金属導体配線パターン
の基板への密着強度が十分ではないので、金属導体配線
パターンを加熱して、これに接する基板をその熱可塑性
樹脂の溶融温度以上の温度になるようにして溶融させ、
金属導体配線パターンに融着させてその密着強度を強め
る。The metal conductor is deposited on the inner surface of the injection molding die by electroplating to form a metal conductor wiring pattern, and then a thermoplastic resin is injected into the injection molding die to inject the substrate. At this time, since the above-mentioned metal conductor wiring pattern has a good releasability from the injection molding die, it was transferred to the injected thermoplastic resin side, that is, the substrate, and the desired metal conductor wiring pattern was attached. A printed wiring board is formed. And in this state as it is, the adhesion strength of the metal conductor wiring pattern to the substrate is not sufficient, so that the metal conductor wiring pattern is heated so that the substrate in contact with it has a temperature not lower than the melting temperature of the thermoplastic resin. Melt,
It is fused to the metal conductor wiring pattern to enhance its adhesion strength.
【００１１】このように、金属導体配線パターンの形成
に電気めっきを用いているので被着密度や強度信頼性の
高い金属導体配線パターンが短時間で形成できる。ま
た、射出成形時の樹脂と金属の食い付きによる転写だけ
でなく、基板を溶融して金属導体配線パターンに融着さ
せているので、その密着強度は大幅に強化される。As described above, since the electroplating is used for forming the metal conductor wiring pattern, the metal conductor wiring pattern having high deposition density and high strength reliability can be formed in a short time. Further, not only the transfer due to the bite between the resin and the metal at the time of injection molding, but also the substrate is melted and fused to the metal conductor wiring pattern, so that the adhesion strength is greatly enhanced.
【００１２】[0012]
【実施例】以下、図面に基づいて本発明の実施例を詳細
に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００１３】図１は本発明の製造方法に係る射出成形用
金型およびそれにより形成されるプリント配線板を示す
側面断面図である。FIG. 1 is a side sectional view showing an injection molding die according to the manufacturing method of the present invention and a printed wiring board formed thereby.
【００１４】本発明に係るプリント配線板の製造方法に
おいては、図１に示すような射出成形用金型１を用い
る。In the method for manufacturing a printed wiring board according to the present invention, an injection molding die 1 as shown in FIG. 1 is used.
【００１５】この射出成形用金型１は、ＷＣ（炭化タン
グステン）にＣＯ（一酸化炭素）を加えた超硬合金を母
材とし、これをＮＣ加工にてザグリ加工して雌型の射出
成形用金型本体２、３を成形し、この内面全体に薄膜形
成プロセスにより絶縁体であるｉ−カーボン膜を被着さ
せ、形成したい配線パターン部分のｉ−カーボン膜をレ
ーザーにて除去して残りの部分が電気めっきレジスト４
となるようにしたものである。The injection molding die 1 is made of a cemented carbide obtained by adding CO (carbon monoxide) to WC (tungsten carbide) as a base material, and this is subjected to counter boring by NC processing to make a female injection molding. The mold main bodies 2 and 3 are molded, an i-carbon film that is an insulator is deposited on the entire inner surface by a thin film forming process, and the i-carbon film of the wiring pattern portion to be formed is removed by a laser and left. Is the electroplating resist 4
It is designed to be
【００１６】前述のＷＣ（炭化タングステン）＋ＣＯ
（一酸化炭素）の超硬合金を母材とした射出成形用金型
本体２、３は、ｉ−カーボン膜の被着性が良く、しかも
Ｃｕ（銅）などの金属およびＰＰＳ（ポリフェニレンサ
ルファイド樹脂）などの熱可塑性樹脂に対して離型性の
良いものとなっている。The above-mentioned WC (tungsten carbide) + CO
The injection-molding die bodies 2 and 3 using a cemented carbide of (carbon monoxide) as a base material have a good adherence of the i-carbon film, and also have a metal such as Cu (copper) and PPS (polyphenylene sulfide resin). ) And other thermoplastic resins have good releasability.
【００１７】このような射出成形用金型１の内面の、電
気めっきレジスト４を施していない部分に電気銅めっき
によりＣｕ（銅）を析出させて、所望の配線パターン５
を形成し、一旦この射出成形用金型本体２、３の内面に
被着させておく。Cu (copper) is deposited by electrolytic copper plating on a portion of the inner surface of the injection molding die 1 where the electroplating resist 4 is not applied, and a desired wiring pattern 5 is formed.
Is formed and is once attached to the inner surfaces of the injection-molding die bodies 2, 3.
【００１８】この射出成形用金型１の上部に設けられた
注入口８からポリフェニレンサルファイド樹脂などの熱
可塑性樹脂を射出成形用金型１の内部に注入して、プリ
ント配線板７の本体である基板６を所望の形状に射出成
形する。A thermoplastic resin such as a polyphenylene sulfide resin is injected into the injection molding die 1 through an injection port 8 provided in the upper portion of the injection molding die 1 to form the main body of the printed wiring board 7. The substrate 6 is injection molded into a desired shape.
【００１９】一旦射出成形用金型本体２、３の内面に被
着させておいた前述の配線パターン５は、この射出成形
と同時に、射出成形された基板６上にその射出成形時の
熱と圧力によって転写される。この場合、このＣｕ
（銅）製の配線パターン５は基板６との食い付きによっ
て、射出成形用金型本体２、３から離型して基板６上に
転写される。The above-mentioned wiring pattern 5 which has been once adhered to the inner surfaces of the injection-molding die bodies 2 and 3 is, simultaneously with this injection molding, heat-treated at the time of the injection molding on the injection-molded substrate 6. Transferred by pressure. In this case, this Cu
The wiring pattern 5 made of (copper) is released from the injection molding die bodies 2 and 3 and transferred onto the substrate 6 by biting with the substrate 6.
【００２０】こうして本体を射出成形し配線パターン５
を転写してのち、図１（ｂ）に示すようにこのプリント
配線板を射出成形用金型１から取り出して、樹脂注入時
に生じたバリを取り去る。In this way, the main body is injection-molded to form the wiring pattern 5.
After transferring, the printed wiring board is taken out of the injection molding die 1 as shown in FIG. 1 (b), and burrs generated during resin injection are removed.
【００２１】そして、さらに配線パターン５の基板６へ
の食い付きを強固にするために、射出成形用金型１と同
様の形状および材質で、めっきレジストが貼着されてい
ない加熱用金型１０を、プリント配線板７の配線パター
ン５に当接させ、この加熱用金型１０全体に外部から熱
を加えて熱可塑性樹脂の溶融温度以上になるまで加熱
し、配線パターン５に接する基板６の熱可塑性樹脂を溶
融させて基板６と配線パターン５とを強固に融着させ
る。これを図２に示す。Then, in order to further strengthen the biting of the wiring pattern 5 to the substrate 6, the heating mold 10 having the same shape and material as the injection molding mold 1 and having no plating resist attached thereto. Is brought into contact with the wiring pattern 5 of the printed wiring board 7, and heat is applied to the entire heating die 10 from the outside until the temperature exceeds the melting temperature of the thermoplastic resin, and the substrate 6 in contact with the wiring pattern 5 is heated. The substrate 6 and the wiring pattern 5 are firmly fused by melting the thermoplastic resin. This is shown in FIG.
【００２２】配線パターン５はプリント配線板７の基板
６の外面に貼着されており、基板６の外面よりもその厚
みの分突出している。このため加熱用金型１０をプリン
ト配線板７に圧接させると、加熱用金型１０は突出して
いる配線パターン５にのみ当接するので、加熱用金型１
０全体に熱を加えても、熱は配線パターン５のみに伝導
され、基板６の配線パターン５に接する部分のみが溶融
され、融着される。The wiring pattern 5 is attached to the outer surface of the substrate 6 of the printed wiring board 7 and protrudes from the outer surface of the substrate 6 by the thickness thereof. Therefore, when the heating die 10 is brought into pressure contact with the printed wiring board 7, the heating die 10 comes into contact only with the protruding wiring pattern 5, so that the heating die 1
Even if heat is applied to the entire 0, the heat is conducted only to the wiring pattern 5, and only the portion of the substrate 6 in contact with the wiring pattern 5 is melted and fused.
【００２３】このとき、配線パターン５が貼設されてい
る部分の熱可塑性樹脂の温度がその溶融温度よりも20℃
から70℃程度高くなるように 3秒程度加熱すれば、基板
６と配線パターン５とが強固に、しかもその他の部位に
影響のない最も好条件な状態で融着されることが、本実
施例の施行にあたって確認されている。At this time, the temperature of the thermoplastic resin in the portion where the wiring pattern 5 is attached is 20 ° C. higher than the melting temperature.
In this embodiment, if the substrate 6 and the wiring pattern 5 are strongly heated to about 70 ° C. for about 3 seconds, the substrate 6 and the wiring pattern 5 are firmly bonded to each other in the most favorable condition without affecting other parts. Has been confirmed upon enforcement.
【００２４】このような製造方法によって製造されたプ
リント配線板７の、配線パターン５と基板６との密着強
度を計測した。その結果、従来のアディティブプロセス
により形成された配線パターンの場合では、密着強度は
0.2〜0.3ｋｇ／ｍｍ2 程度であったものが、本発明に
かかるプリント配線板７の配線パターン５では、 1.0〜
1.5ｋｇ／ｍｍ2 と、その密着強度は著しく強化されて
おり、十分に信頼性が高く実用性の高いものであること
が確認された。The adhesion strength between the wiring pattern 5 and the substrate 6 of the printed wiring board 7 manufactured by such a manufacturing method was measured. As a result, in the case of the wiring pattern formed by the conventional additive process, the adhesion strength is
The wiring pattern of the printed wiring board 7 according to the present invention is about 0.2 to 0.3 kg / mm 2 , but 1.0 to
The adhesion strength was significantly strengthened to 1.5 kg / mm 2, and it was confirmed that the adhesiveness was sufficiently reliable and highly practical.
【００２５】なお、本実施例では配線パターン５の基板
６上への密着強度の強化のために、加熱用金型１０に外
部から熱を加えることで、配線パターン５と基板６とが
接合している部分を溶融させ融着させているが、加熱方
法としてはこれには限定しない。例えば、プリント配線
板７が射出成形用金型１内に形成され保持された状態で
射出成形用金型１を加熱して、プリント配線板７全体に
熱を加えてもよい。ただしこの場合は配線パターン５以
外の部分も溶融温度程度まで加熱されるので、前述の実
施例での加熱温度および加熱時間を変更して、この方法
に適合した加熱条件を設定する必要がある。In this embodiment, in order to enhance the adhesion strength of the wiring pattern 5 on the substrate 6, the heating die 10 is externally heated to bond the wiring pattern 5 and the substrate 6 to each other. Although the part that is shown is melted and fused, the heating method is not limited to this. For example, heat may be applied to the entire printed wiring board 7 by heating the injection molding die 1 while the printed wiring board 7 is formed and held in the injection molding die 1. However, in this case, the portions other than the wiring pattern 5 are also heated to about the melting temperature, so it is necessary to change the heating temperature and the heating time in the above-described embodiment to set the heating conditions suitable for this method.
【００２６】このほかに、配線パターン５が転写された
プリント配線板７を射出成形用金型１から取り出し配線
パターン５に大電流を流してその電気抵抗によりこれを
発熱させて、基板６と配線パターン５とが接合している
部分を溶融させ融着させる方法や、プリント配線板７に
外部の素子や回路部品などをはんだ付けする際に、フロ
ーはんだ付けやベーパーリフローはんだ付けなどのため
の加熱時の熱で配線パターン５および基板６を加熱し
て、配線パターン５と基板６とを融着させる方法などを
用いてもよい。In addition to this, the printed wiring board 7 to which the wiring pattern 5 is transferred is taken out from the injection molding die 1 and a large current is passed through the wiring pattern 5 to generate heat by its electric resistance, thereby wiring the board 6 and the wiring. A method for melting and fusing a portion where the pattern 5 is joined, or heating for flow soldering or vapor reflow soldering when soldering an external element or circuit component to the printed wiring board 7. A method of heating the wiring pattern 5 and the substrate 6 with the heat of time to fuse the wiring pattern 5 and the substrate 6 may be used.
【００２７】また、本発明において用いるべき熱可塑性
樹脂には、プリント配線板として適切な電気絶縁性、耐
熱性、耐湿性、および成形性の良さ、などを備えたもの
であることが要求されるが、これに適合するものとして
は、前述の実施例で用いたポリフェニレンサルファイド
樹脂の他に、例えばポリカーボネート樹脂、ポリスルホ
ン樹脂、ポリエーテルスルホン樹脂、ポリアセタール樹
脂、ポリエーテルケトン樹脂、ポリエーテルイミド樹
脂、ポリフェニレンオキサイド樹脂などが挙げられる。Further, the thermoplastic resin to be used in the present invention is required to have suitable electrical insulation, heat resistance, moisture resistance, and good moldability as a printed wiring board. However, as suitable for this, in addition to the polyphenylene sulfide resin used in the above examples, for example, polycarbonate resin, polysulfone resin, polyethersulfone resin, polyacetal resin, polyetherketone resin, polyetherimide resin, polyphenylene Examples thereof include oxide resins.
【００２８】本実施例では、製造するプリント配線板の
例として、図１に示すように実際にはプラスチックチッ
プキャリアを選んでいる。これは、プラスチックチップ
キャリアは中央に凹部を有して立体的な形態をしてお
り、本発明の製造方法に係るプリント配線板の趣旨に適
合しているためと、チップキャリアはその形態上本発明
の実施例の試作品として手頃な寸法と形状であることに
よる。しかし本発明はこの実施例のような形態のプラス
チックチップキャリアのみに限定されず、射出成形によ
るプリント配線板全般の製造、特に筐体などの形状に形
成される立体的なプリント配線板の製造に好適な技術で
ある。In this embodiment, as an example of the printed wiring board to be manufactured, a plastic chip carrier is actually selected as shown in FIG. This is because the plastic chip carrier has a recess in the center and has a three-dimensional shape, which is suitable for the purpose of the printed wiring board according to the manufacturing method of the present invention. This is because the prototype of the embodiment of the invention has an affordable size and shape. However, the present invention is not limited to only the plastic chip carrier of the form as in this embodiment, and is applicable to the manufacture of printed wiring boards in general by injection molding, particularly to the manufacture of three-dimensional printed wiring boards formed in the shape of a casing or the like. This is a suitable technique.
【００２９】[0029]
【発明の効果】以上詳細に説明したように、本発明のプ
リント配線板の製造方法によれば、射出成形によるプリ
ント配線板の配線パターン形成において、配線パターン
のファインパターン化が実現できかつ配線パターンを短
時間で形成できるようにし、さらに配線パターンの被着
強度を向上させた射出成形によるプリント配線板を提供
することができる。As described in detail above, according to the method for manufacturing a printed wiring board of the present invention, in forming the wiring pattern of the printed wiring board by injection molding, a fine wiring pattern can be realized and the wiring pattern can be realized. It is possible to provide a printed wiring board by injection molding, which enables formation in a short time and further improves the adhesion strength of the wiring pattern.
【図１】本発明の製造方法に係る射出成形用金型および
それにより形成されるプリント配線板を示す側面断面
図。FIG. 1 is a side sectional view showing an injection molding die according to a manufacturing method of the present invention and a printed wiring board formed thereby.
【図２】本発明の製造方法に係る加熱用金型およびそれ
が圧接されたプリント配線板を示す側面断面図。FIG. 2 is a side sectional view showing a heating mold according to the manufacturing method of the present invention and a printed wiring board to which the heating mold is pressed.
１…射出成形用金型 ２、３…射出成形用金型本体 ４…電気めっきレジスト ５…配線パターン ６…基板 ７…プリント配線板 ８…注入口 ９…支持棒 １０…加熱用金型 1 ... Mold for injection molding 2, 3 ... Injection mold main body 4 ... Electroplating resist 5 ... Wiring pattern 6 ... Substrate 7 ... Printed wiring board 8 ... Filling port 9 ... Support rod 10 ... Heating mold
Claims (3)
成形するプリント配線板の製造方法において、前記射出
成形用金型は内面にめっきレジストパターンが貼設さ
れ、かつ金属の離型性の良い材質よりなるものであっ
て、前記射出成形用金型の内面の前記めっきレジストパ
ターンが被着されていない部分に電気めっきにより金属
導体を被着させて所望の金属導体配線パターンを形成さ
せる工程と、前記射出成形用金型に熱可塑性樹脂を注入
してプリント配線板の基板を射出成形するとともに、前
記射出成形用金型の内面に被着されていた前記金属導体
配線パターンを前記基板に転写する工程と、前記金属導
体配線パターンおよび前記基板を、前記射出成形用金型
から離型する工程と、前記金属導体配線パターンを加熱
して、その温度を前記熱可塑性樹脂の溶融温度以上に加
熱する工程と、を具備するプリント配線板の製造方法。1. A method for manufacturing a printed wiring board in which a thermoplastic resin is injection-molded by an injection-molding die, wherein the injection-molding die has a plating resist pattern affixed to the inner surface thereof, and metal releasability. Which is made of a good material, is formed by electroplating a metal conductor on a portion of the inner surface of the injection molding die where the plating resist pattern is not deposited to form a desired metal conductor wiring pattern. And a step of injecting a thermoplastic resin into the injection-molding die to injection-mold a substrate of a printed wiring board, and the metal conductor wiring pattern adhered to the inner surface of the injection-molding die is applied to the substrate. And a step of releasing the metal conductor wiring pattern and the substrate from the injection molding die, heating the metal conductor wiring pattern, A method of manufacturing a printed wiring board, comprising the step of heating to a melting temperature of a plastic resin or higher.
転写して後、前記金属導体配線パターンに電流を導通さ
せ、その電気抵抗による発熱で前記金属導体配線パター
ンの温度を前記熱可塑性樹脂の溶融温度以上に加熱する
請求項第１項記載のプリント配線板の製造方法。2. The metal conductor wiring pattern is transferred to the substrate, a current is conducted to the metal conductor wiring pattern, and the temperature of the metal conductor wiring pattern is melted by the heat generated by the electric resistance of the thermoplastic resin. The method for producing a printed wiring board according to claim 1, wherein the heating is performed at a temperature or higher.
転写して後、外部の電子部品を前記プリント配線板には
んだ付けする際に、前記はんだ付け時の熱により前記金
属導体配線パターンの温度を前記熱可塑性樹脂の溶融温
度以上に加熱する請求項第１項記載のプリント配線板の
製造方法。3. When the external electronic component is soldered to the printed wiring board after the metal conductor wiring pattern is transferred to the substrate, the temperature of the metal conductor wiring pattern is controlled by the heat during the soldering. The method for manufacturing a printed wiring board according to claim 1, wherein heating is performed at a melting temperature of the thermoplastic resin or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15716491A JPH057066A (en) | 1991-06-27 | 1991-06-27 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15716491A JPH057066A (en) | 1991-06-27 | 1991-06-27 | Method for manufacturing printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH057066A true JPH057066A (en) | 1993-01-14 |
Family
ID=15643591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15716491A Withdrawn JPH057066A (en) | 1991-06-27 | 1991-06-27 | Method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH057066A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6945707B2 (en) | 2000-04-21 | 2005-09-20 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
| JP2009158910A (en) * | 2007-12-27 | 2009-07-16 | Samsung Electro Mech Co Ltd | Light emitting diode unit |
-
1991
- 1991-06-27 JP JP15716491A patent/JPH057066A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6945707B2 (en) | 2000-04-21 | 2005-09-20 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
| US7040817B2 (en) | 2000-04-21 | 2006-05-09 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
| JP2009158910A (en) * | 2007-12-27 | 2009-07-16 | Samsung Electro Mech Co Ltd | Light emitting diode unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |