JPH0573261B2 - - Google Patents
Info
- Publication number
- JPH0573261B2 JPH0573261B2 JP61161145A JP16114586A JPH0573261B2 JP H0573261 B2 JPH0573261 B2 JP H0573261B2 JP 61161145 A JP61161145 A JP 61161145A JP 16114586 A JP16114586 A JP 16114586A JP H0573261 B2 JPH0573261 B2 JP H0573261B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- cold plate
- temperature sensor
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61161145A JPS6316648A (ja) | 1986-07-08 | 1986-07-08 | 集積回路パツケ−ジ温度検出構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61161145A JPS6316648A (ja) | 1986-07-08 | 1986-07-08 | 集積回路パツケ−ジ温度検出構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6316648A JPS6316648A (ja) | 1988-01-23 |
| JPH0573261B2 true JPH0573261B2 (cs) | 1993-10-14 |
Family
ID=15729447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61161145A Granted JPS6316648A (ja) | 1986-07-08 | 1986-07-08 | 集積回路パツケ−ジ温度検出構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316648A (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110232866A1 (en) * | 2010-03-29 | 2011-09-29 | Zaffetti Mark A | Integral cold plate and honeycomb facesheet assembly |
| JP5926928B2 (ja) * | 2011-11-04 | 2016-05-25 | 昭和電工株式会社 | パワー半導体モジュール冷却装置 |
-
1986
- 1986-07-08 JP JP61161145A patent/JPS6316648A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6316648A (ja) | 1988-01-23 |
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