JPH0574967A - Data deletion preventive cover and ic socket for eprom - Google Patents

Abstract

(57) [Summary] [Object] To provide a data erasure prevention cover which is convenient for reusing an EPROM, and an IC socket which surely holds the cover in an attached state. As a data erasure prevention cover 3 which covers an erasure window 1b of an EPROM 1 and is attached to a package 1a, both ends of a strip-shaped cover substrate 3a coated with an ultraviolet light shielding material are folded back in a U-shape to form an engaging claw portion 3b. And engage the engaging claws with E
The cover is attached and held to the package by being hooked on the end of the package of the PROM. Further, stepped projections 4a are provided at both ends of the IC socket 4 for mounting the EPROM,
With the EPROM mounted in the socket, the folded back end of the engaging claw portion of the cover is clamped and fixed between the step projection and the EPROM package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a data erasure prevention cover which is attached to an EPROM package and covers an erasure window, and an IC socket structure applied to the EPROM.

[0002]

2. Description of the Related Art EPROM (erasable program)
mable ROM), especially FAMOS, which can erase data by irradiating ultraviolet rays, writes data to ROM products and then protects the data from being erased by blocking the ultraviolet rays on the surface of the package. A label is attached to block the erase window of the EPROM.

FIG. 4 shows a conventional data erasure prevention label and its usage state. In the figure, 1 is EPROM, 1a is its package, 1
Reference numeral b is an erasing window provided in the center of the package 1a, and reference numeral 1c is a lead pin for external connection which is drawn out on both sides of the package 1a. Reference numeral 2 denotes a data erasure prevention label that is used by being attached to the surface of the EPROM package 1a, and an adhesive adhesive is applied to the entire back surface side of a sheet made of an ultraviolet light shielding material. Then, after writing data in the IC memory of the EPROM, the label 2 is attached to the surface of the package 1a so as to cover the erasing window 1b and used.

[0004]

By the way, the above-mentioned conventional data erasure prevention label has the following problems in terms of use. That is, when the data already written in the EPROM is erased and new data is written again for reuse, the data erasure prevention label once attached to the package 1a is peeled off, and then the data erasure and the new data write operation are performed. It is necessary to re-attach the label after performing. However, in the case where the adhesive sheet 2b of the label 2 is applied to the entire surface of the label 2 as described above, the adhesive remains on the erasing window 1b of the EPROM 1 when the label 2 is peeled off. Moreover, if the erasing window 1b is soiled with the adhesive, it will hinder the subsequent erasing of existing data and the writing of new data. Therefore, conventionally, when the label 2 is peeled off, a troublesome work is required to wipe the surface of the erasure 1b with alcohol or the like to remove the adhesive attached to the window surface.

The present invention has been made in view of the above points, and its purpose is to replace the conventional data erasure prevention label and to enable data erasure prevention to be applied to an EPROM package without using an adhesive. It is an object of the present invention to provide an IC socket suitable for a cover and an EPROM to which the cover is attached.

[0006]

In order to achieve the above object, the data erasure prevention cover of the present invention has an engaging claw portion formed by folding both ends of a strip-shaped cover substrate coated with an ultraviolet light shielding material into a U-shape. It is formed, and the engaging claw portion is hooked on the end portion of the package of the EPROM, and the cover is attached and held to the package. Further, it is applied to an EPROM having the data erasure prevention cover attached.
In the present invention, as a C socket, both ends of the data erasure prevention cover are provided with EPROMs at both ends of the socket.
It shall be configured by providing a step-like protrusion that is sandwiched between the package and the package.

[0007]

By adopting the data erasure prevention cover described above, the cover can be attached and fixed to the EPROM package without using an adhesive, and the cover can be easily removed when the EPROM is reused. After that, it becomes possible to immediately erase data and write new data without cleaning the erase window. Moreover, after writing new data, the cover can be reattached to the EPROM package and repeatedly used.

Further, when the EPROM is inserted and set in the IC socket having the above-mentioned structure with the data erasure prevention cover attached to the package, the folded back end of the engaging claw portion of the cover is formed at both ends of the socket. Protrusion and EP
Since it is sandwiched between the ROM package and the ROM package, the cover is securely fixed.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. In the drawings of the embodiments, the same members as those in FIG. 4 are designated by the same reference numerals. First, in FIGS. 1 and 2, 3 is a data erasure prevention cover that covers the erasure window 1b of the EPROM 1 and is attached to the package 1a, and 4 is EPRO.
IC socket for mounting M1. Here, the cover 3 is provided with engaging claw portions 3b folded back in a U shape at both ends of a strip substrate 3a having elasticity such as plastic.
Further, a sheet 3c made of an ultraviolet ray shielding material is attached to the surface area of the EPROM which covers the erasing window 1b, or an ultraviolet ray shielding material is applied. Further, with respect to the IC socket 4, stepped projections 4a bulging toward the mounting surface side of the EPROM 1 are formed at both ends of the socket body.

Next, the above-mentioned data erasure prevention cover 3
FIG. 3 shows a method of attaching the EPROM 1 and the mounting state of the EPROM 1 to the IC socket 4. First, one engagement claw portion 3b of the cover 3 is moved from the state shown in FIG.
The M1 package 1a is held and hooked on one end. Subsequently, while bending the cover 3, the other engaging claw portion 3b is hooked on the other end of the package 1a as shown in FIGS. As a result, the cover 3 covers the erase window of the EPROM 1 and is fixedly attached to the surface of the package 1a as shown in FIG. Next, with the cover 3 attached, the lead pin 1c of the EPROM 1 is inserted into the IC socket 4 from above as shown in (e) and mounted, and the engaging claw portion 3b is folded back as shown in (f). The end portion is sandwiched and fixed between the projecting portion 4a of the socket 4 and the EPROM package 1a.

When the EPROM 1 is reused from such a use state, the EPROM package 1a is removed from the IC socket 4 and then the data erasure prevention cover 3 is removed from the package 1a. Write data. In addition, after writing new data, the cover 3 is again EPR-operated by the same operation as described above.
Used by attaching to OM1.

[0012]

As described above, the following effects can be obtained by using the data erasure prevention cover and the IC socket of the present invention. First, since the data erasure prevention cover is attached and held on the EPROM package without using an adhesive, when the EPROM is reused, the data erasure prevention cover should be easily removed. The existing data can be erased immediately and the new data can be written, and the handling is greatly simplified compared to the conventional data erasure prevention label attached with an adhesive.

Also, by using the IC socket having the protrusions at both ends, the folded end of the data erasure prevention cover attached to the EPROM package is sandwiched between the protrusion of the socket and the EPROM package. As a result, the cover can be securely held in the attached position.

[Brief description of drawings]

FIG. 1 is an assembly configuration diagram showing a usage state of an embodiment of the present invention, (a) is a plan view and (b) is a side view of (a).

FIG. 2 is an exploded perspective view of FIG.

FIG. 3 is an assembly process diagram of FIG. 1, wherein (a) to (f) are views showing states of each assembly process.

FIG. 4 is an EP coated with a conventional data erasure prevention label.
ROM plan view

[Explanation of symbols]

 1 EPROM 1a Package 1b Erase Window 1c Lead Pin 3 Data Erase Prevention Cover 3a Substrate 3b Engaging Claw 3c Ultraviolet Light Shielding Sheet 4 IC Package 4a Projection

Claims (2)

[Claims] 1. A data erasure prevention cover which is attached to an EPROM package and covers an erasure window, wherein both ends of a strip-shaped cover substrate coated with an ultraviolet light shielding material are folded back in a U shape to form an engaging claw portion. An EPROM data erasure prevention cover characterized in that the engaging claw portion is hooked on an end portion of an EPROM package and the cover is attached and held to the package. 2. An IC socket applied to an EPROM to which the data erasure prevention cover according to claim 1 is attached,
An IC socket, characterized in that stepped projections are provided at both ends of the socket for sandwiching the folded back end of the engaging claw portion of the cover with the EPROM package.