JPH0575603B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to electronic components such as integrated circuit elements, chip resistors, chip capacitors, cylindrical leadless resistors, and other small components. In order to supply chip components when mounting them on an electronic circuit board, etc., component storage sections are provided at regular intervals in the longitudinal direction of a tape-shaped carrier sheet made of synthetic resin, and the chip components are stored in each component storage section. The present invention relates to a device, a device for taking out chip parts from each component storage section thereof, and a carrier sheet applied to these devices.

[Problems to be solved by conventional technology and invention]

When mounting chip components such as electronic components onto an electronic circuit board, these chip components must be supplied to the component supply device without being turned upside down and in a predetermined left-right orientation. After a carrier sheet made of synthetic resin is stored in each component storage part in advance in a predetermined posture, the upper surface of the carrier sheet is sealed with a cover tape to hold the chip components in each component storage part so that their postures do not change.

On the other hand, when this carrier sheet is attached to the component supply device, the cover tape is peeled off near the attachment portion to the electronic circuit board, and the chip components are taken out from each component storage portion using a vacuum suction bit.

As described above, various so-called chip component loading devices have been devised for loading chip components such as electronic components into each component storage section of a synthetic resin carrier sheet in a normal (correct) orientation.

As one of the prior art, for example, JP-A-63-
In Publication No. 317408, electronic components such as transistors formed at regular intervals on a strip-shaped lead frame are separated from the lead frame at the upper part of the outer periphery of a rotating loading drum, and electronic components such as transistors are formed at regular intervals on the outer periphery of the rotating loading drum. The parts are vacuum-adsorbed and drawn in so as to be stored in pockets provided at intervals, and the parts storage part is recessed downward so that it faces the opening of the pocket at the location where the outer peripheral surface of the loading drum faces downward. The loaded synthetic resin carrier sheet is transported along its longitudinal direction, and at a point where the outer circumferential surface of the loading drum faces downward, a vacuum suction bit that can protrude radially outward from the inner diameter side of the drum is used. Extruding the chip parts while adsorbing them,
A configuration is disclosed in which the parts are pushed and loaded into the parts storage section in the carrier sheet.

In this prior art, the chip parts are inserted one by one into the component storage part of the carrier sheet using the vacuum suction bit, so while the vacuum suction bit protrudes radially outward with respect to the loading drum, the loading drum There was a problem in that the loading speed of chip parts could not be increased.

Another problem was that the structure of the device became extremely complicated, as it required a passage for vacuum suction to be provided in each pocket of the loading drum, and the vacuum suction bit, its driving device, and synchronization mechanism.

As another prior art, in the embodiment device shown in FIG. 7 described in Japanese Unexamined Patent Publication No. 63-155712, a push-out pin that protrudes radially outward from the bottom surface of each pocket of the loading drum is inserted into the loading drum. A cam provided on the inner circumference side is provided so that the ejector pin protrudes and retracts, and the ejector pin is moved to a position where the outer circumferential surface (opening of the pocket part) of the loading drum extends horizontally to downwardly. By forcibly pushing the chip parts stored in each pocket into the parts storage part of the carrier sheet wrapped around the outer circumferential surface of the loading drum, When the chip component is transferred from the pocket section to the component storage section of the carrier seat, the chip component is configured to avoid inconveniences such as the chip component being turned upside down.

Also, No. 10 described in the same Japanese Unexamined Patent Publication No. 155712/1983
In the example device shown in the figure, holes are drilled in the bottom of each component storage section in the carrier sheet, and holes are formed in the area from the point where the outer circumferential surface of the loading drum (opening of the pocket section) faces sideways to the point where it faces downward. In,
The guide body (located on the bottom side of the carrier sheet) that guides the carrier sheet so that it comes into contact with the outer peripheral surface of the loading drum is provided with multiple vacuum suction ports, and parts of the carrier sheet are removed from the pocket of the loading drum. It is proposed that chip parts be forcibly sucked into the storage section.

Since this type of device also requires a complicated structure such as an ejector pin and a vacuum device, the problem of increasing the size of the force device and the manufacturing cost of the device cannot be solved.

One object of the present invention is to provide a chip component loading device that eliminates these drawbacks of the prior art.

Another object of the present invention is to solve the inconvenience of a device for taking out chip parts from each part storage section in a carrier seat.

That is, in an apparatus for mounting chip components on an electronic circuit board, when the cover tape on the top surface of the carrier sheet is peeled off near the mounting section and the chip component is sucked from the component storage section of the carrier sheet using a vacuum suction bit, the If the outer diameter of the vacuum suction bit is made smaller than the opening area of the parts storage section,
Although it is possible to push the vacuum suction bit into the component housing and bring it close to the top surface of the chip component,
On the other hand, if the suction port of the vacuum suction bit becomes small, the vacuum suction force will be insufficient and suction will fail.On the other hand, if the outer diameter of the vacuum suction bit is too large than the opening area of the parts storage part, the bottom surface of the vacuum suction bit will become smaller. Since it is difficult to bring the chip close to the chip component, there is also the problem that the vacuum suction force is insufficient and the chip component fails to adsorb. If the chip parts roll), the chip parts will no longer be in the correct position (the position in which they are correctly mounted on the electronic circuit board), so a monitoring mechanism is required, and there is also the problem of easily producing defective electronic circuit boards. Ta.

Therefore, Japanese Patent Application Laid-open No. 130600/1983 proposes pushing up chip parts from the bottom of each part storage section in a carrier sheet toward the bottom of the vacuum suction bit using push-up pins.

However, since the push-up pin pushes up the chip component upward, there is usually only one point, so the posture of the pushed-up chip component is unstable and easily changes, and if the pushing-up speed is not increased, The mounting efficiency is also poor, and if the mounting process is carried out too quickly, the tip parts that are pushed up are likely to be damaged, and there is a greater possibility that the posture of the chip parts will change due to the impact or vibration.

Another object of the present invention is to provide a chip component removal device that solves this problem.

Still another object of the present invention is to provide a carrier sheet that can be commonly applied to these chip component loading and unloading devices.

[Means to solve the problem]

In order to achieve the above object, the invention relating to a chip component loading device as set forth in the first claim includes recessed component storage portions for storing chip components at regular intervals in the longitudinal direction. , and transporting a tape-shaped carrier sheet in the longitudinal direction, the tape-shaped carrier sheet having front and rear longitudinal grooves formed so as to communicate with the bottom plate in each component storage section and the front and rear side plates in the longitudinal direction of the carrier sheet. A component loading drum having pockets facing the upper opening of the component storage section at regular intervals on the outer circumferential surface is disposed in the transfer path, and the pockets on the outer circumferential surface of the loading drum are In the section where the chip components in the section move toward the component storage section in the carrier sheet, the chip components are gradually introduced into the component storage section from the outside of the bottom plate of the plurality of component storage sections of the carrier sheet. This feature is characterized by the provision of a longitudinal guide body for guiding.

Further, the invention relating to the chip component take-out device as set forth in the second claim is such that component storage portions for storing chip components are formed at regular intervals in the longitudinal direction, and each of the component storage portions is recessed. Component storage in the carrier sheet is provided above the transport path of the tape-shaped carrier sheet, which is formed by providing a front and rear longitudinal groove formed so as to communicate with the bottom plate in the section and the front and rear side plates in the longitudinal transport direction of the carrier sheet. A part suction means for suctioning chip parts from the upper opening of the part is provided so as to be movable up and down,
At a lower position of the carrier sheet facing the component suction means, a front and rear longitudinal guide body facing into the cut groove across a plurality of component storage sections in the carrier sheet is disposed, and the upper surface of the guide body is The height of the carrier sheet is increased as the carrier sheet is transferred in the direction of the component suction means.

Furthermore, the invention relates to a tape-shaped carrier sheet used in the chip component loading device of the first aspect or the chip component unloading device of the second aspect,
Component storage portions for storing chip components are formed at regular intervals in the longitudinal direction of the carrier sheet, and the bottom plate of each component storage portion is cut so as to communicate with the front and rear side plates in the transport direction of the carrier sheet. It is characterized by the provision of longitudinal longitudinal cut grooves formed in the front and rear.

〔Example〕

Next, to explain the embodiments of each invention, the first
The carrier sheet 1 shown in the figure can be commonly applied to a chip component loading device 2 and a chip component unloading device 3, which will be described later. The upper opening component storage portions 4 are embossed and recessed downward at regular intervals (P) along the direction, and the shape of each component storage portion 4 is determined by the chip resistance to be stored inside. The chip parts W are stored in a predetermined posture in each parts storage section 4, and the chip parts W are stored in a predetermined posture in order to correspond to the shape of the chip parts W such as small electronic parts such as containers and chip capacitors.
The depth dimension (H1) is set from the top opening surface to the bottom plate 4a to prevent the plate from flipping over or inverting by approximately 90 degrees.

Reference numeral 5 denotes a bottom plate 4a in each component storage section 4.
and an upwardly U-shaped cut groove in a side view formed so as to communicate with the front and rear side plates 4b and 4c (the front and rear positions in the longitudinal direction of the carrier sheet 1) connected thereto. The height at the front and rear side plates 4b and 4c is H2 (<H1).

Reference numeral 6 denotes a feed hole into which a feed pin 7 protruding from a transfer means, which will be described later, is fitted when the carrier sheet 1 is transferred along its longitudinal direction. provided, but not necessarily required.

Further, reference numeral 8 is a cover tape that covers the upper surface of the carrier sheet 1 with a heat sheet, pressure-sensitive adhesive, etc., and prevents the chip parts W in each parts storage section 4 from accidentally falling off or reversing their posture. It is something.

Figures 2 to 4 show the main parts of the loading device 2 for loading chip parts W into each component storage section 4 of the carrier sheet 1, and the carrier sheet 1 wound into a coil is not shown. It is transferred from the uncoiler to the outer periphery of the feed roller 9 in the direction of arrow A.

As shown in FIG. 4, the outer circumferential surface 9a of the feed roller 9 is provided with an annular groove 10 through which the component storage portion 4 of the carrier sheet 1 can fit and pass, and the outer circumferential surface on the side of the annular groove 10 The above-mentioned feed pin 7 is implanted in a radially outward direction.

Reference numeral 11 denotes a loading drum which is disposed in parallel so as to face the upper surface of the outer periphery of the feed roller 9 and is driven to rotate intermittently or continuously at the same circumferential speed as the feed roller 9, and the driving means is a servo. motor,
Since it is a stepping motor or the like, illustration is omitted.

Pockets 12 are recessed on the outer circumferential surface of the loading drum 11 at the same intervals as the component storage areas 4 in the carrier sheet 1, and the pockets 12 in the loading drum 11 face upward or sideways. The chip parts W fed from the feed chute 13 at predetermined intervals are stored in the pocket part 12 at certain locations.

Reference numeral 14 denotes a guide body disposed along the outer peripheral surface of the loading drum 11 to prevent the chip parts W from protruding from the pocket portion 12.

Reference numeral 15 denotes a longitudinal guide body disposed longitudinally along the transport direction (arrow A) of the carrier sheet 1 at a location where the pocket portion 12 of the loading drum 11 faces substantially downward; It is fitted into an annular recess 16 on the bottom side of the annular groove 10 so as to face the upward outer peripheral surface of the roller 9, and is fixed in position regardless of the rotation of the feed roller 9. Reference numerals 17 and 18 are mounting pins for fixing the front and rear ends of the longitudinal guide body 15 outside the feed roller 9.

In addition, this longitudinal guide body 15 is similar to the guide body 1
4 near the end (where the upper surface of the feed roller 9 and the lower surface of the loading drum 11 approach) along each groove 5 in the plurality of component storage sections 4 of the carrier sheet 1 so as to face inward into the component storage section 4. and the upper surface of the longitudinal guide body 15 is connected to the guide body 1.
The height of the longitudinal guide body 15 is large enough to fit into the parts storage section 4 on the side near the end of the longitudinal guide body 4, and as the carrier sheet 1 moves away from the upper surface of the feed roller 9 in the direction of arrow A, the height of the longitudinal guide body 15 decreases. This is how it is formed.

In other words, in the section of the outer peripheral surface of the loading drum 11 where the chip parts W in the pocket part 12 move toward the component storage part 4 of the carrier sheet 1, the plurality of parts storage areas of the carrier sheet 1 are A longitudinal guide body 15 is arranged so as to face into the cut groove 5 from the lower side of the bottom plate 4a in the part 4 and to gradually guide the chip parts W into the parts storage part 4.

With this configuration, the chip parts W stored in each pocket portion 12 of the loading drum 11 move downward along the arcuate outer periphery of the guide body 14 due to the rotation of the loading drum 11, and the pocket portion 12 moves downward. Therefore, it slides while being in contact with the arcuate outer peripheral surface of the guide body 14.

Then, at a location past the end of the guide body 14, the downwardly facing pocket portion 12 and the component storage portion 4 of the carrier sheet 1 being transported by the feed roller 9 face each other, and the chip component W at the location is Storage part 4
It falls in the direction.

At this time, the upper surface of the longitudinal guide body 15, which is disposed in the forward direction of the transfer from the point, touches the parts storage section 4 at a point near the end of the guide body 14.
(See Figure 3)
The lower surface of the chip component W about to fall is immediately caught by the upper surface of the longitudinal guide body 15, and when the chip component W enters the component storage section 4, its posture may be reversed or the side surface of the chip component W may be There will be no reversal of posture such as facing downwards,
Furthermore, the upper surface of the longitudinal guide body 15 is connected to the parts storage section 4.
As the chip part WH gradually approaches the bottom plate 4a, the received chip part WH maintains its posture,
The parts are gradually loaded into the parts storage section 4.

The reference numeral 19 designates a cover and guide member that covers the upper opening surface of the component storage section 4 so that the chip components W transferred to be loaded into each component storage section 4 of the carrier sheet 1 maintain their posture. The cover-cum-guiding member 19 is formed longitudinally in the same direction as the longitudinal guide body 15, that is, along the transport direction of the carrier sheet 1, and extends along the outer peripheral surface of the loading drum 11 and at a radius from the bottom surface of each pocket portion 12. It is disposed on the downward outer circumferential surface side of the loading drum 11 like an endless strip within the guide groove 11a recessed inward.

Due to the synergistic effect of this cover-cum-guiding member 19 and the longitudinal guide body 15, when transferring from the downward-facing pocket part 12 past the end of the guide body 14 into the parts storage part 4 of the carrier seat 1. This makes it possible to more reliably guide the person so that the posture is not reversed.

Reference numeral 20 is a guide wheel that guides the cover tape 8 so as to apply it to the upper surface of the carrier sheet 1 moving on the table 27, and reference numeral 21 is a sealing means for heat-sealing the cover tape 8 to the carrier sheet.

In place of the annular groove 10, recesses into which the component storage portions 4 of the carrier sheet 1 are inserted may be formed at predetermined intervals on the outer peripheral surface of the feed roller 9 in this embodiment.

FIG. 5 shows another embodiment of a device for loading chip parts, in which a loading drum 11 having pockets 12 formed at regular intervals on its outer circumferential surface is rotated intermittently or continuously while the loading drum 11 is rotated intermittently or continuously. Shoot 22
Then, one chip part W is stored in each pocket part 12.

Reference numeral 23 designates carrier seat 1 having the same form as described above.
The guide wheel 24 is a guide wheel that transports the chips toward the outer circumferential surface of the loading drum 11, and the guide body 24 extends over a section from a point where the pocket portion 12 in which the chip component W is stored faces sideways to a point where the pocket portion 12 faces downward.
The carrier sheet 1 is arranged so as to face the outer circumferential surface of the loading drum 11 and guide the carrier sheet 1 therein. Guide body 24
A guide groove 25 is formed in the shape of an arc, into which the parts storage section 4 of the carrier sheet 1 can be moved in a fitted state.

Reference numeral 26 denotes a longitudinal guide body disposed along the longitudinal direction of the guide groove 25, and the longitudinal guide body 26 extends from the cut groove 5 in the plurality of component storage areas 4 in the carrier sheet 1 into each of the component storage areas 4. As shown, the pocket portion 12 of the loading drum 11 extends over a section from a point where it is slightly diagonally downward to a point where it is downward.

The upper surface of the longitudinal guide body 26 extends from the cut groove 5 of the component storage section 4 of the carrier sheet 1 into the component storage section 4 at a location where the opening surface of the pocket section 12 of the loading drum 11 faces diagonally downward. It is formed so that it gradually approaches the bottom plate 4a of the component storage section 4 as it enters and goes below the longitudinal guide body 26.

With this configuration, as the loading drum 11 rotates, when the chip parts W in the pocket part 12 slide toward the parts storage part 4 in the facing carrier seat 1, each part storage part 4 Since it is supported by the upper surface of the longitudinal guide body 26 facing inward, the chip component W is gradually loaded into the component storage section 4 without major changes in the transfer posture, and the posture of the chip component W at the time of transfer is maintained. It can be maintained in a predetermined normal state.

The process and apparatus for sealing the upper surface of the carrier sheet 1 with the cover tape 8 on the table 27 after loading the chip parts W are substantially the same as in the first embodiment.

FIG. 6 shows the main parts of the device 3 for taking out the chip components W loaded in the carrier sheet 1 in the vicinity of the component supply device (not shown) that mounts them on the electronic circuit board as described above. The cover tape 8 is peeled off from the upper surface of the carrier sheet 1 being transferred in the direction of arrow B along A component suction means 30 such as a bit is arranged so as to be movable up and down and reciprocated in a direction perpendicular to the plane of the paper.

Reference numeral 31 denotes a guide body projecting upward in a recess 33 on the lower surface of the guide groove 32 of the table 28, and the guide body 31 is used to guide a plurality of components in the carrier sheet 1 that move approximately horizontally along the guide groove 32. As the carrier sheet 1 approaches the component suction means 30 from the cover body 29 facing upward from the cut groove 5 at the lower part of the storage section 4, the upper surface of the guide body 31 approaches the component suction means 30. The slope is formed so that the height approaches the lower surface of the. Note that the upper surface of the guide body 30 below the component suction means 30 is horizontal so that the chip component W supported on the upper surface does not tilt forward or backward.

With this configuration, as the carrier sheet 1 moves toward the component suction means 30, the component storage section 4
The chip component W that is in contact with the bottom plate 4a of the carrier is gradually pushed up by the guide body 31, and the top surface of the chip component W can be positioned above the top surface of the carrier sheet 1. There is no need to push the chip into the component storage section 4 in the sheet, and the upper surface of the chip W can be brought very close to the component suction means 30 to ensure that it is suctioned.

FIG. 8 shows another embodiment of the carrier seat 1, in which the bottom plate 4a of the parts storage section 4 and the front and rear side plates 4b, 4c connected thereto.
Large diameter portions 5a are bored at certain locations in the bottom plate 4a so as to communicate with the cut grooves 5 that communicate with each other.

By providing the cut groove 5 and the large-diameter portion 5a in this way, it is possible to construct a structure in which a chip component can be retracted toward the bottom plate with a chip component placed on the protruding pin pushed out into the component storage section 4, or vice versa. The carrier heat 1 of the present invention can be applied to chip component filling and unloading devices having conventional configurations in which chip components are pushed out using protruding pins, and the carrier heat 1 of the present invention can also be applied to devices having the configuration of the present invention. can do.

[Operations and Effects of the Invention] In this way, the tape-shaped carrier sheet is recessed to accommodate chip components at regular intervals in its longitudinal direction, and the bottom plate and bottom plate of each component storage section are In the chip component loading device, the carrier sheet is configured to have front and rear longitudinal grooves which are formed so as to communicate with each other across the front and rear side plates in the longitudinal direction of transport of the carrier sheet.
A longitudinal guide body along the transport direction of the carrier sheet is provided in the section where the chip components are transferred from the pocket portion of the loading drum in which the chip components are stored to the component storage portion of the carrier sheet facing the outer peripheral surface of the loading drum. By simply forming the upper surface of the longitudinal guide body in an inclined shape so that it is high at the beginning of the transfer section of the chip component and then gradually lowered, the chip component can be easily moved without reversing its orientation. This has the effect that it can be loaded on the carrier seat side.

Since the device for this purpose is very simple, consisting of a longitudinal guide body, the structure is simple and the manufacturing cost of the device can be reduced.

Furthermore, in the device for taking out chip parts from a carrier sheet, a component suction means for sucking chip parts from the upper surface opening of the component storage part in the carrier sheet is provided above the transport path of the carrier sheet so as to be movable up and down. On the other hand, at a position below the carrier sheet facing the component suction means,
A longitudinal guide body facing into the cut groove is disposed across a plurality of component storage portions in the carrier sheet, and the upper surface of the guide body is raised higher as the carrier sheet is transferred in the direction of the component suction means. By simply adding extremely simple equipment to form the chip into a shape, it is possible to reliably adsorb the chip component to the component suction means without causing any inconvenience such as the orientation of the chip component being reversed. It is.

In addition, each component storage section of the carrier sheet is provided with front and rear longitudinal grooves that communicate with the bottom plate and the front and rear side plates in the longitudinal transport direction of the carrier sheet, so that the chip component loading device and the chip component removal device can be easily connected to each other. It has a remarkable effect that it can be used in common with both types of devices.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a perspective view of a carrier sheet, FIG. 2 is a side view of the main part of the chip component loading device, and FIG. 3 is an enlarged side sectional view of the main part of FIG. 2, and FIG. 4 is a cross-sectional view of FIG. 3, FIG. 5 is a partially cutaway side view of another embodiment of the chip loading device, FIG. 6 is a side sectional view of the main part of the chip loading device, and FIG. The figure is a bottom view of another embodiment of the carrier sheet. W... Chip parts, 1... Carrier seat, 2
... Loading device, 3 ... Unloading device, 4 ... Parts storage section, 4a ... Bottom plate, 4b, 4c ... Front and rear side plates,
5... Cut groove, 6... Feed hole, 7... Feed pin,
8...Cover tape, 9...Feed roller, 10...
...Annular groove, 11... Loading drum, 12... Pocket portion, 14... Guide body, 15, 26... Longitudinal guide body, 16... Annular recess, 17, 18... Mounting pin, 19... Cover/guidance member, 20,2
3...Guide wheel, 21...Sealing means, 13...
... feed chute, 22 ... chute, 24 ... guide body, 27, 28 ... table, 29 ... cover body, 30 ... component suction means, 31 ... guide body,
32... Guide groove, 33... Recess.

Claims (1)

[Scope of Claims] 1. Concave parts storage parts for storing chip parts are formed at regular intervals in the longitudinal direction, and the bottom plate of each parts storage part communicates with the front and rear side plates in the longitudinal direction of the carrier sheet. During the transfer route for longitudinally transporting a tape-shaped carrier sheet having front and rear longitudinal grooves formed in such a manner that A component loading drum is provided at regular intervals on the carrier sheet, and the carrier sheet is provided with a component loading drum provided at regular intervals in a section of the outer peripheral surface of the loading drum where the chip component in the pocket portion moves toward the component storage section in the carrier sheet. A loading device for chip parts, characterized in that a longitudinal guide body is provided that faces into the cut groove from the outside of the bottom plate of a plurality of parts storage parts of a seat and gradually guides the chip parts into the parts storage parts. 2. Recesses are formed in the component storage areas for storing chip components at regular intervals in the longitudinal direction, and cutouts are formed so that the bottom plate of each component storage area communicates with the front and rear side plates in the longitudinal direction of the carrier sheet. A part suction means for suctioning chip parts from the upper surface opening of the parts storage part of the carrier sheet is provided above the transfer path of the tape-shaped carrier sheet having front and rear longitudinal grooves. At a lower position of the carrier sheet facing the component suction means, a longitudinal longitudinal guide body extending across the plurality of component storage sections of the carrier sheet and facing into the grooves is disposed, and the upper surface of the guide body is . A device for taking out chip parts, characterized in that the carrier sheet is formed to be higher as it is transferred in the direction of the part suction means. 3. A tape-shaped carrier sheet used in the chip component loading device of the first claim or the chip component unloading device of the second claim, wherein the carrier sheet is arranged at regular intervals in the longitudinal direction of the carrier sheet. A component storage section for storing chip components is formed with a recess, and a front and rear longitudinal cut groove is provided so as to communicate with the bottom plate of each component storage section and the front and rear side panels in the transport direction of the carrier sheet. This carrier seat is characterized by: