JPH057652Y2 - - Google Patents
Info
- Publication number
- JPH057652Y2 JPH057652Y2 JP1985011478U JP1147885U JPH057652Y2 JP H057652 Y2 JPH057652 Y2 JP H057652Y2 JP 1985011478 U JP1985011478 U JP 1985011478U JP 1147885 U JP1147885 U JP 1147885U JP H057652 Y2 JPH057652 Y2 JP H057652Y2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- recess
- chip
- card base
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、ICメモリーチツプを内蔵したメモ
リーカードに関する。[Detailed description of the invention] (Field of industrial application) The present invention relates to a memory card with a built-in IC memory chip.
プラスチツク等の薄板にICチツプを搭載した
メモリーカードは従来の磁気カードに比べ記憶容
量が大きく又容易に偽造することができないこと
から、識別カード、クレジツトカード、ゲーム、
教育用カード等として有望であり種々の提案がな
されている。 Memory cards, which have IC chips mounted on thin plates such as plastic, have a larger storage capacity than conventional magnetic cards and cannot be easily counterfeited, so they are used as identification cards, credit cards, games, etc.
It is promising as an educational card, etc., and various proposals have been made.
（従来技術）
この種メモリーカードとして、ICチツプを内
蔵し、該ICチツプに接続された外部端子を有す
るIC基板をカード基体に形成した凹所に埋設し、
固着一体化したものが知られている。(Prior art) As this type of memory card, an IC board having a built-in IC chip and an external terminal connected to the IC chip is buried in a recess formed in a card base,
Fixed and integrated types are known.
しかしながら、このようなメモリーカードは外
部端子を有するIC基板の全面がカード表面に露
出するため外観上好ましいものではない。 However, such a memory card has an unfavorable appearance since the entire surface of the IC board having external terminals is exposed on the card surface.
そこで、IC基板の外部端子部分を残してカー
ド基体の表面にオーバーシートがカード基体に完
全に接着しないと界面から剥離するという欠点が
ある。 Therefore, there is a drawback that if the oversheet is not completely adhered to the card base while leaving the external terminal portion of the IC board on the surface of the card base, it will peel off from the interface.
又、オーバーシートを熱圧着により被覆する場
合にはIC基板に内蔵したICチツプに過剰な熱が
加えられるため、ICチツプが破壊する虞れのあ
るものであつた。 Further, when the oversheet is coated by thermocompression bonding, excessive heat is applied to the IC chips built into the IC substrate, which may cause the IC chips to be destroyed.
（問題点を解決するための手段）
本考案は上記従来の問題点に鑑みなされたもの
であつて、ICチツプを内蔵し、該ICチツプに接
続された外部端子を有するICユニツトを収容す
る大きさの凹所を有するカード基体の凹所底面の
うちICユニツトの外部端子に対応する箇所を切
欠いて貫通孔を形成すると共に、貫通孔からカー
ド基体の一側縁までのカード基体の表面を上記凹
所底面の厚みだけ切欠いて段部を形成し、上記
ICユニツトの外部端子と段部の表面とを面一に
してICユニツトをカード基体の凹所に埋設し固
着するようにして、ICカードの表面にオーバー
シートを積層被覆することなくICユニツトの外
部端子部分のみをカード表面に露出させるように
したものである。(Means for Solving the Problems) The present invention has been devised in view of the above-mentioned conventional problems, and is a large-sized device that accommodates an IC unit that has a built-in IC chip and external terminals connected to the IC chip. A through hole is formed by cutting out the bottom of the recess of the card base, which corresponds to the external terminal of the IC unit, and the surface of the card base from the through hole to one side edge of the card base is Cut out the thickness of the bottom of the recess to form a step, and then
By embedding and fixing the IC unit in the recess of the card base with the external terminals of the IC unit flush with the surface of the stepped part, the IC unit can be mounted on the outside of the IC unit without laminating an oversheet on the surface of the IC card. Only the terminal portion is exposed on the card surface.
（実施例）
以下、本考案の具体的構成を第１〜４図に示す
実施例に基づいて説明する。(Example) Hereinafter, the specific structure of the present invention will be explained based on the example shown in FIGS. 1 to 4.
第１図は本考案のメモリーカードの一実施例を
示す斜視図、第２図は第１図の−断面図、第
３図は本考案のメモリーカードの組立状態を示す
分解斜視図、第４図は第３図の−断面図であ
る。 FIG. 1 is a perspective view showing an embodiment of the memory card of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is an exploded perspective view showing the assembled state of the memory card of the present invention, and FIG. The figure is a - sectional view of FIG.
第１図において、１はIC基板であつて、ガラ
スエポキシあるいはポリイミド製等の基板１１の
上面にコンピユータなどの装置との接続のための
外部端子１２が多数設けてあり、下面にROM、
EPROM、EEPROM等の１チツプあるいは
EPROM等とマイクロプロセツサーの２チツプの
ICチツプ１３がモールド被覆され装着されてい
る。又基板１１の下面には多数のプリント配線１
４が設けられており、ICチツプ１３は各プリン
ト配線１４に接続されると共に該プリント配線１
４は基板１１の端部において基板１１を貫通する
スルーホール（図示略）により基板１１の上面の
各外部端子１２と各々接続され、ICチツプ１３
はプリント配線１４を介して外部端子１２に接続
されている。 In FIG. 1, reference numeral 1 is an IC board, and the top surface of the board 11 made of glass epoxy or polyimide is provided with many external terminals 12 for connection with devices such as computers, and the bottom surface is provided with ROM,
1 chip such as EPROM, EEPROM, etc.
2-chip EPROM etc. and microprocessor
An IC chip 13 is molded and mounted. Also, on the bottom surface of the board 11 there are many printed wiring lines 1.
4 are provided, and the IC chip 13 is connected to each printed wiring 14 and connected to the printed wiring 1.
4 is connected to each external terminal 12 on the top surface of the board 11 through a through hole (not shown) penetrating the board 11 at the end of the board 11, and the IC chip 13
is connected to the external terminal 12 via a printed wiring 14.
２は、ABS樹脂、ポリ塩化ビニル等の合成樹
脂製のカード基板であつて、該カード基体２には
ICユニツト１を収容する大きさの凹所２１が形
成してある。該凹所２１の底面のうちICユニツ
ト１の外部端子１２に対応する箇所を切欠いて貫
通孔２２が形成してあると共に、貫通孔２２から
カード基体２の一側縁までのカード基体２の表面
を凹所２１底面の厚み分だけ切欠いてカード基体
２の残りの表面２ｂより低くした段部２ａを形成
してある。 2 is a card substrate made of synthetic resin such as ABS resin or polyvinyl chloride;
A recess 21 having a size to accommodate the IC unit 1 is formed. A through hole 22 is formed by cutting out a portion of the bottom surface of the recess 21 that corresponds to the external terminal 12 of the IC unit 1, and the surface of the card base 2 from the through hole 22 to one side edge of the card base 2. is cut out by the thickness of the bottom surface of the recess 21 to form a stepped portion 2a that is lower than the remaining surface 2b of the card base 2.
該カード基体２はポリ塩化ビニル、ABS樹脂
などの合成樹脂を射出成形やプレスにより一体に
成形すると生産性も高く好適であるが、合成樹脂
性の平板を切削し凹所２１、貫通孔２２を加工成
形しても良いものである。 It is preferable to form the card base 2 by integrally molding a synthetic resin such as polyvinyl chloride or ABS resin by injection molding or pressing, since it is highly productive. It may also be processed and molded.
ICユニツト１をカード基体２の凹所２１に埋
設するには、第３図に示すようにICユニツト１
をカード基体２の凹所２１の嵌合段部に嵌着させ
ると共に、外部端子１２と段部２ａの表面が面一
になるようにして超音波シールや接着材等により
固着すれば良い。 To embed the IC unit 1 in the recess 21 of the card base 2, bury the IC unit 1 in the recess 21 of the card base 2 as shown in Figure 3.
may be fitted into the fitting stepped portion of the recess 21 of the card base 2, and the surfaces of the external terminal 12 and the stepped portion 2a may be flush with each other and fixed using an ultrasonic seal, an adhesive, or the like.
図示したようにICユニツトに鍔部１４，１５
を形成しておくとICユニツト１が凹所２１にが
たつくことなく嵌合して固着することができる
が、これに限定されず鍔部１４，１５は必ずしも
必要ではない。 As shown in the figure, the flanges 14 and 15 are attached to the IC unit.
If formed, the IC unit 1 can fit and be fixed in the recess 21 without rattling, but the invention is not limited to this, and the flanges 14 and 15 are not necessarily necessary.
（考案の効果）
本考案は、上記構成としたので、オーバーシー
トを積層被覆することなくICユニツトの外部端
子部分のみをカード表面に露出させることがで
き、従来オーバーシートを積層被覆した場合、オ
ーバーシートが界面から剥離したり、オーバーシ
ートを熱圧着する際ICチツプが破壊するという
欠点をなくすことができ、しかも外観美麗である
等の利点がある。(Effects of the Invention) As the present invention has the above-mentioned configuration, it is possible to expose only the external terminal portion of the IC unit on the surface of the card without laminating and covering it with an oversheet. This eliminates the drawbacks that arise when a laminated oversheet is used in the conventional case, such as the oversheet peeling off from the interface or the IC chip being destroyed when the oversheet is thermocompressed, and also has the advantage of having a beautiful appearance.
第１図は本考案のメモリーカードの一実施例を
示す斜視図、第２図は第１図の−断面図、第
３図は本考案のメモリーカードの組立状態を示す
分解斜視図、第４図は第３図の−断面図であ
る。
図中、１はICユニツト、１２は外部端子、１
３はICチツプ、２はカード基体、２１は凹所、
２２は貫通孔、２ａは段部である。
FIG. 1 is a perspective view showing an embodiment of the memory card of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is an exploded perspective view showing the assembled state of the memory card of the present invention, and FIG. The figure is a - sectional view of FIG. In the figure, 1 is an IC unit, 12 is an external terminal, 1
3 is the IC chip, 2 is the card base, 21 is the recess,
22 is a through hole, and 2a is a stepped portion.
Claims (1)
外部端子を有するICユニツトを収容する大きさ
の凹所を有するカード基体の凹所底面のうちIC
ユニツトの外部端子に対応する箇所を切欠いて貫
通孔を形成すると共に、貫通孔からカード基体の
一側縁までのカード基体の表面を上記凹所底面の
厚みだけ切欠いて段部を形成し、上記ICユニツ
トの外部端子と段部の表面とを面一にしてICユ
ニツトをカード基体の凹所に埋設し固着したこと
を特徴とするメモリーカード。 The IC chip is located on the bottom of the recess in the card base, which has a recess large enough to accommodate an IC unit that has a built-in IC chip and an external terminal connected to the IC chip.
A through hole is formed by notching a portion corresponding to the external terminal of the unit, and a stepped portion is formed by notching the surface of the card base from the through hole to one side edge of the card base by the thickness of the bottom surface of the recess. A memory card characterized in that the IC unit is embedded and fixed in a recess in a card base with the external terminal of the IC unit and the surface of the stepped portion flush with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985011478U JPH057652Y2 (en) | 1985-01-30 | 1985-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985011478U JPH057652Y2 (en) | 1985-01-30 | 1985-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61128756U JPS61128756U (en) | 1986-08-12 |
| JPH057652Y2 true JPH057652Y2 (en) | 1993-02-25 |
Family
ID=30493635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985011478U Expired - Lifetime JPH057652Y2 (en) | 1985-01-30 | 1985-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH057652Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003346109A (en) * | 2002-05-22 | 2003-12-05 | Toshiba Corp | IC card and semiconductor integrated circuit device package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247419Y2 (en) * | 1972-10-09 | 1977-10-27 |
-
1985
- 1985-01-30 JP JP1985011478U patent/JPH057652Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61128756U (en) | 1986-08-12 |
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