JPH0577968U - Flat cable soldering structure - Google Patents
Flat cable soldering structureInfo
- Publication number
- JPH0577968U JPH0577968U JP2495492U JP2495492U JPH0577968U JP H0577968 U JPH0577968 U JP H0577968U JP 2495492 U JP2495492 U JP 2495492U JP 2495492 U JP2495492 U JP 2495492U JP H0577968 U JPH0577968 U JP H0577968U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- flat cable
- exposed portion
- exposed
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 114
- 239000002390 adhesive tape Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000005452 bending Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
[目的] 基板(5)に対するフラットケーブル
(1)の半田付けを適正に且つ簡易に行えるようにす
る。
[構成] フラットケーブル(1)端部の導体露出部
(9)を導体(2)が外側に位置するように折り曲げた
状態で基板(5)に半田付けする構造において、折り曲
げられる導体露出部(9)の間に両面接着テープ(8)
を挟み込む。
(57) [Summary] [Purpose] To enable proper and easy soldering of the flat cable (1) to the substrate (5). [Configuration] In a structure in which the conductor exposed portion (9) at the end of the flat cable (1) is bent and soldered to the substrate (5) so that the conductor (2) is positioned outside, the conductor exposed portion ( 9) Between double sided adhesive tape (8)
Sandwich.
Description
【0001】[0001]
本考案は、基板同志又は基板と電動部品などを接続するフラットケーブルの半 田付け構造に関する。 The present invention relates to a flat cable half-bonding structure for connecting a board or a board to an electric component.
【0002】[0002]
従来、基板に対するフラットケーブルの半田付けは、実開昭60−78172 号公報、実開昭61−183565号公報、特開昭62−242385号公報な どに記載された基板同志の接続構造と同じように行われている。 Conventionally, the soldering of a flat cable to a board is the same as the connection structure of board-like members described in JP-A-60-78172, JP-A-61-183565, and JP-A-62-242385. Is being done.
【0003】[0003]
前記従来技術は、フラットケーブル端部の導体露出部を半田付けするとき、導 体露出部の折り曲げを保持できないから、導体露出部の伸展による半田付け不良 が発生すると共に、導体露出部を折り曲げる場合に導体が鋭角に折れ曲がらない ようにしないと、折り曲げ部で断線や電気抵抗増大による発熱が発生する。また 、フラットケーブル自体柔軟で、基板の導体に対するフラットケーブルの導体露 出部の位置決めが容易に行えないため、半田付け不良の発生割合いが増すと共に 、半田付け作業が困難なものになっている。 In the prior art, when soldering the exposed conductor of the end of the flat cable, the bending of the exposed conductor cannot be maintained.Therefore, soldering failure occurs due to extension of the exposed conductor, and the exposed conductor is bent. If the conductor is not bent at an acute angle, heat will be generated due to wire breakage and increased electrical resistance at the bend. Also, since the flat cable itself is flexible and the conductor exposed part of the flat cable cannot be easily positioned with respect to the conductor of the board, the rate of defective soldering increases and the soldering work becomes difficult. .
【0004】[0004]
然るに本考案は、フラットケーブルの端部に導体の片面だけを露出させる導体 露出部を設け、導体が外側に位置し、且つ、導体露出部先端側が導体非露出部に 重なるように、導体露出部の中間部を折り曲げ、折り曲げ部より先端側の導体露 出部の導体を基板の導体に面接合させた状態で、導体露出部を基板に半田付けす るフラットケーブルの半田付け構造において、導体非露出部及び折り曲げ部より 基端側の導体露出部とこれらに対向する折り曲げ部より先端側の導体露出部の間 に両面接着テープを挟み込み、両面接着テープによって導体露出部の折り曲げを 保持できるから、導体露出部の伸展による半田付け不良の発生をなくし得ると共 に、両面接着テープの肉厚によって導体露出部を湾曲させて折り曲げ、且つその 湾曲を折り曲げ後も維持できるから、導体露出部の鋭角な折れ曲がりによる導体 の断線や電気抵抗増大による発熱をなくし得るものである。 Therefore, the present invention provides a conductor exposed portion that exposes only one side of the conductor at the end of the flat cable, and the conductor is located outside, and the conductor exposed portion is such that the tip end side of the conductor overlaps the conductor unexposed portion. In the flat cable soldering structure, the middle part of the cable is bent, and the conductor of the conductor exposed part on the tip side of the bent part is surface-bonded to the conductor of the board. Since the double-sided adhesive tape can be sandwiched between the exposed conductor part on the base end side of the exposed part and the bent part and the conductor exposed part on the tip side of the bent part facing them, the double-sided adhesive tape can hold the bent part of the exposed conductor. It is possible to prevent the occurrence of soldering failure due to the extension of the exposed conductor part, and at the same time, bend the exposed conductor part by the thickness of the double-sided adhesive tape, and bend the curve. Because can be maintained, it is capable eliminate heat generated by the conductor of the disconnection or resistance increase due to sharp bending of the conductor exposed portion.
【0005】[0005]
以下本考案の実施例を図面に基づいて詳述する。図1はフラットケーブルを基 板に半田付けした状態を示す断面図、図2は半田付けする前のフラットケーブル の断面図であり、図中(1)は周知の可撓性のフラットケーブル、(2)はフラ ットケーブル(1)の銅箔製の導体、(3)(4)はフラットケーブル(1)の 可撓性フィルム製の被服体、(5)は可撓性又は硬質のプリント配線基板、(6 )は基板(5)の銅箔製の導体、(7)は半田、(8)は両面接着テープであり 、前記フラットケーブル(1)を基板(5)に接続するもので、図2に示す如く 、フラットケーブル(1)の端部に導体(2)の片面だけを露出させる導体露出 部(9)を設ける。云いかえれば、フラットケーブル(1)端部の導体露出部( 9)の導体(2)片面だけに被服体(4)を残す。そして、前記被服体(4)の 表面に両面接着テープ(8)を貼り付ける。このとき、両面接着テープ(8)が フラットケーブル(1)の導体非露出部(10)側の被服体(4)と導体露出部 (9)側の被服体(4)に貼り付くように、導体非露出部(10)と導体露出部 (9)の境目(11)を中心にして両面接着テープ(8)を被服体(4)に貼り 付ける。然る後、図1に示す如く、導体(2)が外側に位置し、且つ導体露出部 (9)先端側が導体非露出部(10)に重なるように、導体露出部(9)中間部 を折り曲げ、折り曲げ部(12)より先端側の被服体(4)を折り曲げ部(12 )より基端側の被服体(4)に貼り付く前記両面接着テープ(8)に貼付け、両 面接着テープ(8)により導体露出部(9)の折り曲げを保持すると共に、両面 接着テープ(8)の肉厚により、折り曲げ部(12)より基端側の導体露出部( 9)と折り曲げ部(12)より先端側の導体露出部(9)間に隙間(13)を形 成し、導体露出部(9)を湾曲させて折り曲げるようにしている。そして、折り 曲げ部(12)より先端側の導体露出部(9)の導体(2)を基板(5)の導体 (6)の端子部に位置決めして面接合させた状態で、導体露出部(9)を基板( 5)に半田(7)付けすることにより、フラットケーブル(1)が基板(5)に 接続され、且つフラットケーブル(1)の導体(2)と基板(5)の導体(6) が接続され、電気的にも接続されるものである。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a state in which a flat cable is soldered to a base plate, and FIG. 2 is a cross-sectional view of the flat cable before soldering, in which (1) is a well-known flexible flat cable, 2) is a copper foil conductor of the flat cable (1), (3) and (4) are flexible film clothing of the flat cable (1), and (5) is a flexible or hard printed wiring board. , (6) is a conductor made of copper foil of the substrate (5), (7) is solder, and (8) is a double-sided adhesive tape for connecting the flat cable (1) to the substrate (5). As shown in 2, a conductor exposed portion (9) is provided at the end of the flat cable (1) to expose only one surface of the conductor (2). In other words, the body (4) is left on only one surface of the conductor (2) of the conductor exposed portion (9) at the end of the flat cable (1). Then, a double-sided adhesive tape (8) is attached to the surface of the body (4). At this time, the double-sided adhesive tape (8) is attached to the clothing (4) on the conductor non-exposed portion (10) side and the clothing (4) on the conductor exposed portion (9) side of the flat cable (1), The double-sided adhesive tape (8) is attached to the clothing body (4) around the boundary (11) between the conductor non-exposed portion (10) and the conductor exposed portion (9). After that, as shown in FIG. 1, the conductor exposed portion (9) intermediate portion is placed so that the conductor (2) is located outside and the tip end side of the conductor exposed portion (9) overlaps with the conductor unexposed portion (10). Folding, affixing the clothing body (4) on the tip side of the folding part (12) to the double-sided adhesive tape (8) attached to the clothing body (4) on the proximal side of the folding part (12), The conductor exposed portion (9) is kept bent by 8), and the thickness of the double-sided adhesive tape (8) causes the conductor exposed portion (9) and the bent portion (12) to be located on the base end side of the folded portion (12). A gap (13) is formed between the conductor exposed portions (9) on the tip side, and the conductor exposed portions (9) are curved and bent. Then, the conductor (2) of the conductor exposed portion (9) on the tip side of the bent portion (12) is positioned and surface-bonded to the terminal portion of the conductor (6) of the substrate (5), and the conductor exposed portion is The flat cable (1) is connected to the board (5) by soldering (9) the board (5) to the board (5), and the conductor (2) of the flat cable (1) and the conductor of the board (5). (6) is connected and also electrically connected.
【0006】 図3は他の実施例におけるフラットケーブルを基板に半田付けした状態を示す 断面図、図4は半田付けする前のフラットケーブルの断面図であり、図中(21 )は周知の可撓性のフラットケーブル、(22)はフラットケーブル(21)の 銅箔製の導体、(23)(24)はフラットケーブル(1)の可撓性フィルム製 の被服体、(25)は可撓性又は硬質のプリント配線基板、(26)は基板(2 5)の銅箔製の導体、(27)は半田、(28)は両面接着テープであり、前記 フラットケーブル(21)を基板(25)に接続するもので、図4に示す如く、 フラットケーブル(21)の端部に導体(22)の片面だけを露出させる導体露 出部(29)を設ける。云いかえれば、フラットケーブル(21)端部の導体露 出部(9)の導体(22)片面だけに被服体(24)を残す。そして、前記被服 体(24)の表面に両面接着テープ(28)を貼り付ける。このとき、両面接着 テープ(28)は導体露出部(29)の略中間部より先端側の被服体(24)の 表面に貼り付けると共に、両面接着テープ(24)の一端を導体露出部(29) の先端より突出させておく。然る後、図3に示す如く、導体(22)が外側に位 置し、且つ導体露出部(29)先端側が導体非露出部(30)に重なるように、 導体露出部(29)中間部を折り曲げ、折り曲げ部(32)より先端側の被服体 (24)に貼り付く前記両面接着テープ(28)だけを折り曲げ部(32)より 基端側の被服体(24)に貼り付け、両面接着テープ(28)により導体露出部 (29)の折り曲げを保持すると共に、両面接着テープ(28)の肉厚により折 り曲げ部(32)より基端側の導体露出部(29)と折り曲げ部(32)より先 端側の導体露出部(29)間に隙間(33)を形成し、導体露出部(29)を湾 曲させて折り曲げるようにしている。FIG. 3 is a sectional view showing a state in which a flat cable according to another embodiment is soldered to a substrate, and FIG. 4 is a sectional view of the flat cable before being soldered. Flexible flat cable, (22) is a copper foil conductor of the flat cable (21), (23) and (24) are flexible film clothes of the flat cable (1), and (25) is flexible. A flexible or hard printed wiring board, (26) a copper foil conductor of the board (25), (27) solder, (28) a double-sided adhesive tape, and the flat cable (21) to the board (25). 4), a conductor exposed portion (29) exposing only one surface of the conductor (22) is provided at the end of the flat cable (21) as shown in FIG. In other words, the clothing body (24) is left only on one surface of the conductor (22) of the conductor exposed portion (9) at the end of the flat cable (21). Then, a double-sided adhesive tape (28) is attached to the surface of the body (24). At this time, the double-sided adhesive tape (28) is attached to the surface of the body (24) near the tip of the conductor-exposed portion (29), and one end of the double-sided adhesive tape (24) is attached to the conductor-exposed portion (29). ) Make it protrude from the tip. After that, as shown in FIG. 3, the conductor (22) is positioned outside, and the conductor exposed portion (29) intermediate portion is arranged so that the tip end side of the conductor exposed portion (29) overlaps with the conductor unexposed portion (30). The double-sided adhesive tape (28) that is attached to the clothing body (24) on the distal side of the folding portion (32) is attached to the clothing body (24) on the proximal side of the folding portion (32), and double-sided adhesion is performed. The tape (28) keeps the conductor exposed part (29) bent, and the thickness of the double-sided adhesive tape (28) causes the conductor exposed part (29) and the bent part (29) closer to the base end than the bent part (32). 32) A gap (33) is formed between the conductor exposed portions (29) on the front end side, and the conductor exposed portions (29) are bent and bent.
【0007】 そして、折り曲げ部(32)より先端側の導体露出部(29)の導体(22) を基板(25)の導体(26)の端子部に位置決めして面接合させた状態で、導 体露出部(29)を基板(25)に半田(27)付けすることにより、フラット ケーブル(21)が基板(25)に接続され、且つフラットケーブル(21)の 導体(22)と基板(25)の導体(26)が接続され、電気的にも接続される ものである。ところで、折り曲げ部(32)より先端側の導体露出部(29)の 導体(22)を基板(25)の導体(26)の端子部に位置決めして面接合させ る場合、導体露出部(29)先端より突出する両面接着テープ(28)を基板( 25)に貼り付けて行うもので、これにより半田(27)付けするときにフラッ トケーブル(1)の導体露出部(29)が位置ずれするのを防ぐようにしている 。Then, the conductor (22) of the conductor exposed portion (29) on the tip side of the bent portion (32) is positioned and surface-bonded to the terminal portion of the conductor (26) of the substrate (25), The flat cable (21) is connected to the substrate (25) by soldering (27) the body exposed portion (29) to the substrate (25), and the conductor (22) and the substrate (25) of the flat cable (21) are connected. The conductor (26) is connected and electrically connected. By the way, when the conductor (22) of the conductor exposed portion (29) on the tip side of the bent portion (32) is positioned and surface-bonded to the terminal portion of the conductor (26) of the substrate (25), the conductor exposed portion (29 ) The double-sided adhesive tape (28) protruding from the tip is attached to the substrate (25) so that the conductor exposed portion (29) of the flat cable (1) is displaced when soldering (27). I try to prevent it.
【0008】[0008]
以上実施例から明らかなように本考案は、フラットケーブル(1)(21)の 端部に導体(2)(22)の片面だけを露出させる導体露出部(9)(29)を 設け、導体(2)(22)が外側に位置し、且つ、導体露出部(9)(29)先 端側が導体非露出部(10)(30)に重なるように、導体露出部(9)(29 )の中間部を折り曲げ、折り曲げ部(12)(32)より先端側の導体露出部( 9)(29)の導体(2)(22)を基板(5)(25)の導体(6)(26) に面接合させた状態で、導体露出部(9)(29)を基板(5)(25)に半田 付けするフラットケーブルの半田付け構造において、導体非露出部(10)(3 0)及び折り曲げ部(12)(32)より基端側の導体露出部(9)(29)と これらに対向する折り曲げ部(12)(32)より先端側の導体露出部(9)( 29)の間に両面接着テープ(8)(28)を挟み込むもので、両面接着テープ (8)(28)によって導体露出部(9)(29)の折り曲げを保持できるから 、導体露出部(9)(29)の伸展による半田付け不良の発生をなくすことがで きると共に、両面接着テープ(8)(28)の肉厚によって導体露出部(9)( 29)を湾曲させて折り曲げ、且つその湾曲を折り曲げ後も維持できるから、導 体露出部(9)(29)の鋭角な折れ曲がりによる導体(2)(22)の断線や 電気抵抗増大による発熱をなくすことができ、従来に比べてフラットケーブル( 1)(21)の半田付けを適正且つ簡易に行うことができる。 As is apparent from the above embodiments, the present invention provides conductor exposed portions (9) and (29) for exposing only one side of the conductors (2) and (22) at the ends of the flat cables (1) and (21). (2) The conductor exposed portion (9) (29) is located so that the conductor exposed portion (9) (29) is located outside and the conductor exposed portion (9) (29) has its front end side overlapped with the conductor non-exposed portion (10) (30). Of the conductors (2) and (22) of the exposed conductors (9) and (29) on the tip side of the bent portions (12) and (32) are bent to the conductors (6) and (26) of the substrates (5) and (25). In a flat cable soldering structure in which the exposed conductors (9) (29) are soldered to the substrates (5) (25) in a state of being surface-bonded to the conductors (4), the conductor non-exposed portions (10) (30) and The conductor exposed portions (9) and (29) on the base end side of the bent portions (12) and (32) face these. The double-sided adhesive tapes (8) and (28) are sandwiched between the conductor exposed portions (9) and (29) on the tip side of the bent portions (12) and (32), and the conductor is exposed by the double-sided adhesive tapes (8) and (28). Since the bending of the portions (9) and (29) can be held, the occurrence of soldering failure due to the extension of the exposed conductor portions (9) and (29) can be eliminated, and the meat of the double-sided adhesive tapes (8) and (28) can be eliminated. The conductor exposed portions (9) (29) can be bent and bent depending on the thickness, and since the bending can be maintained even after the bending, conductors (2) (22) due to sharp bending of the conductor exposed portions (9) (29) It is possible to eliminate heat generation due to wire breakage and increase in electric resistance, and it is possible to properly and easily solder the flat cables (1) and (21) as compared with the conventional case.
【0009】 また、前記両面接着テープ(28)の一端を導体露出部(29)先端より突出 させ、基板(25)に両面接着テープ(28)の突出端を接着させることにより 、基板(25)の導体(26)に対するフラットケーブル(21)の導体露出部 (29)の位置決めを半田付けなどの仮り止め手段を用いることなく、両面接着 テープ(28)により行うことができるから、半田付け不良の発生防止を一層助 長して図ることができると共に、半田付け作業の簡易化を容易に図ることができ る。In addition, one end of the double-sided adhesive tape (28) is projected from the tip of the conductor exposed portion (29), and the protruding end of the double-sided adhesive tape (28) is adhered to the substrate (25), whereby the substrate (25) Since the conductor exposed portion (29) of the flat cable (21) can be positioned with respect to the conductor (26) of the flat cable (21) by using the double-sided adhesive tape (28) without using a temporary fixing means such as soldering, a soldering failure can be prevented. It is possible to further promote the prevention of the occurrence and to easily simplify the soldering work.
【図面の簡単な説明】[Brief description of drawings]
【図1】本考案の実施例におけるフラットケーブルを基
板に半田付けした状態の断面図。FIG. 1 is a sectional view showing a state in which a flat cable according to an embodiment of the present invention is soldered to a substrate.
【図2】半田付けする前のフラットケーブルの断面図。FIG. 2 is a cross-sectional view of the flat cable before soldering.
【図3】本考案の他の実施例におけるフラットケーブル
を基板に半田付けした状態の断面図。FIG. 3 is a cross-sectional view of a flat cable according to another embodiment of the present invention soldered to a substrate.
【図4】半田付けする前のフラットケーブルの断面図。FIG. 4 is a cross-sectional view of the flat cable before soldering.
(1)(21) フラットケーブル (2)(22) 導体 (3)(4)(23)(24) 被服体 (5)(25) 基板 (6)(26) 導体 (7)(27) 半田 (8)(28) 両面接着テープ (9)(29) 導体露出部 (10)(30) 導体非露出部 (12)(32) 折り曲げ部 (1) (21) Flat cable (2) (22) Conductor (3) (4) (23) (24) Clothing (5) (25) Substrate (6) (26) Conductor (7) (27) Solder (8) (28) Double-sided adhesive tape (9) (29) Conductor exposed part (10) (30) Conductor non-exposed part (12) (32) Bent part
Claims (2)
けを露出させる導体露出部を設け、導体が外側に位置
し、且つ、導体露出部先端側が導体非露出部に重なるよ
うに、導体露出部の中間部を折り曲げ、折り曲げ部より
先端側の導体露出部の導体を基板の導体に面接合させた
状態で、導体露出部を基板に半田付けするフラットケー
ブルの半田付け構造において、導体非露出部及び折り曲
げ部より基端側の導体露出部とこれらに対向する折り曲
げ部より先端側の導体露出部の間に両面接着テープを挟
み込むことを特徴とするフラットケーブルの半田付け構
造。1. A conductor exposed portion is provided at an end of a flat cable to expose only one surface of the conductor so that the conductor is located outside and a tip end side of the conductor exposed portion overlaps a conductor non-exposed portion. In the flat cable soldering structure in which the middle part of is bent and the conductor of the exposed conductor on the tip side of the bent part is surface-bonded to the conductor of the board, And a double-sided adhesive tape is sandwiched between a conductor exposed portion on the base end side of the bent portion and a conductor exposed portion on the tip end side of the bent portion facing the conductor exposed portion.
先端より突出させ、基板に両面接着テープの突出端を接
着させることを特徴とする第1項記載のフラットケーブ
ルの半田付け構造。2. The flat cable soldering structure according to claim 1, wherein one end of the double-sided adhesive tape is projected from the tip of the exposed conductor portion, and the protruding end of the double-sided adhesive tape is adhered to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2495492U JPH0577968U (en) | 1992-03-24 | 1992-03-24 | Flat cable soldering structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2495492U JPH0577968U (en) | 1992-03-24 | 1992-03-24 | Flat cable soldering structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0577968U true JPH0577968U (en) | 1993-10-22 |
Family
ID=12152386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2495492U Pending JPH0577968U (en) | 1992-03-24 | 1992-03-24 | Flat cable soldering structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0577968U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007041263A (en) * | 2005-08-03 | 2007-02-15 | Sanyo Epson Imaging Devices Corp | Electro-optical device and electronic apparatus |
| JP2007096054A (en) * | 2005-09-29 | 2007-04-12 | Casio Comput Co Ltd | Conductive bonding structure of flexible wiring board |
| US7271860B2 (en) | 2000-08-28 | 2007-09-18 | Sharp Kabushiki Kaisha | Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
-
1992
- 1992-03-24 JP JP2495492U patent/JPH0577968U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7271860B2 (en) | 2000-08-28 | 2007-09-18 | Sharp Kabushiki Kaisha | Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
| JP2007041263A (en) * | 2005-08-03 | 2007-02-15 | Sanyo Epson Imaging Devices Corp | Electro-optical device and electronic apparatus |
| JP2007096054A (en) * | 2005-09-29 | 2007-04-12 | Casio Comput Co Ltd | Conductive bonding structure of flexible wiring board |
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