JPH057864B2 - - Google Patents
Info
- Publication number
- JPH057864B2 JPH057864B2 JP58219471A JP21947183A JPH057864B2 JP H057864 B2 JPH057864 B2 JP H057864B2 JP 58219471 A JP58219471 A JP 58219471A JP 21947183 A JP21947183 A JP 21947183A JP H057864 B2 JPH057864 B2 JP H057864B2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- resin
- cavity
- mold
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates
- B29C45/2704—Controlling the filling rates or the filling times of two or more mould cavities by controlling the cross section or the length of the runners or the gates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
- B29C33/0066—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel with a subdivided channel for feeding the material to a plurality of locations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
〔発明の利用分野〕
本発明は半導体を樹脂封止（以下レジンモール
ドという）する場合等に好適な金型の構造に関
し、更に詳しくは均一な品質で信頼性の高いレジ
ンモールド半導体を歩留りよく成形するための金
型内部の樹脂流路構造に関するものである。
〔発明の背景〕
従来１シヨツト当り多数個のレジンモールド半
導体（以下製品という）等を成形するために使用
されている熱硬化性樹脂封止用金型について、そ
の具体的公知例として特許第1028866（特公昭55−
17697）がある。これを第１〜２図によつて説明
する。
第１図ａは第１図ｂ（金型を水平方向に切つた
断面平面図）の−断面図で、上型３と下型４
により構成されるランナ２の縦断面図である。ポ
ツト１（またはスブル）で加圧された溶融樹脂は
ランナ２ゲート５を経て、インサート（例えば半
導体封止のようなリードフレーム）がセツトされ
ているキヤビテイ６内に充填され。樹脂が硬化し
た後、離型してゲート５部を折れば目的の製品が
得られる。
図から明らかなようにランナ２のゲート５が接
続されていない底壁と上壁とで形成される高さｈ
はテーパ状になつており、溶融樹脂７の進行方向
に沿つてランナ２の断面積が直線的に小さくなつ
ている。また、第１図ｃはランナ２から分岐する
各ゲート５の縦断面図をポツト１から近い順にＡ
−Ａ，Ｂ−Ｂ，Ｃ−Ｃ，Ｄ−Ｄ，Ｅ−Ｅまで示し
たものである。図から明らかなようにゲート５の
絞り角θ（ゲート上下面のなす角度）はポツト１
から遠くにあるキヤビテイ６程逐次大きくしてあ
る。
すなわち、
θA＜θB＜θC＜θD＜θE ……(1)
このような構成になつているので、ランナ２内
の溶融樹脂７の流動速度はポツト１から遠ざかる
につれて、樹脂の流動方向にランナ２断面積が変
化しない場合のそれよりも速くなる。一方ゲート
５の絞り角θが大きくなると、そこを通過する溶
融樹脂の圧力損失が減少するので、ポツト１から
遠ざかるにつれてゲート５の絞り角θを大きくす
ることにより、ポツト１から各キヤビテイ６に到
る溶融樹脂７の圧力損失の合計（＝ランナ通過時
の圧力損失＋ゲート通過時の圧力損失）を等しく
することができる。圧力損失が等しければ各キヤ
ビテイ内での溶融樹脂７の流速も等しくなる。
上記従来の金型での各キヤビテイ内の樹脂充填
状況を第２図に示す。図において横軸はキヤビテ
イ内樹脂充填開始からの無次元時間Ｔ／T0（Ｔは
キヤビテイに樹脂充填を開始してからの時間T0
はキヤビテイに樹脂が充填し終わるまでの時間）
を、縦軸は各キヤビテイ内の樹脂の充填率Ｗ／
W0（Ｗは時間Ｔにおける樹脂充填量W0は時間T0
における樹脂充填量）をそれぞれ目盛つてある。
各キヤビテイ内へ樹脂が充填中は図中に示されて
いる勾配、すなわち、樹脂流速が揃つているが、
ポツト１に近いキヤビテイの方が樹脂充填開始時
刻が早いため、その分だけ充填完了時刻も早くな
る。したがつて、上流側のキヤビテイが充填完了
後には、そこを流れていた樹脂流量が順次下流側
のキヤビテイにシフトしていくため、ポツト１か
ら遠くのキヤビテイ程充填完了前に樹脂流速が大
きくなる。このため、下流側のキヤビテイ程イン
サートが大きな力を受け、変形しやすいという問
題があつた。また上流側のキヤビテイでは先に充
填が完了するため、ゲート部の樹脂の流れが止ま
り金型による伝熱効果によつて樹脂が硬化するゲ
ートシールが進み、樹脂の最終圧が十分にキヤビ
テイ内に加わらない状態、すなわち、ボイド（空
孔）を潰しきれないまま成形品ができ上る場合が
あつた。したがつて、これらの問題を起さないよ
うにするためには各キヤビテイでの樹脂充填完了
時刻を揃えることが必要であるが、上記従来の金
型構造のままでは第１図ｄに示すごとく、上流側
のゲート絞り角θ(A)を極端に小さくするか、ある
いは、下流側のゲート絞り角θ(E)を、第１図ｅの
ごとく、極端に大きくすることが必要となり、前
者は製品成形後のゲートブレーク（ゲート部樹脂
の折損除去）の際に成形品の根本から折れてくれ
ない欠点があり、後者はランナ２底よりさらにゲ
ート５底が深くなり、金型加工が困難であるとい
う問題があつた。したがつて、従来の金型構造で
は、各キヤビテイでの樹脂充填完了時刻を揃える
ことができず、製品の品質の信頼性および歩留り
の向上は望めない状態にあつた。
〔発明の目的〕
本発明の目的は、上記した従来の半導体をレジ
ンモールドする金型の欠点をなくし、金型の各キ
ヤビテイでの樹脂の充填完了時刻の不揃いによる
障害をなくし、均一な品質で信頼性の高い製品を
歩留りよく成形でき、かつ樹脂使用効率を大幅に
向上し生産コストの低減をはかることができる、
レジンモールド用金型を提供するにある。
〔発明の概要〕
本発明は、半導体等のレジンモールド用金型に
おいて、製品を得る各キヤビテイに通ずる各ゲー
トの諸元（幅、深さ、絞り角）をすべて変えて、
各ゲート部で所望の溶融樹脂の流動抵抗値が得ら
れるように設計して、各キヤビテイでの樹脂充填
完了時刻を容易に揃えられる構造にしたことを特
徴とするものである。したがつて、樹脂充填完了
時刻の不揃によつて起るゲートシールによるボイ
ドの発生と、インサートに対する樹脂接着の不良
および下流側キヤビテイでの樹脂流速増大（圧力
損失の増加）にともなうインサートの変形を防止
することができる。また、本発明のもう一つの特
徴は、従来の金型に比べ樹脂の流動抵抗（圧力損
失）値を大幅に小さくすることができるから樹脂
の使用効率の向上が計られる。
以下、本発明を完成するに至つた経過を説明す
る。第３図ｂは、従来の金型による場合、すなわ
ち、各キヤビテイにおいて樹脂流速を揃えて充填
させるために各ゲートが持つべき形状抵抗値βGと
本発明の場合の各キヤビテイでの充填完了時刻を
揃えるために各ゲートが持つべき形状抵抗値βGと
の比較を示したものである。なお、第３図ａは従
来の金型のゲート部の形状を示す図である。図か
らも明らかなごとく、樹脂充填完了時刻を揃える
ためには従来の樹脂流速を揃える場合に比較し
て、ポツトに近い上流側ではかなり樹脂が流れに
くいゲート形状とし、下流側ではかなり樹脂が流
れ易いゲート形状にする必要のあることがわか
る。第３図中のゲート部形状抵抗値βGの範囲Ｌ
は、ゲート幅ｗ、深さhgの諸元を標準値のままに
して、生産工程で問題のない範囲内で絞り角θの
みを変えて得られるゲート部形状抵抗値βGの変化
範囲で、これから絞り角θのみでは本発明の目的
とする樹脂充填完了時刻を揃える場合のゲート部
形状抵抗値βGの全範囲をカバーできないことがわ
かる。また、範囲Ｍはゲート幅ｗ、絞り角θを標
準値のままにして、生産工程で問題のない範囲内
で深さhgのみを変えた場合のゲート部形状抵抗値
βGの範囲であり、これからも深さhgのみを変える
だけでは、本発明の目的とするゲート部形状抵抗
値βGをカバーできないことになる。また、範囲Ｎ
はゲート深さhg、絞り角θを標準値のままにし
て、生産工程で問題のない範囲内でゲート幅ｗの
みを変えた場合のゲート部形状抵抗値βGの範囲を
示し、これからもゲート幅ｗの変化だけでは、本
発明の目的とするゲート部形状抵抗値βGをカバー
することができないことがわかる。以上の結果か
ら本発明者等は、各キヤビテイにおいて樹脂充填
完了時刻を揃えるためにはゲートの諸元である幅
ｗ、深さhg、絞り角θのいずれも変える必要があ
ることを知見し本発明る完成するに至つた。
〔発明の実施例〕
以下、本発明の一実施例について第４図〜第６
図によつて説明する。図において第１図と同一番
号を付したものは同一部分である。第４図ａは本
発明による金型のランナ２の縦断面図であり、第
４図ｂは第４図ａのＡ−Ａ断面図でありゲート５
部の形状を示す。ランナ２は各キヤビテイ６への
樹脂充填開始時刻の差を縮めるためにランナ２の
高さｈはテーパ状になつておりその断面積はポツ
ト１から遠ざかるにしたがつて逐次減少させた先
細り形状とし、ゲート５の幅ｗ、深さhg、絞り角
θをポツト１から遠ざかる程大きくする構造にし
た。第１表に、第１キヤビテイでの幅ｗ、深さ
hg、絞り角θの値を１としたときの各キヤビテイ
（キヤビテイNo.２、３、４、５）でのそれぞれの
幅ｗ、深さhg、絞り角θの値を比率で示す。な
お、これらのゲート部の諸元は実際の生産工程で
問題の起きない範囲内に収めてある。
[Field of Application of the Invention] The present invention relates to the structure of a mold suitable for molding semiconductors with resin (hereinafter referred to as resin molding), and more specifically, to molding resin-molded semiconductors of uniform quality and high reliability with a high yield. This relates to the resin flow path structure inside the mold for this purpose. [Background of the Invention] Patent No. 1028866 is a specific known example of a thermosetting resin sealing mold that is conventionally used to mold a large number of resin molded semiconductors (hereinafter referred to as products) per shot. (Tokuko Showa 55-
17697). This will be explained with reference to FIGS. 1 and 2. Figure 1a is a cross-sectional view of Figure 1b (cross-sectional plan view of the mold cut horizontally), showing an upper mold 3 and a lower mold 4.
FIG. The molten resin pressurized in the pot 1 (or subble) passes through the runner 2 and the gate 5, and is filled into the cavity 6 in which an insert (for example, a lead frame for semiconductor sealing) is set. After the resin has hardened, the desired product can be obtained by releasing the mold and folding the gate 5. As is clear from the figure, the height h formed by the bottom wall and the top wall to which the gate 5 of the runner 2 is not connected
is tapered, and the cross-sectional area of the runner 2 decreases linearly along the direction in which the molten resin 7 travels. Furthermore, FIG.
-A, BB, CC, DD, and EE are shown. As is clear from the figure, the aperture angle θ of gate 5 (the angle formed by the upper and lower surfaces of the gate) is at point 1.
The cavities 6 that are further away from the center are gradually enlarged. That is, θ A < θ B < θ C < θ D < θ E (1) With this configuration, the flow velocity of the molten resin 7 in the runner 2 increases as the distance from the pot 1 increases. This is faster than when the cross-sectional area of the runner 2 does not change in the flow direction. On the other hand, as the constriction angle θ of the gate 5 increases, the pressure loss of the molten resin passing through it decreases. The total pressure loss of the molten resin 7 (=pressure loss when passing through the runner + pressure loss when passing through the gate) can be made equal. If the pressure losses are equal, the flow velocity of the molten resin 7 within each cavity will also be equal. FIG. 2 shows the state of resin filling in each cavity in the conventional mold described above. In the figure, the horizontal axis is the dimensionless time T/T 0 from the start of resin filling into the cavity (T is the time T 0 from the start of resin filling into the cavity).
is the time until the cavity is filled with resin)
, the vertical axis is the filling rate of resin in each cavity W/
W 0 (W is the amount of resin filling at time T W 0 is the amount of resin filling at time T 0
The resin filling amount in each case is scaled.
While the resin is being filled into each cavity, the slope shown in the figure, that is, the resin flow velocity is the same, but
Since the resin filling start time of the cavity closer to pot 1 is earlier, the filling completion time is also earlier. Therefore, after the filling of the upstream cavity is completed, the resin flow rate flowing through it is sequentially shifted to the downstream cavities, so that the farther the cavity is from pot 1, the higher the resin flow rate is before the filling is completed. . For this reason, there was a problem that the insert was subjected to a greater force toward the downstream side of the cavity and was more likely to deform. In addition, since filling is completed first in the upstream cavity, the flow of resin at the gate stops and the gate seal, where the resin hardens due to the heat transfer effect of the mold, progresses, and the final pressure of the resin is sufficiently applied inside the cavity. There were cases in which the molded product was completed without being added, that is, without the voids being completely crushed. Therefore, in order to prevent these problems from occurring, it is necessary to synchronize the resin filling completion time in each cavity, but if the conventional mold structure is used as shown in Figure 1d, , it is necessary to either make the gate aperture angle θ (A) on the upstream side extremely small, or to make the gate aperture angle θ (E) on the downstream side extremely large, as shown in Figure 1 e. There is a drawback that the molded product does not break from the base during gate breaking (removal of broken gate resin) after product molding, and in the latter case, the gate 5 bottom is deeper than the runner 2 bottom, making mold processing difficult. There was a problem. Therefore, with the conventional mold structure, it was not possible to complete the resin filling in each cavity at the same time, and it was not possible to improve reliability of product quality and yield. [Object of the Invention] The object of the present invention is to eliminate the drawbacks of the conventional molds for resin molding semiconductors as described above, to eliminate problems caused by uneven filling completion times of resin in each cavity of the mold, and to achieve uniform quality. It is possible to mold highly reliable products with high yields, significantly improve resin usage efficiency, and reduce production costs.
To provide molds for resin molds. [Summary of the Invention] The present invention is a mold for resin molding of semiconductors, etc., by changing all the specifications (width, depth, drawing angle) of each gate leading to each cavity for obtaining a product.
The structure is designed so that a desired flow resistance value of the molten resin can be obtained at each gate portion, and the resin filling completion time in each cavity can be easily aligned. Therefore, the occurrence of voids due to gate sealing caused by uneven resin filling completion times, poor resin adhesion to the insert, and deformation of the insert due to increased resin flow velocity (increased pressure loss) in the downstream cavity. can be prevented. Another feature of the present invention is that the flow resistance (pressure loss) value of the resin can be significantly reduced compared to conventional molds, thereby improving the efficiency of resin usage. Hereinafter, the progress that led to the completion of the present invention will be explained. Figure 3b shows the shape resistance value β G that each gate should have in order to fill each cavity with the same resin flow rate when using a conventional mold, and the filling completion time in each cavity in the case of the present invention. This figure shows a comparison with the shape resistance value β G that each gate should have in order to make the values uniform. Note that FIG. 3a is a diagram showing the shape of the gate portion of a conventional mold. As is clear from the figure, in order to equalize the resin filling completion time, compared to the conventional case of equalizing the resin flow speed, the gate shape is designed to make it much harder for the resin to flow on the upstream side near the pot, and the gate shape makes it much harder for the resin to flow on the downstream side. It can be seen that it is necessary to create a gate shape that is easy to use. Range L of gate shape resistance value β G in Figure 3
is the range of change in the gate shape resistance value β G obtained by leaving the specifications of gate width w and depth h g at standard values and changing only the aperture angle θ within a range that does not cause problems in the production process. From this, it can be seen that the aperture angle θ alone cannot cover the entire range of the gate shape resistance value β G when the resin filling completion times are aligned, which is the objective of the present invention. Moreover, the range M is the range of the gate shape resistance value β G when the gate width w and the aperture angle θ are kept at their standard values, and only the depth h g is changed within a range that does not cause problems in the production process. From now on, it will not be possible to cover the gate shape resistance value β G that is the object of the present invention by changing only the depth h g . Also, range N
shows the range of the gate shape resistance value β G when the gate depth h g and the aperture angle θ are kept at the standard values and only the gate width w is changed within the range that does not cause problems in the production process. It can be seen that changing the gate width w alone cannot cover the gate shape resistance value β G that is the object of the present invention. From the above results, the inventors found that in order to make the resin filling completion time uniform in each cavity, it is necessary to change the gate specifications such as width w, depth h g , and aperture angle θ. The invention has now been completed. [Embodiment of the Invention] Hereinafter, one embodiment of the present invention will be explained in Figs. 4 to 6.
This will be explained using figures. In the figure, the same parts as in FIG. 1 are denoted by the same numbers. FIG. 4a is a longitudinal cross-sectional view of the runner 2 of the mold according to the present invention, and FIG. 4b is a cross-sectional view taken along line A-A in FIG.
Indicates the shape of the part. The height h of the runner 2 is tapered in order to reduce the difference in the start time of resin filling into each cavity 6, and its cross-sectional area is tapered as it goes away from the pot 1. , the width w, depth h g , and aperture angle θ of the gate 5 are made larger as the distance from the pot 1 increases. Table 1 shows the width w and depth of the first cavity.
The values of width w, depth h g , and aperture angle θ of each cavity (cavity No. 2, 3, 4, and 5) are shown as a ratio when the value of h g and aperture angle θ is 1. Note that the specifications of these gate portions are kept within a range that does not cause problems in the actual production process.
以上詳細に説明したように本発明による金型で
は、製品を得る各キヤビテイに通ずる各ゲートの
諸元（幅、深さ、絞り角）のすべてを変えて、各
ゲート部で所望の溶融樹脂の流動抵抗値が得られ
るようにして各キヤビテイでの樹脂充填完了時刻
を揃える構造とし、かつ従来の金型に比べて樹脂
の流動抵抗（圧力損失）値を大幅に小さくしてい
るので、ボイドの発生やインサートに対する樹脂
接着不良およびインサートの変形を防止して、均
一な品質で信頼性の高い製品を高歩留りで生産す
ることができ、そのうえ樹脂使用率が低減できる
ので安価なレジンモールド半導体が得られ実用上
の効果は大きい。
As explained in detail above, in the mold according to the present invention, all the specifications (width, depth, drawing angle) of each gate leading to each cavity for obtaining a product are changed, and the desired amount of molten resin is produced at each gate part. It has a structure that aligns the resin filling completion time in each cavity so that the flow resistance value can be obtained, and the resin flow resistance (pressure loss) value is significantly smaller than that of conventional molds, so voids can be eliminated. It is possible to produce products with uniform quality and high reliability at a high yield by preventing resin molding, poor adhesion of the resin to the insert, and deformation of the insert.In addition, the resin usage rate can be reduced, resulting in inexpensive resin-molded semiconductors. This has great practical effects.
第１図は従来の金型を示し、ａはｂの−断
面図、ｂは金型を水平方向に切つた断面の平面
図、ｃはｂのＡ−Ａ，Ｂ−Ｂ，Ｃ−Ｃ，Ｄ−Ｄ，
Ｅ−Ｅ断面図、ｄ，ｅはいずれも各キヤビテイで
の樹脂充填完了時刻を揃えるために必要な従来の
金型構造を示す図、第２図は従来の金型での各キ
ヤビテイ内の樹脂充填状況を示すグラフ、第３図
ａは従来の金型のゲート部形状を示す図、第３図
ｂは充填完了時刻を揃える場合と流速を揃える場
合とのゲート部形状抵抗値の比較グラフ、第４図
ａは本発明による金型のランナ部の縦断面図、第
４図ｂは第４図ａのA′−A′断面図、第５図は本
発明による金型と従来の金型による各キヤビテイ
内での樹脂の充填状況の比較グラフ、第６図は本
発明による金型と従来の金型による樹脂使用量と
最終圧力損失の比較グラフである。
１……ポツト、２……ランナ、５……ゲート、
ｗ……ゲート幅、hg……ゲート深さ、θ……ゲー
ト絞り角。
Fig. 1 shows a conventional mold, where a is a cross-sectional view of b, b is a plan view of a cross-section of the mold cut horizontally, and c is a cross-sectional view of b, A-A, B-B, C-C, D-D,
E-E sectional view, d and e are both diagrams showing the conventional mold structure necessary to align the resin filling completion time in each cavity, and Figure 2 is a diagram showing the resin in each cavity in the conventional mold. Graph showing the filling situation, Figure 3a is a diagram showing the shape of the gate part of a conventional mold, Figure 3b is a graph comparing the resistance value of the gate part shape when the filling completion times are the same and when the flow velocity is the same, FIG. 4a is a longitudinal sectional view of the runner part of the mold according to the present invention, FIG. 4b is a sectional view taken along line A'-A' in FIG. 4a, and FIG. 5 is a diagram showing the mold according to the present invention and the conventional mold. FIG. 6 is a comparison graph of the amount of resin used and the final pressure loss between a mold according to the present invention and a conventional mold. 1... Pot, 2... Runner, 5... Gate,
w...Gate width, h g ...Gate depth, θ...Gate aperture angle.
Claims (1)
分岐接続された複数のキヤビテイを該ランナに沿
つて配設した樹脂封止用金型において、該ゲート
の絞り角をポツトから遠ざかるにしたがつて逐次
広げるとともに、幅ならびに深さを上流側のゲー
ト以上の大きさにすることにより、ゲートの底が
ランナ底より深くならない状態で各ゲート部で所
望の樹脂流動抵抗値が得られるように、各キヤビ
テイ毎にゲート形状を設定し、各キヤビテイでの
樹脂充填完了時刻を揃える構造にしたことを特徴
とする樹脂封止用金型。 ２ ランナの断面積をポツトから遠ざかるにした
がつて逐次減少させることを特徴とする特許請求
範囲第１項の樹脂封止用金型。[Claims] 1. A mold for resin sealing in which a plurality of cavities are branched and connected to a runner connected to a pot along the runner, and the drawing angle of the gate is set from the pot to the runner. By gradually widening the distance from the gate and making the width and depth larger than the upstream gate, the desired resin flow resistance value can be obtained at each gate without making the bottom of the gate deeper than the bottom of the runner. A mold for resin sealing characterized by having a structure in which a gate shape is set for each cavity so that the resin filling completion time in each cavity is aligned. 2. The mold for resin sealing according to claim 1, wherein the cross-sectional area of the runner is gradually decreased as the distance from the pot increases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21947183A JPS60113437A (en) | 1983-11-24 | 1983-11-24 | Mold for resin sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21947183A JPS60113437A (en) | 1983-11-24 | 1983-11-24 | Mold for resin sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113437A JPS60113437A (en) | 1985-06-19 |
| JPH057864B2 true JPH057864B2 (en) | 1993-01-29 |
Family
ID=16735947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21947183A Granted JPS60113437A (en) | 1983-11-24 | 1983-11-24 | Mold for resin sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113437A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2560443Y2 (en) * | 1991-04-26 | 1998-01-21 | 株式会社東海理化電機製作所 | Parts mounting device |
| JP5331675B2 (en) * | 2009-12-28 | 2013-10-30 | 株式会社日立製作所 | Method and apparatus for calculating flow resistance value of porous body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5747028U (en) * | 1980-08-29 | 1982-03-16 |
-
1983
- 1983-11-24 JP JP21947183A patent/JPS60113437A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60113437A (en) | 1985-06-19 |
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