JPH0578868A - Chemical polishing equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] A solid reaction product produced when a metal surface of a plate-like body is chemically polished by using an acidic solution is opposed to a chemical polishing apparatus that conveys the plate-like body. The purpose is to prevent it from adhering to the roll and impeding uniform polishing of the treated surface. Constitution is provided with a conveying means in which a plurality of pairs of upper and lower opposed rolls are horizontally installed, an exhaust unit at least at a front stage and a rear stage of the conveying unit, and a chemical polishing treatment liquid supply unit in the middle of the conveying unit. In the chemical polishing apparatus, the chemical polishing apparatus further includes a cleaning unit that cleans at least a lower roll of a pair of upper and lower facing rolls located near the exhaust unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical polishing apparatus for chemically polishing the surface of a plate-like body such as a metal plate or a resin plate having a metal layer on the surface.

[0002]

2. Description of the Related Art Conventionally, when a dry film layer for forming a resist for plating or etching is coated or attached to a plate-like body having a copper metal surface such as an inner layer board of a printed wiring board, As the pretreatment, generally, a treatment liquid for chemical polishing (for example, a mixed solution of sulfuric acid and hydrogen peroxide) is brought into contact with the copper surface of the plate-like body, and the surface is chemically polished.

The process of the conventional chemical polishing treatment line for a general copper surface will be described with reference to the conventional chemical polishing apparatus of FIG. 3 and the general chemical polishing process diagram of FIG. A plate-shaped body 1 having a copper (Cu) surface to be charged is charged from a charging unit 3 of a processing line of a chemical polishing apparatus 2. Then, a pair of upper and lower opposing rolls 4 that are driven to rotate
The plate-shaped body 1 is sandwiched between the opposing rolls 4 of the conveying means 5 in which a plurality of (upper rolls 4a, lower rolls 4b) are arranged in the horizontal direction, and the plates 1 are conveyed horizontally in the right direction in FIG.

A plurality of chemical polishing processing liquid supply parts 6 are provided above and below the upper and lower facing rolls 4, 4, 4, ... A mixed liquid of dilute sulfuric acid (H ₂ SO ₄ ) and hydrogen peroxide solution (H ₂ O ₂ ) is supplied from the chemical polishing treatment liquid supply unit 6 to the front surface or the back surface of the plate-shaped body 1 conveyed at 5. The copper surface of the plate-shaped body 1 is chemically polished by supplying (for example, spraying) it as a chemical polishing solution and bringing them into contact with each other.

Subsequently, the plate-shaped body 1 that has finished passing through the chemical polishing treatment liquid supply section 6 is carried out to the water washing means 7 side and remains on the copper surface of the plate-shaped body 1 while passing through the water washing means 7. Rinse the polishing solution with water.

Subsequently, the plate-like body 1 which has passed through the washing means 7
Is to pass the drying means 8 (far-infrared heater, hot-air fan, etc.) as appropriate to dry the chemically polished surface, and to finish the chemical polishing.

[0007]

In the chemical polishing process in the above chemical polishing process, the copper (C
When u) is subjected to a chemical polishing treatment using a dilute sulfuric acid or hydrogen peroxide solution or a mixed solution thereof as a chemical polishing treatment liquid, the following reaction proceeds in the chemical polishing apparatus 2 (chamber) to produce copper sulfate ( CuSO ₄ ) is produced as a crystalline solid as a solid. Cu + H ₂ SO ₄ + H ₂ O ₂ → Cu SO ₄ + 2H ₂ O

On the other hand, the conventional chemical polishing apparatus 2 during processing
The diluted sulfuric acid (H ₂ S
In order for the O ₄ ) droplets to be filled in the form of acidic gas or mist, the chemical polishing apparatus 2 is provided with an exhaust unit 9 (natural exhaust system or forced exhaust system).
The acidic gas accumulated inside is exhausted to the outside of the device 2.

Therefore, the moisture in the device 2 is also discharged to the outside of the device 2 at the same time as the exhaust, and particularly, the opposed roll 4 located near the exhaust part 9 (for example, the position A near the exhaust part in FIG.
B) is easy to dry due to reduction of water content by exhaust, and copper sulfate (CuSO ₄ ) attached in an aqueous solution state to the counter roll 4 or the like during the chemical polishing treatment is dried in a solid state on the peripheral surface of the counter roll 4 or the like. It tends to be in a crystalline state and attach easily.

The copper sulfate deposited in this solid state is
It is an obstacle to uniformly roughening the copper surface of the plate-like body 1 for chemical polishing treatment that is sequentially conveyed, and also causes stains on the copper surface of the plate-like body 1 after treatment. It is also accompanied.

According to the present invention, a polishing treatment reaction product is applied to a counter roll for transporting a plate of a chemical polishing treatment apparatus for chemically polishing the metal surface of a plate using an acidic chemical polishing liquid. The purpose is to prevent it from becoming solid and adhering.

[0012]

DISCLOSURE OF THE INVENTION According to the present invention, a conveying means in which a plurality of pairs of upper and lower opposed rolls are horizontally installed, an exhaust unit at least before and after the conveying means, and an intermediate portion of the conveying means. In a chemical polishing apparatus having a chemical polishing treatment liquid supply section, at least a cleaning means for cleaning the lower rolls of a pair of upper and lower opposing rolls located in the vicinity of the exhaust section is provided. is there.

Further, according to the present invention, the chemical polishing apparatus is characterized in that the cleaning means for cleaning the lower roll of the pair of upper and lower opposed rolls is a cleaning liquid tank for immersing the lower roll.

Further, the present invention is characterized in that the cleaning means for cleaning the lower roll of the pair of upper and lower opposed rolls is a cleaning liquid jetting section for supplying a cleaning liquid to the peripheral surface of the lower roll. It is a polishing device.

[0015]

EXAMPLES The present invention will be described in detail with reference to examples. FIG. 1 is a side view of a chemical polishing apparatus 24 according to the present invention, and a bottom portion 26, four side walls 27, 27, 27, 27 and an upper plate 28 constitute an outer housing portion 25 of the chemical polishing apparatus 24.

In the housing portion 25, a pair of upper and lower drive rolls, which can be driven and rotated, (upper roll 4a and lower roll 4b form a pair) are horizontally arranged. A plurality of pairs are arranged, and the opposing rolls are interlocked with each other and rotatable by a drive motor.

All of the opposed rolls 4 are chemical resistant rubber rolls or resin rolls, or the opposed rolls 4 are used in combination with chemical resistant rubber rolls and resin rolls. It is also possible to use a metal roll as long as it is chemically resistant. A treatment liquid for supplying a chemical polishing treatment liquid (for example, an acidic aqueous solution such as a mixed liquid of dilute sulfuric acid and hydrogen peroxide solution) above and below the arrangement position of the opposed roll 4 in the direction of the opposed roll 4. One supply unit 6 or a plurality of supply units 6 are installed in parallel to the arrangement direction of the opposing rolls 4.

The treatment liquid supply section 6 may be a spray nozzle for supplying the treatment liquid so as to spray it, a spray pipe, or a coating roll.

An exhaust portion 9 is provided in a part of the housing portion 25.
Is provided so that the gas in the housing portion 25 can be exhausted. The exhaust system of the exhaust unit 9 may be either a natural exhaust system or a forced exhaust system such as an intake fan or a pushing fan.

In the embodiment of FIG. 1, the exhaust unit 9
Are installed at both ends of the plurality of opposed rolls 4, 4, 4, ... Arranged in the housing portion 25. Further, the opposing roll 4 provided near the exhaust unit 9
And the opposing roll 4 adjacent to the opposing roll 4, a partition plate 23 is appropriately installed so that the influence of the gas flow due to the exhaust does not directly affect the adjacent opposing roll 4. It is possible.

In the present invention, the lower roll 4b of the pair of opposed rolls 4 provided near the exhaust portion is provided with the cleaning means 10 capable of cleaning the peripheral surface of the lower roll 4b. In one embodiment of the present invention, as shown in FIG. 1, the exhaust unit 9 is provided near the exhaust unit 9 (positions A and B near the exhaust unit).
Of the pair of upper rolls 4a and the lower rolls 4b of the opposing rolls 4, a cleaning liquid tank 11 for storing a cleaning liquid 12 such as washing water for immersing the lower rolls 4b is installed.

The cleaning liquid tank 11 includes the lower roll 4b.
There is provided a detachable means that can be attached to and detached from, and the detachable means can be achieved by a conventionally known means, and the cleaning liquid circulation for constantly supplying the cleaning liquid 12 to the cleaning liquid tank 11 in a circulating manner. A supply means can be provided side by side, and a conventionally known liquid circulation supply pump or the like can be used as the cleaning liquid circulation supply means.

Further, in the present invention, the cleaning liquid layer 11
Is the opposed roll 4 arranged at the closest position to the exhaust unit 9.
Although the object of the present invention can be sufficiently achieved by installing the lower roll 4b on the lower roll 4b, the present invention is not necessarily limited to this, and the opposed rolls 4 and 4 arranged horizontally in the housing portion 25 are provided. , 4 ... so that the lower roll 4b of any of the cleaning means 10 is immersed in the cleaning liquid.
It is possible to install (the cleaning liquid tank 11 in the above-mentioned embodiment).

Further, in the present invention, if necessary, the housing portions 2 at both ends of the facing roll 4 in the horizontal arrangement direction.
5 A pair of feed rolls 21 facing each other vertically on the outside
(Upper roll 21a, lower roll 21b) and delivery roll 22 (upper roll 22a, lower roll 22b) are installed, and the plate-like body 1 for chemical polishing is charged and discharged.

FIG. 2 is a side view of the cleaning means 10 in another embodiment of the chemical polishing treatment apparatus of the present invention. Of the pair of upper and lower opposed rolls 4, cleaning water is applied to the peripheral surface of the lower roll 4b. The cleaning liquid spraying nozzle 14 for spraying the cleaning liquid is installed.

Next, an operation method for treating the metal surface of the plate-shaped body 1 by using the chemical polishing apparatus of the present invention will be described with reference to FIG. Then, it is fed into the chamber 25 through the charging port 16 and fed forward. The plate-like body 1 charged through the charging port 16 is driven by the opposed rolls 4, 4, 4, ...
It is sandwiched between the two and is conveyed forward in the chamber 25 by the rotation of each opposing roll 4.

While passing through each of the facing rolls 4, the acidic treating liquid 15 is sprayed on both sides of the plate 1 from the chemical treating liquid supply portions 6 installed above and below the facing rolls 4. The metal surface of the plate 1 is chemically polished by the acidic treatment liquid 15.

While the plate-shaped body 1 is being conveyed forward, the lower roll 4b of the opposed rolls 4 which is being driven and rotated is provided with the cleaning means 10, that is, the cleaning liquid 12 (which is stored in the cleaning liquid tank 11). The roll peripheral surface of the lower roll 4b immersed in (washing water) is always in contact with the cleaning liquid 12,
The wet state is maintained without being dried, and the solid content of the processing waste liquid generated by the chemical polishing treatment is always washed away and cleaned by the cleaning liquid 12.

The plate-like body 1 which has finished passing through the facing rolls 4, 4, 4, ... Is introduced between the sending rollers 22 which face each other after passing through the carry-out port 17, and outside the chemical polishing processing device 24. Be delivered to.

The carried-out plate-shaped body 1 is washed with a treatment liquid (not shown) provided downstream of the chemical polishing treatment device 24 so that the treatment liquid 15 is washed off to complete the chemical polishing treatment. Drying means installed in the latter stage (not shown)
And dried to complete the chemical polishing process operation.

[0031]

The chemical polishing apparatus of the present invention is an apparatus for chemically polishing the metal surface of a plate-like body by using an acidic chemical polishing treatment liquid, and the plate-like body to be polished is vertically moved. Since the cleaning means was provided on the rotating opposing roll for transporting further forward while sandwiching, the plate-shaped body was transported forward while sandwiching by the opposing roll, and the metal surface was chemically polished by the acidic treatment liquid ( Smoothing polishing of the metal surface, roughening polishing, etc.) The product contained in the processing waste liquid generated during the polishing is always solidified by the cleaning means so that the product does not adhere to the opposing roll. The circumference can be kept clean.

[0032]

INDUSTRIAL APPLICABILITY The chemical polishing apparatus of the present invention can prevent the solid content of the processing waste liquid generated by the chemical polishing processing from adhering to the opposed roll that conveys the plate-like material, and the solid content adheres to the opposed roll. Then, it is possible to eliminate the occurrence of processing unevenness in the plate-like body, for example, for forming a resist for plating or etching on the plate-like body having a copper metal surface such as an inner layer plate of a printed wiring board. It is effective for chemical polishing treatment such as pretreatment polishing when coating or laminating a dry film layer.

[Brief description of drawings]

FIG. 1 is a side view of an embodiment of a chemical polishing processing apparatus of the present invention.

FIG. 2 is a side view of cleaning means in another embodiment of the chemical polishing processing apparatus of the present invention.

FIG. 3 is a side view of a conventional chemical polishing apparatus.

FIG. 4 is an explanatory diagram illustrating a general chemical polishing process.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Plate-shaped body 2 ... Chemical polishing device 3 ... Input part 4 ... Opposite roll 4a ... Upper roll 4b ... Lower roll 5 ... Conveying means 6 ... Treatment liquid supply part 7 ... Water washing means 8 ... Drying means 9 ... Exhaust part 10 ... Cleaning means 11 ... Cleaning liquid layer 1
2 ... Cleaning liquid 14 ... Cleaning liquid nozzle 15 ... Treatment liquid 16
… Inlet 17… Outgoing port 21… Infeed roll 22
... Sending roll 23 ... Partition plate 24 ... Chemical polishing device 25 ... Chamber 26 ... Bottom 27 ... Side wall 28 ...
Upper plate 29 ... Treated liquid discharge pipe A, B ... Position near exhaust unit

Claims (3)

[Claims] 1. A conveying means in which a plurality of pairs of upper and lower opposed rolls are horizontally installed, an exhaust unit at least at a front stage and a rear stage of the conveying unit, and a chemical polishing treatment liquid supply unit in the middle of the conveying unit. A chemical polishing apparatus comprising: a chemical polishing apparatus including cleaning means for cleaning at least a lower roll of a pair of upper and lower facing rolls located near the exhaust part. 2. The chemical polishing apparatus according to claim 1, wherein the cleaning means for cleaning the lower roll of the pair of upper and lower opposed rolls is a cleaning liquid tank for immersing the lower roll. 3. The chemical polishing apparatus according to claim 1, wherein the cleaning means for cleaning the lower roll of the pair of upper and lower opposed rolls is a cleaning liquid jetting unit for supplying a cleaning liquid to the peripheral surface of the lower roll.