JPH0578939B2 - - Google Patents
Info
- Publication number
- JPH0578939B2 JPH0578939B2 JP59149586A JP14958684A JPH0578939B2 JP H0578939 B2 JPH0578939 B2 JP H0578939B2 JP 59149586 A JP59149586 A JP 59149586A JP 14958684 A JP14958684 A JP 14958684A JP H0578939 B2 JPH0578939 B2 JP H0578939B2
- Authority
- JP
- Japan
- Prior art keywords
- sio
- uneven substrate
- silicone resin
- temperature
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59149586A JPS6129153A (ja) | 1984-07-20 | 1984-07-20 | 凹凸基板の平坦化方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59149586A JPS6129153A (ja) | 1984-07-20 | 1984-07-20 | 凹凸基板の平坦化方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6129153A JPS6129153A (ja) | 1986-02-10 |
| JPH0578939B2 true JPH0578939B2 (2) | 1993-10-29 |
Family
ID=15478436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59149586A Granted JPS6129153A (ja) | 1984-07-20 | 1984-07-20 | 凹凸基板の平坦化方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6129153A (2) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR900008647B1 (ko) * | 1986-03-20 | 1990-11-26 | 후지쓰 가부시끼가이샤 | 3차원 집적회로와 그의 제조방법 |
| JPH02106948A (ja) * | 1988-10-17 | 1990-04-19 | Fujitsu Ltd | 半導体装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5760330A (en) * | 1980-09-27 | 1982-04-12 | Fujitsu Ltd | Resin composition |
| JPS5957437A (ja) * | 1982-09-28 | 1984-04-03 | Fujitsu Ltd | 酸化珪素膜の形成方法 |
-
1984
- 1984-07-20 JP JP59149586A patent/JPS6129153A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6129153A (ja) | 1986-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |