JPH0579509B2 - - Google Patents
Info
- Publication number
- JPH0579509B2 JPH0579509B2 JP59133135A JP13313584A JPH0579509B2 JP H0579509 B2 JPH0579509 B2 JP H0579509B2 JP 59133135 A JP59133135 A JP 59133135A JP 13313584 A JP13313584 A JP 13313584A JP H0579509 B2 JPH0579509 B2 JP H0579509B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resistor
- thermal
- insulating layer
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はフアクシミリ等の印画に使用する感熱
記録ヘツドに関し、特に抵抗体寿命、耐熱性に優
れた感熱記録ヘツドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a heat-sensitive recording head used for printing facsimiles and the like, and particularly to a heat-sensitive recording head with excellent resistor life and heat resistance.
従来の感熱記録ヘツドは例えば特開昭52−
100245号公報に開示されているように、熱絶縁層
に熱伝導率の小さいエポキシまたは芳香族ポリイ
ミド等の樹脂を用いて、熱効率、熱応答特性を良
好にするものが知られている。しかし、この技術
は、抵抗体の安定性、耐熱強度の点には配慮され
ていなかつた。
Conventional heat-sensitive recording heads are, for example, disclosed in Japanese Patent Application Laid-Open No. 1986-
As disclosed in Japanese Patent No. 100245, it is known to improve thermal efficiency and thermal response characteristics by using a resin such as epoxy or aromatic polyimide with low thermal conductivity in the thermal insulation layer. However, this technique did not take into account the stability and heat resistance of the resistor.
本発明の目的は、抵抗体の安定性、耐熱性の優
れた高信頼性の感熱記録ヘツドを提供することに
ある。
An object of the present invention is to provide a highly reliable thermal recording head with excellent resistor stability and heat resistance.
本発明の感熱記録ヘツドは、抵抗体と耐熱性樹
脂で形成した熱絶縁層の間に熱安定性の高い絶縁
性セラミツクより成る耐熱層を設け抵抗体への不
純物混入を防止し、抵抗体に加わる熱応力を低下
させたことを特徴とする。
The heat-sensitive recording head of the present invention has a heat-resistant layer made of insulating ceramic with high thermal stability between the resistor and the heat-insulating layer made of heat-resistant resin to prevent impurities from entering the resistor. It is characterized by a reduction in applied thermal stress.
以下、本発明の感熱記録ヘツドの一実施例を、
第１図により説明する。基板１の上には、耐熱性
樹脂による熱絶縁層２が設けられている。この熱
絶縁層２の上には、絶縁性セラミツクによる耐熱
層３が設けられ、その上に形成される抵抗体４と
前述の熱絶縁層２が接しないようにしている。更
に、この抵抗体４の上には導体５、保護層６が設
けてある。熱絶縁層２に用いる耐熱性樹脂には、
芳香族ポリアミド、ポリイミド、ポリスルホン、
ポリフエニレンオキシド等の解離温度の高い耐熱
性の優れた材料が有利である。耐熱層３には保護
層６と同様な材料が一般に用いることが可能であ
る。例えばSiO2、Si3N4、SiC等が有利であり、
抵抗体４の材料に適した密着性の良好な、そして
ち密な絶縁性セラミツクが好ましい。このような
構成をとることにより、抵抗体４と熱絶縁層２は
直接触れることがなくなる。熱絶縁層２を構成す
る酸素、窒素、炭素、水素、硫黄などの元素は、
一部遊離し、抵抗体の抵抗値変動を引き起こす可
能性がある。しかし、セラミツクによる耐熱層を
設けることにより、抵抗体への拡散を防止するこ
とができるので、寿命、抵抗値の安定性が向上す
る効果がある。
An embodiment of the thermal recording head of the present invention will be described below.
This will be explained with reference to FIG. A heat insulating layer 2 made of heat-resistant resin is provided on the substrate 1 . A heat-resistant layer 3 made of insulating ceramic is provided on this thermal insulating layer 2, and the above-mentioned thermal insulating layer 2 is prevented from coming into contact with the resistor 4 formed thereon. Furthermore, a conductor 5 and a protective layer 6 are provided on the resistor 4. The heat-resistant resin used for the thermal insulation layer 2 includes:
aromatic polyamide, polyimide, polysulfone,
Materials with high dissociation temperature and excellent heat resistance, such as polyphenylene oxide, are advantageous. The same material as the protective layer 6 can generally be used for the heat-resistant layer 3. For example, SiO 2 , Si 3 N 4 , SiC, etc. are advantageous;
It is preferable to use a dense insulating ceramic that has good adhesion and is suitable for the material of the resistor 4. By adopting such a configuration, the resistor 4 and the thermal insulation layer 2 do not come into direct contact with each other. Elements such as oxygen, nitrogen, carbon, hydrogen, and sulfur that constitute the thermal insulation layer 2 are as follows:
There is a possibility that some of it will be released and cause resistance value fluctuation of the resistor. However, by providing a heat-resistant layer made of ceramic, it is possible to prevent diffusion into the resistor, which has the effect of improving the life span and stability of the resistance value.
耐熱樹脂製熱絶縁層と抵抗体が直接触れる構成
では、熱絶縁層を構成する元素が一部遊離して抵
抗値変動を引き起こす可能性があり、また熱絶縁
層と抵抗体の熱膨張率が異なるため、抵抗体に直
接熱応力が加わる。熱応力が大きいと耐熱樹脂製
熱絶縁層或いは抵抗体が破損する。従つてセラミ
ツク製耐熱層が無いと耐熱樹脂製熱絶縁層に割れ
を発生し、感熱記録ヘツドを構成できなくなる。
そこで本実施例によればそのような問題がなくな
るのである。 In a configuration where the heat-resistant resin thermal insulation layer and the resistor come into direct contact, some of the elements that make up the thermal insulation layer may be liberated, causing resistance value fluctuations, and the thermal expansion coefficient of the thermal insulation layer and the resistor may change. Because of the difference, thermal stress is directly applied to the resistor. If the thermal stress is large, the heat insulating layer made of heat resistant resin or the resistor will be damaged. Therefore, without the ceramic heat-resistant layer, cracks will occur in the heat-resistant resin heat-insulating layer, making it impossible to construct a heat-sensitive recording head.
According to this embodiment, such a problem is eliminated.
セラミツクの熱膨張率は一般に0.2×10-61／℃
〜10×10-61／℃と小さいのに対して、樹脂では
1.5×10-51／℃〜８×10-51／℃と大きな値を示
す。抵抗体の多くは高比抵抗値を持つセラミツク
製であり、樹脂と積層すると直接熱応力が抵抗体
に加わる。しかし、その間にセラミツク製の耐熱
層を設けると熱応力の大きな部分は耐熱層が負担
することになり、抵抗体への熱応力が低減できる
ので抵抗体の耐熱性を向上できる効果がある。 The coefficient of thermal expansion of ceramic is generally 0.2×10 -6 1/℃
〜10×10 -6 1/℃, which is small, whereas with resin
It shows a large value of 1.5×10 -5 1/℃ to 8×10 -5 1/℃. Most resistors are made of ceramic with a high specific resistance value, and when laminated with resin, direct thermal stress is applied to the resistor. However, if a ceramic heat-resistant layer is provided in between, the heat-resistant layer will bear the large portion of thermal stress, and the thermal stress on the resistor can be reduced, which has the effect of improving the heat resistance of the resistor.
セラミツク耐熱層３は薄いほど熱容量が小さく
なり熱効率が良いが、拡散防止および熱応力の負
担に必要な厚さから１〜5μｍが好ましい。 The thinner the ceramic heat-resistant layer 3, the smaller the heat capacity and the better the thermal efficiency, but the thickness is preferably 1 to 5 μm in view of the thickness required to prevent diffusion and bear thermal stress.
別の実施例を第２図と第３図に示す。第２図は
耐熱層３を発熱部の付近にのみに形成した実施例
であり、第３図は熱絶縁層２を発熱部の付近のみ
に形成した実施例である。これらの実施例は第１
図に示した実施例の効果の他に、印画媒体との接
触が良好となる効果がある。 Another embodiment is shown in FIGS. 2 and 3. FIG. 2 shows an embodiment in which the heat-resistant layer 3 is formed only in the vicinity of the heat generating part, and FIG. 3 shows an embodiment in which the heat insulating layer 2 is formed only in the vicinity of the heat generating part. These examples are the first
In addition to the effects of the embodiment shown in the figure, there is an effect of improving contact with the printing medium.
本発明によれば、熱絶縁層からの抵抗体への不
純物拡散を防止でき、さらに熱応力を低減できる
ので抵抗体の安定性を増し、耐熱性を向上する効
果がある。
According to the present invention, diffusion of impurities from the heat insulating layer to the resistor can be prevented, and thermal stress can be further reduced, so that the stability of the resistor can be increased and the heat resistance can be improved.
第１図は本発明の感熱記録ヘツドの一実施例を
示す概略断面図、第２図および第３図は本発明の
感熱記録ヘツドの他の実施例を示す概略断面図で
ある。
１……基板、２……熱絶縁層、３……耐熱層、
４……抵抗体、５……導体、６……保護層。
FIG. 1 is a schematic cross-sectional view showing one embodiment of the heat-sensitive recording head of the present invention, and FIGS. 2 and 3 are schematic cross-sectional views showing other embodiments of the heat-sensitive recording head of the present invention. 1...Substrate, 2...Heat insulating layer, 3...Heat resistant layer,
4...Resistor, 5...Conductor, 6...Protective layer.
Claims (1)
と、この熱絶縁層上に設けた通電することにより
発熱する抵抗体と、この抵抗体に電力を供給する
導体とを備えた感熱記録ヘツドにおいて、前記熱
絶縁層と抵抗体の間に更に絶縁性セラミツクより
成る耐熱層を設けたことを特徴とする感熱記録ヘ
ツド。1. A thermal recording head comprising at least a thermal insulating layer formed of a heat-resistant resin, a resistor provided on the thermal insulating layer that generates heat when energized, and a conductor for supplying power to the resistor, A heat-sensitive recording head characterized in that a heat-resistant layer made of insulating ceramic is further provided between the heat-insulating layer and the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13313584A JPS6112357A (en) | 1984-06-29 | 1984-06-29 | Thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13313584A JPS6112357A (en) | 1984-06-29 | 1984-06-29 | Thermal recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6112357A JPS6112357A (en) | 1986-01-20 |
| JPH0579509B2 true JPH0579509B2 (en) | 1993-11-02 |
Family
ID=15097584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13313584A Granted JPS6112357A (en) | 1984-06-29 | 1984-06-29 | Thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112357A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6377752A (en) * | 1986-09-19 | 1988-04-07 | Fujitsu Ltd | Thermal head |
| JPH0659737B2 (en) * | 1987-12-11 | 1994-08-10 | 株式会社東芝 | Thermal head |
| JPH021339A (en) * | 1988-03-28 | 1990-01-05 | Toshiba Corp | Heat-resistant insulation substrate, thermal head and heat sensitive recording device |
| US5252988A (en) * | 1989-12-15 | 1993-10-12 | Sharp Kabushiki Kaisha | Thermal head for thermal recording machine |
| JPH06238933A (en) * | 1992-07-03 | 1994-08-30 | Hitachi Koki Co Ltd | Thermal print head and thermal printer |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4892032A (en) * | 1972-02-29 | 1973-11-29 | ||
| JPS52100245A (en) * | 1976-02-19 | 1977-08-23 | Oki Electric Ind Co Ltd | Thermal head of high heat efficiency |
| JPS6034802B2 (en) * | 1977-10-13 | 1985-08-10 | キヤノン株式会社 | Thermal head for thermal recording device |
| JPS5440128U (en) * | 1977-08-24 | 1979-03-16 | ||
| JPS5521276A (en) * | 1978-08-02 | 1980-02-15 | Tdk Corp | Thermal head |
| JPS5783475A (en) * | 1980-11-13 | 1982-05-25 | Seiko Epson Corp | Thermal head |
| JPS57185173A (en) * | 1981-05-11 | 1982-11-15 | Oki Electric Ind Co Ltd | Thermal head |
| JPS60255459A (en) * | 1984-06-01 | 1985-12-17 | Ricoh Co Ltd | thermal head |
-
1984
- 1984-06-29 JP JP13313584A patent/JPS6112357A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6112357A (en) | 1986-01-20 |
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