JPH058640B2 - - Google Patents
Info
- Publication number
- JPH058640B2 JPH058640B2 JP22140483A JP22140483A JPH058640B2 JP H058640 B2 JPH058640 B2 JP H058640B2 JP 22140483 A JP22140483 A JP 22140483A JP 22140483 A JP22140483 A JP 22140483A JP H058640 B2 JPH058640 B2 JP H058640B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric ceramic
- backing material
- frame
- manufacturing
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 claims 1
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は診断のための医療機器の分野に属し、
特に超音波プローブにおける超音波トランスジユ
ーサの製造方法に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention belongs to the field of medical devices for diagnosis,
In particular, the present invention relates to a method of manufacturing an ultrasonic transducer in an ultrasonic probe.
［発明の技術的背景とその問題点］
従来より、例えば超音波プローブにおけるトラ
ンスジユーサとしての圧電振動子には圧電セラミ
ツクが用いられ、その使用する用途に応じて例え
ばリンク状若しくはダイス状又はアレイ状に切断
していた。この切断に際してカツターで切断する
場合には、固形のバツキング材に圧電セラミツク
を接着固定した後にカツテイングを行なつてい
た。この際、バツキング材は治具の役割も果すこ
とになる。一方、レーザで切断する場合には、例
えば銅の治具上で圧電セラミツクを載置した後に
レーザで所定形状に切断し、それを固形のバツキ
ング材に貼り付けていた。直後にバツキング材上
でレーザ加工すると、熱伝導性の悪いバツキング
材は切断面に悪影響を及ぼすからである。[Technical background of the invention and its problems] Piezoelectric ceramics have conventionally been used as piezoelectric vibrators as transducers in ultrasonic probes. It was cut into pieces. When cutting with a cutter, piezoelectric ceramic is adhesively fixed to a solid backing material and then cutting is performed. At this time, the backing material also plays the role of a jig. On the other hand, when cutting with a laser, for example, the piezoelectric ceramic is placed on a copper jig, cut into a predetermined shape with a laser, and then affixed to a solid backing material. This is because if laser processing is performed on the backing material immediately after, the backing material with poor thermal conductivity will have an adverse effect on the cut surface.
しかしながら、前記したいずれの方法による場
合も、バツキング材は固形であるため、切断分割
された圧電セラミツクの各エレメントからリード
線により電極を取り出すことに物理的な制約を受
け、製造工程の困難性が強られることは勿論、リ
ード線の取り出し位置精度などについても問題が
生じる。また圧電セラミツクは固形のバツキング
材に接着剤により固定されているため、この接着
層の存在により圧電セラミツクからの超音波に不
要信号が混入することがあるので、前記接着剤層
を充分に薄くするというようなコントロールが必
要であつた。さらに、バツキング材は予め成形さ
れた固形のため、圧電セラミツクから放射される
超音波に応じた超音波吸収特性を有するバツキン
グ材に適宜に変えることが困難でもあつた。 However, in any of the above-mentioned methods, since the backing material is solid, there are physical constraints on taking out the electrodes from each element of the cut and divided piezoelectric ceramic using lead wires, making the manufacturing process difficult. Of course, problems arise with regard to the accuracy of the lead wire extraction position. Furthermore, since the piezoelectric ceramic is fixed to a solid backing material with an adhesive, the presence of this adhesive layer may cause unnecessary signals to be mixed into the ultrasonic waves from the piezoelectric ceramic, so the adhesive layer must be made sufficiently thin. Such control was necessary. Furthermore, since the backing material is a pre-formed solid, it is difficult to change it to a backing material that has ultrasonic absorption characteristics corresponding to the ultrasonic waves emitted from the piezoelectric ceramic.
［発明の目的］
本発明は前記事情に基づいてなされたものであ
り、圧電セラミツクからバツキング材を介して容
易に電極を取り出すことができると共に、バツキ
ング材の吸音特性を適切に調整でき、然も圧電セ
ラミツクからの超音波に悪影響を全く与えない超
音波トランスジユーサの製造方法を提供すること
を目的とする。[Object of the Invention] The present invention has been made based on the above circumstances, and it is possible to easily take out an electrode from a piezoelectric ceramic through a backing material, and also to appropriately adjust the sound absorption characteristics of the backing material. It is an object of the present invention to provide a method for manufacturing an ultrasonic transducer that does not have any adverse effect on ultrasonic waves from piezoelectric ceramics.
［発明の概要］
上記目的を達成するための本発明の概要は、圧
電セラミツクを治具に仮固定した後、該セラミツ
クを所定形成のエレメントに切断分割する工程
と、各エレメントにリード線を接続する工程と、
前記分割された圧電セラミツクに筒状の枠体を仮
設する工程と、枠体内に所望の音響特性を有する
ように配合した注型バツキング材を流し込む工程
と、該注型バツキング材が固化した後に前記枠体
と治具を取り除く工程とを含むことを特徴とする
ものである。[Summary of the Invention] The outline of the present invention for achieving the above object includes a step of temporarily fixing a piezoelectric ceramic to a jig, then cutting and dividing the ceramic into elements of a predetermined shape, and connecting a lead wire to each element. The process of
a step of temporarily installing a cylindrical frame on the divided piezoelectric ceramic; a step of pouring a cast backing material blended to have desired acoustic characteristics into the frame; and after the cast backing material has solidified, This method is characterized by including a step of removing the frame and the jig.
［発明の実施例］
本発明の超音波トランスジユーサの製造方法に
ついて図面を参照しながら説明する。[Embodiments of the Invention] A method of manufacturing an ultrasonic transducer of the present invention will be described with reference to the drawings.
第１図から第４図まではアレイ状のトランスジ
ユーサを製造するまでの工程を示す概略説明図で
ある。 FIGS. 1 to 4 are schematic explanatory diagrams showing the steps up to manufacturing an array-shaped transducer.
先ず、第１図に示すように、方形板状の圧電セ
ラミツク１の一面をコーテイング被膜し、その面
が下側になるように金属治具２の上面に前記圧電
セラミツク１を仮固定した後、例えばレーザ加工
により圧電セラミツク１を短冊状に切断し分割す
る。この際、圧電セラミツク１の一面にはコーテ
イング層があるため、分割された各エレメントが
ばらばらになることがない。尚、金属治具２は熱
伝導性のよい例えば銅で成形されたものを使用す
る。 First, as shown in FIG. 1, one surface of a rectangular plate-shaped piezoelectric ceramic 1 is coated, and the piezoelectric ceramic 1 is temporarily fixed on the upper surface of a metal jig 2 with that surface facing downward. For example, the piezoelectric ceramic 1 is cut and divided into strips by laser processing. At this time, since there is a coating layer on one surface of the piezoelectric ceramic 1, the divided elements do not come apart. Note that the metal jig 2 is made of, for example, copper, which has good thermal conductivity.
次に、第２図に示すように金属治具２の上面で
短冊状に分割された圧電セラミツク１の各エレメ
ント１ａ，１ｂ，１ｃ，１ｄ，１ｅ，１ｆにリー
ド線３をそれぞれハンダ付けして配線した後に前
記圧電セラミツク１を囲繞するように金属治具２
上に、内周輪郭が圧電セラミツク１の形状と同一
形状の枠体４を配置する。 Next, as shown in FIG. 2, lead wires 3 are soldered to each element 1a, 1b, 1c, 1d, 1e, 1f of the piezoelectric ceramic 1 divided into strips on the top surface of the metal jig 2. After wiring, a metal jig 2 is installed to surround the piezoelectric ceramic 1.
A frame 4 having an inner peripheral contour identical to the shape of the piezoelectric ceramic 1 is placed on top.
次いで、第３図に示すように前記枠体４内に充
分な粘度を有する液状のバツキング材５を流し込
み、所定時間後に固化させる。この際には圧電セ
ラミツク１の各エレメント１ａ〜１ｆから引き出
されたリード線３が前記注型バツキング材５を貫
通してその上部に引き出されるようにする。 Next, as shown in FIG. 3, a liquid backing material 5 having sufficient viscosity is poured into the frame 4 and solidified after a predetermined period of time. At this time, the lead wires 3 drawn out from each element 1a to 1f of the piezoelectric ceramic 1 are made to penetrate through the casting backing material 5 and drawn out to the upper part thereof.
前記注型バツキング材５は、セメンダイン
＃1565にマンガン悪鉛（Mn−Zn）フエライト粉
末（品番M4A13）を配合したもので、その配合
する重量比を変えることによつて、適宜の音響特
性を得ることができる。例えば、前記セメンダイ
ンにMn−Znフエライト粉末を重量比70％で混合
すれば、音響インピーダンス6.5（M.K.S）減衰
10dB／mm at5MHzとなり、また、前記重量比を
75％とすれば音響インピーダンスを6.9（Ｍ、K.S）
とすることができる。 The casting bucking material 5 is made by blending Cemendine #1565 with manganese bad lead (Mn-Zn) ferrite powder (product number M4A13), and by changing the blending weight ratio, appropriate acoustic characteristics can be obtained. be able to. For example, if Mn-Zn ferrite powder is mixed with Cemendine at a weight ratio of 70%, the acoustic impedance will be attenuated by 6.5 (MKS).
10dB/mm at 5MHz, and the weight ratio is
If it is 75%, the acoustic impedance is 6.9 (M, KS)
It can be done.
このように、バツキング材５それ自体が接着剤
としての機能を有するので、これを注型すること
によつて各エレメントに分割された圧電セラミツ
ク１がバツキング材５と強固に固着すると共に、
リード線３を容易にバツキング材５の外側へ引き
出すことができる。また、バツキング材５は組成
材料の重量比を適宜に変えることによつて、圧電
セラミツク１から放射される超音波に最も適合す
る吸音特性を有する吸音材とすることが可能であ
る。さらに、前記したように、圧電セラミツク１
は特別の接着剤を介することなくバツキング材５
と固着することができるので、両者の間には従来
のような接着層が存在しなくなり、従つて圧電セ
ラミツク１から放射される超音波が反射されて不
要な信号として再度圧電セラミツク１に到達する
ことがなくなる。 In this way, since the backing material 5 itself has a function as an adhesive, by casting it, the piezoelectric ceramic 1 divided into each element is firmly fixed to the backing material 5.
The lead wire 3 can be easily pulled out to the outside of the backing material 5. Further, the backing material 5 can be made into a sound absorbing material having sound absorbing properties most suitable for the ultrasonic waves emitted from the piezoelectric ceramic 1 by appropriately changing the weight ratio of the constituent materials. Furthermore, as mentioned above, the piezoelectric ceramic 1
is a backing material 5 without using a special adhesive.
As a result, there is no longer an adhesive layer between the two as in the past, and the ultrasonic waves emitted from the piezoelectric ceramic 1 are reflected and reach the piezoelectric ceramic 1 again as unnecessary signals. Things will disappear.
最後に、第４図に示すように、バツキング材５
が充分に固化した後に、前記枠体４と金属治具２
を取りはずし、ここにアレイ状のトランスジユー
サが完成する。 Finally, as shown in FIG.
After solidifying sufficiently, the frame 4 and the metal jig 2
is removed, and the array-shaped transducer is completed.
尚、バツキング材５を通つて引き出されたリー
ド線３は図示しない送受信回路に接続している。 Incidentally, the lead wire 3 drawn out through the backing material 5 is connected to a transmitting/receiving circuit (not shown).
上記説明は本発明に係るトランスジユーサの製
造方法の一実施例であるが、本発明の要旨を変更
しない範囲で種々に変形して実施できることは言
うまでもない。例えば圧電セラミツクを格子状に
切断するダイス状のトランスジユーサの場合や圧
電セラミツクを同心円状に切断するリンク状のト
ランスジユーサの場合は勿論、全く切断を行なわ
ないシングルトランスジユーサの場合にも、本発
明の製造方法が応用できる。 Although the above description is an example of the method for manufacturing a transducer according to the present invention, it goes without saying that various modifications can be made without changing the gist of the present invention. For example, in the case of a die-shaped transducer that cuts piezoelectric ceramic in a grid pattern, in the case of a link-shaped transducer that cuts piezoelectric ceramic in concentric circles, and in the case of a single transducer that does not cut at all, , the manufacturing method of the present invention can be applied.
［発明の効果］
以上詳述したように本発明の超音波トランスジ
ユーサの製造方法によれば、圧電セラミツクから
バツキング材を介して容易に電極を取り出すこと
ができると共に、バツキング材の配合組成比を変
えることにより所望の超音波吸収特性を簡便に得
ることができ、然も不要な信号の混入しない所望
の超音波特性が容易に得ることができる超音波ト
ランスジユーサの製造方法を提供するものであ
る。また、本発明によれば、バツキング材それ自
体が接着性を有するので、特別に接着剤を使用す
る必要がなく便利である。[Effects of the Invention] As detailed above, according to the method for manufacturing an ultrasonic transducer of the present invention, electrodes can be easily taken out from piezoelectric ceramic through the backing material, and the composition ratio of the backing material can be adjusted. To provide a method for manufacturing an ultrasonic transducer, in which desired ultrasonic absorption characteristics can be easily obtained by changing the ultrasonic wave characteristics, and the desired ultrasonic characteristics can be easily obtained without mixing in unnecessary signals. It is. Further, according to the present invention, since the backing material itself has adhesive properties, there is no need to use a special adhesive, which is convenient.
第１図から第４図までは本発明に係る超音波ト
ランスジユーサの製造方法における製造工程を示
す概略説明図であり、第１図は切断分割された圧
電セラミツクが金属治具上面に仮固定した状態を
示すもの、第２図は圧電セラミツクの各エレメン
トに配線し且つ枠体を仮設した状態を示すもの、
第３図は枠体内にバツキング材を流し込んで固化
した状態を示すもの、第４図は枠体と金属治具を
取り去つた状態で完成した製品を示すものであ
る。
１…圧電セラミツク、１ａ〜１ｆ…圧電セラミ
ツクの各エレメント、２…金属治具、３…リード
線、４…枠体、５…バツキング材。
1 to 4 are schematic explanatory diagrams showing the manufacturing process in the method for manufacturing an ultrasonic transducer according to the present invention, and FIG. 1 shows a piezoelectric ceramic that has been cut and divided temporarily fixed on the top surface of a metal jig Figure 2 shows the state in which the piezoelectric ceramic elements are wired and the frame is temporarily installed.
Figure 3 shows the backing material poured into the frame and solidified, and Figure 4 shows the completed product with the frame and metal jig removed. DESCRIPTION OF SYMBOLS 1...Piezoelectric ceramic, 1a-1f...Each element of piezoelectric ceramic, 2...Metal jig, 3...Lead wire, 4...Frame, 5...Backing material.
Claims (1)
ラミツクを所定形成のエレメントに切断分割する
工程と、各エレメントにリード線を接続する工程
と、前記分割された圧電セラミツクに筒状の枠体
を仮設する工程と、枠体内に所望の音響特性を有
するように配合した注型バツキング材を流し込む
工程と、該注型バツキング材が固化した後に前記
枠体と治具を取り除く工程とを含むことを特徴と
する超音波トランスジユーサの製造方法。 ２ 前記注型バツキング材がセメダインにマンガ
ン亜鉛フエライト粉末を混合してなることを特徴
とする特許請求の範囲第１項記載の超音波トラン
スジユーサの製造方法。[Scope of Claims] 1. After temporarily fixing the piezoelectric ceramic to a jig, a step of cutting and dividing the ceramic into elements having a predetermined shape, a step of connecting a lead wire to each element, and a step of connecting the piezoelectric ceramic to the divided piezoelectric ceramic. a step of temporarily installing a cylindrical frame; a step of pouring a cast backing material blended to have desired acoustic characteristics into the frame; and after the cast backing material has solidified, the frame and the jig are removed. A method of manufacturing an ultrasonic transducer, comprising the steps of: 2. The method of manufacturing an ultrasonic transducer according to claim 1, wherein the casting bucking material is made by mixing Cemedine with manganese zinc ferrite powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22140483A JPS60114100A (en) | 1983-11-26 | 1983-11-26 | Method for producing ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22140483A JPS60114100A (en) | 1983-11-26 | 1983-11-26 | Method for producing ultrasonic transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60114100A JPS60114100A (en) | 1985-06-20 |
| JPH058640B2 true JPH058640B2 (en) | 1993-02-02 |
Family
ID=16766217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22140483A Granted JPS60114100A (en) | 1983-11-26 | 1983-11-26 | Method for producing ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60114100A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07200166A (en) * | 1993-12-07 | 1995-08-04 | Lg Electron Inc | Portable computer trackball |
| JPH08292835A (en) * | 1995-04-21 | 1996-11-05 | Nec Corp | Information processor with pointing device |
| JPH0991084A (en) * | 1995-09-27 | 1997-04-04 | Nec Gumma Ltd | Main body detachable track ball mouse device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19626293A1 (en) * | 1996-07-01 | 1998-01-08 | Teves Gmbh Alfred | Ultrasonic transducer with contact element |
| WO2009128322A1 (en) * | 2008-04-14 | 2009-10-22 | コニカミノルタエムジー株式会社 | Sound damping member and method for producing sound damping member, ultrasonic probe, and ultrasonic diagnosis device |
| CN102179361B (en) * | 2011-01-04 | 2013-02-27 | 瑞声声学科技(深圳)有限公司 | Method for manufacturing ultrasonic transducer |
-
1983
- 1983-11-26 JP JP22140483A patent/JPS60114100A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07200166A (en) * | 1993-12-07 | 1995-08-04 | Lg Electron Inc | Portable computer trackball |
| JPH08292835A (en) * | 1995-04-21 | 1996-11-05 | Nec Corp | Information processor with pointing device |
| JPH0991084A (en) * | 1995-09-27 | 1997-04-04 | Nec Gumma Ltd | Main body detachable track ball mouse device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60114100A (en) | 1985-06-20 |
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