JPH0587909U - High frequency coil - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] The present invention eliminates temporary fixing of chip elements such as chip capacitors to simplify the assembly work, and also the degree of freedom in the configuration of the chip elements to be soldered It is an object of the present invention to provide a high frequency coil in which the production efficiency is improved and the reliability of soldering is improved by ensuring the above. [Structure] A base 11 on which a coil element is to be mounted, a plurality of terminals 13 and 14 penetrating vertically through the base and having a lower end protruding in a pin shape, and the terminals on the base. In a high-frequency coil including a chip element 15 electrically connected to the terminal, an upper portion of the terminal protruding from an upper surface of the base is bent in a substantially horizontal direction. The high-frequency coil 10 is configured such that the upper portions of the terminals bent to be brought into contact with the respective electrode portions of the chip element 15 placed on the base and soldered.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a high-frequency coil which is miniaturized by mounting a chip element together with a coil element on a base, and which is optimum as a high-frequency coil for filters, RF, IF, OSC circuits and the like.

[0002]

[Prior Art]

 Conventionally, such a high frequency coil is configured, for example, as shown in FIG. That is, in FIG. 5, the high-frequency coil 1 has, for example, a drum core around which a coil (not shown) is wound, a cap core, and the like are arranged on a resin-molded substantially rectangular parallelepiped base 2, and the whole is not shown. It is constructed by being covered by a shield case.

Two terminals 3 and 4 are respectively planted on the edges of the base 2 that face each other so as to project upward from the upper surface of the base 2. Each of the lower ends projects downward from the lower surface of the base 2 and is formed into a pin shape. When the lower end is mounted on a printed circuit board (not shown), it is inserted into a hole provided in the printed circuit board. It is fixed and soldered so that it can be electrically connected.

Of the pair of terminals 3 and 4 projecting from the upper surface of the base 2, one terminal, in the illustrated case, a space between the terminals 3 is, as shown in the drawing, a chip element such as a chip capacitor. 6 are provided. This chip capacitor 6 is temporarily fixed by, for example, applying an adhesive to the upper surface of the base 2 between the terminals 3, and then the electrode portion of the chip capacitor 6 and the vicinity of the upper end of each terminal 3 are connected. By being soldered together, they can be fixed and electrically connected. Further, the winding lead terminals of the above coil element are wound around the terminals 3 and 4 and connected by soldering or the like.

The high-frequency coil 1 thus configured has the above-described printed board by inserting the lower ends of the terminals 3 and 4 into the holes provided in the printed board and soldering the terminals 3 and 4. Can be implemented on. As a result, the work with a capacitor with a lead wire placed on the base and the lead wire wound around the pin terminals can be performed more easily and can be automated. ing.

[0006]

[Problems to be solved by the device]

 However, in the conventional high-frequency coil 1 configured as described above, it is necessary to temporarily fix the chip capacitor 6 with an adhesive, which complicates the assembly work, is troublesome, and increases the cost. Moreover, it is necessary to accurately match the interval between the terminals 3 and the size of the chip capacitors 6 arranged between the terminals 3, which limits the degree of freedom in the configuration, and different chip capacitors are different from each other. It is necessary to prepare the base 2 of the structure, which lowers the production efficiency, and the contact area between the terminal 3 and the electrode portion of the chip capacitor 5 is relatively small. Therefore, the reliability of soldering is not so great. There was a problem that it was not expensive.

In view of the above points, the present invention eliminates temporary fixing of chip elements such as chip capacitors, simplifies the assembly work, and secures the degree of freedom in the configuration of the chip elements to be soldered. Therefore, it is an object of the present invention to provide a high frequency coil which improves the production efficiency and further improves the reliability of soldering.

[0008]

[Means for Solving the Problems]

 According to the present invention, the above object is to mount a coil base on which a coil element is mounted, a plurality of terminals vertically penetrating the base and projecting in a pin shape at a lower end, and a plurality of terminals mounted on the base. In a high-frequency coil comprising a coil element to be attached and a chip element electrically connected to the terminal on the base, the terminal is projected from an upper surface of the base. The upper part is bent in a substantially horizontal direction.The upper part of each horizontally bent terminal is brought into contact with each electrode part of the chip element mounted on the base and soldered. It is achieved by a high-frequency coil, characterized in that

[0009]

[Action]

 According to the above configuration, the upper portion of each terminal protruding on the upper surface of the base is brought into contact with each electrode portion of the chip element from a side or an upper side with a relatively large contact area, Since the chip element is sandwiched or pressed against the base, the stability of the electrode portion of the chip element is relatively high, and temporary fixing of the chip element is not necessary, and the soldering ensures the reliability. Since it can be fixed and electrically connected, the reliability of soldering is improved.

Further, since the electrode part of the chip element is sandwiched by each terminal from both sides, or pressed from above and soldered to the base, the size of the electrode part of the chip element is reduced. Since there is flexibility, and chip elements of various sizes can be mounted, production efficiency can be improved.

[0011]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. FIG. 1 shows an embodiment of a high frequency coil according to the present invention.

The high-frequency coil 10 includes, for example, a drum core 12 around which a coil (not shown) is wound, and the like, which is arranged on a resin-molded base 11 having a substantially rectangular parallelepiped shape. It is composed by being covered.

One side (front side in the drawing) of the base 11 is lined up along the longitudinal direction, and two terminal insertion holes 11a are formed on the other side (the other side in the drawing) in the longitudinal direction. Two terminal insertion holes 11b are formed side by side along the base 11 so as to vertically penetrate the base 11.

A chip element accommodating portion 11c is formed near the center of the upper surface of the base 11, and the chip element accommodating portion 11c exposes at least the electrode portion of the chip element accommodated therein. Has been formed.

Of the terminal insertion holes 11a and 11b, the terminals 13 and 14 are inserted into the terminal insertion hole 11a by press fitting or the like. Here, as shown in FIG. 3, each of the terminals 13 and 14 is inserted into each of the terminal insertion holes 11a and 11b of the base 11, and then the upper portion protruding from the base 11 is folded. By being bent, it is positioned substantially horizontally on the upper surface of the base 11 and extends to the region where the electrode portions at both ends of the chip element accommodating portion 11c are exposed.

The high-frequency coil 10 according to the present invention is configured as described above. The high-frequency coil 10 is a chip element in which the upper portions of the terminals 13 and 14 are opened as shown in FIG. 3 (A). After accommodating the chip capacitor 15 in the accommodating portion 11c, the terminals 13 and 14 are closed in the terminal insertion hole 11a to be closed as shown in FIG. 14a is brought into contact with the electrode portion of the chip capacitor 16. As a result, the electrode portions 15a and 15b of the chip capacitor 15 are sandwiched by the tips 13a and 14a of the terminals 13 and 14, respectively.

At this time, since the tips 13a and 14a extend substantially horizontally, the contact area with the electrode portions 15a and 15b becomes relatively large. Therefore, the stability of the chip capacitor 15 becomes relatively high, so that the temporary fixing of the chip capacitor 15 becomes unnecessary, and it is possible to surely fix and electrically connect by soldering.

In the high-frequency coil 10 thus configured, the lower ends of the terminals 13 and 14 are inserted into the mounting holes provided on the printed circuit board, and the terminals 13 and 14 are soldered, thereby It can be mounted on a printed circuit board.

FIG. 4 shows a positional relationship between terminals and a chip capacitor in another embodiment of the high frequency coil according to the present invention. In FIG. 4, the high frequency coil 20 is different from the high frequency coil 20 in that the tips 13a and 14a of the terminals 13 and 14 are brought into contact with the electrode portions 15a and 15b of the chip capacitor 15 from above. Has the same configuration as that of the embodiment of FIG. 1, and the electrode portions 15a and 15b of the chip capacitor 15 are pressed against the surface of the base 11 by the tips 13a and 14a of the terminals 13 and 14, respectively. As a result, the chip capacitor 15 can be stably held, and similarly, the temporary fixing of the chip capacitor 15 is not necessary, and it can be securely fixed and electrically connected by soldering.

[0020]

[Effect of the device]

 As described above, according to the present invention, the temporary fixing of the chip element such as the chip capacitor is eliminated, the assembling work is simplified, and the flexibility of the configuration of the chip element to be soldered is secured. As a result, it is possible to provide an extremely high-frequency coil that improves production efficiency and has high reliability in soldering.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a high frequency coil according to the present invention.

FIG. 2 is a plan view showing a base of the high frequency coil shown in FIG.

3 shows the positional relationship between the terminals of the high-frequency coil and the chip capacitor of FIG. 1, (A) before soldering and (B).
FIG. 6 is a perspective view showing a state after soldering.

FIG. 4 is a perspective view showing a positional relationship between terminals and a chip capacitor in another embodiment of the high-frequency coil according to the present invention, (A) showing a state before soldering and (B) showing a state after soldering.

FIG. 5 is an exploded perspective view showing an example of a conventional high frequency coil.

[Explanation of symbols]

 10, 20 High frequency coil 11 Base 11a Terminal insertion hole 11b Terminal insertion hole 12 Drum core 13, 14 Terminal 13a, 14b Terminal upper part 15 Chip capacitor (chip element)

Claims (1)

[Scope of utility model registration request] 1. A base on which a coil element is to be mounted, a plurality of terminals penetrating vertically through the base and having a lower end protruding in a pin shape, and a coil element mounted on the base. A high-frequency coil, comprising: a chip element electrically connected to the terminal on the base, wherein the terminal has an upper portion protruding from an upper surface of the base folded in a substantially horizontal direction. It is bent, and the upper part of each terminal bent horizontally is brought into contact with each electrode part of the chip element mounted on the base, and is connected, coil.