JPH0588380A - Automatic exposing machine - Google Patents

Abstract

PURPOSE:To obtain the automatic exposing machine which automatically position a substrate and a mask pattern with small deviation. CONSTITUTION:This automatic exposing machine 50 which has a positioning mechanism for fixing the substrate 10 on the exposing machine 50, an XYtheta variable table which positions an exposure pattern 20 on the substrate 10, and a detecting mechanism which detects the position deviation between the substrate 10 and exposure pattern 20 has a positioning stage 32 in front of an exposure stage 31 and is provided with a mechanism 33 which detects the position deviation between the substrate 10 and exposure pattern 20 at the exposure stage 31 to judge whether or not exposure is possible and discharges the substrate 10 after or without exposure. Further, the position deviation between the substrate 10 and exposure pattern 20 which is detected at the exposure stage 31 is fed back to the positioning stage 32 and a correcting mechanism 34 corrects the position deviation previously by moving the XYtheta variable table.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic exposure machine for exposing a substrate to an exposure pattern such as wiring or a mask, and more particularly to an automatic exposure machine for moving an exposure pattern on an XYθ variable table to align it with the substrate.

[0002]

2. Description of the Related Art Conventionally, for example, a photosensitive solder resist is applied on a printed wiring board, and a mask pattern is exposed by aligning it with a conductor circuit of the printed wiring board, followed by development and curing steps. Is being formed. Compared to the previous thermosetting type solder resist, this photosensitive solder resist can improve the alignment accuracy to the board, increase the number of external terminals of the electronic parts to be mounted, and increase the density of electronic parts on the board. It is widely used in recent years. The alignment of the mask pattern with the conductor circuit of the substrate is generally performed by initial alignment. However, in the alignment, 0.08-
Although the position accuracy can be greatly improved to 0.1 mm,
In particular, it takes a lot of time to align the mask pattern, and the workability is poor, and since the alignment depends on a person, there is a large problem in that the alignment varies from person to person.

In order to solve this problem, in recent years, C
X the substrate and the mask pattern by using a CD camera or the like.
(Horizontal position), Y (vertical position), θ (rotational position) An automatic alignment exposure machine that automatically performs alignment using a variable table has been developed. However, this automatic alignment exposure machine (hereinafter, simply referred to as an automatic exposure machine) aligns a mask pattern on a substrate with a preliminary stage by the alignment mechanism, and sends the substrate and the aligned mask pattern to the exposure stage. Since the exposure was carried out as it was, it had the following drawbacks. First, when the substrate or the like is sent from the preliminary stage to the exposure stage, the mask pattern aligned with the substrate is displaced by the sending. This deviation is about 0.05 to 0.15 mm, and a deviation of 0.1 mm or more can be improved by smoothing the feed, but it was difficult to adjust the deviation to be smaller than 0.1 mm.
If this happens, the substrate, etc. will be exposed with a deviation, and if the exposure is once and the deviation is more than the permissible value, the photosensitive solder resist will be stripped with a solvent, etc. The cost is high, and the reclaiming process often causes the substrate surface to become rough and become defective. This is the second drawback.

[0004]

The present invention has been made to solve the above problems and drawbacks. The problem to be solved is to send the substrate and the exposure pattern from the preliminary stage to the exposure stage. If there is a deviation, it is to prevent exposure. Further, it is desirable to prevent the deviation between the substrate and the exposure pattern. And the purpose is that the substrate and the mask pattern can be automatically matched, and even if the substrate and the exposure pattern are largely shifted by feeding from the preliminary stage to the exposure stage, it is not necessary to regenerate the substrate. An object of the present invention is to provide an automatic exposure device in which the exposure pattern does not largely deviate from the substrate even by feeding.

[0005]

Means adopted by the present invention for solving the above-mentioned problems will be described with reference to the reference numerals used in the examples. "The substrate (10) will be used as an exposure device (50)". A positioning mechanism for fixing, an XYθ variable table for aligning the exposure pattern (20) for exposing the substrate (10), and a positional deviation between the substrate (10) and the exposure pattern (20) aligned thereon are detected. In the automatic exposure machine (50) having the detection mechanism (30), the exposure pattern (2
0) before the exposure stage (31) to expose the substrate (1
0) has an alignment stage (32) for aligning the exposure pattern (20), and an exposure stage (31)
In addition, an automatic payout mechanism (33) for detecting the positional deviation between the substrate (10) and the exposure pattern (20) before the exposure to judge whether the exposure is possible or not and exposing the substrate to the exposure or not. Exposure machine (50), and more preferably, in the automatic exposure machine (50), the positional deviation between the pre-exposure substrate (10) and the exposure pattern (20) detected by the exposure stage (31) Alignment stage (3
The automatic exposure machine (50) ”is provided with a correction mechanism (34) that feeds back to (2) and corrects the positional deviation in advance by moving the XYθ variable table.

[0006]

In the automatic exposure machine (50) of the present invention, the exposure stage (31) detects the positional deviation between the substrate (10) and the exposure pattern (20) before the exposure to judge whether the exposure is possible or not. Alternatively, since the payout mechanism (33) for paying out without exposing is provided, those with a large positional deviation exceeding the allowable limit are not exposed and paid out without being exposed. Therefore, it is no longer used for reproduction due to the large positional deviation. Only those with a small misalignment are exposed.
Further, when the correction mechanism (34) is provided, the XYθ deviation information detected by the exposure stage (31) is fed back to the alignment stage (32), and the correction based on it is performed by the alignment stage (32). Since it is reflected in the alignment, the alignment between the substrate (10) and the exposure pattern (20) is just right when it is sent from the alignment stage (32) to the exposure stage (31). Of. Further, even if the deviation tendency changes for some reason, the correction amount is corrected and changed at any time, so that the deviation amount is always minimized.

[0007]

1 is a schematic view showing an embodiment of an automatic exposure machine (50) of the present invention. Here, first, the substrate (10) coated with the photosensitive solder resist is placed on the exposure device (50) of the alignment stage (32). And a conductor circuit (not shown) on the substrate (10)
Then, the exposure (mask) pattern (20) is aligned using an alignment mechanism (30) such as a CCD. The exposure pattern (20) is fixed on the XYθ table and is X
The Yθ table moves to align the exposure pattern (20) with the substrate (10). Next, the aligned substrate (10) and exposure pattern (20) are sent to the exposure stage (31). This exposure stage (3
In 1), the positions of the substrate (10) and the exposure pattern (20) are confirmed again by the detection mechanism (30) provided there. Then, if the positional deviation between the substrate (10) and the exposure pattern (20) is within the allowable limit, exposure is performed. If there is a deviation exceeding the allowable limit, the payout mechanism (3
In step 0), the wafer is exposed to the outside of the exposure stage (31) without being exposed.

In this embodiment, the case where the photosensitive solder resist is applied to the printed wiring board on which the pattern is formed as the substrate (10) has been described, but the etching resist is applied to the printed wiring board on which the pattern is not formed. It can also be used when aligning and exposing a pattern to be a conductor. The positioning mechanism for mounting the substrate (10) on the exposure machine (50) may be a pin stand, a positioning guide, or suction fixing, or any combination of various positioning mechanisms. Further, the transportation method is not limited to various conveyors, suction transportation and the like. Further, the detection mechanism (30) for aligning the substrate (10) and the exposure pattern (20) and the XYθ table may be provided on the upper and lower sides of the exposure machine (50), or the substrate (10) side or the exposure pattern may be provided. (20) or whether or not the detection mechanism (32) of the alignment stage (32) is shared with that of the exposure stage (31) is not limited. Further, the substrate may be a ceramic substrate.

FIG. 2 shows another embodiment of the present invention in which a correction mechanism (34) is further provided. Here, the deviation information of the substrate (10) and the exposure pattern (20) detected by the detection mechanism (30) before the exposure on the exposure stage (31) is fed back to the alignment stage (32),
It shows how the correction is reflected in the alignment on the alignment stage (32). Therefore, when the correction mechanism (34) is provided, the alignment stage (3
The exposure pattern (20) exactly matches the substrate (10) with good positional accuracy when the film is fed from 2) to the exposure stage (31), and the alignment accuracy can be further improved. The correction may be performed every time, but it is desirable to set the timing of the correction by the statistical quality control method. In the automatic exposure device (50) in the case of FIG. 2, the deviation can be reduced to about 0.03 mm by providing the correction mechanism (34). Further, the substrate (10) discharged due to the displacement was reduced by about 30% as compared with the embodiment of FIG.

[0010]

As described in detail above, in the automatic exposure apparatus of the present invention, the substrate and the exposure pattern can be automatically aligned, and the substrate and the exposure pattern are largely shifted by feeding from the preliminary stage to the exposure stage. Even if it is, it is not necessary to regenerate the substrate, and if a correction mechanism is provided, the alignment accuracy can be improved without a large deviation between the substrate and the exposure pattern even by feeding, and the substrate to be paid out without being exposed The number of exposures can be reduced and the exposure work can be efficiently performed as a whole.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of an automatic exposure machine of the present invention.

FIG. 2 is a schematic perspective view of an embodiment in which the automatic exposure machine of the present invention is further provided with a correction mechanism.

[Explanation of symbols]

 10 substrate 20 exposure pattern 30 detection mechanism 31 exposure stage 32 alignment stage 33 payout mechanism 34 correction mechanism 50 automatic exposure machine

Claims (2)

[Claims] 1. A positioning mechanism for fixing a substrate to an exposure machine, an XYθ variable table for aligning an exposure pattern to be exposed on the substrate, and a positional deviation between the substrate and the exposure pattern aligned thereon. In an automatic exposure machine having a detection mechanism that has a positioning stage that positions the exposure pattern on the substrate before the exposure stage that exposes the exposure pattern on the substrate,
An automatic exposure machine, further comprising: a payout mechanism that detects a positional deviation between the substrate and the exposure pattern before the exposure on the exposure stage, determines whether or not the exposure is possible, and pays out the exposure or not. 2. The automatic exposure machine according to claim 1, wherein the positional deviation between the pre-exposure substrate and the exposure pattern detected by the exposure stage is fed back to the alignment stage to move the XYθ variable table. An automatic exposure machine having a correction mechanism for previously correcting a positional deviation.